CN1189739C - Holder mechanism - Google Patents

Holder mechanism Download PDF

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Publication number
CN1189739C
CN1189739C CNB018010989A CN01801098A CN1189739C CN 1189739 C CN1189739 C CN 1189739C CN B018010989 A CNB018010989 A CN B018010989A CN 01801098 A CN01801098 A CN 01801098A CN 1189739 C CN1189739 C CN 1189739C
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CN
China
Prior art keywords
mentioned
movable
glass substrate
reference pins
saw
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Expired - Fee Related
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CNB018010989A
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Chinese (zh)
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CN1366606A (en
Inventor
丸山规夫
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Olympus Corp
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Olympus Optical Co Ltd
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Publication of CN1366606A publication Critical patent/CN1366606A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

Abstract

The holder mechanism of the present invention comprises a holder frame holding a held body, a fixed reference member installed on the holder frame and allowing the held body to press thereagainst, a movable reference member movable relative to the holder frame according to the size of the held body and allowing the held body to press thereagainst, a pressing member installed, by at least one, on the holder frame in lateral and vertical directions and pressing the held body against the fixed reference member or the movable reference member, and a drive part driving the movable reference member.

Description

Retainer mechanism
Technical field
The present invention relates to a kind of retainer mechanism, be applicable to and check that for example LCD flat-panel monitors (FPD) such as (LCD) is gone up used glass substrate, detect the Substrate checking device of defective etc.
Background technology
On LCD, in the defect inspection of used glass substrate, be called the inspection of macroscopic view observation and be called the inspection that microcosmic is observed.Wherein macroscopic view observation is irradiating illumination light on the surface of glass substrate, and its reflected light of visual observation by the supervisory personnel or penetrate the optical change of light detects the defectives such as scar on the glass substrate surface.
When the observation of this macroscopic view, glass substrate is remained on the retainer of Substrate checking device, shake above-mentioned retainer at this state, the surface of the above-mentioned glass substrate of visual observation by the supervisory personnel.In the time also will continuing to observe the back side of above-mentioned glass substrate, above-mentioned glass substrate is turned over, with the above-mentioned the same above-mentioned retainer that shakes, the back side of the above-mentioned glass substrate of visual observation by the supervisory personnel.
When observing, can carry out inspection to most dimension glass substrates in above-mentioned macroscopic view observation or with microscopical microcosmic.
Figure 14 is the pie graph that is illustrated in substrate holder used in the Substrate checking device of conventional example.Substrate holder 1 is made of the maintenance frame-saw 2 that forms the quadrilateral frame shape.In this keeps frame-saw 2, unillustrated support lath or anchor from the figure of back side support FPD glass substrate, interval in accordance with regulations is impartial to be provided with.In addition,, fixedly install reference pins 3a, 3b and 3c, 3d respectively, and, be provided with respectively and compress pin 4a, 4b and 4c, 4d along the upside that keeps frame-saw 2 and the frame in left side along the right side that keeps frame-saw 2 and the frame of downside.These compress pin 4a, 4b and 4c, 4d energize on each compaction direction f1, f2 respectively, and glass substrate 8 is pressed on reference pins 3c, 3d and 3a, the 3b, and glass substrate 8 is positioned.Respectively compress pin 4a, 4b and 4c, 4d respectively in each movable hole 5a, 5b and 5c, 5d, can move to each compaction direction f1, f2.
In addition, on the frame of upside that keeps frame-saw 2 and downside, form reference pins unit installation portion 7a, 7b respectively.The reference pins unit (lath) 6 of promising setting different size glass substrate reference position is installed by screw on these reference pins installation portions 7a, 7b.The reference position of the glass substrate that the 6 pairs of sizes in reference pins unit are little is set.On reference pins unit 6, fixedly install 2 reference pins 6a, 6b.
Figure 15 is illustrated in the constitutional diagram that keeps the large glass substrate on the above-mentioned substrate holder.When carrying out macroscopic view observation (or microcosmic observation) with 1 pair of large glass substrate of above-mentioned substrate holder 8,, take off the reference pins unit from keeping frame-saw 2 by supervisory personnel's manual operation.At this state, when keeping frame-saw to be provided with large glass substrate 8, on compaction direction f1, f2, compress pin 4a, 4b and 4c, 4d respectively, two limits of large-scale glass substrate 8 contact respectively on reference pins 3c, 3d and 3a, 3b, like this, large glass substrate 8 will be positioned.
Figure 16 is illustrated in the constitutional diagram that keeps small-sized glass substrate on the above-mentioned substrate holder.When carrying out macroscopic view observation (or microcosmic observation) with 1 pair of small-sized glass substrate 9 of above-mentioned substrate holder,, keeping reference for installation pin unit 6 on the frame-saw 2 by supervisory personnel's manual operation.At this state, when small-sized glass substrate 9 is set, on compaction direction f1, f2, compress pin 4b and 4c, 4d respectively on keeping frame-saw 2, two limits of small-sized glass substrate 9 are touched respectively on reference pins 3d and 6a, the 6b, like this, small-sized glass substrate 9 will be positioned.
On above-mentioned substrate holder 1, when for example after the macroscopic view observation of large glass substrate 8, carrying out the macroscopic view observation of small-sized glass substrate 9, in order to change the reference position of this small-sized glass substrate 9, must be by supervisory personnel's manual operation reference for installation pin unit 6.This reference pins unit 6 is installed by ways such as screw retention, makes the reference position motionless, and still this installation, field-strip bother spended time very much.Therefore mix in the batch that exists at the different glass substrate of size, spended time in the loading and unloading operation of reference pins unit 6 is difficult to improve the efficient of checking.In addition, along with the maximization of glass substrate 8, keep frame-saw 2 maximization that also becomes.Therefore, when reference for installation pin unit 6, supervisory personnel's hand reaches the inside of substrate holder 1 sometimes, can't carry out screw retention.In addition because the Zhu dust that this operation produces will produce the problem that Substrate checking device degree of purification reduces.
The object of the present invention is to provide a kind of retainer mechanism, can carry out the reference feature glass substrate change operation different simply size.
Disclosure of an invention
(1) retainer of the present invention mechanism comprises: the maintenance frame-saw that keeps being held body; Be arranged on the above-mentioned maintenance frame-saw, compress the above-mentioned fixed reference member that is held body; According to the above-mentioned size that is held body, can move with respect to above-mentioned maintenance frame-saw, compress the above-mentioned movable reference feature that is held body; On above-mentioned maintenance frame-saw horizontal and vertical, at least respectively be provided with one, make the above-mentioned pressed component that body compresses to above-mentioned fixed reference member or above-mentioned movable reference feature that is held; And the drive division of the above-mentioned movable reference feature of driving.
(2) retainer of the present invention mechanism is the mechanism described in above-mentioned (1), and the many groups of above-mentioned movable reference feature are arranged on corresponding on the above-mentioned position that is held the body size of majority.
(3) retainer of the present invention mechanism is the mechanism described in above-mentioned (1) or (2), and a plurality of settings of said fixing reference feature, and above-mentioned adjacent two limits that are held body are compressed.
(4) retainer of the present invention mechanism is the mechanism described in above-mentioned (2), and above-mentioned drive division is held the body size according to what keep on above-mentioned maintenance frame-saw, and selectivity drives the above-mentioned movable reference feature of many groups.
(5) retainer of the present invention mechanism is the mechanism described in above-mentioned (1), and above-mentioned movable reference feature can be to freely rotating corresponding to the above-mentioned position that is held the body size, when above-mentioned maintenance frame-saw keep given size be held body the time, interior side direction to above-mentioned retainer frame rotates, and beyond keeping the afore mentioned rules size be held body the time, rotate to the lateral direction of above-mentioned retainer frame.
(6) retainer of the present invention mechanism is the mechanism described in above-mentioned (5), and above-mentioned maintenance frame-saw, when above-mentioned retainer framework lateral direction is rotated, forms the portion of hiding that above-mentioned movable reference feature hides that makes in above-mentioned movable reference feature.
(7) retainer of the present invention mechanism is the mechanism described in above-mentioned (1), and above-mentioned movable reference feature is arranged on the mobile member that can move freely to horizontal and vertical at least one side of above-mentioned retainer frame.
(8) retainer of the present invention mechanism is the mechanism described in above-mentioned (7), and above-mentioned mobile member forms the I word shape that can move freely on above-mentioned horizontal and vertical some directions.
(9) retainer of the present invention mechanism is the mechanism described in above-mentioned (7), and above-mentioned mobile member forms the L word shape that can move freely on above-mentioned horizontal and vertical both direction.
(10) retainer of the present invention mechanism comprises: the maintenance frame-saw that keeps being held body; Be arranged on the above-mentioned maintenance frame-saw, compress the above-mentioned fixed reference member that is held body; According to the above-mentioned size that is held body, can move with respect to above-mentioned maintenance frame-saw, compress the above-mentioned movable reference feature that is held body; And the drive division of the above-mentioned movable reference feature of driving.
The simple declaration of accompanying drawing
Fig. 1 is the skeleton view that the related Substrate checking device of expression embodiments of the invention constitutes.
Fig. 2 is the pie graph that is illustrated in substrate for use retainer in the related Substrate checking device of embodiments of the invention.
Fig. 3 A is the related movable reference pins concrete figure that constitute of mechanism of expression embodiments of the invention.
Fig. 3 B is the planimetric map and the cross-sectional side view of the related L font arm of embodiments of the invention.
Fig. 4 is the mode chart that the drive system of the related movable reference pins mechanism of expression embodiments of the invention constitutes.
Fig. 5 A is the constitutional diagram of expression when keeping the large glass substrate by the related substrate holder of embodiments of the invention.
Fig. 5 B is the constitutional diagram of expression when keeping small-sized glass substrate by the related substrate holder of embodiments of the invention.
Fig. 6 A is the constitutional diagram of expression when keeping the large glass substrate by the related substrate holder of embodiments of the invention.
Fig. 6 B is the constitutional diagram of expression when keeping small-sized glass substrate by the related substrate holder of embodiments of the invention.
Fig. 7 A, Fig. 7 B are the pie graphs of the related substrate holder of expression embodiments of the invention.
Fig. 8 A, Fig. 8 B are the pie graphs of the related substrate holder of expression embodiments of the invention.
Fig. 9 A is the mode chart that the related movable datum plate driving mechanism of expression embodiments of the invention constitutes.
Fig. 9 B is the sectional drawing that the related movable datum plate driving mechanism of expression embodiments of the invention constitutes.
Figure 10 A, Figure 10 B are the pie graphs of the related substrate holder of expression embodiments of the invention.
Figure 11 is the mode chart that the related movable datum plate driving mechanism of expression embodiments of the invention constitutes.
Figure 12 A, Figure 12 B are the pie graphs of the related substrate holder of the variation of expression embodiments of the invention.
Figure 13 A, Figure 13 B are the pie graphs of the related substrate holder of the variation of expression embodiments of the invention.
Figure 14 is the pie graph that is illustrated in the used substrate holder of the related Substrate checking device of conventional example.
Figure 15 is illustrated in the constitutional diagram that keeps the large glass substrate on the related substrate holder of conventional example.
Figure 16 is illustrated in the constitutional diagram that keeps the large glass substrate on the related substrate holder of conventional example.
The most preferred embodiment of invention
The 1st embodiment of the present invention is described with reference to the accompanying drawings.Part identical with Figure 14 in each figure is added with same numeral, and base describes in detail and omitted.
Fig. 1 is the skeleton view that the related Substrate checking device of expression the 1st embodiment of the present invention constitutes.This Substrate checking device is checked the glass substrate of flat-panel monitors (FPD) such as LCD and plasma display.In Fig. 1, apparatus main body 201 is provided with the maintenance frame-saw 2 of the glass substrate 8 that keeps the inspection object.
Keep frame-saw 2 to constitute dimetric frame, keep large glass substrate 8 by its periphery absorption.Keeping forming square shape by the empty portion that its periphery surrounded on the frame-saw 2, the area of above-mentioned empty portion is more smaller than the area of large glass substrate 8.In addition, along the periphery that keeps frame-saw 2 unillustrated most absorption flanges among the figure are set, by unillustrated vacuum pump among the figure, the periphery of glass substrate 8 is adsorbed on and keeps on frame-saw 2 surfaces, and glass substrate 8 remains on and keeps can not coming off on the frame-saw 2 like this.To narrate in the back about the detailed formation that keeps frame-saw 2.
As shown in Figure 1, on apparatus main body 201 along the both sides of the edge of retainer frame 2, to Y direction configured in parallel pair of guide rails 202,202.In addition, above maintenance frame-saw 2, cross over observing unit support sector 203 that this keeps frame-saw 2 configuration door pillar types.This observing unit support sector 203 is along guide rail 202,202, makes the top of glass substrate 8, promptly keeps the top of the maintenance frame-saw 2 of horizontality, can move to Y direction.
In observing unit support sector 203, support observing unit 204, this observing unit 204 can to observing unit support sector 203 moving directions (Y direction) direction of orthogonal (X-direction) mutually, unillustrated guide rail moves in the figure.Also in observing unit support sector 203, penetration line lighting source 205 is set, relative with the portable cord of observing unit 204.This penetration line lighting source 205 disposes along X-direction passing on the backboard 206 that keeps the support sector 203 below the frame-saw 2.Penetration line lighting source 205 carries out the wire transillumination from the below of glass substrate 8, can move to Y direction with observing unit support sector 203.
Observing unit 204 has the part macroscopic view lighting source 209 that the index of being provided with is observed usefulness with the microcosmic observing unit 208 and the macroscopic view of lighting source 207.Index is used for defective locations on the particular glass substrate 8 with lighting source 207, and the some light of light harvesting on the optics is incident upon on glass substrate 8 surfaces.
Microcosmic observing unit 208 has the microscope functions that comprises object lens 211, eyepiece 212, reaches unillustrated light source for reflection illumination among the figure, and the supervisory personnel can be by the picture of object lens 211 by eyepiece 212 observation glass substrates 8 surfaces.In microcosmic observing unit 208, TV video camera 213 is installed in addition by three glasses tubes.213 pairs of observations by object lens 211 resulting glass substrates 8 surfaces of TV video camera look like to make a video recording, and are transferred to control part 221.Control part 221 will be looked like to be presented on the TV Monitor 222 by the observation of TV video camera 213 shootings.On control part 221, connect the input part 223 that the supervisory personnel operates indication and data input.
The macroscopical lighting source 209 of part is used for macroscopic view observation, with the part on glass substrate 8 surfaces on the maintenance frame-saw 2 of macroscopical illumination light illumination levels state maintenance.Unillustrated comprehensive macroscopical lighting source in utilizing figure when carrying out all macroscopic views observation in glass substrate 8 surface, makes to keep the maintenance frame-saw 2 of glass substrate 8 to shake, for having given omission in this mechanism map.
Fig. 2 is the pie graph that is illustrated in substrate holder used in the above-mentioned Substrate checking device.Substrate holder 1 is made of the maintenance frame-saw 2 that forms tetragonal frame shape.This maintenance frame-saw 2 is provided with a pair of movable reference pins mechanism 10,11.These 10,11 pairs of reference positions corresponding to the small-sized glass substrate (being held body) 9 shown in Figure 14 of a pair of movable reference pins mechanism are set.These movable reference pins mechanisms 10,11 on the frame of supervisory personnel to the inboard that keeps frame-saw 2 and front side, configuration relatively respectively.Movable reference pins mechanism 10,11 has the conversion indication according to sizes of substrate, makes movable reference pins 101,111 movably control to the function of escape hole or reference position respectively.That is, because movably reference pins 101,111 is movable on the said reference position, thereby automatically setting is to the reference position of small-sized glass substrate 9.In addition, on the frame of supervisory personnel, be equivalent to the place of above-mentioned escape hole, form hiding of U font respectively with hole 14,15 to the inboard that keeps frame-saw 2 and front side.
Fig. 3 A is 11 (10) the concrete figure that constitute of the movable reference pins of expression mechanism, and Fig. 3 B is the planimetric map and the cross-sectional side view of L font arm.The movable reference pins mechanism 11 that in Fig. 3 A, has represented in the frame of the front side (supervisory personnel's one side) that keeps frame-saw 2, to be disposed.
Movable reference pins mechanism 11 (10) has L font arm 102.Shown in Fig. 3 B, on the free end of L font arm 102, the movable reference pins 111 (101) of the topped mar proof resin on the side face of ball bearing that setting can rotate freely (for example polyimide, give be coated with ether ketone etc.).The movable pin 103 (ball bearing) that can rotate freely is set below the base end part of L font arm 102.In addition, in keeping frame-saw 2, be provided with cylinder 104.
Cylinder 104 has two cylinder rods that can directly move 105,105.Point at cylinder rod 105,105 is equipped with straight moving rotational transform member 106.On straight moving rotational transform member 106, slotted hole 107 is arranged, in this slotted hole 107, insert movable pin 103.On the bend of L font arm 102, turning axle 108 is set by bearing.Being configured to turning axle 108 and can freely rotating in arrow a direction of L font arm 102 for the center.
On the other hand, on the edge of empty portion 2 ' one sides that keep frame-saw 2, on the track of the movable reference pins 111 (101) when L font arm 102 rotates, form hiding of U font with hole (being also referred to as grooving) 15 (14).In addition, the promising L of the making font arm 102 of configuration stops in keeping frame-saw 2 by screw constitute grades 16.The supervisory personnel makes its point turnover by rotary screw 16, can finely tune the stop position of L font arm 102.So just can adjust the error of the position of movable reference pins 111 (101) settings to the reference position.
In the movable benchmark mechanism 11 (10) of above formation, movable reference pins 111 (101) is when the glass substrate that keeps given size, for example small-sized glass substrate 9, rotate to inboard (the empty portion side) direction that keeps frame-saw 2, be arranged on the reference position corresponding to small-sized glass substrate 9.In addition, movable reference pins 111 (101) is at the glass substrate that keeps the afore mentioned rules size with outside dimension, for example during large glass substrate 8, rotates to the outside (front side (the inboard)) direction that keeps frame-saw 2, can hide and hide with in the hole 15 (14).Though movable reference pins mechanism 10 is owing to be provided with the different but identical formation in position with movable reference pins 11, so the explanation of its formation is omitted.
The glass substrate size conversion indication of these movable reference pins 101,111 by sending from following operating portion can be arranged on each reference position of small-sized glass substrate 9 automatically, perhaps hides and respectively hiding with in the hole 14,15.
It is also the same with movable reference pins 101,111 respectively to compress pin 4a ~ 4d, drives by the mechanism that adopts cylinder.
Fig. 4 is expression, the mode chart that movable reference pins mechanism 10,11 drive systems constitute.Connecting pipings 310,320 on each cylinder 104,104 of movable reference pins mechanism 10,11.On each pipe arrangement 310,320, valve 301,303 and air release 302,304 are set respectively.On each pipe arrangement 310,320, flow into pressurized air.31 pairs of each valves 301,303 of drive division and air release 302,304 carry out driven for opening and closing.Attended operation portion 32 on drive division 31.Each cylinder 104,104 by each L font arm 102, makes each movable reference pins 101,111 removable around each turning axle 108 by pressurized air.The supervisory personnel is to drive division 31, from the dimension information of operating portion 19 input glass substrates.
In above-mentioned drive system, drive each movable reference pins mechanism 10,11 by each cylinder 104,104.But be not limited to this, also can between the movable reference pins of a cylinder and each mechanism 10,11, connect mechanism be set, rotate each L font arm 102.In movable reference pins mechanism 10,11, except cylinder, also can use various gearings such as step motor.
By the control of above-mentioned drive system, each movable reference pins 101,111 can be arranged on each reference position to small-sized glass substrate 9 automatically, perhaps hides to respectively hiding with in the hole 14,15.But be not limited to this, manual manipulation that also can be by the supervisory personnel is perhaps hidden the reference position that each movable reference pins 101,111 is arranged on corresponding to small-sized glass substrate 9 and is respectively being hidden with in the hole 14,15.
Below the substrate maintenance effect on the substrate holder of above-mentioned formation is described.
At first, when large glass substrate 8 being carried out macroscopic view (or microcosmic) observation, can detect the reference position that movable reference pins 101,111 is arranged on corresponding to small-sized glass substrate 9.At this moment, when by the supervisory personnel during from the dimension information of operating portion 32 input large glass substrates 8, the drive control signal of expression large glass substrate 8 sizes is transferred to drive division 31.
Drive division 31 drives each cylinder 104,104, each movable reference pins 101,111 is hidden respectively hidden with in the hole 14,15, at this moment drive division 31 is opened valve 301,301, the group's of closing air release 302,302, the group's of closing valve 303,303 is opened air release 304,304 simultaneously.Like this, by flowing into pressurized air to each cylinder 104,104, extrude each directly moving turn conversion member 106 with each cylinder rod 105,105 from each pipe arrangement 310.Like this, the movable pin 103 in the slotted hole 107 moves to inboard (the empty portion one side) direction that keeps frame-saw 2 along the sidewall of slotted hole 107.Simultaneously owing to each L font arm 102 rotates around each turning axle 108, so each movable reference pins 101,111 is rotated to the outside (front side (the inboard)) direction that keeps frame-saw 2.Soon, each movable reference pins 101,111 is inserted into respectively to be hidden with in the hole 14,15, and each movable pin 103 stops at the antetheca that touches each slotted hole 107.Like this, each movable reference pins 101,111 is just hidden to respectively hiding with hole 14,15 from the empty portion 2 ' that keeps frame-saw 2 and.
Fig. 5 A is the constitutional diagram of expression when keeping large glass substrate 8 by above-mentioned substrate holder.Hide the state of hiding with in the hole 14,15 respectively in each movable reference pins 101,111, large glass substrate 8, is arranged on the maintenance frame-saw 2 shown in Fig. 5 A by the supervisory personnel, and its two limit touches respectively on reference pins 3c, 3d and 3a, the 3d.Like this, compress pin 4a, 4b and 4c, 4d respectively on compaction direction f1, f2, two limits of large glass substrate 8 touch respectively on reference pins 3c, 3d and 3a, the 3d.Thereby large glass substrate 8 is pressed on each reference pins 3a ~ 3d, positions.
Then, when small-sized glass substrate 9 being carried out macroscopic view when observation, during from the dimension information of the small-sized glass substrate 9 of operating portion 32 inputs, represent that the drive control signal of small-sized glass sheet 9 sizes is transferred to drive division 31 by the supervisory personnel.
Drive division 31 drives each cylinder 104,104, makes each movable reference pins 101,111 respectively from hiding with coming out in the hole 14,15, is arranged on the reference position corresponding to the small-sized glass substrate 9 that keeps frame-saw 2 inboards (empty portion one side).At this moment, drive division 31 valve-offs 301,301 are opened air release 302,302, open valve 303,303 simultaneously, close air release 304,304.Like this, by from the pressurized air of each pipe arrangement 320, retract each automatic rotational transform member 106 with each cylinder rod 105,105 to each cylinder 104,104 inflow.Like this, the movable pin 103 in the slotted hole 107 moves to the outside (side (inboard) at the moment) direction that keeps frame-saw 2 along the sidewall of slotted hole 107.Meanwhile, because the rotation around turning axle 108 of each L font arm 102, so each movable reference pins 101,111 is rotated to inboard (the empty portion one side) direction that keeps frame-saw 2.Soon, each movable reference pins 101,111 is respectively from hiding with coming out in the hole 14,15, and each L font arm 102 touches on the shelves 16 and stops.Like this, each movable reference pins 101,111 is arranged on the reference position corresponding to small-sized glass substrate 9 respectively from hiding with coming out the hole 14,15.
Constitutional diagram when Fig. 5 B represents to keep small-sized glass substrate by above-mentioned substrate holder.Be set in state respectively in each movable reference pins 101,111 corresponding to small-sized glass substrate 9 reference positions that keep frame-saw 2 inboards (empty portion one side), small-sized glass substrate 9 is arranged on shown in Fig. 5 B and keeps on the frame-saw 2, and its two limit touches respectively on reference pins 3d and each movable reference pins 101,111.Like this, compress pin 4b and 4c, 4d and extrude at compaction direction f1, f2 respectively, two limits of small-sized glass substrate 9 touch respectively on reference pins 3d and the movable reference pins 101,111.Like this, small-sized glass substrate 9 is pressed on reference pins 3d and each movable reference pins 101,111, positions.
Shown in Fig. 6 A, Fig. 6 B, movable reference pins of double as and the pin 101 ', 111 ' that compresses pin can be set also.These pins 101 ', 111 ' carry out the selectivity action as the pin that compresses that compresses the movable reference pins of small-sized glass substrate or compress small-sized glass substrate according to sizes of substrate.Pin 101 ', 111 ' as shown in Figure 6, is hidden respectively to hiding with in the hole 14,15 when carrying out the observation of large glass substrate 8.In addition, when pin 101 ', 111 ' when carrying out the observation of small-sized glass substrate 9, can shown in Fig. 6 B, from hiding, small-sized glass substrate 9 be compressed to each reference pins 3a, 3b respectively with coming out the hole 14,15.
As mentioned above, in this 1st embodiment, the mechanism of setting when keeping small-sized glass substrate 9, makes movable reference pins 101,111 rotate to the inboard that keeps frame-saw 2, is arranged on the reference position corresponding to small-sized glass substrate 9; And when keeping large glass substrate 8, movable reference pins 101,111 is rotated to the outside that keeps frame-saw 2, hide to hiding with in the hole 14.Like this, even object of observation changes to large glass substrate 8 or small-sized glass substrate 9, also can rotate each movable reference pins 101,111, automatic setting is located on the reference position that is configured in corresponding to large glass substrate 8 or small-sized glass substrate 9 reference pins of the glass substrate of this size.And, by the automatic setting of reference pins, also can shorten observation station's time spent, owing to do not need supervisory personnel's manual manipulation, so can not produce the Zhu dust.
Each movable reference pins 101,111 also can be set by supervisory personnel's manual manipulation, owing to just rotate each movable reference pins 101,111, so do not take time, just can set with shirtsleeve operation.
In addition, in this 1st embodiment, receive the operation input of glass substrate size, automatic setting corresponding to the reference pins of large glass substrate 8 or small-sized glass substrate 9.Like this, even object of observation changes to large glass substrate 8 or small-sized glass substrate 9, also can correctly set reference pins corresponding to these glass substrates 8,9 positions.
In addition,, movable reference pins 101,111 is rotated respectively to the outside that keeps frame-saw 2, hide and hiding with in the hole 14,15 when when penetrating light observation large glass substrate 8.Like this, movably reference pins 101,111 can not hinder the light that penetrates of large glass substrate 8 to observe.
The 2nd embodiment of the present invention is described with reference to the accompanying drawings.Part identical with Fig. 2 in each figure is added with same numeral, and its detailed description is omitted.
Fig. 7 A, Fig. 7 B represent the pie graph of the substrate holder that the 2nd embodiment of the present invention is related.Keeping being provided with on the frame-saw 2 most movable reference pins mechanisms 10,11, most movable reference pins 121,122 and 123,124 to (two groups) are set to (two pairs).These movable reference pins 121,122 and 123,124 are set each reference position of the 1st small-sized glass substrate 20 and the 2nd small-sized glass substrate 21 respectively.
A pair of movable reference pins 121,122 is set the reference position of the 1st small-sized glass substrate 20.Another sets the reference position of the 2nd small-sized glass substrate 21 of big size than the 1st small-sized glass substrate 20 sizes to movable reference pins 123,124.These movable reference pins 121 ~ 124 and driving mechanisms thereof have identical formation with the situation of the movable reference pins 101,111 shown in above-mentioned the 1st embodiment, and base describes in detail and omitted.
These movable reference pins 121,122 and 123,124 are rotated to the interior side direction that keeps frame-saw 2 when the small-sized glass substrate 20,21 that keeps given size respectively, are arranged on the reference position.And movable reference pins 121 ~ 124 is when the glass substrate that keeps given size with outside dimension, promptly during large glass substrate 8, rotates to the outside that keeps frame-saw 2, hides and respectively hiding with in the hole 131,132,133,134.
In addition, these movable reference pins 121 ~ 124 are shown in above-mentioned the 1st embodiment, by the drive mechanism that is made of cylinder etc.That is, drive division 31 is accepted the information from the glass substrate size of operating portion 32 inputs by the supervisory personnel, drives cylinder 104, rotates movable reference pins 121 ~ 124 automatically by L font arm 102.
Below the substrate maintenance effect in the retainer mechanism is as constituted above described.
At first, when large glass substrate 8 is observed, by the dimension information of supervisory personnel from operating portion 32 input large glass substrates 8.And the same with above-mentioned the 1st embodiment, each movable reference pins 121,122 and 123,124 rotates each L font arm 102 by each cylinder 104 around each turning axle 108, hide respectively and hiding with in the hole 131,132,133,134.
At this state, large glass substrate 8 identical with shown in Fig. 5 A, Fig. 6 A, be set in and keep on the frame-saw 2, its two limit contacts respectively on each reference pins 3c, 3d and 3a, 3d, and, be pressed on each reference pins 3c, 3d and 3a, the 3b by producing snap-in force to each compaction direction f1, f2 by respectively compressing pin 4a, 4b and 4c, 4d.
Then, when the 1st small-sized glass substrate 20 is observed, during from the dimension information of operating portion 32 input the 1st small-sized glass substrate 20, represent that the drive control signal of the 1st small-sized glass substrate 20 sizes is transferred to drive division 31 by the supervisory personnel.
Drive division 31 drives each cylinder 104,104 shown in Fig. 7 A, make each movable reference pins 121,122 respectively from hiding with coming out in the hole 131,132, is arranged on the reference position corresponding to the 1st small-sized glass substrate 20 that keeps frame-saw 2 inboards.Like this, each L font arm 102 is rotated around each turning axle 108, make each movable reference pins 121,122, be arranged on the reference position corresponding to the 1st small-sized glass substrate 20 respectively from hiding with coming out the hole 131,132 by each cylinder 104.At this moment, other each movable reference pins 123,124 are hidden in respectively hiding usefulness hole 133,134.
At this state, the 1st small-sized glass substrate 20 is arranged on shown in Fig. 7 A and keeps on the frame-saw 2, its two limit contacts respectively on reference pins 3d and each movable reference pins 121,122, by by respectively compressing pin 4b and 4c, 4d, be pressed on reference pins 3d and each movable reference pins 121,122 simultaneously in the snap-in force that each compaction direction f1, f2 produce.
Then, when the 2nd small-sized glass substrate 21 is observed, when during from the dimension information of operating portion 32 input the 2nd small-sized glass substrate 21, representing that the drive control signal of the 2nd small-sized glass substrate 21 sizes is transferred to drive division 31 by the supervisory personnel.
Drive division 31 drives each cylinder 104,104 shown in Fig. 7 B, make each movable reference pins 123,124 respectively from hiding with coming out in the hole 133,134, is arranged on the reference position corresponding to the 2nd small-sized glass substrate 21 that keeps frame-saw 2 inboards.Like this, by each cylinder 104 each L font arm 102 is rotated around each turning axle 108, each movable reference pins 123,124 is arranged on the reference position corresponding to the 2nd small-sized glass substrate 21 from respectively hiding with coming out the hole 133,134.At this moment, the movable reference pins 121,122 of other each is hidden to respectively hiding with in the hole 131,132.
At this state, the 2nd small-sized glass substrate 21 is arranged on shown in Fig. 7 B and keeps on the frame-saw 2, its two limit touches respectively on reference pins 3d and each movable reference pins 123,124, by by respectively compressing pin 4b and 4c, 4d, be pressed on reference pins 3d and each movable reference pins 123,124 simultaneously in the snap-in force that each compaction direction f1, f2 produce.
In above-described the 2nd embodiment, except large glass substrate 8, in order to set the glass substrate of most sizes, the reference position of the 1st small-sized glass substrate 20 and the 2nd small-sized glass substrate 21 and be provided with each movable reference pins 121 ~ 124 for example.Like this, can be correctly and automatically set reference pins corresponding to most dimension glass substrates.And, by the automatic setting of reference pins, can also shorten observation station's time spent, owing to do not need the supervisory personnel to carry out manual manipulation, so can not produce the Zhu dust.
The 3rd embodiment of the present invention is described with reference to the accompanying drawings.
Fig. 8 A, Fig. 8 B represent the pie graph of the substrate holder that the 3rd embodiment of the present invention is related.Keep frame-saw 2 to be provided with the movable datum plate 30 of I word shape, can move freely at horizontal (directions X).On this movable datum plate 30, be provided with for example 2 movable reference pins 30a, 30b with predetermined distance.This movable datum plate 30 shown in Fig. 8 B, is set the reference position of specific dimensions glass substrate 33 by to laterally moving.As shown in Fig. 8 A, when making movable datum plate 30 move on the accompanying drawing rightmost side, each movable reference pins 30a, 30b are arranged on the reference position of large glass substrate 8.
Fig. 9 A is the mode chart that movable datum plate 30 driving mechanisms of expression constitute, and Fig. 9 B is its cross-sectional side view.One end twist of movable datum plate 30 is on feed screw 34, and near the foot 301,301 the two ends rides on the guide rail 35,35 by bearing etc. respectively.These feed screws 34 and guide rail 35 are housed in and keep in the frame-saw 2.Feed screw 34 is connected on the turning axle of motor (step motor) 37.Motor 37 drives by motor control part 36.Attended operation portion 38 on motor control part 36.
On operating portion 38,, import the size of glass substrate by supervisory personnel's operation.Motor control part 36 is according to the glass substrate size from operating portion 38 operated inputs, and the driving time of control motor 37 moves movable datum plate 30, and each movable reference pins 30a, 30b are set on the reference position of this glass substrate.
Except moving the movable datum plate 30 with electronic, also can on 2 guide rails being laid, ride movable datum plate foot 301,301, by supervisory personnel's manual manipulation, move movable datum plate 30, each movable reference pins 30a, 30b are set on the reference position of this glass substrate.
Below, the substrate maintenance effect of the substrate holder that constitutes is as mentioned above described.
When by the supervisory personnel during from the dimension information of the glass substrate 33 of operating portion 38 input specific dimensions, the drive control signal of glass substrate 33 sizes of expression specific dimensions is transferred to motor control part 36.Motor control part 36 is according to the size of the glass substrate of being imported 33, and control motor 37 makes feed screw 34 rotations, thereby movable datum plate 30 is moved, and each movable reference pins 30a, 30b are arranged on the reference position of this glass substrate.
At this state, the glass substrate 33 of specific dimensions is shown in Fig. 8 B, be arranged on the maintenance frame-saw 2 by the supervisory personnel, its two limit touches respectively on each movable reference pins 30a, 30b of reference pins 3c, 3d and movable datum plate 30, according to respectively compressing pin 4a, 4b and 4c, 4d, be pressed on reference pins 3c, 3d and each movable reference pins 30a, the 30b simultaneously in the snap-in force that each compaction direction f1, f2 produce.
As mentioned above, in this 3rd embodiment, keeping being provided with the movable datum plate 30 that 2 movable reference pins 30a, 30b are for example arranged on the frame-saw 2, can laterally move freely on (directions X).Like this, just large glass substrate 8, small-sized glass substrate 9, reference position that also can automatic setting specific dimensions glass substrate 33.And, by the automatic setting of reference pins, can also shorten observation station's time spent, owing to do not need the supervisory personnel to carry out manual manipulation, so can not produce the Zhu dust.
Even when setting each movable reference pins 30a, 30b, also,, can set with simple operation so do not take time owing to only move movable datum plate 30 by supervisory personnel's manual manipulation.
With reference to the accompanying drawings the 4th embodiment of the present invention is described.Part identical with Fig. 2 in each figure is added with same numeral, and its detailed description is omitted.
Figure 10 A, Figure 10 B represent the pie graph of the substrate holder that the 4th embodiment of the present invention is related.Keep frame-saw 2 to be provided with the movable datum plate 40 of L word shape, can move freely on the direction (XY direction) in length and breadth.On this movable datum plate 40, for example be provided with movable reference pins 41,42 and 43,44 respectively with predetermined distance on the direction in length and breadth.This movable datum plate 40 is set the reference position of specific dimensions glass substrate 45 by moving to direction in length and breadth as shown in Figure 10 B.Shown in Figure 10 A, when movable datum plate 40 being moved on the accompanying drawing lower right side, each movable reference pins 41 ~ 44 can be set on the reference position of large glass substrate 8.
Figure 11 is the mode chart that movable datum plate 40 driving mechanisms of expression constitute.40 pairs of movable datum plates keep frame-saw 2 to link by a plurality of for example 2 abutment ring members 46,47.46,47 pairs of these abutment ring members keep frame-saw 2 and movable datum plate 40, are arranged to free to rotate by each turning axle 46b, 46a and 47b, 47a respectively.In addition, some the going up among each turning axle 46a, 46b, 47a, the 47b links unillustrated motor axis of rotation among the figure.By driving this motor, 40 pairs of movable datum plates keep frame-saw 2 moving on the direction (XY direction) in length and breadth.Like this, reference position that can automatic setting specific dimensions glass substrate 45.
Substrate maintenance effect to the substrate holder of above-mentioned formation describes below.
When keeping the glass substrate 45 of specific dimensions with above-mentioned substrate holder, by unillustrated motor among the figure, each abutment ring member 46,47 rotates to same direction, and movable datum plate 40 can be to direction (XY direction) is mobile in length and breadth.Like this, movable reference pins 41 ~ 44 can be arranged on the reference position of this glass substrate 45.
At this state, the glass substrate 45 of specific dimensions is as shown in Figure 10 B, can be arranged on by the supervisory personnel and keep on the frame-saw 2, its two limit touches respectively on movable reference pins 43,44 and 41,42, by respectively compress the snap-in force that pin 4a, 4b and 4c, 4d produce on each compaction direction f1, f2, be pressed on movable reference pins 43,44 and 41,42 simultaneously.
As mentioned above, in above-mentioned the 4th embodiment,, can move freely on the direction (XY direction) in length and breadth keeping being provided with the movable datum plate 40 of 4 movable reference pins 41 ~ 44 on the frame-saw 2.Like this, be not large glass substrate 8, the reference position of all right automatic setting specific dimensions glass substrate 45.And, by the automatic setting of reference pins, can also shorten macroscopical observation station time spent, owing to do not need the supervisory personnel to carry out manual manipulation, so can not produce the Zhu dust.
Even set each movable reference pins 41 ~ 44 o'clock,,, set with shirtsleeve operation so can not take time owing to only move a movable datum plate 40 by supervisory personnel's manual manipulation.
Figure 12 A, Figure 12 B are the pie graphs of the related substrate holder of the variation of above-mentioned the 4th embodiment of expression.In above-mentioned the 4th embodiment, be provided with the movable datum plate 40 of the L word shape that can on direction (XY direction) in length and breadth, move freely, but as Figure 12 A, Figure 12 B as shown in, also can be arranged on the independent respectively movable datum plate 48,49 that moves on the XY direction.On movable datum plate 48,49, be provided with reference pins main body 50,51 and 52,53 respectively. Movable datum plate 48,49 drives by indivedual various gearings and motors (step motor) that are provided with.The configuration of movable datum plate 48,49 is not being disturbed when the XX direction moves each other.Like this, do not increase and keep the thickness of frame-saw 2 to get final product.
Variation to above-mentioned the 1st ~ the 4th embodiment describes below.
In above-mentioned the 1st embodiment, be movable reference pins to be rotated be arranged on the reference position, make glass substrate be pressed on formation on this movable reference pins, but be not limited to this.If guarantee the glass substrate that size is different, for example the reference position of the small-sized glass substrate that size is little then can be moved the member that is equivalent to movable reference pins and is arranged on the inboard (empty portion one side) that keeps frame-saw with straight line.And when the glass substrate of observation beyond the small-sized glass substrate, for example during the large glass substrate, the member that is equivalent to above-mentioned movable reference pins moves to hide with straight line and is keeping the hiding with in the hole of frame-saw.
Figure 13 A, Figure 13 B are the distortion illustrations of the formation shown in presentation graphs 6A, Fig. 6 B.In Fig. 6 A, Fig. 6 B, movable reference pins is also being done the time spent as compressing pin, be that this pin is rotated.In the formation of Figure 13 A, Figure 13 B, on the direction that maintenance frame-saw 2 is tilted, be provided with and hide with hole 60,61, make the member 62,63 that is equivalent to compress pin, so that the angled state straight line of glass substrate is moved.
When carrying out the macroscopic view observation of large glass substrate 8, as shown in FIG. 13A, member 62,63 can be hidden respectively and hide with in the hole 60,61.In addition, when carrying out the observation of small-sized glass substrate 9, shown in Figure 13 B, member 62,63 from hiding with coming out the hole 14,15, compresses small-sized glass substrate 9 from vergence direction respectively.Member 62,63 drives by the various gear trains and the motor (step motor) of individual settings.
In addition, in above-mentioned the 3rd embodiment the supervisory personnel operates the input glass substrate on operating portion size, according to the size of the glass substrate of being imported, control is set in the movable reference pins of movable datum plate on the reference position of this glass substrate.But, have more than and be limited to such embodiment, also can be at the sensor of a plurality of local configuration detection glass substrate size that for example keeps frame-saw 2.At this moment, when placing glass substrate on keeping frame-saw 2, according to the size of the glass substrate that detects, movable datum plate is moved in control, and movable reference pins is arranged on the reference position of this glass substrate.
In addition, it in above-mentioned the 3rd embodiment size according to the glass substrate of importing from the operating portion operation, control moving of movable datum plate with the driving time of motor, the movable reference pins of movable datum plate can be arranged on the reference position of this glass substrate, but have more than the such embodiment of limit.
In the formation of Fig. 6 A, Fig. 6 B and Figure 13 A, Figure 13 B, make movable reference pins as compressing the pin effect.Except that these, also can make the movable datum plate that for example has movable reference pins, move to direction (XY direction) in length and breadth according to the glass substrate size of object of observation, by this movable reference pins this glass substrate is pressed in each reference pins that keeps frame-saw.
The present invention has more than and is limited to the various embodiments described above, can be out of shape enforcement in the scope that does not change main idea in good time.
Utilize possibility on the industry
Can provide according to the present invention and can simply carry out reference feature to the different glass substrate of size The retainer mechanism of change operation.

Claims (8)

1, a kind of retainer mechanism is characterized in that comprising:
The maintenance frame-saw that is held body that keeps rectangle;
The fixed base pilot pin, it keeps the contiguous both sides of frame-saw to be provided with along this, and sets the above-mentioned reference position that is held body;
Compress pin, its in opposite directions both sides configuration along the both sides that are configured with these fixed base pilot pins, and the above-mentioned body that is held is compressed to above-mentioned fixed reference pin;
Movable reference pins, it is located in the above-mentioned maintenance frame-saw, and is transportable between the reference position of the above-mentioned size that is held body of correspondence and the retreating position in the above-mentioned maintenance frame-saw; And
Drive the movable reference pins mechanism of above-mentioned movable reference pins.
2, retainer as claimed in claim 1 mechanism is characterized in that:
Above-mentioned movable reference pins mechanism has: with the swivel arm of inflection point as the L word shape of turning axle; The rotatable movable reference pins of being located at this swivel arm free end freely; And be connected in the driver of the base end part of this swivel arm;
By above-mentioned swivel arm the rectilinear motion of this driver is transformed to rotation, makes above-mentioned movable reference pins movable between above-mentioned yielding position and said reference position.
3, retainer as claimed in claim 2 mechanism is characterized in that:
The swivel arm of above-mentioned L word shape can be adjusted the said reference position by the detent with fine adjustment function.
4, retainer as claimed in claim 1 mechanism is characterized in that:
Above-mentioned movable reference pins is to use the bearing that covers wear-resistant resin on side face.
5, retainer as claimed in claim 1 mechanism is characterized in that:
Above-mentioned movable reference pins is being provided with corresponding to the reference position that is held the body size;
Above-mentioned movable reference pins mechanism drives the said reference pin selectively according to the dimension information that is held body.
6, a kind of retainer mechanism is characterized in that having:
The maintenance frame-saw that is held body that keeps rectangle:
The fixed base pilot pin is provided with along the both sides with this maintenance frame-saw adjacency, and is used to set the described reference position that is held body;
Compress pin, it is along being set up with both sides in opposite directions, the both sides that these fixed base pilot pins are set, and the above-mentioned body that is held is pressed in the said fixing reference pins;
Movably compress pin, it is set in the above-mentioned maintenance frame-saw, and above-mentioned corresponding compacted position of size that is held body and the yielding position in the above-mentioned maintenance frame-saw between be movable;
Movably compress pin mechanism, it is used for driving and movably compresses pin, and this movably compresses pin is that the above-mentioned body that is held is pressed in the said fixing reference pins.
7, retainer as claimed in claim 6 mechanism is characterized in that:
The above-mentioned pin mechanism that movably compresses has:
With the swivel arm of inflection point as turning axle L word shape;
Rotate the free-ended pin that movably compresses that is arranged on this swivel arm freely; And
The driver that is connected with the base end part of above-mentioned swivel arm is transformed to rotation by above-mentioned swivel arm with the rectilinear motion of this driver, and makes that above-mentioned movably to compress pin movable between above-mentioned yielding position and above-mentioned compacted position.
8, retainer as claimed in claim 6 mechanism is characterized in that:
The described pin that movably compresses is to use the bearing that applies the mar proof resin on the side face.
CNB018010989A 2000-04-26 2001-04-25 Holder mechanism Expired - Fee Related CN1189739C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000126045 2000-04-26
JP126045/2000 2000-04-26
JP126045/00 2000-04-26

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KR100582345B1 (en) * 2003-12-09 2006-05-22 삼성코닝정밀유리 주식회사 Apparatus for clamping a glass substrate for inspection
US9082799B2 (en) * 2012-09-20 2015-07-14 Varian Semiconductor Equipment Associates, Inc. System and method for 2D workpiece alignment
CN103399020A (en) * 2013-07-24 2013-11-20 惠晶显示科技（苏州）有限公司 Glass testing device
JP5941971B2 (en) * 2014-12-10 2016-06-29 東京エレクトロン株式会社 Ring-shaped shield member and substrate mounting table provided with ring-shaped shield member

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JPS59155471A (en) * 1983-02-24 1984-09-04 Nippon Piston Ring Co Ltd Heat-resistant, wear-resistant coating material
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JPH0193735U (en) * 1987-12-16 1989-06-20
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TW501219B (en) 2002-09-01
WO2001081903A1 (en) 2001-11-01
JP4803940B2 (en) 2011-10-26
KR20020022697A (en) 2002-03-27
KR100764313B1 (en) 2007-10-05
AU5257001A (en) 2001-11-07

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