WO2023185099A1

WO2023185099A1 - Multi-layer carrier board for led product and device using same

Info

Publication number: WO2023185099A1
Application number: PCT/CN2022/138981
Authority: WO
Inventors: 袁楚卓; 陈都
Original assignee: 深圳市美矽微半导体有限公司
Priority date: 2022-03-27
Filing date: 2022-12-14
Publication date: 2023-10-05
Also published as: CN114867145A; CN114867145B; CN118140594A; CN118234124A

Abstract

Disclosed in the present invention is a multi-layer carrier board for an LED product, comprising a GND board, a VDD board, and an optional DATA board. The middle of the GND board comprises a GND board mesoporous area (GNDSP), the middle of the VDD board comprises a VDD board mesoporous area (VDDSP), and the middle of the optional DATA board comprises a DATA board mesoporous area (DATASP). Moreover, outer contours of the GND board mesoporous area (GNDSP), the VDD board mesoporous area (VDDSP) and the optional DATA mesoporous hole area (DATASP) completely correspond to one another; and areas outside the GND board mesoporous area (GNDSP), the VDD board mesoporous area (VDDSP) and the optional DATA board mesoporous area (DATASP) are carrier board body areas corresponding to the respective boards. The present disclosure can consider the light transmission and the LED display/illumination effect, even achieve the equal-interval display effect, and further, even achieve the visual effect having equal intervals and increased light transmittance.

Description

A multi-layer carrier board and equipment for LED products

Technical field

The present disclosure relates to the field of LED, and specifically to a multi-layer carrier board for LED products and equipment thereof.

Background technique

Currently, there are a wide range of LED carrier boards in the existing technology, but when used for lighting or display, demands for transparent and translucent lighting or display begin to appear on the market.

Taking display as an example, the requirement for translucent display puts forward new requirements for the LED carrier board structure. Overall, there is an urgent need in this field to develop LED carrier board technology and display equipment that take into account both light transmission and display visual effects.

technical problem

The invention solves the technical problem of LED transparent or translucent display.

Technical solutions

The present disclosure provides a multi-layer carrier board for LED products, specifically as follows:

The multi-layer LED carrier board includes: a GND board, a VDD board, and an optional DATA board, where the GND board is used for grounding, the VDD board is used for power supply, and the optional DATA board is used to provide data signals to LED products; When the DATA board is not included, the data signal is provided to the LED product in the form of a carrier wave through the VDD board and GND board.

The middle part of the GND plate includes a GND plate hole area (GNDSP).

The middle part of the VDD board includes a VDD board hole area (VDDSP).

The middle part of the optional DATA board includes a DATA board hole area (DATASP).

and,

The outer contours of the hole area in the GND board (GNDSP), the hole area in the VDD board (VDDSP), and the optional hole area in the DATA board (DATASP) completely correspond to each other.

The area outside the hole area in the GND board (GNDSP), the hole area in the VDD board (VDDSP), and the optional hole area in the DATA board (DATASP) is the carrier board main area of the corresponding board.

Preferably,

LED products are fixed on the DATA board, or VDD board, or GND board.

Preferably,

The DATA board itself is divided into two separate parts, and the two parts are symmetrical.

Preferably,

The VDD board and GND board are respectively a complete carrier board body and are symmetrical.

Preferably,

The GND board, VDD board, and DATA board are insulated from each other to prevent short circuits.

Preferably,

Among the GND board, VDD board, and DATA board, the middle board can be the VDD board, the GND board, or the DATA board.

The GND board, VDD board, and the remaining two boards in the DATA board, either one is above the centered board and the other is below the centered board.

Preferably,

For the central board and the boards located above the central board, insulating coatings are provided on their respective lower surfaces so that the GND board, the VDD board, and the DATA board are insulated from each other.

Preferably,

For the central board, and the boards located above the central board, additional first insulating boards and second insulating boards are provided below each, so that the GND board, the VDD board, and the DATA board are connected to each other. insulation.

Preferably,

For the multi-layer carrier board, via holes are provided on one or more of the GND board, VDD board, and DATA board; and when at least two boards are provided with via holes, at least one of the boards A via hole corresponds to a via hole on another board in position, shape, and size.

Preferably,

The multi-layer carrier board is taken as a whole, and the board on one side of the whole does not need to be provided with via holes.

beneficial effects

The above-mentioned multi-layer carrier board of the present disclosure can take into account light transmission and LED display/illumination effects, and even achieve equal-spaced display effects. Furthermore, even achieve equal-spaced visual effects with improved light transmittance.

Description of drawings

In order to explain the technical solutions of the embodiments of the present disclosure more clearly, the drawings needed to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present disclosure and therefore do not It should be regarded as a limitation of the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without exerting creative efforts.

Figure 1 is a schematic structural diagram of a multi-layer carrier board provided by an embodiment of the present disclosure;

Figure 2 is a schematic diagram of the mesopore area and the surrounding area of the mesopore area of a multi-layer carrier board according to an embodiment of the present disclosure;

Figure 3 is a schematic assembly diagram of a multi-layer carrier board provided by an embodiment of the present disclosure when used in LED products;

Figure 4 is a schematic assembly diagram of a multi-layer carrier board provided by an embodiment of the present disclosure when used in LED products;

Figure 5 is a schematic diagram of left and right expansion and up and down expansion of a multi-layer carrier board provided by an embodiment of the present disclosure;

Figure 6 is a schematic diagram of the GND board extending left and right and up and down in a multi-layer carrier board according to an embodiment of the present disclosure.

Best Mode of Carrying Out the Invention

In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings 1 to 6 in the embodiments of the present disclosure. Obviously, the technical solutions in the embodiments of the present disclosure will be described clearly and completely. The described embodiments are some, but not all, of the embodiments of the present disclosure. The components of the embodiments of the present disclosure generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

Referring to Figures 1 and 2, in one embodiment, the present disclosure discloses a multi-layer carrier board for LED products, including: a GND board, a VDD board, and an optional DATA board, wherein the GND board is used for Ground, the VDD board is used for power supply, and the optional DATA board is used to provide data signals to LED products; when the DATA board is not included, data signals are provided to LED products in the form of carrier waves through the VDD board and GND board.

The middle part of the GND plate includes a GND plate hole area (GNDSP).

The middle part of the VDD board includes a VDD board hole area (VDDSP).

and,

First, take having a DATA board as an example:

GND board, VDD board, and DATA board. The GND board is used for grounding, the VDD board is used for power supply, and the DATA board is used to provide data signals to LED products.

The middle part of the GND plate includes a GND plate hole area (GNDSP).

The middle part of the VDD board includes a VDD board hole area (VDDSP).

The middle part of the DATA board includes a DATA board hole area (DATASP).

and,

The outer contours of the hole area in the GND board (GNDSP), the hole area in the VDD board (VDDSP), and the hole area in the DATA board (DATASP) completely correspond to each other.

The area outside the hole area in the GND board (GNDSP), the hole area in the VDD board (VDDSP), and the hole area in the DATA board (DATASP) is the carrier board main area of the corresponding board.

In this case, since the outer contours of the hole area in the GND board (GNDSP), the hole area in the VDD board (VDDSP), and the hole area in the DATA board (DATASP) completely correspond to each other, the multi-layer carrier board will show 3 After the mesohole areas of the two boards completely overlap, the mesohole area is reflected to the outside. Therefore, when the multilayer carrier board is used as a carrier board for LED products, the mesohole area can be used as an area for light to pass through.

Secondly, for situations where a DATA board is not available, in the field of LED driving, technology has emerged that uses power supply lines such as zero live wires/positive and negative wires to transmit data signals while supplying power. This is equivalent to a carrier wave technology.

This means that even if there is no special DATA board, relying on the VDD board and GND board mentioned above, it can also transmit data signals while powering the LED product.

For the purpose of this disclosure, the LED product may include an LED luminous body, and the data signal may be a data signal for a specific LED product, a signal for different LED luminous bodies of a certain LED product, or a signal for a single LED luminous body. Specific encoding signals of different LED chips; that is, the data signal can be for the macro level of the LED product, or for the level of the LED light body underlying the LED product, or for the lower level object of the LED chip. .

In addition, the data signal may be an address encoding signal of a specific LED product/LED light body/LED chip, or may be a color signal of the color of illumination or display.

In short, regardless of whether the DATA board is included or not, the multi-layer carrier board can realize the transmission of corresponding data signals.

It can be understood that when the LED product is carried on the multi-layer carrier board, since the LED product is arranged in an area outside the mesohole area, then:

When the LED product is not working during the day, people's eyes can pass through the above middle hole area.

When the LED product is working, people's eyes can still pass through the above middle hole area.

In addition, the mesohole area can also be used for ventilation and heat dissipation when LED products are working.

In another embodiment,

One side of the multi-layer carrier board is used as the front to fix the LED product, and the other side of the multi-layer carrier board is used as the back, and the back is free of any IC and/or other components used to connect the LED products.

For this embodiment, it embodies another major innovation of the present disclosure compared with the prior art. LED products include LED illuminators. When the LED illuminators themselves include driver ICs (not limited to current-limiting ICs and constant-current ICs) in addition to LED chips, then the carrier board only needs to connect the LEDs through the corresponding pins on the front of the carrier board. The luminous body only needs to be powered, and there is no need to set any IC and/or other components connected to the LED luminous body on the back of the carrier board.

In another embodiment, a DATA board dedicated for data signal transmission is taken as an example.

Corresponding to the multi-layer carrier board, the LED product is fixed on the DATA board, or the VDD board, or the GND board.

For example, see Figure 3. When this side of the DATA board is used as the front of the multi-layer carrier board, the LED can be fixed on it. As for the LED, which needs to be connected to the VDD power supply and GND, it will not be affected. It can be understood that from a circuit perspective, for the multi-layer carrier board, the board corresponding to any layer can be used as the front surface to fix the LED, and the remaining boards can be used as other layers. No matter how you flexibly set the spatial relationship between the DATA board, VDD board, and GND board, you can complete the interconnection of the circuit while ensuring insulation, such as connecting multiple boards through vias, or connecting each board in a multi-layer carrier board. Each board has corresponding gold fingers on the edge to connect VDD power supply or data signal or ground. Naturally, when the VDD board is used as the front side of the multi-layer carrier board, it can also fix the LED; when the GND board is used as the front side of the multi-layer carrier board, it can also fix the LED.

Further, in another embodiment, for the multi-layer carrier board, via holes are provided on one or more of the GND board, VDD board, and DATA board; and when at least two boards are provided with When there are via holes, at least one via hole on one of the boards corresponds to one via hole on the other board in position, shape, and size.

Referring to Figures 2 and 3, taking the DATA board as the front side of a multi-layer carrier board as an example, when the LED is fixed on the front side, the following solution is exemplarily disclosed:

The DATA board is provided with a grounding type via DATAGND1 connected to the GND board, which corresponds to the position, shape, and size of the grounding type via VDDGND1 of the VDD board; when LED products (such as those mentioned above include LED chips and drivers) When the LED light body of the IC is fixed on the DATA board, the LED product is connected to the GND board through the two via holes on the DATA board and VDD board to achieve grounding.

Similarly, the DATA board is provided with a VDD-type via DATAVDD1 connected to the VDD board; when the LED product (such as the LED light body including the LED chip and driver IC mentioned above) is fixed on the DATA board, the LED product passes The via DATAVDD1 on the DATA board is connected to the VDD board for power supply; in addition, the LED product is connected to the DATA board through the data signal pin on the DATA board, namely the DATA1 pin, to interact with the data signal.

In another embodiment, the multi-layer carrier board is used as a whole, and the board on one side of the whole body does not need to be provided with via holes.

For this embodiment, as shown in Figures 2 and 3, the DATA board is used as the front side of the multi-layer carrier board as an example, and the GND board is used as a side board of the entire multi-layer carrier board, eliminating the need to provide via holes.

In another embodiment, the DATA board itself is in two separate parts, and the two parts are symmetrical. For example, in Figure 2, the DATA board is divided into left and right parts, and there is a left-right gap between the right end of the left part and the left end of the right part. Moreover, the upper and lower parts of the left part are symmetrical. For example, if the lower part and the upper part of the DATA board are cut along the middle horizontal line, the cut lower part can be translated upward and completely overlap with the upper part.

In another embodiment, the VDD board and the GND board are respectively a complete carrier board body and are symmetrical.

For the above two embodiments, see Figures 2 and 3, which illustrate that the DATA board is used on the front side of the multi-layer carrier board to fix the LED. For the flexibility of LED deployment, the DATA board itself is divided into two separate parts, and each part of the DATA board shown in Figure 2 and Figure 3 includes corresponding ground type vias DATAGND, VDD type vias DATAVDD and The data signal pin is the DATA pin (Note: DATAGND1, DATAVDD1 and DATA1 are marked in the figure, DATAGND2, DATAVDD2 and DATA2 are not marked) and each part can fix 2 LEDs. Referring to Figure 3 and Figure 4, the four LEDs are fixed to the DATA board through corresponding tin posts, and interconnected with the DATA board and the VDD board and GND board below it. It should be noted that the electrical interconnection between each board and the LED can also be achieved by welding wires or flying wires instead of tin pillars.

In another embodiment, the GND board, VDD board, and DATA board are insulated from each other to prevent short circuits.

In another embodiment, among the GND board, VDD board, and DATA board, the middle board may be a VDD board, a GND board, or a DATA board.

As mentioned before, the spatial positions of the GND board, VDD board, and DATA board can be flexibly set, and on the premise of ensuring insulation, circuit interconnection can be completed, such as connecting multiple boards through vias. Or each board in the multi-layer carrier board has corresponding gold fingers on the edge to connect VDD power supply or data signal or ground.

Referring further to Figures 2 and 3, this embodiment illustrates the situation where the VDD board is centered. Taking the VDD board in the center as an example, the DATA board can be located above or below the VDD board. Figure 2, Figure 3 and even Figure 1, the examples from top to bottom are: DATA board, VDD board, GND board.

In another embodiment, for the central board, and the boards located above the central board, insulating coatings are provided on their respective lower surfaces, so that the GND board, the VDD board, and the DATA board are in contact with each other. insulation.

For example, an insulating coating can be provided on the lower surfaces of the DATA board and the VDD board in FIGS. 1 to 3 .

In another embodiment, for the central board, and the boards located above the central board, additional first insulating boards and second insulating boards are provided below each, so that the GND board, the VDD board, and the DATA board plates, insulated from each other.

Compared with the previous embodiment, this embodiment reveals another solution for achieving insulation. When an additional insulating board is involved, the insulating board must include at least one via hole corresponding to the position, shape, and size relative to the board above or below the insulating board, so that the insulating board does not affect the remaining boards interconnected through the via holes.

Referring to Figure 2, in another embodiment, the surrounding board surface of the hole area (GNDSP) in the GND board includes four areas: a first area (A1), a second area (A2), and a third area (A3). , the fourth area (A4), and these four areas are all solid.

Combined with the DATA board disclosed above as the front side of the multi-layer carrier board, the VDD board is used as the central board, the via holes can be provided on the DATA board and the VDD board, and the GND board does not need to be provided with via holes. Therefore, in this embodiment, the GND board The four areas of are all solid.

Referring to Figure 2, in another embodiment, the middle part of the VDD board includes a VDD board hole area (VDDSP), and the surrounding board surface of the VDD board hole area (VDDSP) also includes four areas: the four area, corresponding to the first area (A1), second area (A2), third area (A3), and fourth area (A4) of the four areas of the GND board respectively, and among the four areas of the VDD board, each Set one via hole in each area, such as via hole VDDGND1.

Referring to Figure 2, in another embodiment, the middle part of the DATA board includes a DATA plate hole area (DATASP), and the surrounding board surface of the DATA plate hole area (DATASP) also includes four areas: the four The areas correspond to the four areas of the VDD board respectively, and among the four areas of the DATA board, one via hole is provided in each area, and the via hole in each area has the same position and shape as the corresponding via hole in the VDD board. , size corresponding. For example, the via DATAGND1 of the DATA board corresponds to the position of the via VDDGND1 of the VDD board.

Referring to Figure 2, it should be supplemented that the DATA board is also provided with an additional VDD type via hole DATAVDD1 for connecting to the VDD board. There is no need to set a via hole corresponding to the via hole DATAVDD1 on the VDD board.

Referring to Figure 2, in another embodiment, among the four areas surrounding the hole area (GNDSP) in the GND plate, the first area (A1), the second area (A2), the third area (A3), the The four areas (A4) are located in the northwest corner, southwest corner, northeast corner, and southeast corner of the GND plate hole area (GNDSP). Among them, in the counterclockwise direction,

The first area extends with a first area arm 1 (UARM1) and a first area arm 2 (LARM1).

The second area extends with a second area arm 1 (LARM2) and a second area arm 2 (DARM1).

The third area extends with a third area arm 1 (DARM2) and a third area arm 2 (RARM2).

The third area extends to the fourth area arm 1 (RARM1) and the fourth area arm 2 (UARM2).

and,

Between the first area arm 2 (LARM1) and the second area arm 1 (LARM2) is the left hole area (LSP) of the GND board.

Between the third area arm 2 (RARM2) and the fourth area arm 1 (RARM1) is the right hole area (RSP) of the GND board.

Between the second area arm 2 (DARM1) and the third area arm 1 (DARM2) is the lower hole area (DSP) of the GND board.

Between the fourth area arm 2 (UARM2) and the first area arm 1 (UARM1) is the upper hole area (USP) of the GND board.

For this embodiment, a specific example is used to illustrate how this embodiment uses relevant arms to ensure the basic mechanical properties of the multi-layer carrier plate. To be more precise, the relevant arms and the main body of the board except for the middle hole area, the left hole area, the right hole area, the upper hole area, and the lower hole area constitute multiple island-shaped carrier board areas surrounding the middle hole area. , forming an archipelago, ensuring the basic mechanical properties of the VDD board, DATA board, and GND board, thus ensuring the basic mechanical properties of the multi-layer carrier board.

Further, in another embodiment, the carrier plate does not need to be provided with row-like or column-like grids.

For this embodiment, compared to a traditional LED carrier plate or LED transparent display device (for example, LED transparent display screen) with one or more grids in the horizontal or vertical direction:

The present disclosure eliminates the need for any row or column grids. The reason is that the present disclosure can meet the mechanical properties of the carrier plate through the archipelago formed by the carrier plate body of each plate outside the mesopore area, to be precise, through the multiple island-shaped carrier plate areas included in the carrier plate body. It is not necessary to set up one or more grids in rows or columns to meet the basic requirements of the mechanical properties of the carrier plate. In other words, this embodiment has a mechanically reinforced structure through the solid areas of each plate outside the mesopore area. In addition, the grille itself affects the visual effect because the grille can easily cause visual illusions. This is also a consideration for eliminating the need to install a grille in this embodiment.

Further, referring to Figure 2, in another embodiment, the VDD board also has a hole area on the left side of the VDD board, a hole area on the right side of the VDD board, a lower hole area on the VDD board, an upper hole area on the VDD board, and is connected to: the left side of the GND board The hole area (LSP), the right hole area of the GND board (RSP), the lower hole area of the GND board (DSP), and the upper hole area of the GND board (USP) are completely corresponding in terms of position, shape, and size.

Further, referring to Figure 2, in another embodiment, the DATA board also has a hole area on the left side of the DATA board, a hole area on the right side of the DATA board, a lower hole area on the DATA board, an upper hole area on the DATA board, and is connected to: the left side of the GND board The hole area (LSP), the right hole area of the GND board (RSP), the lower hole area of the GND board (DSP), and the upper hole area of the GND board (USP) correspond to each other in terms of location and outer contour.

It should be noted that in Figure 2, the DATA board is exemplified as two separate parts. Therefore, in this embodiment, the left/right hole area, the upper/lower hole area, and the GND board correspond to the hole area. Although the shape They are not completely corresponding, but the position and outer contour are corresponding. Among them, the left/right hole areas are completely corresponding in terms of position, shape, and size, and the upper/lower hole areas are corresponding in terms of position and outer contour.

Further, in another embodiment, the left hole area and the right hole area of any one of the GND board, VDD board, and DATA board are symmetrical, and in a geometric relationship, the left hole area and the right hole area are The side hole area is equal to the middle hole area.

Further, in another embodiment, the upper hole area and the lower hole area of any one of the GND board, VDD board, and DATA board are symmetrical, and in terms of geometric relationship, the upper hole area plus the lower hole area equals Mesopore area.

For the above two embodiments, this means that the multi-layer carrier board of the present disclosure can be expanded left and right, or expanded up and down:

When expanded left and right, the right hole area of the left multi-layer carrier board and the left hole area of the right multi-layer carrier board are jointly spliced into a spliced middle hole area, which is connected to any multi-layer The hole area in the GND board of the carrier board is exactly the same as the hole area in the VDD board of any multi-layer carrier board.

When expanded up and down, the lower hole area of the upper multi-layer carrier board and the upper hole area of the lower multi-layer carrier board are jointly spliced into a spliced middle hole area, which is connected to the GND of any multi-layer carrier board. The hole area in the board is completely consistent, and it is also completely consistent with the hole area in the VDD board of any multi-layer carrier board.

It can be understood that the multi-layer carrier board of this embodiment can be used to form matrix LED products, such as LED lighting or display carrier boards of a certain size. See Figure 5, which illustrates the left and right expansion and up and down expansion of the multi-layer carrier board. Figure 1 represents the GND connection, Figure 2 represents the data signal connection, and Figure 3 represents the VDD power supply connection.

It should be noted that when expanding to the left and right and up and down, the LED products on the two-two multi-layer carrier boards are equally spaced on the left and right, and equally spaced on the top and bottom. Even the left and right, top and bottom are all set at the same equal spacing.

As a result, the multi-layer carrier board can take into account light transmission and LED display/lighting effects, and even achieve equidistant display effects. Furthermore, by optimizing the mesohole area, it can even achieve equidistant and high light transmittance visual effects.

Refer to the GND board shown in Figure 6, which illustrates the expansion of the GND board in the upper, lower, left and right directions of the multi-layer carrier board with the above structure. Similarly, the VDD board can also be expanded in this way to adapt to the GND board. Since the VDD board is Centered in this example. Combining Figures 5 and 6, Figure 5 shows the expanded multi-layer carrier board, which illustrates the uppermost DATA board and its separated structure from left to right, and between the parts of the DATA board, the spacing The lower middle VDD board is exposed, while Figure 6 shows the bottom GND board.

Further, in another embodiment, taking the GND board as an example, the hole area in the GND board (GNDSP) can be in various symmetrical shapes, such as regular polygon, circle, ellipse, etc.

In another embodiment, the LED product includes a chip-type LED.

In another embodiment, taking the mesohole area of the GND board as an example, by adjusting the shape and size of the mesohole area, and/or adjusting the area ratio between the mesohole area and the aforementioned island-shaped carrier plate area, the above-mentioned The light transmittance of the multi-layer carrier board and the number of LEDs deployed.

To be clear, this makes perfect sense. Just like in LED lighting or display scenes, people are often far away from the LED device. At this time, on the premise of significantly reducing the number of LEDs, viewing from a distance will not cause a significant deterioration in visual effects, especially for large-size LED lighting or The display can still meet the requirements of visual effects.

Referring to Figures 1 to 3, in another embodiment, for the two separate parts of the DATA board, the left part and the right part are connected with respective data signal lines.

Since the VDD power supply and GND ground can be shared completely, in order to improve the fault tolerance of LED products, when there is an independent DATA board, the DATA board is preferably designed to have two separate parts.

In another embodiment, each board in the multi-layer carrier board is made of a material that can be freely bent or deformed.

It can be understood that this is conducive to achieving visual effects with greater freedom.

In another embodiment, one or more boards in the multi-layer carrier board are made of transparent material.

In addition, the present disclosure also discloses an LED display device, which adopts the multi-layer carrier board described in any of the previous embodiments.

In another embodiment, the LED display device further includes an LED light emitter.

In another embodiment, the LED display device does not require a supporting structure.

Combined with the grille mentioned above, for this embodiment, typically, compared with a traditional display device with a grille (such as a grille screen), the device itself is not mechanically strong enough and requires an additional support structure. To support, including but not limited to grilles, other additional structural frames besides grilles, etc.

In another embodiment, since the front side of the multi-layer carrier board can include an LED chip and a driver IC in the LED light body, the back side of the multi-layer carrier board can be free of any ICs and/or components. This allows the LED display device to be installed on any surface or in the middle of any mezzanine.

The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure. All are covered by the protection scope of this disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

A multi-layer carrier board for LED products, characterized by:

The multi-layer LED carrier board includes: a GND board, a VDD board, and an optional DATA board, where the GND board is used for grounding, the VDD board is used for power supply, and the optional DATA board is used to provide data signals to LED products; When the DATA board is not included, data signals are provided to the LED products in the form of carrier waves through the VDD board and GND board;

The middle part of the GND plate includes the GND plate hole area (GNDSP);

The middle part of the VDD board includes the VDD board hole area (VDDSP);

The middle part of the optional DATA board includes the DATA board hole area (DATASP);

and,

The outer contours of the hole area in the GND board (GNDSP), the hole area in the VDD board (VDDSP), and the optional hole area in the DATA board (DATASP) completely correspond;

The area outside the hole area in the GND board (GNDSP), the hole area in the VDD board (VDDSP), and the optional hole area in the DATA board (DATASP) is the carrier board main area of the corresponding board.
The multilayer carrier board according to claim 1, characterized in that:

LED products are fixed on the optional DATA board, VDD board, or GND board.
The multilayer carrier board according to claim 1, characterized in that:

The DATA board itself is divided into two separate parts, and the two parts are symmetrical.
The multilayer carrier board according to claim 1, characterized in that:

The VDD board and GND board are respectively a complete carrier board body and are symmetrical.
The multilayer carrier board according to claim 1, characterized in that:

The GND board, VDD board, and DATA board are insulated from each other to prevent short circuits.
The multilayer carrier board according to claim 1, characterized in that:

Among the GND board, VDD board, and DATA board, the middle board can be a VDD board, a GND board, or a DATA board;

The GND board, VDD board, and the remaining two boards in the DATA board, either one is above the centered board and the other is below the centered board.
The multilayer carrier board according to claim 6, characterized in that:

For the central board and the boards located above the central board, insulating coatings are provided on their respective lower surfaces so that the GND board, the VDD board, and the DATA board are insulated from each other.
The multilayer carrier board according to claim 6, characterized in that:

For the central board, and the boards located above the central board, additional first insulating boards and second insulating boards are provided below each, so that the GND board, the VDD board, and the DATA board are connected to each other. insulation.
The multilayer carrier board according to claim 1, characterized in that:

For the multi-layer carrier board, via holes are provided on one or more of the GND board, VDD board, and DATA board; and when at least two boards are provided with via holes, at least one of the boards A via hole has a corresponding relationship in position, shape, size, etc. with a via hole in another board.
An LED device, characterized by using the multilayer carrier board as described in any one of claims 1 to 9.