CN111462643A - L ED lamp pearl and L ED show structure - Google Patents

L ED lamp pearl and L ED show structure Download PDF

Info

Publication number
CN111462643A
CN111462643A CN202010184507.2A CN202010184507A CN111462643A CN 111462643 A CN111462643 A CN 111462643A CN 202010184507 A CN202010184507 A CN 202010184507A CN 111462643 A CN111462643 A CN 111462643A
Authority
CN
China
Prior art keywords
chip
chips
pins
row
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010184507.2A
Other languages
Chinese (zh)
Inventor
谢明璞
李选中
吴振志
吴涵渠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Aoto Electronics Co Ltd
Original Assignee
Shenzhen Aoto Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Aoto Electronics Co Ltd filed Critical Shenzhen Aoto Electronics Co Ltd
Priority to CN202010184507.2A priority Critical patent/CN111462643A/en
Publication of CN111462643A publication Critical patent/CN111462643A/en
Priority to PCT/CN2020/130506 priority patent/WO2021184810A1/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Led Device Packages (AREA)

Abstract

The application relates to an L ED lamp bead and a L ED display structure, the L ED lamp bead comprises a lamp body, a light emitting chip group and pins, wherein the light emitting chip group is arranged on a first end face of the lamp body, the pins are arranged on a second end face of the lamp body, the light emitting chip group comprises at least one light emitting chip, the pins comprise color signal pins and row signal pins, at least two row signal pins are arranged, two row signal pins of the same L ED lamp bead are pairwise, the two row signal pins are electrically connected with each other through a circuit inside the lamp body, one of the electrically connected row signal pins is directly connected with an electrode of the light emitting chip, the other is a redundant row signal pin, the L ED lamp bead is attached to a mounting PCB to form a L ED display structure, and by providing the redundant row signal pins, the color signal circuit and the row signal circuit can be arranged on the same layer of the PCB, so that the wiring difficulty and the manufacturing cost of the PCB.

Description

L ED lamp pearl and L ED show structure
Technical Field
The application relates to L ED shows the field, especially relates to a L ED lamp pearl and L ED display structure.
Background
L ED display screen wide application is in more and more scenes such as outdoor display, surveillance center, advertisement/media show, stage, if realize the L ED of large tracts of land and show, then need connect L ED lamp pearl through the circuit and become the matrix, the luminous of lamp pearl matrix is controlled to rethread control chip, can realize diversified display.
The traditional L ED lamp bead is generally provided with 4 pins, namely R, G, B, C pins, wherein R, G, B pins correspond to an R chip, a G chip and a B chip respectively, and C pins are row signal pins.A connecting circuit of a PCB board comprises 2 connecting lines which are mutually vertical in directions, namely a connecting line between transverse row signals (C pins) and a connecting line between longitudinal color signals (R, G, B pins). the two connecting lines are mutually vertical, so the PCB needs to be connected to the lamp bead by using a multilayer structure.
Disclosure of Invention
Based on this, when necessary pasting to the lamp plate to traditional L ED lamp pearl on, need use multilayer PCB, and need punch, increase the problem of PCB's the design degree of difficulty and cost, provide a L ED lamp pearl and L ED display structure.
The application provides an L ED lamp pearl in the first aspect, including lamp body, luminescent chip group and pin, wherein,
the lamp body is provided with a first end face and a second end face which are oppositely arranged, the light emitting chip group is arranged on the first end face, and the pins are arranged on the second end face;
the luminous chip group is electrically connected with the pins, when the L ED lamp bead is pasted on the PCB, the luminous chip group is connected with a circuit on the PCB through the pins, and the luminous chip group comprises at least one luminous chip;
the pins comprise color signal pins and row signal pins, the color signal pins are arranged corresponding to the light-emitting chips, at least two row signal pins are arranged, every two row signal pins of the same L ED lamp bead are paired, and a pair of row signal pins are electrically connected with each other through a circuit in the lamp body;
one of the pair of row signal pins electrically connected with each other is directly connected with an electrode of the light emitting chip, and the other row signal pin is a redundant row signal pin and is not directly connected with the electrode of the light emitting chip, but is indirectly connected with the electrode of the light emitting chip through the paired row signal pins.
In one embodiment, the light emitting chip set includes an R chip, a G chip, and a B chip.
In one embodiment, the number of the row signal pins is two, the number of the color signal pins is three, the R chip, the G chip and the B chip respectively correspond to one color signal pin, the first electrodes of the R chip, the G chip and the B chip are connected to the corresponding color signal pins, and the second electrodes are connected to one of the row signal pins;
the first electrode and the second electrode are one of a cathode and an anode, and the polarities of the first electrode and the second electrode are opposite.
In one embodiment, the light emitting chip set includes a plurality of R chips, a plurality of G chips, and a plurality of B chips, and an R chip, a G chip, and a B chip form a chip cluster, and the chip cluster is arranged in an array on the first end surface.
In one embodiment, in the chip cluster array, first electrodes of the chips in the same color in each column of the chip cluster are connected to the same color signal pin, and second electrodes of the R chip, the G chip and the B chip in each row of the chip cluster are connected to the same row of the signal pin;
the first electrode and the second electrode are one of a cathode and an anode, and the polarities of the first electrode and the second electrode are opposite;
the row signal pins are provided with 2M, the color signal pins are provided with 3N, M is the number of rows of the chip cluster array, and N is the number of columns of the chip cluster array.
In one embodiment, the light emitting chip set comprises 4 chip clusters, the 4 chip clusters are arranged in a 2 × 2 array, anodes of R chips of the same row of chip clusters share one color signal pin, anodes of G chips of the same row of chip clusters share one color signal pin, anodes of B chips of the same row of chip clusters also share one color signal pin, and cathodes of the R chips, the G chips and the B chips of the same row of chip clusters share one row of signal pins.
In one embodiment, in the chip cluster array, the first electrodes of the R chips of each column of chip clusters are connected to the same color signal pin, and the first electrodes of the G chips and the first electrodes of the B chips of each column of chip clusters are connected to the same color signal pin; the second electrodes of the R chip, the G chip and the B chip of each row of chip clusters are connected to the same row of signal pins;
the first electrode and the second electrode are one of a cathode and an anode, and the polarities of the first electrode and the second electrode are opposite;
the row signal pins are provided with 2M, the color signal pins are provided with 2N, M is the number of rows of the chip cluster array, and N is the number of columns of the chip cluster array.
In one embodiment, anodes of the R chips of the same column of chip clusters are connected to the same color signal pin, anodes of the G chips and the B chips of the same column of chip clusters are connected to the same color signal pin, and cathodes of the R chips, the G chips and the B chips of the same row of chip clusters are connected to the same row signal pin.
Through providing redundant row signal pin, can realize that colour signal circuit and row signal circuit can lay on the same layer of PCB, need not to use multilayer structure's PCB, avoided punching on PCB to can reduce PCB's the wiring degree of difficulty and manufacturing cost.
The utility model provides an L ED shows structure, including PCB board and L ED lamp pearl, L ED lamp pearl array sets up on the PCB board, is provided with connecting circuit on the PCB board, is connected through connecting circuit electricity each other between the L ED lamp pearl, L ED lamp pearl aforesaid arbitrary L ED lamp pearl.
In one of them embodiment, the connecting circuit includes colour signal circuit and line signal circuit, and the colour signal circuit corresponds the bottom setting of L ED lamp pearl, and the line signal circuit corresponds the clearance setting of L ED lamp pearl.
Because L ED lamp pearl is provided with redundant row signal pin, therefore the colour signal circuit on the PCB board and the row signal circuit can be laid on the same layer of PCB, and can not produce alternately, therefore the PCB board need not to use multilayer structure, has avoided punching on PCB to can reduce PCB's the wiring degree of difficulty and manufacturing cost.
Drawings
Fig. 1 is a schematic structural diagram of an L ED lamp bead according to an embodiment of the present application;
fig. 2 is a top view of the side of the second end face of an L ED bead of the present application;
fig. 3 is a schematic structural view of an L ED lamp bead according to another embodiment of the present application;
fig. 4 is a schematic structural view of an L ED lamp bead according to yet another embodiment of the present application;
fig. 5 is a schematic structural view of an L ED lamp bead according to yet another embodiment of the present application;
FIG. 6 is a top view of the back of the L ED bead of the embodiment shown in FIG. 5;
fig. 7 is a schematic view of a wiring structure of a Printed Circuit Board (PCB) in which L ED lamp beads are arranged on the PCB when the lamp beads are single lamp beads according to an embodiment of the present application;
fig. 8 is a schematic diagram illustrating a connection relationship between a light emitting chip set and a pin when an L ED lamp bead is a composite lamp bead according to an embodiment of the present disclosure;
fig. 9 is a schematic view illustrating a connection relationship between a light emitting chipset and a pin when an L ED lamp bead of another embodiment of the present application is a composite lamp bead;
fig. 10 is a line structure diagram of L ED lamp beads arranged on a PCB board when the lamp beads are composite lamp beads, the PCB board, according to an embodiment of the present application.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
L ED lamp pearl and L ED of each embodiment of this application show the structure, can realize two mutually perpendicular's circuit structure's on single-layer PCB line, need not to punch on PCB.
L ED lamp beads and L ED display structures of the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Referring to fig. 1 and fig. 2, a schematic structural diagram of an L ED lamp bead 10 according to an embodiment of the present application is exemplarily shown, the L ED lamp bead 10 includes a lamp body 110, a light emitting chipset 120 and pins 130, the lamp body 110 has a first end surface 110a and a second end surface 110b that are oppositely disposed, the light emitting chipset 120 is disposed on the first end surface 110a, the pins 130 are disposed on the second end surface 110b, the light emitting chipset 120 is electrically connected to the pins 130, and when the L ED lamp bead 10 is mounted on a PCB, the light emitting chipset 120 is connected to a circuit on the PCB through the pins 130.
In some embodiments, the light emitting chip set 120 is disposed on the surface of the first end surface 110a, for example, in the embodiment shown in fig. 1, the light emitting chip set 120 is directly attached to the surface of the first end surface 110 a.
Referring to fig. 3, in other embodiments, a lamp cup 112 may be disposed on a side of the lamp body 110 close to the first end surface 110a, and the light emitting chip set 120 may be disposed in the lamp cup 112. For example, the first end surface 110a may be depressed toward the second end surface 110b to form the lamp cup 112. The shape of the lamp cup 112 may be cylindrical or polygonal, but may be other shapes, depending on the product requirements.
Referring to fig. 4, in one or more specific embodiments, the lamp body 110 may include a first substrate 114 and a second substrate 116, the first substrate 114 and the second substrate 116 are stacked and fixed to each other, a through hole 114a is formed on the first substrate 114, the second substrate 116 closes the through hole 114a from one end of the through hole 114a, and the light emitting chip set 120 is disposed on the second substrate 116 and received in the through hole 114a of the first substrate 114. The lamp cup 112 is formed by combining the first substrate 114 and the second substrate 116, so that the light emitting chip set 120 can be conveniently fixed on the lamp body 110.
The light emitting chip group 120 includes at least one light emitting chip, which may be one of a red chip (R chip), a green chip (G chip), and a blue chip (B chip).
As shown in fig. 1, in some embodiments, the L ED lamp bead 10 may be a single lamp bead, and the light emitting chipset 120 includes an R chip, a G chip, and a B chip, that is, an R chip, a G chip, and a B chip are packaged on the same lamp bead.
Referring to fig. 5 and 6, in other embodiments, the L ED lamp bead 10 may be an all-in-one composite lamp bead, the light emitting chipset 120 includes a plurality of R chips, a plurality of G chips, and a plurality of B chips, one R chip, one G chip, and one B chip form a chip cluster, and the chip cluster is distributed on the first end surface 110a in an array manner.
Of course, the light emitting chip set 120 may only include one of the R chip, the G chip and the B chip, and at this time, the L ED lamp bead 10 is a monochromatic lamp bead.
In one or more embodiments, the light emitting chip set 120 may further include surplus chips, i.e., chips that are extra out of the chip cluster, and the surplus chips may be R chips, G chips, B chips, white chips, or chips emitting other colors of light. The surplus chip can be used for assisting in achieving light effect adjustment, contrast adjustment or assisting in achieving touch.
Referring to fig. 2 and 6, the pins 130 include color signal pins 131 and row signal pins 133, the color signal pins 131 are disposed corresponding to the light emitting chips, at least two row signal pins 133 are disposed, and two row signal pins 133 of the same L ED lamp bead 10 are paired in pairs, and the pair of row signal pins 133 are electrically connected to each other through a circuit inside the lamp body 110.
One of the pair of row signal pins 133 electrically connected to each other is directly connected to an electrode of the light emitting chip, and the other is a redundant row signal pin 133, which is not directly connected to an electrode of the light emitting chip but indirectly connected to an electrode of the light emitting chip through the paired row signal pin 133. The electrode of the light emitting chip may be an anode or a cathode.
Referring to fig. 1 and 2, in some embodiments, L ED lamp beads 10 are single lamp beads including one chip cluster, two row signal pins 133 may be provided, and the two row signal pins 133 are electrically connected through a circuit inside the lamp body 110.
The color signal pins 131 may be provided in three numbers, where the R chip, the G chip, and the B chip respectively correspond to one color signal pin 131, first electrodes of the R chip, the G chip, and the B chip are connected to the corresponding color signal pins 131, and second electrodes of the R chip, the G chip, and the B chip are connected to one of the row signal pins 133. The first electrode and the second electrode are one of a cathode and an anode, and the polarities of the first electrode and the second electrode are opposite. When the second electrode is an anode, the R chip, the G chip and the B chip are all positive. When the second electrode is a cathode, the R chip, the G chip and the B chip are all negative.
Please refer to fig. 7, when a plurality of L ED lamp beads 10 are mounted on a PCB, because a redundant row signal pin 133 is added on L ED lamp bead 10, two row signal pins 133 are electrically connected inside the lamp beads, and original row signals running through the PCB are partially cut off and transferred to the L ED lamp bead 10 for internal routing, thereby, a color signal circuit connected to the color signal pin 131 on the PCB can be routed longitudinally under the lamp body 110 correspondingly, and a row signal circuit connected to the row signal pins 133 of different lamp beads can be routed transversely to a gap between the lamp beads, and the color signal circuit and the row signal circuit are routed transversely inside the lamp bead package at the crossing portion, thereby eliminating the crossing of the color signal circuit and the row signal circuit, so that the color signal circuit and the row signal circuit can be arranged on the same layer of the PCB, without using a multilayer PCB, avoiding the punching on the PCB, and thus reducing the wiring difficulty and manufacturing cost of the PCB.
Referring to fig. 5 and 6, in other embodiments, the L ED lamp bead 10 is a composite lamp bead including a plurality of chip clusters, the chip clusters are arranged in an array, in the chip cluster array, the first electrodes of the chips with the same color in each column of the chip clusters are connected to the same color signal pin 131, the second electrodes of the chips R, G, and B in each row of the chip clusters are connected to the same row of the signal pin 133, the first electrode and the second electrode are one of a cathode and an anode, and the polarities of the first electrode and the second electrode are opposite.
The number of the row signal pins 133 is 2M, and the number of the color signal pins 131 is 3N, where M is the number of rows of the chip cluster array, and N is the number of columns of the chip cluster array.
The second electrodes of the R chip, the G chip, and the B chip of each row of chip clusters are connected to one row signal pin 133, two of the row signal pins 133 are a pair, and are connected to one of the paired row signal pins 133, where one of the row signal pins 133 is redundant.
For example, referring to fig. 8, in a composite lamp bead including 4 chip clusters, the 4 chip clusters are arranged in a 2 × 2 array, anodes of R chips of the same row of chip clusters share one color signal pin 131, anodes of G chips of the same row of chip clusters share one color signal pin 131, anodes of B chips of the same row of chip clusters also share one color signal pin 131, and cathodes of R chips, G chips, and B chips of the same row of chip clusters share one row of signal pin 133.
The row signal pins 133 are provided in 4 numbers (redundant row signal pins 133 are not shown in fig. 8), and the 4 row signal pins 133 are provided in two pairs, one of each pair of row signal pins 133 being connected to the cathodes of the R, G, and B chips of each row chip cluster. The number of the color signal pins 131 is 6, and the color signal pins correspond to anodes of the R chip, the G chip, and the B chip of the two rows of chip clusters respectively.
Referring to fig. 5, 6 and 9, in other embodiments, the L ED lamp bead 10 is a composite lamp bead including a plurality of chip clusters, the chip clusters are arranged in an array, in the chip cluster array, the first electrode of the R chip of each column of chip clusters is connected to the same color signal pin 131, the first electrode of the G chip and the first electrode of the B chip of each column of chip clusters are connected to the same color signal pin 131, the second electrodes of the R chip, the G chip and the B chip of each row of chip clusters are connected to the same row signal pin 133, the first electrode and the second electrode are one of a cathode and an anode, and the polarities of the first electrode and the second electrode are opposite.
The number of the row signal pins 133 is 2M, and the number of the color signal pins 131 is 2N, where M is the number of rows of the chip cluster array and N is the number of columns of the chip cluster array.
Fig. 9 shows a pin 130 connection manner of the chip cluster of the 2 × 2 array, in which anodes of R chips of the same column of chip cluster are connected to the same color signal pin 131, anodes of G chips and B chips of the same column of chip cluster are connected to the same color signal pin 131, and cathodes of R chips, G chips and B chips of the same row of chip cluster are connected to the same row signal pin 133.
The row signal pins 133 are provided with 4, 4 row signal pins 133 are arranged in two pairs, and each pair of row signal pins 133 is electrically connected inside the lamp bead. The cathodes of the R, G, and B chips of each row of chip clusters are connected to the same row signal pin 133. The color signal pins 131 are provided with 4, two of which correspond to the anodes of the R chips of each column of chip clusters, and the other two of which correspond to the anodes of the G chips and the B chips of each column of chip clusters.
Referring to fig. 10, when the composite lamp beads are mounted on the PCB, the color signal lines connected to the color signal pins 131 on the PCB are also routed longitudinally from the lower side of the lamp body 110, the row signal lines connected to the row signal pins 133 of different lamp beads are routed transversely to the gaps between the lamp beads, and the color signal lines and the row signal lines are routed transversely inside the lamp bead package at the crossing portions, so that the purpose of eliminating the crossing of the color signal lines and the row signal lines is achieved, the color signal lines and the row signal lines can be arranged on the same layer of the PCB, the PCB with a multi-layer structure is not needed, and the situation that holes are formed in the PCB is avoided, thereby reducing the wiring difficulty and the manufacturing cost of the PCB.
It will be appreciated that the aforementioned rows and columns are not strictly limited, and that row and column interchanges may be achieved by adjusting the viewing direction of the PCB/lamp body 110.
The pins 130 may be disposed along an edge of the second end face 110 b. A predetermined gap is formed between two adjacent pins 130, so as to facilitate the routing of the circuit on the PCB.
It can be seen that by providing the redundant row signal pins 133, the color signal lines and the row signal lines can be arranged on the same layer of the PCB without using the PCB having a multi-layer structure, thereby avoiding punching on the PCB and reducing the wiring difficulty and manufacturing cost of the PCB.
The application still provides an L ED shows structure, including PCB board and L ED lamp pearl, L ED lamp pearl array sets up on the PCB board, is provided with connecting circuit on the PCB board, is connected through connecting circuit electricity each other between the L ED lamp pearl, L ED lamp pearl can be above-mentioned arbitrary embodiment L ED lamp pearl.
The connecting circuit can include color signal circuit and line signal circuit, and the color signal circuit corresponds the bottom setting of L ED lamp pearl, and the line signal circuit corresponds the clearance setting of L ED lamp pearl.
Because L ED lamp pearl is provided with redundant row signal pin, therefore the colour signal circuit on the PCB board and the row signal circuit can be laid on the same layer of PCB, and can not produce alternately, therefore the PCB board need not to use multilayer structure, has avoided punching on PCB to can reduce PCB's the wiring degree of difficulty and manufacturing cost.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An L ED lamp bead is characterized by comprising a lamp body, a luminous chip group and pins, wherein,
the lamp body is provided with a first end face and a second end face which are oppositely arranged, the light emitting chip group is arranged on the first end face, and the pins are arranged on the second end face;
the luminous chip group is electrically connected with the pins, when the L ED lamp bead is pasted on the PCB, the luminous chip group is connected with a circuit on the PCB through the pins, and the luminous chip group comprises at least one luminous chip;
the pins comprise color signal pins and row signal pins, the color signal pins are arranged corresponding to the light-emitting chips, at least two row signal pins are arranged, every two row signal pins of the same L ED lamp bead are paired, and a pair of row signal pins are electrically connected with each other through a circuit in the lamp body;
one of the pair of row signal pins electrically connected with each other is directly connected with an electrode of the light emitting chip, and the other row signal pin is a redundant row signal pin and is not directly connected with the electrode of the light emitting chip, but is indirectly connected with the electrode of the light emitting chip through the paired row signal pins.
2. The L ED lamp bead of claim 1, wherein the light emitting chipset includes an R chip, a G chip and a B chip.
3. The L ED lamp bead of claim 2, wherein the row signal pins are provided with two, the color signal pins are provided with three, each of the R chip, the G chip and the B chip corresponds to one color signal pin, the first electrodes of the R chip, the G chip and the B chip are connected to the corresponding color signal pins, and the second electrodes are connected to one of the row signal pins;
the first electrode and the second electrode are one of a cathode and an anode, and the polarities of the first electrode and the second electrode are opposite.
4. The L ED lamp bead of claim 1, wherein the light emitting chip set includes a plurality of R chips, a plurality of G chips and a plurality of B chips, an R chip, a G chip and a B chip form a chip cluster, and the chip cluster is arranged in an array on the first end face.
5. The L ED lamp bead of claim 4, wherein in a chip cluster array, the first electrodes of the chips of the same color in each column of the chip cluster are connected to the same color signal pin, and the second electrodes of the R chip, the G chip and the B chip in each row of the chip cluster are connected to the same row of the signal pin;
the first electrode and the second electrode are one of a cathode and an anode, and the polarities of the first electrode and the second electrode are opposite;
the row signal pins are provided with 2M, the color signal pins are provided with 3N, M is the number of rows of the chip cluster array, and N is the number of columns of the chip cluster array.
6. The L ED lamp bead of claim 5, wherein the light emitting chip set includes 4 chip clusters, the 4 chip clusters are arranged in a 2 × 2 array, the anodes of the R chips in the same column of chip clusters share a color signal pin, the anodes of the G chips in the same column of chip clusters share a color signal pin, the anodes of the B chips in the same column of chip clusters also share a color signal pin, and the cathodes of the R chips, the G chips and the B chips in the same row of chip clusters share a row of signal pins.
7. The L ED lamp bead of claim 4, wherein in the chip cluster array, the first electrodes of the R chips of each column of chip clusters are connected to the same color signal pin, and the first electrodes of the G chips of each column of chip clusters and the first electrodes of the B chips are connected to the same color signal pin;
the first electrode and the second electrode are one of a cathode and an anode, and the polarities of the first electrode and the second electrode are opposite;
the row signal pins are provided with 2M, the color signal pins are provided with 2N, M is the number of rows of the chip cluster array, and N is the number of columns of the chip cluster array.
8. The L ED lamp bead of claim 7, wherein the anodes of the R chips of the same column of chip clusters are connected to the same color signal pin, the anodes of the G chips and the B chips of the same column of chip clusters are connected to the same color signal pin, and the cathodes of the R chips, the G chips and the B chips of the same row of chip clusters are connected to the same row signal pin.
9. An L ED display structure, includes PCB board and L ED lamp pearl, and L ED lamp pearl array sets up on the PCB board, is provided with connecting circuit on the PCB board, connects electrically each other through connecting circuit between the L ED lamp pearl, L ED lamp pearl be claim 1-8 any one the L ED lamp pearl.
10. The L ED display structure of claim 9, wherein the connection circuitry includes color signal circuitry and row signal circuitry, the color signal circuitry disposed in correspondence with the bottom of the L ED lamp beads and the row signal circuitry disposed in correspondence with the gaps of the L ED lamp beads.
CN202010184507.2A 2020-03-17 2020-03-17 L ED lamp pearl and L ED show structure Pending CN111462643A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202010184507.2A CN111462643A (en) 2020-03-17 2020-03-17 L ED lamp pearl and L ED show structure
PCT/CN2020/130506 WO2021184810A1 (en) 2020-03-17 2020-11-20 Led lamp bead and led display structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010184507.2A CN111462643A (en) 2020-03-17 2020-03-17 L ED lamp pearl and L ED show structure

Publications (1)

Publication Number Publication Date
CN111462643A true CN111462643A (en) 2020-07-28

Family

ID=71679234

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010184507.2A Pending CN111462643A (en) 2020-03-17 2020-03-17 L ED lamp pearl and L ED show structure

Country Status (2)

Country Link
CN (1) CN111462643A (en)
WO (1) WO2021184810A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112864299A (en) * 2020-11-10 2021-05-28 深圳市奥拓电子股份有限公司 Public utmost point pin detached full-color LED lamp pearl and LED display screen
CN112863386A (en) * 2021-02-10 2021-05-28 Tcl华星光电技术有限公司 Backlight module and display device
WO2021184810A1 (en) * 2020-03-17 2021-09-23 深圳市奥拓电子股份有限公司 Led lamp bead and led display structure
CN117334131A (en) * 2023-06-29 2024-01-02 合肥达视光电科技有限公司 Transparent display screen with safeguard function
WO2024007400A1 (en) * 2022-07-05 2024-01-11 江西兆驰晶显有限公司 Led lamp panel structure
WO2024007401A1 (en) * 2022-07-05 2024-01-11 江西兆驰晶显有限公司 Led arrangement structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203367276U (en) * 2013-06-14 2013-12-25 合肥瑞华电子科技有限责任公司 Combined packaging structure of LED lamp beads
CN205946259U (en) * 2016-08-09 2017-02-08 深圳市磊芯半导体有限公司 Double -line serial control's LED lamp
CN108426178A (en) * 2018-02-02 2018-08-21 深圳市奥拓电子股份有限公司 LED lamp bead and LED show structure
CN108803948A (en) * 2018-08-03 2018-11-13 深圳市奥拓电子股份有限公司 LED lamp bead, LED touch modules and LED display
CN208797030U (en) * 2018-05-09 2019-04-26 深圳市聚飞光电股份有限公司 LED lamp panel
CN110504244A (en) * 2018-05-18 2019-11-26 深圳市聚飞光电股份有限公司 LED and light emitting device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200845877A (en) * 2007-05-07 2008-11-16 Tysun Inc Heat-dissipating substrates of composite structure
TWM389350U (en) * 2010-01-26 2010-09-21 Jmk Optoelectronic Co Ltd Light source module of light-emitting diode
CN102956760A (en) * 2011-08-22 2013-03-06 上海尊琪贸易有限公司 Method for realizing multilayer circuit on single-layer conducting plane
WO2013116114A1 (en) * 2012-02-02 2013-08-08 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
CN111462643A (en) * 2020-03-17 2020-07-28 深圳市奥拓电子股份有限公司 L ED lamp pearl and L ED show structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203367276U (en) * 2013-06-14 2013-12-25 合肥瑞华电子科技有限责任公司 Combined packaging structure of LED lamp beads
CN205946259U (en) * 2016-08-09 2017-02-08 深圳市磊芯半导体有限公司 Double -line serial control's LED lamp
CN108426178A (en) * 2018-02-02 2018-08-21 深圳市奥拓电子股份有限公司 LED lamp bead and LED show structure
CN208797030U (en) * 2018-05-09 2019-04-26 深圳市聚飞光电股份有限公司 LED lamp panel
CN110504244A (en) * 2018-05-18 2019-11-26 深圳市聚飞光电股份有限公司 LED and light emitting device
CN108803948A (en) * 2018-08-03 2018-11-13 深圳市奥拓电子股份有限公司 LED lamp bead, LED touch modules and LED display

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021184810A1 (en) * 2020-03-17 2021-09-23 深圳市奥拓电子股份有限公司 Led lamp bead and led display structure
CN112864299A (en) * 2020-11-10 2021-05-28 深圳市奥拓电子股份有限公司 Public utmost point pin detached full-color LED lamp pearl and LED display screen
CN112863386A (en) * 2021-02-10 2021-05-28 Tcl华星光电技术有限公司 Backlight module and display device
WO2024007400A1 (en) * 2022-07-05 2024-01-11 江西兆驰晶显有限公司 Led lamp panel structure
WO2024007401A1 (en) * 2022-07-05 2024-01-11 江西兆驰晶显有限公司 Led arrangement structure
CN117334131A (en) * 2023-06-29 2024-01-02 合肥达视光电科技有限公司 Transparent display screen with safeguard function

Also Published As

Publication number Publication date
WO2021184810A1 (en) 2021-09-23

Similar Documents

Publication Publication Date Title
CN111462643A (en) L ED lamp pearl and L ED show structure
CN107548523A (en) Light emitting module
CN113571627A (en) Circuit board of LED display unit
CN211124837U (en) Mini L ED lamp pearl and L ED display screen of convenient wiring
CN108335639B (en) LED display device
CN221200684U (en) LED lamp panel structure
CN220020538U (en) LED arrangement structure
CN112133731B (en) Display panel and display device
CN113454703B (en) Light emitting panel, circuit board, and display device
CN209309942U (en) Flexible and hard combined structure and backlight module with flexible and hard combined structure
WO2023185099A1 (en) Multi-layer carrier board for led product and device using same
US11450795B2 (en) Light-emitting module and surface-emitting light source including a plurality of wiring formations between two terminals
CN217640579U (en) LED arrangement structure
CN111402751A (en) L ED lamp pearl and L ED display screen
EP4325470A1 (en) Led arrangement structure
CN216054777U (en) LED light-emitting device, display module and display equipment
CN218831207U (en) Light-emitting screen body and light-emitting device
CN215834522U (en) Display panel
CN211827958U (en) LED lamp bead and LED display screen
CN216353113U (en) LED display panel, LED display module and LED display screen
CN116456767A (en) Display panel and display device
TWI705286B (en) Backlight module and light bar used for the same
CN114898674A (en) Lamp bead arrangement structure for LED display
CN117396029A (en) Display panel and display device
CN118587987A (en) LED display carrier plate and display device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information
CB02 Change of applicant information

Address after: 518000 1805, tower 2, Shenye Jinyuan Building, No.112, Qingshuihe 1st Road, Qingshuihe community, Luohu District, Shenzhen City, Guangdong Province

Applicant after: SHENZHEN AOTO ELECTRONICS Co.,Ltd.

Address before: 518000 9th Floor, United Headquarters Building, No. 63 Xuefu Road, Nanshan District, Shenzhen City, Guangdong Province

Applicant before: SHENZHEN AOTO ELECTRONICS Co.,Ltd.

RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20200728