WO2023145440A1 - フィルム配線の製造方法 - Google Patents

フィルム配線の製造方法 Download PDF

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Publication number
WO2023145440A1
WO2023145440A1 PCT/JP2023/000515 JP2023000515W WO2023145440A1 WO 2023145440 A1 WO2023145440 A1 WO 2023145440A1 JP 2023000515 W JP2023000515 W JP 2023000515W WO 2023145440 A1 WO2023145440 A1 WO 2023145440A1
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WO
WIPO (PCT)
Prior art keywords
film
conductive layer
wiring
coating layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/000515
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English (en)
French (fr)
Japanese (ja)
Inventor
英夫 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
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Proterial Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Proterial Ltd filed Critical Proterial Ltd
Priority to JP2023576759A priority Critical patent/JPWO2023145440A1/ja
Priority to CN202380019573.6A priority patent/CN118661234A/zh
Publication of WO2023145440A1 publication Critical patent/WO2023145440A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Definitions

  • the present invention relates to a method for manufacturing film wiring.
  • Aluminum-coated wiring which is being considered for weight reduction as mentioned above, requires a space equivalent to the current copper resin coating, so it cannot be used to save space. Although it can be expected to be space-saving, it has the problem of being expensive and susceptible to electromagnetic noise in the space. In addition, there is a limit to the size of flexible printed circuit boards that can be manufactured. Generally, the length of a flexible printed circuit board is only a few centimeters. There is a problem that it is expensive because it is necessary. In addition, since the exterior mainly made of resin has low conductivity, there is also a problem that a new ground wiring (earth wire) is required.
  • the purpose of the present invention is to provide a new electrical wiring that can be manufactured at low cost, meeting the demands for weight reduction and space saving.
  • the present inventors diligently studied various electrical wiring that can replace the covered wiring and achieve light weight and space saving. As a result, the present inventors have found that light-weight, space-saving electric wiring can be obtained at low cost by forming a thin film on a film and separating it into a predetermined size. That is, the present invention separates a film having a base film made of an insulating resin, a conductive layer formed on the upper surface of the base film, and a coating layer formed on the upper surface of the conductive layer into predetermined shapes. It is a manufacturing method of the film wiring used as an electric wiring.
  • the thickness of the conductive layer is 300 nm or more, and the thickness of the coating layer is 10 to 200 nm.
  • the conductive layer and the coating layer are preferably formed by a sputtering method, and the conductive layer preferably has an electrical resistivity of 10 ⁇ cm or less, and is mainly composed of Al, Cu, or Ag.
  • the coating layer is preferably made of a non-magnetic alloy film containing any one of Ti, Cr, Mo and Ni as a main component.
  • the coating layer is preferably an alloy containing Mo as a main component and a total of 60 at % or less of Ni and Ti.
  • the coating layer is preferably an alloy containing Ni as a main component and containing 60 at % or less of Cu, Mn, and Mo in total.
  • film wiring that is lightweight, space-saving, and inexpensive to manufacture, in place of covered wiring that is used for electrical wiring in automobiles, motorcycles, and the like.
  • the film wiring of the present invention is the production of film wiring by forming a conductive layer and a coating layer covering it on a base film to form a film, and then separating it into pieces of a predetermined size to form electric wiring. in the method.
  • the film wiring of the present invention will be described in detail below.
  • the film wiring of the present invention uses a coated wiring in which a copper wire is coated with a resin. It can be applied to applications in which low-current electronic devices are arranged.
  • thin-film wiring has generally been done by using a photo-etching process to create a precise wiring pattern only on the thin film on the substrate. It is used only for expensive products because it needs to be processed using a strong photoresist or chemicals, and then cleaned using an organic solvent or a large amount of pure water. Furthermore, the larger the area, the larger the manufacturing equipment required and the larger the capital investment required. On the other hand, if the covered wiring used in current automobiles etc. is substituted, a precise wiring pattern is not required, and the conductive layer and the covering layer formed on the base film of the present invention are attached together with the base film. By cutting (separating into predetermined shapes) to form wiring, it is possible to manufacture electric wiring at a low cost.
  • the film wiring can be formed by inexpensively forming a conductive layer and a coating layer on a current resin film with a width of several tens of centimeters by using a sputtering method or the like, and then cutting the film into predetermined pieces of several millimeters to several tens of centimeters.
  • An insulating resin is used for the base film of the film wiring of the present invention. This is to prevent the conductive layer from coming into contact with other metals or the like and causing an electrical short circuit.
  • an inexpensive PET film or a polyimide film with high heat resistance may be used. The thinner the thickness, the easier it is to cut into the film wiring as long as it has the strength necessary for handling the film wiring and the flexibility for easy handling.
  • a coating having the same components as the coating layer may be formed as a base layer between the base film and the conductive layer.
  • the thickness of the base film may be set to 1 to 1000 ⁇ m, for example, as long as it exhibits strength enough to withstand film wiring applications.
  • the lower limit of the thickness is 10 ⁇ m, and the upper limit of the thickness is 500 ⁇ m, which is a desirable range for easy handling.
  • a sputtering method is preferably used to form the conductive layer and coating layer for the film wiring of the present invention.
  • Methods for forming a conductive layer include plating, which is one of the wet methods, and several physical vapor deposition methods, which form a dry method in a vacuum. Sputtering is the most suitable method for forming the film.
  • the conductive layer of the film wiring of the present invention requires high electrical conductivity, and an alloy or an alloy containing any of Al, Cu, and Ag as a main component (containing 80 at% or more), which can easily obtain an electrical resistance of 10 ⁇ cm or less. Pure metals with a purity of 98% or higher are suitable.
  • Al and Cu, which are less expensive than Ag, are preferable, and Cu, which has a higher melting point than Al, is more preferable in consideration of long-term reliability such as electromigration.
  • the coating layer used in the film wiring of the present invention protects the conductive layer from the external environment. Then, environmental resistance for suppressing corrosion of the conductive layer, and improvement of adhesion with the film substrate (base film) when a coating with the same components as the coating layer is formed as a base layer are required, so Ti, Cr , Mo and Ni as main components are desirable.
  • the reason why it is non-magnetic is that it uses the magnetron sputtering method, which has a high film formation speed. With a magnetic material, it is necessary to use a very thin target material in order to obtain a film formation speed, which shortens the life of the target material. This is because productivity decreases.
  • the term "environmental resistance” refers to surface deterioration under high-temperature and high-humidity conditions and under heating in the atmosphere. It can be confirmed by a color change and can be quantitatively evaluated, for example, by reflectance.
  • Cr and Ti are metals with high corrosion resistance, but Cr has a large internal stress when formed by sputtering, and the film may warp. At high temperatures, Ti and Ni may thermally diffuse into Cu to increase electrical resistance.
  • Mo is an element that is difficult to thermally diffuse into Al, Ag, and Cu, which are low-stress and conductive films that easily suppress warping of the film, but has low high-temperature and high-humidity resistance, and because it is a high-melting-point metal, it easily becomes brittle and bends the film.
  • the film is likely to crack when it is applied.
  • a Mo alloy to which Ni or Ti is added. More preferably, it contains 25 to 40 at % of Ni and 5 to 30 at % of Ti.
  • a Ni alloy to which Cu, Mn, and Mo are added for the coating layer in the case of soldering.
  • Mn and Mo in total is 60 at % or less, more preferably 10 to 40 at % of Cu, 7 to 25 at % of Mn and 5 to 30 at % of Mo.
  • the thickness of the conductive layer of the film wiring of the present invention is desirably 300 nm or more in order to achieve low electrical resistance.
  • the thickness of the coating layer is preferably at least 10 nm or more in order to suppress deterioration of the conductive layer due to moisture permeating the film surface or the film. If the thickness is less than 10 nm, the continuity of the film is lowered and the protective function becomes insufficient. In addition, if the thickness is increased, the electrical resistance increases and it takes a long time to form the film, resulting in a decrease in productivity.
  • a more preferable lower limit of the coating layer is 30 nm, and a more preferable upper limit of the coating layer is 100 nm.
  • a magnetic film having soft magnetic properties, such as permalloy on the lower surface or upper surface of the coating layer, it is possible to obtain a composite film that serves both as a wiring and a magnetic shield.
  • Example 1 A PET film having a thickness of 100 ⁇ m was cut into 200 ⁇ 100 mm as a base film for producing film wiring.
  • a model number SME-200E manufactured by ULVAC, Inc. was used as a sputtering device for forming the conductive layer and the coating layer.
  • the target material attached to the sputtering device has a diameter of 100 mm and a thickness of 5 mm. It was prepared by sintering powders of Mo, Ni—Mo alloy and Ti. These target materials were brazed to a copper backing plate and then attached to the sputtering apparatus.
  • the sputtering gas Ar was introduced, and the atmosphere was set to 0.5 Pa to create a Mo-Ni-Ti base layer.
  • An alloy was formed to a thickness of 30 nm at a power of 300 W, a conductive layer of Cu was formed to a thickness of 500 nm at a power of 500 W, and then a Mo--Ni--Ti alloy was formed to a thickness of 30 nm as the coating layer under the same conditions as the underlayer.
  • a cross-section of the layered structure is shown in FIG. Also, for comparison, only a Cu film as a conductive layer was formed on a PET film to a thickness of 500 nm. The electrical resistivity of this Cu film was 2.1 ⁇ cm.
  • a PET film formed with a Cu conductive layer and a Mo-Ni-Ti coating layer and a PET film formed with only a Cu conductive layer were cut into 25 x 50 mm pieces and placed in a high-temperature and high-humidity bath set at a relative humidity of 85% and a temperature of 85 ° C.
  • the case where the Mo--Ni--Ti coating layer was formed had little discoloration and had a metallic luster, but the case where only the Cu conductive layer was formed turned brown. It was confirmed that the formation of the Mo--Ni--Ti coating layer can greatly improve the moisture resistance.
  • a PET film on which a coating layer and a conductive layer were formed was cut to a length of 200 mm and a width of 3 mm using a rotary cutter (manufactured by Lion Business Machine Co., Ltd.: model RC-B4) to prepare film wiring of the present invention example.
  • the terminal of the T10 type LED light bulb and one end of the film wiring (on the side where the conductive film is formed) were fixed, and when the other end of the film wiring was connected to a 12 V power supply, the LED lit up and the film wiring was confirmed.
  • the existing covered wiring with an outer diameter of about 0.5 to 1.5 mm can be made into a thinner and wider area film wiring, and the effect of making it a light weight, space-saving and inexpensive electric wiring. considered to be large.
  • Example 2 A polyimide film having a thickness of 50 ⁇ m was cut into a size of 280 ⁇ 100 mm as a base film for producing film wiring.
  • a model number: CS-200 manufactured by ULVAC, Inc. was used as a sputtering device for forming the conductive layer and the coating layer.
  • the target material attached to the sputtering device has a diameter of 100 mm and a thickness of 5 mm, and is processed from a plate of 4N oxygen-free copper for the conductive film. After weighing predetermined amounts of Ni, blocks of oxygen-free copper, massive Mn and Mo raw materials, ingots were produced by melting and casting in a vacuum melting furnace, and then machined.
  • a polyimide film having a Cu conductive layer and a Ni—Cu—Mo—Mn coating layer (film of the present invention) and a polyimide film having only a Cu conductive layer (film of a comparative example) were cut into 25 ⁇ 50 mm pieces.
  • the Ni—Cu—Mo—Mn coating layer was hardly discolored and had a metallic luster, but Cu conductivity.
  • the color turned dark brown. It was confirmed that the formation of the Ni--Cu--Mo--Mn coating layer can greatly improve the moisture resistance.
  • a polyimide film having a Ni—Cu—Mo—Mn coating layer and a Cu conductive layer was cut into stripes with a width of 5 mm and a length of 100 mm using a rotary cutter (manufactured by Lion Business Machine Co., Ltd.: model RC-B4). It was cut into pieces to prepare film wiring of an example of the present invention. Then, the Cu conducting wire portion of the existing coated wiring (wiring in which the Cu conducting wire is coated with resin) with Sn-based solder attached to the end portion of the film wiring of the present invention is pressed while being heated with a soldering iron, and the Sn-based solder melts. After that, the soldering iron was released to cool.
  • Example 2 The covered wiring and the film wiring were joined, and continuity was confirmed. Subsequently, in the same manner as in Example 1, the terminal of a 10-inch LED light bulb and one end of the film wiring (the side on which the conductive film is formed) were fixed to the terminal of the T10-type LED light bulb, and the coated wiring side was connected to a 12 V power source. However, the LED lit up, and it was confirmed that the film wiring could be brazed and joined to the existing coated wiring. It is thought that the conventional coated wiring that requires a large current and the device that can use the film wiring for power saving can be mixed and used separately, and it is possible to make a useful electric wiring.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
PCT/JP2023/000515 2022-01-31 2023-01-12 フィルム配線の製造方法 Ceased WO2023145440A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023576759A JPWO2023145440A1 (https=) 2022-01-31 2023-01-12
CN202380019573.6A CN118661234A (zh) 2022-01-31 2023-01-12 薄膜布线的制造方法

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JP2022-013194 2022-01-31
JP2022013194 2022-01-31

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WO2023145440A1 true WO2023145440A1 (ja) 2023-08-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117976347A (zh) * 2024-01-31 2024-05-03 东北大学 一种聚醚醚酮薄膜绕包Cu电磁线及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338539A (ja) * 2000-05-25 2001-12-07 Toru Teraoka 薄型積層電気部品の製造方法及び製造装置
JP2017066519A (ja) * 2015-10-01 2017-04-06 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338539A (ja) * 2000-05-25 2001-12-07 Toru Teraoka 薄型積層電気部品の製造方法及び製造装置
JP2017066519A (ja) * 2015-10-01 2017-04-06 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117976347A (zh) * 2024-01-31 2024-05-03 东北大学 一种聚醚醚酮薄膜绕包Cu电磁线及其制备方法和应用
CN117976347B (zh) * 2024-01-31 2025-08-29 东北大学 一种聚醚醚酮薄膜绕包Cu电磁线及其制备方法和应用

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CN118661234A (zh) 2024-09-17

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