CN118140594A

CN118140594A - Multi-layer carrier plate for LED (light-emitting diode) product and equipment thereof

Info

Publication number: CN118140594A
Application number: CN202280061281.4A
Authority: CN
Inventors: 袁楚卓; 陈都
Original assignee: Shenzhen Meisi Micro Semiconductor Co ltd
Current assignee: Shenzhen Meisi Micro Semiconductor Co ltd
Priority date: 2022-03-27
Filing date: 2022-12-14
Publication date: 2024-06-04
Also published as: CN118234124A; CN114867145A; CN114867145B; WO2023185099A1

Abstract

The invention discloses a multilayer carrier board for LED products, which comprises a GND board, a VDD board and an optional DATA board, wherein the middle part of the GND board comprises a GND board middle hole area (GNDSP), and the middle part of the VDD board comprises a VDD board middle hole area (VDDSP); the optional DATA plate middle includes a DATA plate middle hole region (DATASP); and, the outer contours of GND plate middle hole region (GNDSP), VDD plate middle hole region (VDDSP), and optionally DATA plate middle hole region (DATASP) completely correspond; the areas outside the GND plate middle hole area (GNDSP), the VDD plate middle hole area (VDDSP) and the optional DATA plate middle hole area (DATASP) are carrier plate main body areas corresponding to the plates, and the LED display/illumination effect can be achieved, even an equidistant display effect is achieved, even further, even an equidistant visual effect of improving the light transmittance is achieved.

Description

Multi-layer carrier plate for LED (light-emitting diode) product and equipment thereof

Technical Field

The disclosure relates to the field of LEDs, and in particular to a multilayer carrier board for an LED product and a device thereof.

Background

Currently, the LED carrier plates of the prior art are of a wide variety, but when used for illumination or display, the market is beginning to see the need for transparent, translucent illumination or display.

Taking display as an example, semitransparent display requirements put new requirements on the carrier plate structure of the LED. As a whole, there is a need in the art to develop LED carrier technology and display devices thereof that compromise both light transmission and display visual effects.

Technical problem

The invention solves the technical problem of transparent or semitransparent display of the LED.

Technical solution

The disclosure provides a multilayer carrier plate for an LED product, specifically as follows:

The multilayer LED carrier plate comprises: a GND plate for grounding, a VDD plate for supplying power, and an optional DATA plate for providing a DATA signal to the LED product; when the DATA board is not included, a DATA signal is supplied to the LED product in a carrier wave manner through the VDD board and the GND board.

The middle part of the GND plate comprises a GND plate middle hole region (GNDSP).

The middle portion of the VDD plate includes a VDD plate center hole region (VDDSP).

The middle portion of the optional DATA plate includes a DATA plate center hole region (DATASP).

And

The outer contours of the GND plate middle hole region (GNDSP), the VDD plate middle hole region (VDDSP), and optionally the DATA plate middle hole region (DATASP) completely correspond.

The areas outside of the GND plate center hole area (GNDSP), the VDD plate center hole area (VDDSP), and optionally the DATA plate center hole area (DATASP) are carrier body areas of the respective plates.

Preferably, the method comprises the steps of,

The LED product is fixed on the DATA board, or the VDD board, or the GND board.

Preferably, the method comprises the steps of,

The DATA plate itself is two separate parts and the two parts are symmetrical.

Preferably, the method comprises the steps of,

The VDD board and the GND board are respectively a complete carrier board main body and have symmetry.

Preferably, the method comprises the steps of,

The GND plate, the VDD plate, and the DATA plate are insulated from each other by two to prevent a short circuit.

Preferably, the method comprises the steps of,

The central board among the GND board, the VDD board and the DATA board may be the VDD board, the GND board or the DATA board.

The GND plate, the VDD plate, and the remaining two of the DATA plates, one above the centered plate and the other below the centered plate.

Preferably, the method comprises the steps of,

For the center plate, and the plates located above the center plate, insulating coatings are provided on their respective lower surfaces so that the GND plate, the VDD plate, and the DATA plate are insulated from each other two by two.

Preferably, the method comprises the steps of,

For the centered plate, and the plate above the centered plate, additional first and second insulating plates are provided below each such that the GND plate, the VDD plate, and the DATA plate are insulated from each other.

Preferably, the method comprises the steps of,

For the multi-layer carrier board, it provides vias at one or more of the GND board, VDD board, and DATA board; and when at least 2 plates are provided with through holes, the through holes at 1 position of at least one plate correspond to the through holes at 1 position of the other plate in position, shape and size.

Preferably, the method comprises the steps of,

The multilayer carrier plate is taken as a whole, and a side plate of the whole is free from being provided with a via hole.

Advantageous effects

The above-mentioned multilayer carrier plate of this disclosure can compromise printing opacity and LED demonstration/illuminating effect, realizes equidistant display effect even, and is still further, realizes equidistant and improves the visual effect of luminousness even.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present disclosure and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic structural diagram of a multi-layer carrier provided in an embodiment of the present disclosure;

FIG. 2 is a schematic view of a mesoporous region of a multi-layer carrier, a peripheral region of the mesoporous region, according to one embodiment of the present disclosure;

FIG. 3 is a schematic diagram of an assembly of a multi-layer carrier provided in one embodiment of the present disclosure for use in an LED product;

FIG. 4 is a schematic diagram of an assembly of a multi-layer carrier provided by one embodiment of the present disclosure for use in an LED product;

Fig. 5 is a schematic diagram of a left-right expansion and an up-down expansion of a multi-layer carrier provided in an embodiment of the present disclosure;

fig. 6 is a schematic diagram of a left-right expansion and a up-down expansion of a GND board in a multilayer carrier board according to an embodiment of the present disclosure.

Best mode for carrying out the invention

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to fig. 1 to 6 of the embodiments of the present disclosure, and it is apparent that the described embodiments are some embodiments of the present disclosure, but not all embodiments. The components of the embodiments of the present disclosure, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Referring to fig. 1 and 2, in one embodiment, the present disclosure discloses a multi-layer carrier for an LED product, comprising: a GND plate for grounding, a VDD plate for supplying power, and an optional DATA plate for providing a DATA signal to the LED product; when the DATA board is not included, a DATA signal is supplied to the LED product in a carrier wave manner through the VDD board and the GND board.

And

First, take the example with a DATA board:

a GND plate for grounding, a VDD plate for supplying power, and a DATA plate for providing a DATA signal to the LED product.

The middle of the DATA plate includes a hole region (DATASP) in the DATA plate.

And

The outer contours of the GND plate middle hole region (GNDSP), the VDD plate middle hole region (VDDSP) and the DATA plate middle hole region (DATASP) completely correspond.

The areas outside the GND plate center hole area (GNDSP), the VDD plate center hole area (VDDSP) and the DATA plate center hole area (DATASP) are the carrier plate main body areas of the corresponding plates.

For this case, since the outer contours of the GND board middle hole region (GNDSP), the VDD board middle hole region (VDDSP) and the DATA board middle hole region (DATASP) completely correspond, after the 3 board middle hole regions are completely overlapped, the multi-layer carrier plate pair is made to represent the middle hole region. Therefore, when the multi-layer carrier plate is used for a carrier plate of an LED product, the mesoporous region can be used for a region through which light passes.

Second, in the field of driving of LEDs, for the case where a DATA board is not provided, a technology of transmitting a DATA signal while supplying power using a power supply line such as a zero line/positive and negative lines has been developed. This corresponds to a carrier technology.

This means that even without a dedicated DATA board, it is equally possible to transmit DATA signals while powering the LED products, by means of the VDD board and GND board described above.

For purposes of this disclosure, an LED product may include LED lights, which may be data signals for a particular LED product, signals for different LED lights of a certain LED product, or specific encoded signals for different LED chips in a single LED light, i.e., the data signals may be for a macro-level of the LED product, or for a level of a lower LED light of the LED product, or for an object of a lower level of the LED chip.

In addition, the data signal may be an address code signal of a specific LED product/LED luminary/LED chip, or may be a color signal of a color of illumination or display.

In summary, the multi-layer carrier plate may enable the transfer of corresponding DATA signals, whether the DATA plate is included or not.

It can be appreciated that when the LED product is carried on the multilayer carrier plate, since the LED product is disposed in an area other than the mesoporous area, then:

when the LED product is not working in daytime, people can see the eyes through the middle hole area.

When the LED product works, people can still see through the middle hole area.

In addition, the mesoporous region can also be used for ventilation and heat dissipation when the LED product works.

In a further embodiment of the present invention,

One surface of the multilayer carrier plate is used as the front surface to fix the LED product, the other surface of the multilayer carrier plate is used as the back surface, and the back surface is free from being provided with: any IC and/or other components used to connect LED products.

For this embodiment, it represents another great innovation of the present disclosure over the prior art. When the LED luminous body comprises a drive IC (not limited to a current limiting IC and a constant current IC) in addition to the LED chip, the carrier plate only needs to supply power to the LED luminous body through corresponding pins on the front surface of the carrier plate, and any IC and/or other components connected with the LED luminous body are not needed to be arranged on the back surface of the carrier plate.

In another embodiment, a DATA board dedicated to DATA signal transmission is provided as an example.

Corresponding to the multi-layer carrier board, the LED product is fixed on a DATA board, a VDD board or a GND board.

For example, referring to FIG. 3, when the DATA board side is the front side of the multi-layer carrier board, LEDs can be mounted thereon, which are unaffected as long as the LEDs need to be connected to VDD power and GND. It can be understood that, from the circuit point of view, for the multi-layer carrier board, the board corresponding to any layer can be used as the front surface to fix the LEDs, and the rest boards can be used as other layers. The space position relation of the DATA board, the VDD board and the GND board can be flexibly arranged, and the interconnection of circuits can be finished on the premise of ensuring insulation, for example, a plurality of boards are connected in a via way, or each board in the multi-layer carrier board is provided with a corresponding golden finger at the edge so as to be connected with VDD power supply or DATA signals or ground. Naturally, when the VDD plate is used as the front side of the multi-layer carrier plate, it can also fix the LEDs; when the GND board is used as the front side of the multilayer carrier board, it can also fix the LEDs.

Further, in another embodiment, for the multi-layer carrier board, vias are provided at one or more of the GND board, VDD board, and DATA board; and when at least 2 plates are provided with through holes, the through holes at 1 position of at least one plate correspond to the through holes at 1 position of the other plate in position, shape and size.

Referring to fig. 2 and 3, taking a DATA board as an example of the front surface of the multi-layer carrier board, when the LED is fixed on the front surface, the following scheme is exemplarily disclosed:

The DATA board is provided with a ground type via DATAGND1 connected to the GND board, which corresponds in position, shape, size to the ground type via VDDGND of the VDD board; when an LED product (such as the LED light emitter including the LED chip and the driving IC described above) is fixed on the DATA board, the LED product is connected to the GND board through these two vias on the DATA board and the VDD board to realize grounding.

Similarly, the DATA board has a VDD-type via DATAVDD1 disposed thereon that connects to the VDD board; when an LED product (such as the LED luminary including the LED chip and the driving IC described above) is mounted on the DATA board, the LED product is connected to the VDD board through the via DATAVDD1 on the DATA board to achieve power supply; in addition, the LED product is connected to the DATA board through a DATA signal pin on the DATA board, namely, the DATA1 pin, to enable interaction with the DATA signal.

In another embodiment, the multi-layer carrier plate is a whole, and one side plate of the whole is free from being provided with a via hole.

For this embodiment, as shown in fig. 2 and 3, taking the front surface of the DATA board as the multi-layer carrier, the GND board is a board on one side of the whole multi-layer carrier, and no via hole is provided.

In another embodiment, the DATA plate itself is two separate parts, and the two parts are symmetrical. For example, in FIG. 2, the DATA plate is divided into left and right portions, with a space between the right end of the left portion and the left end of the right portion. And, the upper and lower portions of the left portion have symmetry, for example, if the lower and upper portions of the DATA plate are cut along the middle horizontal line, the cut lower portion may be completely overlapped with the upper portion after being upwardly translated.

In another embodiment, the VDD plate and the GND plate are each a complete carrier body and have symmetry.

For both embodiments, see fig. 2, 3, which illustrate a DATA board for the front side of the multi-layer carrier board to secure the LEDs. For flexibility in LED deployment, the DATA board itself is in two separate parts, and each of the DATA boards shown in fig. 2, 3 includes a corresponding ground type via datand, VDD type via DATAVDD, and a DATA signal pin, i.e., a DATA pin (note: DATAGND1, DATAVDD1, and DATA1 are labeled in the figures, DATAGND, DATAVDD2, and DATA2 are not labeled in the figures, etc.), and each of the two parts can hold 2 LEDs. Referring to fig. 3, 4, the 4 LEDs are secured to the DATA board by corresponding tin posts and interconnected to the DATA board and the VDD board, GND board thereunder. It should be noted that, instead of the tin post, the electrical interconnection between each board and the LED may be realized by soldering a wire or by flying wire.

In another embodiment, the GND plate, the VDD plate, and the DATA plate are insulated from each other by two to prevent shorting.

In another embodiment, the central board may be the VDD board, the GND board, or the DATA board.

As described above, the spatial positions of the GND board, the VDD board, and the DATA board can be flexibly set, and the circuit can be interconnected, for example, by connecting a plurality of boards in a via manner, or each board in the multi-layer carrier board has a corresponding gold finger at the edge to connect VDD power or DATA signals or ground, while ensuring insulation.

With further reference to fig. 2 and 3, the present embodiment illustrates the VDD plate centering. Taking VDD plate centering as an example, the DATA plate may be located above the VDD plate or below the VDD plate. Fig. 2,3 and even fig. 1 illustrate the following from top to bottom: DATA board, VDD board, GND board.

In another embodiment, for the center plate, and the plates above the center plate, an insulating coating is provided on their respective lower surfaces so that the GND plate, the VDD plate, and the DATA plate are insulated from each other two by two.

For example, the lower surfaces of the DATA plate and the VDD plate in fig. 1 to 3 may be provided with an insulating coating, respectively.

In another embodiment, for the centered plate, and the plate above the centered plate, additional first and second insulating plates are provided below each such that the GND plate, VDD plate, and DATA plate are insulated from each other.

In comparison with the previous embodiment, this embodiment reveals another solution for achieving insulation. When additional insulating plates are involved, the insulating plates include at least 1 via hole corresponding in position, shape, and size relative to the plates above or below the insulating plates, so that the insulating plates do not affect the remaining plates interconnected by the via holes.

Referring to fig. 2, in another embodiment, the peripheral plate surface of the hole area (GNDSP) in the GND plate includes four areas: the first region (A1), the second region (A2), the third region (A3) and the fourth region (A4) are solid.

In combination with the DATA board disclosed above as the front surface of the multi-layer carrier board, the VDD board is a central board, the vias can be disposed between the DATA board and the VDD board, and the GND board can be free from the vias, so that in this embodiment, the four areas of the GND board are all solid.

Referring to fig. 2, in another embodiment, the middle portion of the VDD plate includes a VDD plate midhole region (VDDSP), and the surrounding plate surface of the VDD plate midhole region (VDDSP) also includes four regions: among the four regions, the first region (A1), the second region (A2), the third region (A3), and the fourth region (A4) respectively correspond to the four regions of the GND board, and among the four regions of the VDD board, 1 via hole, for example, via hole VDDGND1 is provided per region.

Referring to FIG. 2, in another embodiment, the middle of the DATA plate includes a DATA plate midhole region (DATASP), and the surrounding plate surface of the DATA plate midhole region (DATASP) also includes four regions: the four areas correspond to the four areas of the VDD plate, and in the four areas of the DATA plate, 1 via hole is provided in each area, and the via hole in each area corresponds to the corresponding via hole in the VDD plate in position, shape and size. For example, the DATA board via DATAGND1 corresponds to the VDD board via VDDGND location.

Referring to fig. 2, it should be noted that the DATA board is additionally provided with a VDD type via DATAVDD for connecting to the VDD board, and no via corresponding to the via DATAVDD1 is required to be provided on the VDD board.

Referring to fig. 2, in another embodiment, of four areas around the hole area (GNDSP) in the GND plate, the first area (A1), the second area (A2), the third area (A3), and the fourth area (A4) are located at the northwest, southwest, northeast, and southeast angles, respectively, of the hole area (GNDSP) in the GND plate, wherein, in the counterclockwise direction,

The first region extends with a first region arm1 (UARM 1) and a first region arm2 (LARM) respectively.

The second region extends with a second region arm1 (LARM) and a second region arm2 (DARM 1).

The third zone extends with a third zone arm1 (DARM 2), a third zone arm2 (RARM 2).

The third region extends with a fourth region arm1 (RARM 1) and a fourth region arm2 (UARM) respectively.

And, in addition, the method comprises the steps of,

Between the first area arm2 (LARM 1) and the second area arm1 (LARM) is a GND panel left hole area (LSP).

Between the third area arm2 (RARM 2) and the fourth area arm1 (RARM) is the GND plate right hole Region (RSP).

Between the second area arm2 (DARM 1) and the third area arm1 (DARM 2) is the GND plate lower hole area (DSP).

Between the fourth section arm2 (UARM 2) and the first section arm1 (UARM 1) is the GND plate upper hole area (USP).

For the present embodiment, by way of specific example, it is described how the present embodiment guarantees the basic mechanical properties of the multi-layer carrier plate by means of the relevant arms. More precisely, the relevant arms and the plate main body except for the middle hole area, the left hole area, the right hole area, the upper hole area and the lower hole area form a plurality of island-shaped carrier plate areas surrounding the middle hole area, form islands, ensure the basic mechanical properties of each plate of the VDD plate, the DATA plate and the GND plate, and further ensure the basic mechanical properties of the multi-layer carrier plate.

Further, in another embodiment, the carrier board is free from being provided with: a grid of rows or columns.

For this embodiment, compared to a conventional LED carrier or LED transparent display device (e.g., LED transparent display screen) with 1 or more gratings in horizontal or vertical direction:

The present disclosure may avoid providing any row or column grid. The reason is that: the method can meet the basic requirement of the mechanical property of the carrier plate through the carrier plate main body of each plate except the mesoporous area, and precisely, the formed islands are formed through the plurality of island-shaped carrier plate areas included in the carrier plate main body, and 1 or more gratings in a row shape or a column shape are not required to be arranged forcedly to meet the basic requirement of the mechanical property of the carrier plate. In other words, the present embodiment provides a mechanically reinforced structure through the solid areas of each plate outside the mesoporous region. Furthermore, the grille itself affects the visual effect, since it is prone to visual illusions, which is also a consideration of the present embodiment in avoiding the provision of a grille.

Further, referring to FIG. 2, in another embodiment, the VDD plate also has a VDD plate left hole region, a VDD plate right hole region, a VDD plate lower hole region, a VDD plate upper hole region, and is in communication with: the left hole area (LSP) of the GND plate, the right hole area (RSP) of the GND plate, the lower hole area (DSP) of the GND plate and the upper hole area (USP) of the GND plate completely correspond to each other in terms of position, shape and size.

Further, referring to FIG. 2, in another embodiment, the DATA plate also has a DATA plate left hole region, a DATA plate right hole region, a DATA plate lower hole region, a DATA plate upper hole region, and is in communication with: the left hole area (LSP) of the GND plate, the right hole area (RSP) of the GND plate, the lower hole area (DSP) of the GND plate and the upper hole area (USP) of the GND plate correspond to each other in terms of position and outer contour.

In fig. 2, the DATA board is exemplified as 2 separate parts, so in this embodiment, the left/right hole area and the upper/lower hole area correspond to the GND board, but the positions and the outer contours correspond to each other, although the shapes of the left/right hole area and the upper/lower hole area do not completely correspond to each other, and the positions and the outer contours of the upper/lower hole area and the upper/lower hole area correspond to each other.

Further, in another embodiment, any one of the GND plate, VDD plate, DATA plate has its left and right hole areas symmetrical and the left and right hole areas are geometrically equal to the middle hole area.

Further, in another embodiment, any one of the GND plate, VDD plate, and DATA plate has an upper hole area and a lower hole area that are symmetrical, and the upper hole area and the lower hole area are geometrically equal to the middle hole area.

For both embodiments above, this means: the multilayer carrier plate can be expanded left and right or up and down:

When expanding from side to side, the right hole district of left side multilayer carrier plate, with the left hole district of right side multilayer carrier plate, splice into 1 concatenation mesopore district jointly, this concatenation mesopore district is in full conformity with the GND board mesopore district of arbitrary multilayer carrier plate, also is in full conformity with the VDD board mesopore district of arbitrary multilayer carrier plate.

When expanding from top to bottom, the lower hole district of upper portion multilayer carrier plate, with the upper portion hole district of lower portion multilayer carrier plate, splice into 1 concatenation mesopore district jointly, this concatenation mesopore district is in full conformity with the GND board mesopore district of arbitrary multilayer carrier plate, also is in full conformity with the VDD board mesopore district of arbitrary multilayer carrier plate.

It will be appreciated that the multi-layer carrier plate of the present embodiment can be used to compose a matrix LED product, such as a LED lighting or display carrier plate of a certain size. Referring to fig. 5, a left-right expansion and a up-down expansion of the multi-layer carrier board are illustrated, wherein a diagram 1 represents a GND connection, a diagram 2 represents a data signal connection, and a diagram 3 represents a VDD power supply connection.

When expanding left and right and expanding up and down, the LED products on the two-to-two multi-layer carrier plates are arranged at equal intervals left and right and at equal intervals up and down, and even are arranged at the same equal intervals left and right and up and down.

Therefore, the multilayer carrier plate can achieve light transmission and LED display/illumination effects, even achieve equidistant display effects, and further achieve even equidistant visual effects with high light transmittance through optimization of the mesoporous area.

Referring to the GND plate shown in fig. 6, this illustrates the expansion of the GND plate of the above-described multi-layer carrier plate from top to bottom and from side to side, and similarly, the VDD plate may also be expanded to fit the GND plate, since the VDD plate is centered in this example. Referring to fig. 5 and 6, fig. 5 shows an expanded multi-layered carrier plate illustrating the uppermost DATA plate and its split structure from left to right, with the underlying center layer VDD plate exposed between portions of the DATA plates, and fig. 6 illustrates the lowermost GND plate.

Further, in another embodiment, taking the GND plate as an example, the hole region (GNDSP) in the GND plate may be various symmetrical shapes, such as regular polygon, circle, ellipse, etc.

In another embodiment, the LED product comprises a patch LED.

In another embodiment, taking the middle hole area of the GND board as an example, the light transmittance of the multilayer carrier board and the number of the deployed LEDs can be adjusted by adjusting the shape and size of the middle hole area and/or adjusting the area ratio of the middle hole area to the island-shaped carrier board area.

It is to be noted that this is very significant. Just like in the scene of LED illumination or demonstration, people often far away from the LED device, at this moment, under the prerequisite that reduces the quantity of LED by a wide margin, the long-range can not lead to showing the step back of visual effect, especially to large-scale LED illumination or demonstration, still can satisfy the requirement of visual effect.

Referring to fig. 1 to 3, in another embodiment, for the separate two portions of the DATA board, the left and right portions thereof are provided with respective connection arrangements of the DATA signal lines.

Since VDD power and GND ground are fully commonly available, to increase fault tolerance of the LED product, the DATA board is preferably designed to have two separate parts when having separate DATA boards.

In another embodiment, each of the multiple layers of carrier plates is selected to be of a material that is free to bend or deform.

It can be appreciated that this is advantageous for achieving a greater degree of freedom visual effect.

In another embodiment, one or more of the multiple layer carrier plates is selected to be transparent.

In addition, the disclosure also discloses an LED display device, which adopts the multilayer carrier board in any embodiment.

In another embodiment, the LED display device further comprises an LED luminary.

In another embodiment, the LED display device is free of a support structure.

In connection with the grid described above, for this embodiment, the device itself is typically mechanically less strong than conventional display devices with grids (e.g., grid screens), which require additional support structures to support, including but not limited to grids, additional structural frames beyond grids, and the like.

In another embodiment, since the front surface of the multi-layer carrier board may include the LED chip and the driving IC in the LED luminary, the back surface of the multi-layer carrier board may be free from any IC and/or component, which allows: the LED display device may be mounted on any surface or in between any interlayers.

The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the disclosure are intended to be covered by the protection scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

A multilayer carrier plate for LED products, characterized in that:

The multilayer LED carrier plate comprises: a GND plate for grounding, a VDD plate for supplying power, and an optional DATA plate for providing a DATA signal to the LED product; when the DATA board is not included, providing a DATA signal to the LED product in a carrier wave manner through the VDD board and the GND board;

The middle part of the GND plate comprises a GND plate middle hole region (GNDSP);

the middle portion of the VDD plate includes a VDD plate center hole region (VDDSP);

the middle of the optional DATA plate includes a DATA plate center hole region (DATASP);

And

The outer contours of the GND plate middle hole region (GNDSP), the VDD plate middle hole region (VDDSP), and optionally the DATA plate middle hole region (DATASP) completely correspond;

The areas outside of the GND plate center hole area (GNDSP), the VDD plate center hole area (VDDSP), and optionally the DATA plate center hole area (DATASP) are carrier body areas of the respective plates.
The multi-layer carrier plate of claim 1, wherein,

The LED product is fixed on an optional DATA board, or VDD board, or GND board.
The multi-layer carrier plate of claim 1, wherein,

The DATA plate itself is two separate parts and the two parts are symmetrical.
The multi-layer carrier plate of claim 1, wherein,

The VDD board and the GND board are respectively a complete carrier board main body and have symmetry.
The multi-layer carrier plate of claim 1, wherein,

The GND plate, the VDD plate, and the DATA plate are insulated from each other by two to prevent a short circuit.
The multi-layer carrier plate of claim 1, wherein,

The central board of the GND board, the VDD board and the DATA board can be the VDD board, the GND board and the DATA board;

The GND plate, the VDD plate, and the remaining two of the DATA plates, one above the centered plate and the other below the centered plate.
The multi-layer carrier plate of claim 6, wherein,

For the center plate, and the plates located above the center plate, insulating coatings are provided on their respective lower surfaces so that the GND plate, the VDD plate, and the DATA plate are insulated from each other two by two.
The multi-layer carrier plate of claim 6, wherein,

For the centered plate, and the plate above the centered plate, additional first and second insulating plates are provided below each such that the GND plate, the VDD plate, and the DATA plate are insulated from each other.
The multi-layer carrier plate of claim 1, wherein,

For the multi-layer carrier board, it provides vias at one or more of the GND board, VDD board, and DATA board; and when at least 2 plates are provided with through holes, the through holes at 1 position of at least one plate and the through holes at 1 position of the other plate are in corresponding relation of position, shape, size and the like.
LED device, characterized in that a multilayer carrier plate according to any of claims 1 to 9 is used.