JPWO2023181944A1 - - Google Patents
Info
- Publication number
- JPWO2023181944A1 JPWO2023181944A1 JP2024509974A JP2024509974A JPWO2023181944A1 JP WO2023181944 A1 JPWO2023181944 A1 JP WO2023181944A1 JP 2024509974 A JP2024509974 A JP 2024509974A JP 2024509974 A JP2024509974 A JP 2024509974A JP WO2023181944 A1 JPWO2023181944 A1 JP WO2023181944A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
- H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022045601 | 2022-03-22 | ||
| PCT/JP2023/008826 WO2023181944A1 (ja) | 2022-03-22 | 2023-03-08 | 冷却器および半導体モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181944A1 true JPWO2023181944A1 (https=) | 2023-09-28 |
| JPWO2023181944A5 JPWO2023181944A5 (https=) | 2024-11-29 |
Family
ID=88101298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509974A Pending JPWO2023181944A1 (https=) | 2022-03-22 | 2023-03-08 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240421028A1 (https=) |
| JP (1) | JPWO2023181944A1 (https=) |
| CN (1) | CN118922936A (https=) |
| WO (1) | WO2023181944A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119717340A (zh) * | 2023-09-28 | 2025-03-28 | 群创光电股份有限公司 | 电子装置及其制作方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766339A (ja) * | 1993-08-31 | 1995-03-10 | Hitachi Ltd | 半導体冷却装置 |
| JPH0727161U (ja) * | 1993-10-22 | 1995-05-19 | 株式会社アドバンテスト | 電子部品用冷却装置 |
| JP4367331B2 (ja) * | 2004-12-17 | 2009-11-18 | 三菱電機株式会社 | 半導体装置 |
-
2023
- 2023-03-08 WO PCT/JP2023/008826 patent/WO2023181944A1/ja not_active Ceased
- 2023-03-08 CN CN202380028530.4A patent/CN118922936A/zh active Pending
- 2023-03-08 JP JP2024509974A patent/JPWO2023181944A1/ja active Pending
-
2024
- 2024-09-03 US US18/823,279 patent/US20240421028A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240421028A1 (en) | 2024-12-19 |
| WO2023181944A1 (ja) | 2023-09-28 |
| CN118922936A (zh) | 2024-11-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240724 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260227 |