CN118511665A - 电子控制装置以及电子控制装置的制造方法 - Google Patents

电子控制装置以及电子控制装置的制造方法 Download PDF

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Publication number
CN118511665A
CN118511665A CN202380016067.1A CN202380016067A CN118511665A CN 118511665 A CN118511665 A CN 118511665A CN 202380016067 A CN202380016067 A CN 202380016067A CN 118511665 A CN118511665 A CN 118511665A
Authority
CN
China
Prior art keywords
heat dissipation
control device
metal heat
electronic control
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380016067.1A
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English (en)
Chinese (zh)
Inventor
长岛和明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Publication of CN118511665A publication Critical patent/CN118511665A/zh
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
CN202380016067.1A 2022-03-25 2023-02-27 电子控制装置以及电子控制装置的制造方法 Pending CN118511665A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-049245 2022-03-25
JP2022049245 2022-03-25
PCT/JP2023/007033 WO2023181792A1 (ja) 2022-03-25 2023-02-27 電子制御装置、及び、電子制御装置の製造方法

Publications (1)

Publication Number Publication Date
CN118511665A true CN118511665A (zh) 2024-08-16

Family

ID=88100544

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380016067.1A Pending CN118511665A (zh) 2022-03-25 2023-02-27 电子控制装置以及电子控制装置的制造方法

Country Status (3)

Country Link
JP (1) JP7652982B2 (https=)
CN (1) CN118511665A (https=)
WO (1) WO2023181792A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0183390U (https=) * 1987-11-21 1989-06-02
JP2002084082A (ja) * 2000-09-05 2002-03-22 Shindengen Electric Mfg Co Ltd 電子回路装置
JP4289073B2 (ja) * 2003-02-19 2009-07-01 東芝ライテック株式会社 配線基板収容装置及び放電灯点灯装置
DE102008040501A1 (de) * 2008-07-17 2010-01-21 Robert Bosch Gmbh Verbesserte Wärmeabfuhr aus einem Steuergerät
JP2014093414A (ja) 2012-11-02 2014-05-19 Hitachi Automotive Systems Ltd 電子制御装置
JP6171631B2 (ja) * 2013-07-01 2017-08-02 株式会社デンソー 電子装置の製造方法
JP2018032658A (ja) * 2016-08-22 2018-03-01 アルプス電気株式会社 回路モジュール
JP6631581B2 (ja) * 2017-04-17 2020-01-15 株式会社デンソー 電子装置

Also Published As

Publication number Publication date
WO2023181792A1 (ja) 2023-09-28
JPWO2023181792A1 (https=) 2023-09-28
JP7652982B2 (ja) 2025-03-27

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