CN118661234A - 薄膜布线的制造方法 - Google Patents

薄膜布线的制造方法 Download PDF

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Publication number
CN118661234A
CN118661234A CN202380019573.6A CN202380019573A CN118661234A CN 118661234 A CN118661234 A CN 118661234A CN 202380019573 A CN202380019573 A CN 202380019573A CN 118661234 A CN118661234 A CN 118661234A
Authority
CN
China
Prior art keywords
thin film
film
conductive layer
wiring
coating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380019573.6A
Other languages
English (en)
Chinese (zh)
Inventor
村田英夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bomeilicheng Co ltd
Original Assignee
Bomeilicheng Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bomeilicheng Co ltd filed Critical Bomeilicheng Co ltd
Publication of CN118661234A publication Critical patent/CN118661234A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
CN202380019573.6A 2022-01-31 2023-01-12 薄膜布线的制造方法 Pending CN118661234A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-013194 2022-01-31
JP2022013194 2022-01-31
PCT/JP2023/000515 WO2023145440A1 (ja) 2022-01-31 2023-01-12 フィルム配線の製造方法

Publications (1)

Publication Number Publication Date
CN118661234A true CN118661234A (zh) 2024-09-17

Family

ID=87471230

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380019573.6A Pending CN118661234A (zh) 2022-01-31 2023-01-12 薄膜布线的制造方法

Country Status (3)

Country Link
JP (1) JPWO2023145440A1 (https=)
CN (1) CN118661234A (https=)
WO (1) WO2023145440A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117976347B (zh) * 2024-01-31 2025-08-29 东北大学 一种聚醚醚酮薄膜绕包Cu电磁线及其制备方法和应用

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4475741B2 (ja) * 2000-05-25 2010-06-09 グンゼ株式会社 薄型積層電気部品の製造装置
JP6823799B2 (ja) * 2015-10-01 2021-02-03 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材

Also Published As

Publication number Publication date
JPWO2023145440A1 (https=) 2023-08-03
WO2023145440A1 (ja) 2023-08-03

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