JPWO2023145440A1 - - Google Patents
Info
- Publication number
- JPWO2023145440A1 JPWO2023145440A1 JP2023576759A JP2023576759A JPWO2023145440A1 JP WO2023145440 A1 JPWO2023145440 A1 JP WO2023145440A1 JP 2023576759 A JP2023576759 A JP 2023576759A JP 2023576759 A JP2023576759 A JP 2023576759A JP WO2023145440 A1 JPWO2023145440 A1 JP WO2023145440A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022013194 | 2022-01-31 | ||
| PCT/JP2023/000515 WO2023145440A1 (ja) | 2022-01-31 | 2023-01-12 | フィルム配線の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023145440A1 true JPWO2023145440A1 (https=) | 2023-08-03 |
Family
ID=87471230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023576759A Pending JPWO2023145440A1 (https=) | 2022-01-31 | 2023-01-12 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023145440A1 (https=) |
| CN (1) | CN118661234A (https=) |
| WO (1) | WO2023145440A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117976347B (zh) * | 2024-01-31 | 2025-08-29 | 东北大学 | 一种聚醚醚酮薄膜绕包Cu电磁线及其制备方法和应用 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4475741B2 (ja) * | 2000-05-25 | 2010-06-09 | グンゼ株式会社 | 薄型積層電気部品の製造装置 |
| JP6823799B2 (ja) * | 2015-10-01 | 2021-02-03 | 日立金属株式会社 | 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 |
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2023
- 2023-01-12 CN CN202380019573.6A patent/CN118661234A/zh active Pending
- 2023-01-12 WO PCT/JP2023/000515 patent/WO2023145440A1/ja not_active Ceased
- 2023-01-12 JP JP2023576759A patent/JPWO2023145440A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023145440A1 (ja) | 2023-08-03 |
| CN118661234A (zh) | 2024-09-17 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251110 |