CN118355077A - 树脂组合物、层叠片、预浸体、硬化物、带硬化物的基板及电子机器 - Google Patents

树脂组合物、层叠片、预浸体、硬化物、带硬化物的基板及电子机器 Download PDF

Info

Publication number
CN118355077A
CN118355077A CN202280080896.1A CN202280080896A CN118355077A CN 118355077 A CN118355077 A CN 118355077A CN 202280080896 A CN202280080896 A CN 202280080896A CN 118355077 A CN118355077 A CN 118355077A
Authority
CN
China
Prior art keywords
group
polyimide resin
resin composition
resin
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280080896.1A
Other languages
English (en)
Chinese (zh)
Inventor
阪口豪
曽根田裕士
宇佐勇贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aitiansi Co ltd
Toyochem Co Ltd
Original Assignee
Aitiansi Co ltd
Toyochem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aitiansi Co ltd, Toyochem Co Ltd filed Critical Aitiansi Co ltd
Publication of CN118355077A publication Critical patent/CN118355077A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
CN202280080896.1A 2021-12-27 2022-12-15 树脂组合物、层叠片、预浸体、硬化物、带硬化物的基板及电子机器 Pending CN118355077A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-213179 2021-12-27
JP2021213179A JP7196275B1 (ja) 2021-12-27 2021-12-27 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器
PCT/JP2022/046199 WO2023127523A1 (ja) 2021-12-27 2022-12-15 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器

Publications (1)

Publication Number Publication Date
CN118355077A true CN118355077A (zh) 2024-07-16

Family

ID=84600882

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280080896.1A Pending CN118355077A (zh) 2021-12-27 2022-12-15 树脂组合物、层叠片、预浸体、硬化物、带硬化物的基板及电子机器

Country Status (5)

Country Link
JP (3) JP7196275B1 (https=)
KR (1) KR20240124940A (https=)
CN (1) CN118355077A (https=)
TW (1) TWI832614B (https=)
WO (1) WO2023127523A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202449021A (zh) 2023-04-07 2024-12-16 日商味之素股份有限公司 樹脂組成物
TWI887816B (zh) * 2023-10-24 2025-06-21 財團法人工業技術研究院 多孔膜與銅箔基板
TWI863680B (zh) * 2023-11-07 2024-11-21 聯茂電子股份有限公司 預浸漬片、層壓板及印刷電路板
WO2025225251A1 (ja) * 2024-04-25 2025-10-30 グローバルポリアセタール株式会社 樹脂組成物、ペレット、および、成形体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5534378B2 (ja) 2012-02-24 2014-06-25 荒川化学工業株式会社 ポリイミド系接着剤組成物、硬化物、接着シート、積層体、フレキシブルプリント基板
JP2015117278A (ja) * 2013-12-17 2015-06-25 株式会社ティ−アンドケイ東華 官能基化ポリイミド樹脂及びそれを含むエポキシ樹脂組成物
JP6686619B2 (ja) 2015-03-30 2020-04-22 荒川化学工業株式会社 ポリイミド系接着剤、フィルム状接着材、接着層、接着シート、銅張積層板及びプリント配線板、並びに多層配線板及びその製造方法
KR20190059872A (ko) 2016-09-29 2019-05-31 세키스이가가쿠 고교가부시키가이샤 층간 절연 재료 및 다층 프린트 배선판
JP2019119755A (ja) * 2017-12-28 2019-07-22 日鉄ケミカル＆マテリアル株式会社 光電表示装置形成用ポリイミド原料のジアミン化合物、これを用いたポリアミド酸及びポリイミド
US12139576B2 (en) * 2018-03-28 2024-11-12 Sekisui Chemical Co., Ltd. Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board
WO2019189466A1 (ja) 2018-03-28 2019-10-03 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7474064B2 (ja) * 2019-02-18 2024-04-24 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7135970B2 (ja) 2019-03-27 2022-09-13 味の素株式会社 樹脂組成物
JP7563913B2 (ja) 2019-08-01 2024-10-08 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7676106B2 (ja) * 2019-09-13 2025-05-14 味の素株式会社 樹脂組成物
JP2021070824A (ja) * 2019-10-29 2021-05-06 日鉄ケミカル＆マテリアル株式会社 ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
JP6791428B2 (ja) 2020-07-17 2020-11-25 味の素株式会社 樹脂組成物
JP7400678B2 (ja) * 2020-09-25 2023-12-19 東洋インキＳｃホールディングス株式会社 熱硬化性組成物、熱硬化性シート、硬化物、硬化シートおよびプリント配線板
JP6981522B1 (ja) * 2020-12-15 2021-12-15 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、およびその利用

Also Published As

Publication number Publication date
JP2023097050A (ja) 2023-07-07
TWI832614B (zh) 2024-02-11
WO2023127523A1 (ja) 2023-07-06
JP7196275B1 (ja) 2022-12-26
TW202325799A (zh) 2023-07-01
JP2023097359A (ja) 2023-07-07
JP7601263B2 (ja) 2024-12-17
JPWO2023127523A1 (https=) 2023-07-06
KR20240124940A (ko) 2024-08-19

Similar Documents

Publication Publication Date Title
TWI804598B (zh) 樹脂材料、積層構造體及多層印刷佈線板
JP7547109B2 (ja) 樹脂材料及び多層プリント配線板
JP7601263B2 (ja) 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器
JP7474064B2 (ja) 樹脂材料及び多層プリント配線板
JP7563913B2 (ja) 樹脂材料及び多層プリント配線板
JP7563912B2 (ja) 樹脂材料及び多層プリント配線板
TW201819536A (zh) 阻燃性樹脂組成物及附有樹脂之銅箔
TW202534069A (zh) 樹脂組成物
JP7680839B2 (ja) 樹脂材料及び多層プリント配線板
CN118222091A (zh) 树脂组合物、层叠片、预浸体、硬化物、带硬化物的基板及电子机器
TWI823606B (zh) 熱硬化性組成物、接著片、印刷配線板及電子機器
CN116888189A (zh) 热硬化性树脂组合物、硬化物、树脂片材、预浸体、覆金属箔层叠板、多层印刷配线板、密封用材料、纤维加强复合材料、接着剂以及半导体装置
JP7834718B2 (ja) 硬化樹脂組成物とその硬化物
JP2023068373A (ja) 樹脂組成物
JP2005314562A (ja) 熱硬化性樹脂組成物およびその利用
CN121889467A (zh) 含有聚酰亚胺树脂的组合物及其硬化物
JP7706849B2 (ja) 硬化性樹脂組成物、半導体封止材、接着剤、接着フィルム、プリプレグ、層間絶縁材料及びプリント配線板
TW202122492A (zh) 樹脂組成物
JP2022151212A (ja) プリント配線板の製造方法
JP7533808B1 (ja) ブロックポリマー、樹脂組成物、該樹脂組成物を用いて形成される積層シート、プリプレグ、硬化物、硬化物付基板および電子機器
JP7506486B2 (ja) 樹脂材料及び多層プリント配線板
JP2025127572A (ja) 硬化性樹脂組成物、接着シート、プリプレグ、硬化物、硬化物付基板、及び電子機器
JP2025019602A (ja) 樹脂組成物
TW202449049A (zh) 聚醯亞胺樹脂組成物及其硬化物
JP2024170009A (ja) 硬化性樹脂組成物、それを用いた積層シート、プリプレグおよび硬化物付基板、ならびに該硬化物基板を搭載した電子機器

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination