CN213660406U - Integrated LED lamp bead - Google Patents
Integrated LED lamp bead Download PDFInfo
- Publication number
- CN213660406U CN213660406U CN202023249365.8U CN202023249365U CN213660406U CN 213660406 U CN213660406 U CN 213660406U CN 202023249365 U CN202023249365 U CN 202023249365U CN 213660406 U CN213660406 U CN 213660406U
- Authority
- CN
- China
- Prior art keywords
- lamp bead
- led light
- metal
- led
- emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The application provides an integrated LED lamp bead, which comprises a cover plate, a support, at least three groups of LED light-emitting modules and a plurality of lamp bead bonding pads, wherein each LED light-emitting module comprises a plurality of LED light-emitting wafers and a plurality of metal bonding pads; the LED light-emitting wafer is fixedly arranged on the metal bonding pad; a bonding wire for conducting the metal bonding pad and the LED light-emitting wafer is arranged between the metal bonding pad and the LED light-emitting wafer, wherein a bonding point for connecting the bonding wire is arranged on the metal bonding pad; the metal bonding pads are fixed in the bracket through packaging glue, the lamp bead bonding pads are arranged on the lower end face of the bracket, and the metal bonding pads are connected with the lamp bead bonding pads; the cover plate is provided with at least three concave holes and is in adaptive connection with the upper end face of the bracket; the process and the mounting difficulty can be reduced, the processing cost is reduced, and the success rate of processing the LED lamp beads is improved.
Description
Technical Field
The application relates to the field of LED lamp beads, in particular to an integrated LED lamp bead.
Background
The LED lamp bead is an English abbreviation LED of a light-emitting diode.
The LED lamp bead is widely used in the production fields of lamp decoration illumination, LED large screen display, traffic lights, decoration, computers, electronic toy gifts, exchangers, telephones, advertisements, urban light and color engineering and the like.
The LED screen formed by the LED lamp beads at present is formed by a single LED lamp bead, the single LED lamp bead needs to be correspondingly provided with a lamp bead bonding pad and a driving IC, the single LED lamp bead is time-consuming and labor-consuming in a surface mounting process, the failure rate is easily increased, and the processing process and the surface mounting difficulty of the circuit board are increased.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present application is proposed in order to provide an integrated LED lamp bead that overcomes or at least partially solves the above mentioned problems, comprising:
an integrated LED lamp bead comprises a cover plate, a support, at least three groups of LED light-emitting modules and a plurality of lamp bead bonding pads, wherein each LED light-emitting module comprises a plurality of LED light-emitting wafers and a plurality of metal bonding pads;
the LED light-emitting wafer is fixedly arranged on the metal bonding pad; a bonding wire for conducting the metal bonding pad and the LED light-emitting wafer is arranged between the metal bonding pad and the LED light-emitting wafer, wherein a bonding point for connecting the bonding wire is arranged on the metal bonding pad;
the metal bonding pads are fixed in the bracket through packaging glue, the lamp bead bonding pads are arranged on the lower end face of the bracket, and the metal bonding pads are connected with the lamp bead bonding pads;
the cover plate is provided with at least three concave holes, and the cover plate is connected with the upper end face of the support in a matching mode.
Further, the support is an insulating circuit board, and the insulating circuit board is provided with a metal through hole for connecting the metal pad and the lamp bead pad through a wire.
Further, the LED light emitting wafer comprises a red LED wafer, a green LED wafer and a blue LED wafer.
Further, still include the lamp pearl, the lamp pearl passes through the paster and connects the lamp pearl pad.
Furthermore, the LED lamp also comprises a drive IC, and pins of the drive IC are connected with the lamp beads through solder paste.
Further, the bonding point is formed by ultrasonic welding, and the bonding point is in any one of a spherical shape, a circular shape and a fishtail shape.
The application has the following advantages:
in the embodiment of the application, the integrated LED lamp bead comprises a cover plate, a support, at least three groups of LED light-emitting modules and a plurality of lamp bead bonding pads, wherein each LED light-emitting module comprises a plurality of LED light-emitting wafers and a plurality of metal bonding pads; the LED light-emitting wafer is fixedly arranged on the metal bonding pad; a bonding wire for conducting the metal bonding pad and the LED light-emitting wafer is arranged between the metal bonding pad and the LED light-emitting wafer, wherein a bonding point for connecting the bonding wire is arranged on the metal bonding pad; the metal bonding pads are fixed in the bracket through packaging glue, the lamp bead bonding pads are arranged on the lower end face of the bracket, and the metal bonding pads are connected with the lamp bead bonding pads; the cover plate is provided with at least three concave holes, and the cover plate is connected with the upper end face of the support in a matching mode. The process and the mounting difficulty can be reduced, the processing cost is reduced, and the success rate of processing the LED lamp beads is improved.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a schematic structural diagram of an integrated LED lamp bead provided in an embodiment of the present application;
fig. 2 is another schematic structural diagram of an integrated LED lamp bead provided in an embodiment of the present application.
In the drawings: 1. an LED light emitting wafer; 2. a metal pad; 3. a bonding wire; 4. a bonding point; 5. packaging glue; 6. a support; 7. a lamp bead welding plate; 8. a cover plate; 9. a concave hole.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
An LED (Light Emitting Diode); an Integrated Circuit (IC).
Referring to fig. 1 and fig. 2, schematic structural diagrams of an integrated LED lamp bead provided in an embodiment of the present application are shown;
an integrated LED lamp bead comprises a cover plate 8, a bracket 6, at least three groups of LED light-emitting modules and a plurality of lamp bead bonding pads 7, wherein each LED light-emitting module comprises a plurality of LED light-emitting wafers 1 and a plurality of metal bonding pads 2;
the LED light-emitting wafer 1 is fixedly arranged on the metal bonding pad 2; a bonding wire 3 for conducting the metal bonding pad 2 and the LED light-emitting wafer 1 is arranged between the metal bonding pad 2 and the LED light-emitting wafer 1, wherein a bonding point 4 for connecting the bonding wire 3 is arranged on the metal bonding pad 2;
the metal pads 2 are fixed in the bracket 6 through packaging glue 5, the lamp bead pads 7 are arranged on the lower end face of the bracket 6, and the metal pads 2 are connected with the lamp bead pads 7;
at least three concave holes 9 are formed in the cover plate 8, and the cover plate 8 is connected with the upper end face of the support 6 in a matching mode.
In the embodiment of the application, the integrated LED lamp bead comprises a cover plate 8, a bracket 6, at least three groups of LED light-emitting modules and a plurality of lamp bead bonding pads 7, wherein each LED light-emitting module comprises a plurality of LED light-emitting wafers 1 and a plurality of metal bonding pads 2; the LED light-emitting wafer 1 is fixedly arranged on the metal bonding pad 2; a bonding wire 3 for conducting the metal bonding pad 2 and the LED light-emitting wafer 1 is arranged between the metal bonding pad 2 and the LED light-emitting wafer 1, wherein a bonding point 4 for connecting the bonding wire 3 is arranged on the metal bonding pad 2; the metal pads 2 are fixed in the bracket 6 through packaging glue 5, the lamp bead pads 7 are arranged on the lower end face of the bracket 6, and the metal pads 2 are connected with the lamp bead pads 7; at least three concave holes 9 are formed in the cover plate 8, and the cover plate 8 is connected with the upper end face of the support 6 in a matching mode. The process and the mounting difficulty can be reduced, the processing cost is reduced, and the success rate of processing the LED lamp beads is improved.
An integrated LED lamp bead in the present exemplary embodiment will be further described below.
In an embodiment of the present invention, the metal pad 2 is used for fixing the LED chip 1, and forms a circuit loop with other adjacent metal pads 2 through the bonding wire 3.
In an embodiment of the present invention, the encapsulation glue 5 is used to prevent the LED chip 1 and the bonding wires 3 from being touched by the outside, so as to prevent oxidation and form a unified lens.
The utility model relates to an in the embodiment, the notch is used for forming the required shrinkage pool 9 of lamp pearl encapsulation, the luminous angle of fixed lamp pearl to and make it reach better mixed light effect.
In an embodiment of the present invention, the bonding wire 3 is used to connect the metal pad 2 and the LED chip 1 to form a circuit loop.
In an embodiment of the present invention, the support 6 is an insulating circuit board, and the insulating circuit board is provided with a metal via hole for connecting the metal pad 2 and the lamp bead pad 7 through a wire; the metal pad 2 is connected with the lamp bead pad 7 through a metal through hole; via holes are also known as metallization holes; drilling a common hole, namely a via hole, at the intersection of the wires needing to be communicated in each layer in order to communicate the printed wires among the layers in the double-sided board and the multilayer board; the parameters of the via hole are mainly the outer diameter of the hole and the size of the drilled hole; the utility model discloses an in the embodiment, support 6 is insulating circuit board, and insulating circuit board will be above-mentioned metal pad 2 and the lamp pearl pad 7 of bottom keep apart, then the rethread metal via hole switches on metal pad 2 and lamp pearl pad 7 according to setting for the position.
In an embodiment of the present invention, the LED light emitting chip 1 includes a red LED chip, a green LED chip, and a blue LED chip.
In an embodiment of the utility model, the lamp also comprises a lamp bead, and the lamp bead is connected with the lamp bead bonding pad 7 through a patch; in a specific embodiment of the present invention, each of the lamp beads includes a red LED chip, a green LED chip, and a blue LED chip.
In an embodiment of the present invention, the lamp further comprises a driving IC, and a pin of the driving IC is connected to the lamp bead through solder paste; in an embodiment of the present invention, the driver IC is an LED driver IC.
In an embodiment of the present invention, the bonding point 4 is a bonding point 4 formed by ultrasonic welding, and the bonding point 4 is in any one of a spherical shape, a circular shape and a fishtail shape.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The integrated LED lamp bead provided by the present application is introduced in detail, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the above example is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (6)
1. An integrated LED lamp bead is characterized by comprising a cover plate, a support, at least three groups of LED light-emitting modules and a plurality of lamp bead bonding pads, wherein each LED light-emitting module comprises a plurality of LED light-emitting wafers and a plurality of metal bonding pads;
the LED light-emitting wafer is fixedly arranged on the metal bonding pad; a bonding wire for conducting the metal bonding pad and the LED light-emitting wafer is arranged between the metal bonding pad and the LED light-emitting wafer, wherein a bonding point for connecting the bonding wire is arranged on the metal bonding pad;
the metal bonding pads are fixed in the bracket through packaging glue, the lamp bead bonding pads are arranged on the lower end face of the bracket, and the metal bonding pads are connected with the lamp bead bonding pads;
the cover plate is provided with at least three concave holes, and the cover plate is connected with the upper end face of the support in a matching mode.
2. The integrated LED lamp bead according to claim 1, wherein the support is an insulated circuit board provided with metal via holes for connecting the metal pads and the lamp bead pads through wires.
3. The integrated LED lamp bead according to claim 1, wherein said LED light emitting chips comprise red LED chips, green LED chips and blue LED chips.
4. The integrated LED lamp bead of claim 1, further comprising a lamp bead, wherein the lamp bead is connected to the lamp bead pad through a patch.
5. The integrated LED lamp bead according to claim 4, further comprising a driver IC, wherein pins of the driver IC are connected to the lamp bead through solder paste.
6. The integrated LED lamp bead according to claim 1, wherein the bonding point is formed by ultrasonic welding, and the bonding point is in any one of a spherical shape, a circular shape and a fishtail shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023249365.8U CN213660406U (en) | 2020-12-28 | 2020-12-28 | Integrated LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023249365.8U CN213660406U (en) | 2020-12-28 | 2020-12-28 | Integrated LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213660406U true CN213660406U (en) | 2021-07-09 |
Family
ID=76690602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023249365.8U Active CN213660406U (en) | 2020-12-28 | 2020-12-28 | Integrated LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213660406U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114413187A (en) * | 2022-01-27 | 2022-04-29 | 深圳市稳耀半导体科技有限公司 | Novel-structure LED module indicator lamp with blind hole multilayer PCB as carrier |
-
2020
- 2020-12-28 CN CN202023249365.8U patent/CN213660406U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114413187A (en) * | 2022-01-27 | 2022-04-29 | 深圳市稳耀半导体科技有限公司 | Novel-structure LED module indicator lamp with blind hole multilayer PCB as carrier |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH07235696A (en) | Chip part type led and manufacture thereof | |
| TWI250485B (en) | Light emission device and manufacturing method thereof | |
| JP2003023183A (en) | Surface mounting led lamp | |
| KR100977260B1 (en) | High Power LED Package and Manufacturing Method Thereof | |
| CN213660406U (en) | Integrated LED lamp bead | |
| CN104428911A (en) | Light emission device, illumination device, and insulating substrate | |
| CN113113526B (en) | Small-size LED transparent display screen and production method thereof | |
| WO2022267217A1 (en) | Display panel and preparation method therefor | |
| CN111987082B (en) | LED packaging structure | |
| US20080042157A1 (en) | Surface mount light emitting diode package | |
| CN104241466A (en) | Connection structure of LED (light emitting diode) substrate, designing method for PCB (printed circuit board) connection layer and LED display screen | |
| CN101673789B (en) | Light emitting diode package substrate structure, manufacturing method thereof and packaging structure thereof | |
| US8604510B2 (en) | Light-emitting diode mounted on intersected and discontinuous transparent conductive pattern layers and manufacturing method thereof | |
| TWI719721B (en) | Tiled display and manufacturing method thereof | |
| CN103474564A (en) | COB packaging structure and COB packaging method | |
| CN106801791A (en) | COB LED encapsulation modules, display device, lighting device and method for packing | |
| JP6595059B1 (en) | Wiring board structure for high reflection backlight and manufacturing method thereof | |
| US20070080354A1 (en) | Power package and fabrication method thereof | |
| CN112291923A (en) | Circuit board, lamp panel, backlight module and display device | |
| CN105789389B (en) | The modularity packaging method of LED chip | |
| CN102136431B (en) | Light emitting diode package and manufacturing method thereof | |
| CN219435896U (en) | LED bulb lighting chip structure | |
| JP2006041113A (en) | Light-emitting diode assembly substrate and display device using the same | |
| CN218975087U (en) | Glass substrate for local dimming | |
| CN213840538U (en) | Integrated colorful light source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |