CN118511665A - 电子控制装置以及电子控制装置的制造方法 - Google Patents
电子控制装置以及电子控制装置的制造方法 Download PDFInfo
- Publication number
- CN118511665A CN118511665A CN202380016067.1A CN202380016067A CN118511665A CN 118511665 A CN118511665 A CN 118511665A CN 202380016067 A CN202380016067 A CN 202380016067A CN 118511665 A CN118511665 A CN 118511665A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- control device
- metal heat
- electronic control
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-049245 | 2022-03-25 | ||
| JP2022049245 | 2022-03-25 | ||
| PCT/JP2023/007033 WO2023181792A1 (ja) | 2022-03-25 | 2023-02-27 | 電子制御装置、及び、電子制御装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118511665A true CN118511665A (zh) | 2024-08-16 |
Family
ID=88100544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380016067.1A Pending CN118511665A (zh) | 2022-03-25 | 2023-02-27 | 电子控制装置以及电子控制装置的制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7652982B2 (https=) |
| CN (1) | CN118511665A (https=) |
| WO (1) | WO2023181792A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0183390U (https=) * | 1987-11-21 | 1989-06-02 | ||
| JP2002084082A (ja) * | 2000-09-05 | 2002-03-22 | Shindengen Electric Mfg Co Ltd | 電子回路装置 |
| JP4289073B2 (ja) * | 2003-02-19 | 2009-07-01 | 東芝ライテック株式会社 | 配線基板収容装置及び放電灯点灯装置 |
| DE102008040501A1 (de) * | 2008-07-17 | 2010-01-21 | Robert Bosch Gmbh | Verbesserte Wärmeabfuhr aus einem Steuergerät |
| JP2014093414A (ja) | 2012-11-02 | 2014-05-19 | Hitachi Automotive Systems Ltd | 電子制御装置 |
| JP6171631B2 (ja) * | 2013-07-01 | 2017-08-02 | 株式会社デンソー | 電子装置の製造方法 |
| JP2018032658A (ja) * | 2016-08-22 | 2018-03-01 | アルプス電気株式会社 | 回路モジュール |
| JP6631581B2 (ja) * | 2017-04-17 | 2020-01-15 | 株式会社デンソー | 電子装置 |
-
2023
- 2023-02-27 CN CN202380016067.1A patent/CN118511665A/zh active Pending
- 2023-02-27 JP JP2024509877A patent/JP7652982B2/ja active Active
- 2023-02-27 WO PCT/JP2023/007033 patent/WO2023181792A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023181792A1 (ja) | 2023-09-28 |
| JPWO2023181792A1 (https=) | 2023-09-28 |
| JP7652982B2 (ja) | 2025-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |