CN118922936A - 冷却器以及半导体模块 - Google Patents

冷却器以及半导体模块 Download PDF

Info

Publication number
CN118922936A
CN118922936A CN202380028530.4A CN202380028530A CN118922936A CN 118922936 A CN118922936 A CN 118922936A CN 202380028530 A CN202380028530 A CN 202380028530A CN 118922936 A CN118922936 A CN 118922936A
Authority
CN
China
Prior art keywords
cooler
main surface
heat dissipation
layer
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380028530.4A
Other languages
English (en)
Chinese (zh)
Inventor
林口匡司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN118922936A publication Critical patent/CN118922936A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202380028530.4A 2022-03-22 2023-03-08 冷却器以及半导体模块 Pending CN118922936A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-045601 2022-03-22
JP2022045601 2022-03-22
PCT/JP2023/008826 WO2023181944A1 (ja) 2022-03-22 2023-03-08 冷却器および半導体モジュール

Publications (1)

Publication Number Publication Date
CN118922936A true CN118922936A (zh) 2024-11-08

Family

ID=88101298

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380028530.4A Pending CN118922936A (zh) 2022-03-22 2023-03-08 冷却器以及半导体模块

Country Status (4)

Country Link
US (1) US20240421028A1 (https=)
JP (1) JPWO2023181944A1 (https=)
CN (1) CN118922936A (https=)
WO (1) WO2023181944A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119717340A (zh) * 2023-09-28 2025-03-28 群创光电股份有限公司 电子装置及其制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766339A (ja) * 1993-08-31 1995-03-10 Hitachi Ltd 半導体冷却装置
JPH0727161U (ja) * 1993-10-22 1995-05-19 株式会社アドバンテスト 電子部品用冷却装置
JP4367331B2 (ja) * 2004-12-17 2009-11-18 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
US20240421028A1 (en) 2024-12-19
WO2023181944A1 (ja) 2023-09-28
JPWO2023181944A1 (https=) 2023-09-28

Similar Documents

Publication Publication Date Title
US20070236883A1 (en) Electronics assembly having heat sink substrate disposed in cooling vessel
JP7380062B2 (ja) 半導体モジュール
CN112514066B (zh) 半导体装置
US6943293B1 (en) High power electronic package with enhanced cooling characteristics
CN103988298A (zh) 半导体装置
CN100533764C (zh) 半导体装置的模块结构
US11990393B2 (en) Semiconductor device including resin with a filler for encapsulating bridge member connected to a substrate
US20210005528A1 (en) Semiconductor module, semiconductor device, and manufacturing method of semiconductor module
CN104160502A (zh) 半导体模块
JP7070661B2 (ja) 半導体装置
WO2024116873A1 (ja) 半導体モジュール
CN206471321U (zh) 半导体装置
US20240421028A1 (en) Cooler and semiconductor module
JP4019993B2 (ja) 半導体装置
JP7218806B2 (ja) 半導体装置
WO2024029274A1 (ja) 半導体装置
WO2023210379A1 (ja) 半導体モジュール
US20250118629A1 (en) Cooler and cooling structure for semiconductor device
US20250246510A1 (en) Cooling structure for a semiconductor device
US20240203849A1 (en) Semiconductor device and mounting structure for semiconductor device
US20250226281A1 (en) Semiconductor device
US20250391750A1 (en) Semiconductor device, semiconductor assembly, and vehicle
JP2004055830A (ja) 半導体装置
WO2026034289A1 (ja) 半導体装置、半導体モジュールおよび車両
CN116783707A (zh) 功率半导体器件

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination