CN118648086A - 对半导体制造系统组供给电功率的电功率供给系统 - Google Patents

对半导体制造系统组供给电功率的电功率供给系统 Download PDF

Info

Publication number
CN118648086A
CN118648086A CN202380020197.2A CN202380020197A CN118648086A CN 118648086 A CN118648086 A CN 118648086A CN 202380020197 A CN202380020197 A CN 202380020197A CN 118648086 A CN118648086 A CN 118648086A
Authority
CN
China
Prior art keywords
electric power
semiconductor manufacturing
power supply
manufacturing systems
distribution unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380020197.2A
Other languages
English (en)
Chinese (zh)
Inventor
松本直树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN118648086A publication Critical patent/CN118648086A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R22/00—Arrangements for measuring time integral of electric power or current, e.g. electricity meters
    • G01R22/06—Arrangements for measuring time integral of electric power or current, e.g. electricity meters by electronic methods
    • G01R22/061—Details of electronic electricity meters
    • G01R22/063—Details of electronic electricity meters related to remote communication
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J3/00—Circuit arrangements for AC mains or AC distribution networks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J3/00—Circuit arrangements for AC mains or AC distribution networks
    • H02J3/38—Arrangements for feeding a single network from two or more generators or sources in parallel; Arrangements for feeding already energised networks from additional generators or sources in parallel
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/40—Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/80—Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
CN202380020197.2A 2022-02-10 2023-01-27 对半导体制造系统组供给电功率的电功率供给系统 Pending CN118648086A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022019863 2022-02-10
JP2022-019863 2022-02-10
PCT/JP2023/002579 WO2023153236A1 (ja) 2022-02-10 2023-01-27 半導体製造システム群への電力供給システム

Publications (1)

Publication Number Publication Date
CN118648086A true CN118648086A (zh) 2024-09-13

Family

ID=87564135

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380020197.2A Pending CN118648086A (zh) 2022-02-10 2023-01-27 对半导体制造系统组供给电功率的电功率供给系统

Country Status (6)

Country Link
US (1) US20240222969A1 (https=)
JP (1) JPWO2023153236A1 (https=)
KR (1) KR20240148380A (https=)
CN (1) CN118648086A (https=)
TW (1) TW202338978A (https=)
WO (1) WO2023153236A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7694553B2 (ja) * 2022-12-26 2025-06-18 株式会社ダイフク 非接触給電設備

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100448773B1 (ko) 2001-12-07 2004-09-16 현대자동차주식회사 차량용 자동 변속기의 런-업 쇼크 방지 방법
JP4753172B2 (ja) * 2005-02-18 2011-08-24 東京エレクトロン株式会社 複数の電力使用系の動作制御装置、動作制御方法及び記憶媒体
US7421601B2 (en) * 2006-02-17 2008-09-02 International Business Machines Corporation Method and system for controlling power in a chip through a power-performance monitor and control unit
US9312728B2 (en) * 2009-08-24 2016-04-12 Access Business Group International Llc Physical and virtual identification in a wireless power network
JP2013240246A (ja) * 2012-05-17 2013-11-28 Toshiba Corp 無線給電中継装置
KR102654165B1 (ko) * 2020-07-28 2024-04-02 세메스 주식회사 물품 반송 시스템에서 물품 반송 차량의 전력을 관리하기 위한 장치 및 방법
US12068622B2 (en) * 2020-09-29 2024-08-20 Milwaukee Electric Tool Corporation Universal wireless charging of power tool battery packs
WO2022196295A1 (ja) * 2021-03-19 2022-09-22 株式会社 東芝 製造プロセスおよびサービスを自律制御する情報管理システム並びに方法

Also Published As

Publication number Publication date
TW202338978A (zh) 2023-10-01
US20240222969A1 (en) 2024-07-04
KR20240148380A (ko) 2024-10-11
WO2023153236A1 (ja) 2023-08-17
JPWO2023153236A1 (https=) 2023-08-17

Similar Documents

Publication Publication Date Title
TWI758765B (zh) 具有載體內部的污染管理功能的自動搬送系統
JP4464993B2 (ja) 基板の処理システム
CN102270562B (zh) 基板处理系统和基板处理方法
US8236132B2 (en) Substrate processing system and substrate transfer method
US10319621B2 (en) Semiconductor processing assembly and facility
JP4999415B2 (ja) 基板処理装置及び基板処理方法並びに基板処理装置の用力供給装置及び基板処理装置の用力供給方法
CN114253226B (zh) 控制搬送车辆的方法、车辆控制装置以及物品搬送系统
KR20140102678A (ko) 생산 효율화 시스템, 생산 효율화 장치 및 생산 효율화 방법
US8046095B2 (en) Substrate processing system and substrate transfer method
CN118648086A (zh) 对半导体制造系统组供给电功率的电功率供给系统
JP2020113746A (ja) 処理装置
CN117476500A (zh) 基板处理系统和基板处理方法
US20140121831A1 (en) Transfer unit, method for controlling the transfer unit, and apparatus and method for treating substrate using the transfer unit
WO2005057648A1 (ja) 基板処理装置
CN118657460B (zh) 半导体高效制造芯片物流及智能派工方法及系统
CN114496870A (zh) 检测装置、处理系统和输送方法
US11199785B2 (en) Coating and developing apparatus and coating and developing method
JP6079510B2 (ja) 基板処理システム、基板処理方法及び記憶媒体
CN118202447A (zh) 基片处理装置、基片处理系统、电功率供给系统和电功率供给方法
KR20180069190A (ko) 기판 처리 장치의 에이징 기판 교체 방법
JP2004214290A (ja) 基板処理装置
KR102876368B1 (ko) 기판 처리 장치
JP3129794U (ja) 基板処理装置及び基板処理装置の用力装置
JP5538469B2 (ja) 基板処理装置及び基板処理方法並びに基板処理装置の用力供給装置及び基板処理装置の用力供給方法
KR20230099568A (ko) Oht 주행경로 할당 시스템 및 방법

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination