CN118715877A - 布线电路基板及其制造方法 - Google Patents

布线电路基板及其制造方法 Download PDF

Info

Publication number
CN118715877A
CN118715877A CN202380022364.7A CN202380022364A CN118715877A CN 118715877 A CN118715877 A CN 118715877A CN 202380022364 A CN202380022364 A CN 202380022364A CN 118715877 A CN118715877 A CN 118715877A
Authority
CN
China
Prior art keywords
conductor
metal support
layer
coating layer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380022364.7A
Other languages
English (en)
Chinese (zh)
Inventor
桑山裕纪
石井淳
大薮恭也
镰仓真树
程野将行
重良直史
阿曾知起
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN118715877A publication Critical patent/CN118715877A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
CN202380022364.7A 2022-02-16 2023-02-13 布线电路基板及其制造方法 Pending CN118715877A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022022327 2022-02-16
JP2022-022327 2022-02-16
PCT/JP2023/004740 WO2023157794A1 (ja) 2022-02-16 2023-02-13 配線回路基板およびその製造方法

Publications (1)

Publication Number Publication Date
CN118715877A true CN118715877A (zh) 2024-09-27

Family

ID=87578206

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380022364.7A Pending CN118715877A (zh) 2022-02-16 2023-02-13 布线电路基板及其制造方法

Country Status (5)

Country Link
JP (1) JPWO2023157794A1 (https=)
KR (1) KR20240147693A (https=)
CN (1) CN118715877A (https=)
TW (1) TW202341823A (https=)
WO (1) WO2023157794A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025192060A1 (ja) * 2024-03-15 2025-09-18 株式会社村田製作所 弾性波フィルタ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179291A (ja) 2002-11-26 2004-06-24 Ibiden Co Ltd 配線板および配線板の製造方法
JP2008098202A (ja) * 2006-10-05 2008-04-24 Ngk Spark Plug Co Ltd 多層配線基板、多層配線基板構造体
JP2017108033A (ja) * 2015-12-11 2017-06-15 イビデン株式会社 配線基板及びその製造方法

Also Published As

Publication number Publication date
KR20240147693A (ko) 2024-10-08
JPWO2023157794A1 (https=) 2023-08-24
TW202341823A (zh) 2023-10-16
WO2023157794A1 (ja) 2023-08-24

Similar Documents

Publication Publication Date Title
US8334461B2 (en) Wiring board and electronic component device
KR101469698B1 (ko) 배선 기판 및 그 제조 방법
KR101392950B1 (ko) 배선기판 및 배선기판 제조방법
US20090017613A1 (en) Method of manufacturing interconnect substrate and semiconductor device
US8330050B2 (en) Wiring board having heat intercepting member
KR20100130555A (ko) 배선기판 및 그 제조방법
JP2002164467A (ja) 回路ブロック体及びその製造方法、配線回路装置及びその製造方法並びに半導体装置及びその製造方法
US7943863B2 (en) Wiring substrate and manufacturing method thereof, and semiconductor device
JP3757172B2 (ja) 半導体装置及びその製造方法
JP6600573B2 (ja) 配線基板及び半導体パッケージ
CN118715877A (zh) 布线电路基板及其制造方法
US11935822B2 (en) Wiring substrate having metal post offset from conductor pad and method for manufacturing wiring substrate
TW201204204A (en) Embedded printed circuit board and method of manufacturing the same
JP4848752B2 (ja) 部品実装用ピンを有するプリント配線板及びこれを使用した電子機器
JP2024094622A (ja) 配線回路基板およびその製造方法
JP2023087329A (ja) 配線基板
CN101958292A (zh) 印刷电路板、封装件及其制造方法
JP2004228446A (ja) プリント基板
CN118715876A (zh) 布线电路基板及其制造方法
TW202326956A (zh) 再配線基板及其製造方法
US20250038122A1 (en) Semiconductor package
TW202439881A (zh) 電氣組件安裝基板的製造方法、電氣組件安裝基板及電子機器
JP2025067408A (ja) 配線回路基板、及び配線回路基板の製造方法
CN121128326A (zh) 布线电路基板、电气元件安装基板、电子设备、以及布线电路基板的制造方法
JP2024006955A (ja) 半導体パッケージ基板及び支持体付き基板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20240927