CN118099050B - Double-row quartz boat for semiconductor silicon wafer and processing device thereof - Google Patents
Double-row quartz boat for semiconductor silicon wafer and processing device thereof Download PDFInfo
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- CN118099050B CN118099050B CN202410297545.7A CN202410297545A CN118099050B CN 118099050 B CN118099050 B CN 118099050B CN 202410297545 A CN202410297545 A CN 202410297545A CN 118099050 B CN118099050 B CN 118099050B
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- outer frame
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 144
- 239000010703 silicon Substances 0.000 title claims abstract description 144
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 142
- 239000010453 quartz Substances 0.000 title claims abstract description 74
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 4
- 230000008569 process Effects 0.000 claims abstract description 4
- 230000007246 mechanism Effects 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 16
- 230000002457 bidirectional effect Effects 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 abstract description 40
- 244000309464 bull Species 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a double quartz boat that semiconductor silicon chip was used, belongs to semiconductor processing technology field, including quartz plate and revolving plate, fixed mounting has the pivot on the revolving plate, and revolving plate and quartz plate rotate the installation, and link up a plurality of quartz plate through adjusting the bull stick, a semiconductor silicon chip processingequipment, including ejecting device, ejecting device is used for ejecting the silicon rod that waits to process and carries out the centre gripping, is provided with operation device on the ejecting device, is provided with double quartz boat on the operation device, and operation device is used for processing the silicon rod into the silicon chip to lay the silicon chip on double quartz boat. The pushing device provided by the invention can continuously push out the silicon rod, clamps the silicon rod, and is convenient for the operation device to continuously cut the silicon rod into a piece of silicon wafer by using the ground wire, so that the automation degree is high, and the manufacturing efficiency is high; the double-row quartz boat for the semiconductor silicon wafers is provided with double-row quartz boats, each row of quartz boats is provided with a plurality of groups of quartz plates, and the double-row quartz boats are clamped through clamping pieces, so that the double-row quartz boat is convenient to use.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a double-row quartz boat for a semiconductor silicon wafer and a processing device thereof.
Background
Quartz boat semiconductors are a type of equipment that may be used in semiconductor manufacturing processes, typically for carrying and transporting semiconductor chips, and quartz boats are used to place semiconductor chips in heaters or reactors for various chemical and physical processes. Quartz boats are typically made of high temperature, corrosion resistant quartz materials that remain stable even in harsh manufacturing environments. In addition, the quartz boat has the characteristics of high purity and low impurity so as to ensure that the produced semiconductor chip has high quality and high reliability. In recent years, with the rapid development of the semiconductor industry, the production process of semiconductor silicon wafers is continuously evolved and perfected, and infinite possibility is created for the performance improvement and application expansion of various electronic devices. The Chinese patent application with publication number CN115464485A discloses grinding wheel polishing equipment special for processing semiconductor silicon wafers, and the prior art utilizes a transmission mechanism to polish the cut silicon wafers, belongs to a subsequent process of wire cutting, and does not relate to how the semiconductor silicon wafers are processed and arranged in corresponding quartz boats;
Disclosure of Invention
Aiming at the technical problems, the invention adopts the following technical scheme: the utility model provides a double quartz boat that semiconductor silicon chip was used, includes quartz plate and revolving plate, fixed mounting has the pivot on the revolving plate, and revolving plate and quartz plate rotate the installation, and the regulation bull stick is with a plurality of quartz plate cluster, and slidable mounting has the clamping piece on the regulation bull stick, is provided with positive screw thread and reverse screw thread on the regulation bull stick, and positive screw thread and reverse screw thread opposite direction, and the clamping piece forms the screw thread transmission with positive screw thread and reverse screw thread, and the internal thread opposite direction of two adjacent clamping pieces rotates on the regulation bull stick and installs the gag lever post.
The utility model provides a semiconductor silicon chip processingequipment, includes ejecting device, its characterized in that: the pushing device comprises a bracket, the pushing device is used for pushing out and clamping a silicon rod to be processed, an operation device is arranged on the pushing device, the operation device comprises an outer frame and a switching motor, the outer frame is fixedly arranged with the bracket, a double-row quartz boat is arranged on the operation device, the double-row quartz boat comprises a quartz plate and a rotating plate, a rotating shaft is fixedly arranged on the rotating plate, the rotating plate is rotatably arranged with the quartz plate, a plurality of quartz plates are connected in series through an adjusting rotating rod, clamping pieces are slidably arranged on the adjusting rotating rod, a positive thread and a reverse thread are arranged on the adjusting rotating rod, the directions of the positive thread and the reverse thread are opposite, the clamping pieces and the positive thread and the reverse thread form a thread transmission silicon chip, the directions of the internal threads of the two adjacent clamping pieces are opposite, a limiting rod is rotatably arranged on the adjusting rotating rod, and the operation device is used for processing the silicon rod into a silicon chip and placing the silicon chip on the double-row quartz boat.
Further, the pushing device comprises a sliding plate which is slidably arranged on a bracket, a pushing block is slidably arranged on the sliding plate, a pushing block spring is arranged between the pushing block and the sliding plate, a silicon rod is placed on the bracket, a pushing motor is fixedly arranged on the bracket, a pushing screw rod is rotatably arranged on the bracket, a motor shaft of the pushing motor is fixedly arranged on the pushing screw rod, the pushing screw rod and the sliding plate form a threaded transmission, an upper rotating rod and a lower rotating rod are rotatably arranged on the sliding plate, an upper retainer ring is rotatably arranged on the upper rotating rod, an upper guide post is fixedly arranged on the bracket, an upper retainer ring and a lower retainer ring are slidably arranged on the bracket, an upper rack is fixedly arranged on the upper retainer ring, a lower column is fixedly arranged on the lower retainer ring, a lower inner tooth bar is fixedly arranged on the lower retainer ring, a lower rotating rod and a lower tooth bar are rotatably arranged on the upper retainer ring, and a clamping mechanism is arranged on the upper retainer ring.
Further, the clamping mechanism comprises an upper gear which is rotatably arranged on an upper fixing ring, the upper gear is meshed with an upper rack, a jacking column is fixedly arranged on the upper fixing ring, an upper sliding plate is slidably arranged on the jacking column, a jacking rack is fixedly arranged on the upper sliding plate and is meshed with the upper gear, a clamping column is slidably arranged on the upper sliding plate, an upper clamping piece is fixedly arranged on the clamping column, a clamping column spring is arranged between the upper clamping piece and the upper sliding plate, a lower sliding column is fixedly arranged on a lower fixing ring, a lower sliding rod is slidably arranged on the lower sliding column, a lower standing rack is fixedly arranged on the lower sliding rod, a lower gear is rotatably arranged on the lower fixing ring, the lower standing rack is meshed with the lower gear, and a lower clamping piece is fixedly arranged on the lower sliding rod.
The silicon rod to be processed is placed on the bracket, in an initial state, the upper check ring blocks the silicon rod, the pushing motor rotates to drive the pushing screw rod to rotate, and accordingly the sliding plate is driven to slide forwards along the bracket, the pushing block spring is compressed, the sliding plate slides to drive the upper rotating rod and the lower rotating rod to rotate, and accordingly the upper check ring is driven to slide upwards along the upper guide post, the lower check ring slides downwards along the lower column, and accordingly the upper check ring does not block the silicon rod any more, then the pushing block spring rebounds, the pushing block is driven to push the silicon rod out, the subsequent pushing block continuously pushes the silicon rod, the lower check ring descends, the lower internal tooth bar is driven to descend, the lower gear is driven to rotate, the lower vertical rack and the lower slide rod are driven to ascend along the lower slide column, and accordingly the lower clamping piece is driven to ascend, the lower vertical rack and the lower clamping piece are driven to be continuously ascended, the lower rack is driven to be continuously rotated to continuously ascend along the lower the upper clamping piece, and the lower clamping piece is driven to continuously rotate along the upper clamping piece at the moment, and the lower clamping piece is driven to continuously ascend along the highest, and the upper clamping piece is driven to continuously slide along the lower the clamping piece is driven to be contacted with the lower clamping piece.
Further, the operation device comprises a rotating motor fixedly arranged on an outer frame, a screw rod shaft is rotatably arranged on the outer frame, a motor gear is fixedly arranged on the screw rod shaft, a side wheel is rotatably arranged on the outer frame, a side bevel gear is fixedly arranged on the side wheel, the side bevel gear is meshed with the motor gear, a bidirectional screw rod is rotatably arranged on the outer frame, a belt pulley is fixedly arranged on the bidirectional screw rod, a belt is wound outside the belt pulley and the side wheel, a track rod is fixedly arranged on the outer frame, a sliding rod is fixedly arranged on the outer frame, a switching motor is fixedly arranged on the outer frame, a motor shaft and a rotating shaft of the switching motor are fixedly arranged on the limiting rod and the track rod in a sliding mode, and a sucker mechanism and a wire cutting mechanism are arranged on the outer frame.
Further, the sucking disc mechanism comprises a moving cross beam which is slidably arranged on the outer frame, the moving cross beam and a screw rod shaft form threaded transmission, an electric cylinder is fixedly arranged on the moving cross beam, a lifting block is fixedly arranged at the top of the electric cylinder, the lifting block is slidably arranged with the moving cross beam, and an electric sucking disc is fixedly arranged on the lifting block.
Further, the wire cutting mechanism comprises a wire cutting frame which is slidably arranged on the outer frame, the wire cutting frame and the bidirectional screw rod form threaded transmission, a wire cutting motor is fixedly arranged on the wire cutting frame, a cutting line is rotatably arranged on the wire cutting frame, the cutting line is fixedly arranged on a motor shaft of the wire cutting motor, and the wire cutting frame is slidably arranged on the sliding rod.
Further, an optical axis is arranged at the end part of the screw rod shaft, and the silicon rod is cut to form a silicon wafer.
The rotation motor rotates to drive the screw rod shaft and the motor gear to rotate, so that the movable cross beam is driven to slide along the outer frame towards the silicon rod, and the silicon rod is adsorbed after the electric sucking disc is contacted with the end part of the silicon rod.
The motor gear rotates to drive the side bevel gears and the side wheels to rotate, thereby driving the belt pulley and the bidirectional screw rod to rotate through the belt, thereby driving the wire cutting frame to slide back and forth, thereby driving the cutting wire to slide back and forth, the wire cutting motor rotates to drive the cutting wire to rotate at a high speed, when the screw rod shaft drives the movable cross beam to move to the contact of the electric suction disc and the silicon rod, the optical axis starts to be matched with the movable cross beam, the screw rod shaft continues to rotate and can not drive the movable cross beam to continuously advance, at the moment, the movable cross beam keeps unchanged in position, the movement and rotation of the cutting wire cut the end of the side bevel gears into a next small piece, namely the silicon wafer, the silicon wafer is adsorbed by the electric suction disc, then the rotating motor rotates to reversely drive the rotating plate and the rotating shaft to rotate, thereby driving the silicon wafer to rotate, the limiting rod slides along the track rod, so that the silicon wafer always faces upwards, the silicon wafer is driven by the electric cylinder to stretch out and draw back, then the electric suction disc releases the silicon wafer, enters into the silicon wafer, then the silicon rod is cut into a plurality of rotating rods in a similar way, and is placed in the silicon wafer, the silicon wafer is sequentially, and the silicon wafer is clamped by the silicon wafer through the silicon wafer, and the silicon wafer is clamped by the other group after the silicon wafer is switched by rotating and the silicon wafer.
Compared with the prior art, the invention has the beneficial effects that: (1) The pushing device provided by the invention can continuously push out the silicon rod, clamps the silicon rod, and is convenient for the operation device to continuously cut the silicon rod into a piece of silicon wafer by using the ground wire, so that the automation degree is high, and the manufacturing efficiency is high; (2) The operation device provided by the invention has the advantages that the silicon rod is cut in a linear manner through the linear cutting mechanism, the cutting surface is smooth, the cutting speed is high, and meanwhile, the silicon wafer is placed in the double-row quartz boat to be clamped by matching with the sucking disc mechanism, so that the automation degree is high; (3) The double-row quartz boat for the semiconductor silicon wafers is provided with the double-row quartz boat, each row of quartz boat is provided with a plurality of groups of quartz plates, and the double-row quartz boat is clamped by the clamping pieces, so that the double-row quartz boat is convenient to use.
Drawings
FIG. 1 shows a double row of the present invention the structure of the quartz boat is schematically shown.
FIG. 2 is a schematic view of the structure of the adjusting rotating rod of the present invention.
Fig. 3 is a schematic view of the whole structure of the processing device of the present invention.
Fig. 4 is a schematic view of the overall structure of the processing device (shelling) of the present invention.
Fig. 5 is a schematic structural diagram of the ejector according to the present invention.
Fig. 6 is a schematic structural diagram of a pushing device according to the present invention.
Fig. 7 is a schematic diagram of a pushing device according to the third embodiment of the present invention.
Fig. 8 is a schematic structural diagram of an operation device according to the present invention.
FIG. 9 is a second schematic structural view of the working device of the present invention.
Fig. 10 is a schematic view of the structure of the screw shaft according to the present invention.
FIG. 11 is a schematic diagram of a working device according to the present invention.
Reference numerals: 101-a bracket; 102-a propulsion motor; 103-pushing the screw rod; 104-a sliding plate; 105-silicon rod; 106-an upper rotating rod; 107-upper guide posts; 108-a guide post spring; 109-upper retainer ring; 110-upper rack; 111-upper gear; 112-upper fixing ring; 113-top rack; 114-upper slide plate; 115-clamping columns; 116-clamping column springs; 117-upper clip; 118-lower retainer ring; 119-lower rotating rod; 120-lower check ring; 121-a lower gear; 122-lower vertical rack; 123-lower slide bar; 124-lower clip; 125-a lower strut; 126-pushing blocks; 127-pusher spring; 128-lower internal rack; 129-lower column; 130-a top column; 201-quartz plates; 202-adjusting the rotating rod; 2021-positive thread; 2022-counter thread; 203-clamping pieces; 204-rotating plate; 205-a spindle; 206-a limit rod; 301-an outer frame; 302-rotating a motor; 303-motor gear; 304-a screw shaft; 3041-optical axis; 305-side bevel gears; 306-side wheels; 307-belt; 308-a pulley; 309-bidirectional screw rod; 310-wire cutting frame; 311-wire cutting motor; 312-slide bar; 313-cutting line; 314—a moving beam; 315-electric cylinder; 316-lifting block; 317-electric suction cups; 318-track bar; 319-switching the motor; 320-silicon wafer.
Detailed Description
The following describes the embodiments of the present invention further with reference to the drawings.
Examples: referring to fig. 1-11, a double-row quartz boat for a semiconductor silicon wafer comprises a quartz plate 201 and a rotating plate 204, wherein a rotating shaft 205 is fixedly installed on the rotating plate 204, the rotating plate 204 is rotatably installed with the quartz plate 201, a plurality of quartz plates 201 are connected in series through an adjusting rotating rod 202, a clamping piece 203 is slidably installed on the adjusting rotating rod 202, a positive thread 2021 and a reverse thread 2022 are arranged on the adjusting rotating rod 202, the directions of the threads of the positive thread 2021 and the reverse thread 2022 are opposite, the clamping piece 203 and the positive thread 2021 and the reverse thread 2022 form threaded transmission, the directions of the internal threads of two adjacent clamping pieces 203 are opposite, and a limiting rod 206 is rotatably installed on the adjusting rotating rod 202.
As shown in fig. 1 to 11, a semiconductor silicon wafer processing device comprises an ejector device, the ejector device comprises a bracket 101, the ejector device is used for ejecting and clamping a silicon rod to be processed, the ejector device is provided with an operation device, the operation device comprises an outer frame 301 and a switching motor 319, the outer frame 301 is fixedly installed with the bracket 101, the operation device is provided with a double-row quartz boat, the double-row quartz boat comprises quartz plates 201 and a rotating plate 204, a rotating shaft 205 is fixedly installed on the rotating plate 204, the rotating plate 204 is rotatably installed with the quartz plates 201, a plurality of quartz plates 201 are connected in series through an adjusting rotating rod 202, a clamping piece 203 is slidably installed on the adjusting rotating rod 202, a positive thread 2021 and a reverse thread 2022 are arranged on the adjusting rotating rod 202, the positive thread 2021 and the reverse thread 2022 are in opposite directions, the clamping piece 203 and the positive thread 2021 and the reverse thread 2022 form thread transmission, and the inner threads of two adjacent clamping pieces 203 are opposite in directions, a limiting rod 206 is rotatably installed on the adjusting rotating rod 202, and the operation device is used for processing the silicon rod into the silicon wafer and placing the silicon wafer on the double-row quartz boats.
As shown in fig. 1 to 7, the pushing device comprises a sliding plate 104 slidably mounted on a bracket 101, a pushing block 126 is slidably mounted on the sliding plate 104, a pushing block spring 127 is arranged between the pushing block 126 and the sliding plate 104, a silicon rod 105 is placed on the bracket 101, a pushing motor 102 is fixedly mounted on the bracket 101, a pushing screw 103 is rotatably mounted on the bracket 101, a motor shaft of the pushing motor 102 is fixedly mounted with the pushing screw 103, the pushing screw 103 and the sliding plate 104 form a threaded transmission, an upper rotating rod 106 and a lower rotating rod 119 are rotatably mounted on the sliding plate 104, an upper retaining ring 109 is rotatably mounted on the upper rotating rod 106, an upper guide post 107 is fixedly mounted on the bracket 101, an upper retaining ring 109 is slidably mounted on the upper guide post 107, a guide post spring 108 is arranged between the upper guide post 107 and the upper retaining ring 109, an upper fixed ring 112 and a lower fixed ring 118 are fixedly mounted on the bracket 101, a lower column 129 is fixedly mounted on the lower fixed ring 118, a lower rotating rod 120 is slidably mounted on the lower column 129, a lower inner toothed bar 128 is fixedly mounted on the lower retaining ring 120, and a clamping mechanism is arranged on the upper and lower retaining ring 119.
As shown in fig. 5 to 7, the clamping mechanism comprises an upper gear 111 rotatably mounted on an upper fixing ring 112, the upper gear 111 is meshed with an upper rack 110, a jack post 130 is fixedly mounted on the upper fixing ring 112, an upper sliding plate 114 is slidably mounted on the jack post 130, a jack rack 113 is fixedly mounted on the upper sliding plate 114, the jack rack 113 is meshed with the upper gear 111, a clamping post 115 is slidably mounted on the upper sliding plate 114, an upper clamping piece 117 is fixedly mounted on the clamping post 115, a clamping post spring 116 is arranged between the upper clamping piece 117 and the upper sliding plate 114, a lower sliding post 125 is fixedly mounted on a lower fixing ring 118, a lower sliding rod 123 is slidably mounted on the lower sliding rod 123, a lower gear 121 is rotatably mounted on the lower fixing ring 118, the lower vertical rack 122 is meshed with the lower gear 121, and a lower clamping piece 124 is fixedly mounted on the lower sliding rod 123.
The silicon rod 105 to be processed is placed on the bracket 101, in an initial state, the upper retainer ring 109 blocks the silicon rod 105, the pushing motor 102 rotates to drive the pushing screw 103 to rotate, the sliding plate 104 is driven to slide forwards along the bracket 101, the silicon rod 105 is pushed by the pushing block 126, as the silicon rod 105 is blocked by the upper retainer ring 109, the pushing block spring 127 is compressed, the sliding plate 104 slides to drive the upper rotating rod 106 and the lower rotating rod 119 to rotate, the upper retainer ring 109 is driven to slide upwards along the upper guide post 107, the lower retainer ring 120 slides downwards along the lower post 129, so that the upper retainer ring 109 no longer blocks the silicon rod 105, the pushing block spring 127 rebounds, the pushing block 126 is driven to push the silicon rod 105, the silicon rod 105 is continuously pushed by the subsequent pushing block 126, the lower inner tooth bar 128 is driven to descend when the lower retainer ring 120 is descended, the lower gear 121 is driven to rotate, the lower vertical rack 122 and the lower sliding rod 123 are driven to ascend along the lower sliding post 125, thereby driving the lower clamping piece 124 to rise, after the lower vertical rack 122 and the lower clamping piece 124 rise to the highest position, the lower clamping piece 124 supports the silicon rod 105, at this time, the lower vertical rack 122 is just disengaged from the lower gear 121, the lower gear 121 continues to rotate and does not drive the lower vertical rack 122 to continue to rise, meanwhile, when the upper check ring 109 rises, the upper rack 110 is driven to rise, the upper gear 111 is driven to rotate, the top rack 113 and the upper sliding plate 114 are driven to descend, the clamping post 115 and the upper clamping piece 117 are driven to descend along the top post 130, when the upper clamping piece 117 contacts with the silicon rod 105, the upper gear 111 continues to rotate and drives the top rack 113 and the upper sliding plate 114 to continue to descend, so that the clamping post spring 116 is compressed, the upper clamping piece 117 and the lower clamping piece 124 clamp the silicon rod 105, and simultaneously the push motor 102 continues to rotate and drive the silicon rod 105 to slowly advance under the clamping state, facilitating wire cutting of the silicon rod 105.
As shown in fig. 8 to 11, the working device includes a rotating motor 302 fixedly mounted on an outer frame 301, a screw shaft 304 rotatably mounted on the outer frame 301, a screw shaft 304 fixedly mounted on a motor shaft of the rotating motor 302, a motor gear 303 fixedly mounted on the screw shaft 304, a side wheel 306 rotatably mounted on the outer frame 301, a side bevel gear 305 fixedly mounted on the side wheel 306, the side bevel gear 305 engaged with the motor gear 303, a bidirectional screw 309 rotatably mounted on the outer frame 301, a belt pulley 308 fixedly mounted on the bidirectional screw 309, a belt 307 wound around the belt pulley 308 and the side wheel 306, a track rod 318 fixedly mounted on the outer frame 301, a slide bar 312 fixedly mounted on the outer frame 301, a switching motor 319 fixedly mounted on the outer frame 301, a motor shaft of the switching motor 319 fixedly mounted on the rotary shaft 205, a stopper rod 206 slidably mounted on the track rod 318, and a chuck mechanism and a wire cutting mechanism provided on the outer frame 301.
As shown in fig. 8-11, the suction cup mechanism comprises a moving beam 314 slidably mounted on the outer frame 301, the moving beam 314 and the screw shaft 304 form a screw transmission, an electric cylinder 315 is fixedly mounted on the moving beam 314, a lifting block 316 is fixedly mounted on the top of the electric cylinder 315, the lifting block 316 and the moving beam 314 are slidably mounted, and an electric suction cup 317 is fixedly mounted on the lifting block 316.
As shown in fig. 8 to 11, the wire cutting mechanism comprises a wire cutting frame 310 slidably mounted on an outer frame 301, the wire cutting frame 310 and a bidirectional screw rod 309 form screw transmission, a wire cutting motor 311 is fixedly mounted on the wire cutting frame 310, a cutting wire 313 is rotatably mounted on the wire cutting frame 310, the cutting wire 313 is fixedly mounted on a motor shaft of the wire cutting motor 311, and the wire cutting frame 310 and a sliding rod 312 are slidably mounted.
As shown in fig. 8-11, the end of the screw shaft 304 is provided with an optical axis 3041, and the silicon rod 105 is cut to form a silicon wafer 320.
The rotation motor 302 rotates to drive the screw shaft 304 and the motor gear 303 to rotate, so that the movable cross beam 314 is driven to slide along the outer frame 301 towards the silicon rod 105, and the silicon rod 105 is adsorbed after the electric sucking disc 317 contacts with the end part of the silicon rod 105.
The motor gear 303 rotates to drive the side bevel gear 305 and the side wheel 306 to rotate, thereby driving the belt pulley 308 and the bidirectional screw rod 309 to rotate through the belt 307, and then driving the wire cutting frame 310 to slide back and forth, and driving the cutting wire 313 to slide back and forth, and driving the wire cutting motor 311 to rotate to drive the cutting wire 313 to rotate at a high speed, when the screw rod shaft 304 drives the moving beam 314 to move to the electric chuck 317 to contact with the silicon rod 105, at the moment, the optical axis 3041 starts to be matched with the moving beam 314, the screw rod shaft 304 continues to rotate and does not drive the moving beam 314 to continue to advance, at the moment, the moving beam 314 keeps unchanged in position, the movement and rotation of the cutting wire 313 cuts the end of the side bevel gear 305 into a small piece, namely the silicon piece 320, the silicon piece 320 is adsorbed by the electric chuck 317, then the rotating motor 302 rotates reversely to drive the moving beam 314 to retract, and the switching motor 319 rotates to drive the rotating plate 204 and the rotating shaft 205 to rotate, thereby driving the quartz piece 201 to rotate along the track rod 318, so that the quartz piece 201 always faces upwards, the quartz piece 201 and the clamping piece 203 reaches the lower part of the silicon piece 320 of the electric chuck 317, and the electric chuck 317 is placed in the quartz piece 201 through the telescopic cylinder to be stretched and 320, then the electric chuck 317 is released, and then the electric chuck 317 is released, the silicon piece 320 is moved into the silicon piece 201, and the silicon piece is clamped by the silicon piece 201, and the silicon piece 201 is sequentially and then turned and the silicon piece is turned and then turned by the adjacent silicon piece 201, and the silicon piece 201 is turned by the clamping piece 201, and the silicon piece is turned by the clamping piece and the silicon piece and the clamping piece 201 and the silicon by the silicon piece 201 and the next, and the silicon by the silicon piece and the silicon by and the silicon piece by the next, and the silicon by and the silicon piece.
The invention discloses a double-row quartz boat for a semiconductor silicon wafer and a working principle of a processing device thereof, wherein the double-row quartz boat comprises the following components: the silicon rod 105 to be processed is placed on the bracket 101, in an initial state, the upper retainer ring 109 blocks the silicon rod 105, the pushing motor 102 rotates to drive the pushing screw 103 to rotate, so that the sliding plate 104 is driven to slide forwards along the bracket 101, the silicon rod 105 is pushed by the pushing block 126, the pushing block spring 127 is compressed because the silicon rod 105 is blocked by the upper retainer ring 109, meanwhile, the sliding plate 104 slides to drive the upper rotating rod 106 and the lower rotating rod 119 to rotate, so that the upper retainer ring 109 is driven to slide upwards along the upper guide pillar 107, the lower retainer ring 120 slides downwards along the lower post 129, so that the upper retainer ring 109 no longer blocks the silicon rod 105, then the push block spring 127 rebounds, the push block 126 is driven to push the silicon rod 105 out, the subsequent push block 126 continuously pushes the silicon rod 105, when the lower retainer ring 120 descends, the lower internal tooth strip 128 is driven to descend, the lower gear 121 is driven to rotate, the lower vertical rack 122 and the lower slide bar 123 are driven to ascend along the lower slide post 125, the lower clamping piece 124 is driven to ascend, after the lower vertical rack 122 and the lower clamping piece 124 ascend to the highest position, the lower clamping piece 124 supports the silicon rod 105, at the moment, the lower vertical rack 122 is just disengaged with the lower gear 121, The lower gear 121 continues to rotate and does not drive the lower vertical rack 122 to continue to rise, meanwhile, when the upper retainer ring 109 rises, the upper rack 110 is driven to rise, the upper gear 111 is driven to rotate, the top rack 113 and the upper sliding plate 114 are driven to descend, the clamping post 115 and the upper clamping piece 117 are driven to descend along the top post 130, when the upper clamping piece 117 contacts with the silicon rod 105, the upper gear 111 continues to rotate and drives the top rack 113 and the upper sliding plate 114 to continue to descend, so that the clamping post spring 116 is compressed, the silicon rod 105 is clamped by the upper clamping piece 117 and the lower clamping piece 124, meanwhile, the pushing motor 102 continues to rotate and drives the silicon rod 105 to slowly advance under the clamping state, facilitating wire cutting of the silicon rod 105. The rotation motor 302 rotates to drive the screw shaft 304 and the motor gear 303 to rotate, so that the movable cross beam 314 is driven to slide along the outer frame 301 towards the silicon rod 105, and the silicon rod 105 is adsorbed after the electric sucking disc 317 contacts with the end part of the silicon rod 105. The motor gear 303 rotates to drive the side bevel gear 305 and the side wheel 306 to rotate, so that the belt 307 drives the belt pulley 308 and the bidirectional screw rod 309 to rotate, so that the wire cutting frame 310 is driven to slide back and forth, the wire cutting motor 311 rotates to drive the wire cutting 313 to rotate at a high speed, when the screw rod shaft 304 drives the movable cross beam 314 to move to the electric sucker 317 to contact with the silicon rod 105, at the moment, the optical axis 3041 is matched with the movable cross beam 314, the screw rod shaft 304 continues to rotate and does not drive the movable cross beam 314 to continue to advance, at the moment, the position of the movable cross beam 314 is kept unchanged, The movement and rotation of the cutting line 313 cuts the end of the side bevel gear 305 into a small piece, namely a silicon piece 320, the silicon piece 320 is absorbed by the electric sucking disc 317, then the rotating motor 302 is rotated reversely to drive the moving beam 314 to retract, the switching motor 319 is rotated to drive the rotating plate 204 and the rotating shaft 205 to rotate, thereby driving the quartz piece 201 to rotate, the limit rod 206 slides along the track rod 318, so that the quartz piece 201 is always upwards, the quartz piece 201 and the clamping piece 203 are driven to reach the position below the silicon piece 320 absorbed by the electric sucking disc 317, the silicon piece 320 is placed in the quartz piece 201 through the expansion and the contraction of the electric cylinder 315, The electric chuck 317 then releases the silicon wafers 320, the silicon wafers 320 enter the quartz plates 201, the silicon rods 105 are cut into a plurality of silicon wafers 320 in a similar manner, and the silicon wafers 320 are sequentially placed in the quartz plates 201, and the adjacent two clamping pieces 203 can be driven to rotate in opposite directions by rotating the adjusting rotating rod 202, so that the silicon wafers 320 in the quartz plates 201 are clamped, and when the silicon wafers 320 on one group of the quartz plates 201 are full, the other group of the quartz plates 201 are switched by rotating the switching motor 319.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the technical scope of the present invention, should make equivalent substitutions or modifications according to the technical solution of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (8)
1. The utility model provides a double quartz boat that semiconductor silicon chip used, includes quartz plate (201) and revolving plate (204), its characterized in that: the rotating plate (204) is fixedly provided with a rotating shaft (205), the rotating plate (204) is rotatably mounted with the quartz plates (201), a plurality of quartz plates (201) are connected in series through an adjusting rotating rod (202), clamping pieces (203) are slidably mounted on the adjusting rotating rod (202), positive threads (2021) and reverse threads (2022) are arranged on the adjusting rotating rod (202), the threads of the positive threads (2021) and the threads of the reverse threads (2022) are opposite, the clamping pieces (203) form threaded transmission with the positive threads (2021) and the reverse threads (2022), the directions of the internal threads of two adjacent clamping pieces (203) are opposite, and a limiting rod (206) is rotatably mounted on the adjusting rotating rod (202).
2. The utility model provides a semiconductor silicon chip processingequipment, includes ejecting device, its characterized in that: the pushing device comprises a bracket (101), the pushing device is used for pushing out and clamping a silicon rod to be processed, an operation device is arranged on the pushing device, the operation device comprises an outer frame (301) and a switching motor (319), the outer frame (301) and the bracket (101) are fixedly installed, a double-row quartz boat is arranged on the operation device and comprises quartz plates (201) and a rotating plate (204), a rotating shaft (205) is fixedly installed on the rotating plate (204), the rotating plate (204) is rotatably installed with the quartz plates (201), a plurality of quartz plates (201) are connected in series through an adjusting rotating rod (202), clamping pieces (203) are slidably installed on the adjusting rotating rod (202), positive threads (2021) and reverse threads (2022) are arranged on the adjusting rotating rod (202), the positive threads (2021) and the reverse threads (2022) are in opposite directions, threaded transmission is formed between the clamping pieces (203) and the positive threads (2021) and the reverse threads (2022), the inner threads (202) of two adjacent quartz plates are opposite in directions, and the adjusting rotating rod (202) is used for placing the silicon rod to process the silicon rod.
3. The semiconductor wafer processing apparatus according to claim 2, wherein: the push-out device comprises a sliding plate (104) which is slidably arranged on a bracket (101), a push block (126) is slidably arranged on the sliding plate (104), a push block spring (127) is arranged between the push block (126) and the sliding plate (104), a silicon rod (105) is arranged on the bracket (101), a push motor (102) is fixedly arranged on the bracket (101), a push screw (103) is rotatably arranged on the bracket (101), a motor shaft of the push motor (102) is fixedly arranged on the push screw (103), the push screw (103) and the sliding plate (104) form screw transmission, an upper rotating rod (106) and a lower rotating rod (119) are rotatably arranged on the sliding plate (104), an upper check ring (109) is rotatably arranged on the upper rotating rod (106), an upper guide post (107) is fixedly arranged on the bracket (101), a guide post spring (108) is arranged between the upper guide post (107) and the upper check ring (109), an upper fixing ring (112) and a lower fixing ring (118) are fixedly arranged on the bracket (101), an upper check ring (109) and a lower fixing ring (118) are fixedly arranged on the bracket (101), an upper fixing ring (110) and a lower fixing ring (129) are fixedly arranged on the upper fixing ring (129), the lower check ring (120) is fixedly provided with a lower inner rack (128), the lower rotating rod (119) is rotatably arranged with the lower check ring (120), and the upper fixing ring (112) is provided with a clamping mechanism.
4. A semiconductor wafer processing apparatus according to claim 3, wherein: the clamping mechanism comprises an upper gear (111) rotatably mounted on an upper fixing ring (112), the upper gear (111) is meshed with an upper rack (110), a jacking column (130) is fixedly mounted on the upper fixing ring (112), an upper sliding plate (114) is mounted on the jacking column (130) in a sliding manner, a jacking rack (113) is fixedly mounted on the upper sliding plate (114), the jacking rack (113) is meshed with the upper gear (111), a clamping column (115) is mounted on the upper sliding plate (114) in a sliding manner, an upper clamping piece (117) is fixedly mounted on the clamping column (115), a clamping column spring (116) is arranged between the upper clamping piece (117) and the upper sliding plate (114), a lower sliding column (125) is fixedly mounted on a lower fixing ring (118), a lower sliding rod (123) is mounted on the lower sliding rod (123), a lower vertical rack (122) is mounted on the lower fixing ring (118) in a sliding manner, a lower gear (121) is meshed with the lower rack (122), and a lower clamping piece (124) is fixedly mounted on the lower sliding rod (123).
5. A semiconductor wafer processing apparatus according to claim 3, wherein: the operation device comprises a rotating motor (302) fixedly arranged on an outer frame (301), a screw rod shaft (304) is rotatably arranged on the outer frame (301), a track rod (318) is fixedly arranged on the outer frame (301), a motor gear (303) is fixedly arranged on the screw rod shaft (304), a side wheel (306) is rotatably arranged on the outer frame (301), a side bevel gear (305) is fixedly arranged on the side wheel (306), the side bevel gear (305) is meshed with the motor gear (303), a bidirectional screw rod (309) is rotatably arranged on the outer frame (301), a belt pulley (308) is fixedly arranged on the bidirectional screw rod (309), a belt (307) is wound outside the belt pulley (308) and the side wheel (306), a slide rod (312) is fixedly arranged on the outer frame (301), a switching motor (319) is fixedly arranged on the outer frame (301), a motor shaft and the rotating shaft (205) of the switching motor (319) are fixedly arranged, a limiting rod (206) and the track rod (318) are slidably arranged, and a sucking disc mechanism and a wire cutting mechanism are arranged on the outer frame (301).
6. The semiconductor wafer processing apparatus according to claim 5, wherein: the sucker mechanism comprises a moving cross beam (314) which is slidably arranged on the outer frame (301), the moving cross beam (314) and a screw rod shaft (304) form screw transmission, an electric cylinder (315) is fixedly arranged on the moving cross beam (314), a lifting block (316) is fixedly arranged at the top of the electric cylinder (315), the lifting block (316) is slidably arranged with the moving cross beam (314), and an electric sucker (317) is fixedly arranged on the lifting block (316).
7. The semiconductor wafer processing apparatus according to claim 5, wherein: the wire cutting mechanism comprises a wire cutting frame (310) which is slidably mounted on the outer frame (301), the wire cutting frame (310) and the bidirectional screw rod (309) form threaded transmission, a wire cutting motor (311) is fixedly mounted on the wire cutting frame (310), a cutting line (313) is rotatably mounted on the wire cutting frame (310), the cutting line (313) is fixedly mounted with a motor shaft of the wire cutting motor (311), and the wire cutting frame (310) and the sliding rod (312) are slidably mounted.
8. The semiconductor wafer processing apparatus according to claim 5, wherein: an optical axis (3041) is arranged at the end part of the screw rod shaft (304), and the silicon rod (105) is cut to form a silicon wafer (320).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410297545.7A CN118099050B (en) | 2024-03-15 | 2024-03-15 | Double-row quartz boat for semiconductor silicon wafer and processing device thereof |
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| CN202410297545.7A CN118099050B (en) | 2024-03-15 | 2024-03-15 | Double-row quartz boat for semiconductor silicon wafer and processing device thereof |
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| CN118099050B true CN118099050B (en) | 2024-08-09 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115367470A (en) * | 2022-08-30 | 2022-11-22 | 江苏格林保尔光伏有限公司 | Graphite boat transfer device |
| CN117140762A (en) * | 2023-09-26 | 2023-12-01 | 万安县泰鑫电子有限责任公司 | Diamond wire cutting quartz wafer device and method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207572346U (en) * | 2017-10-23 | 2018-07-03 | 苏州中航天成电子科技有限公司 | A kind of semi-automatic supplying system for diffusion furnace |
| CN219078951U (en) * | 2022-12-28 | 2023-05-26 | 济南市中源汽车配件有限公司 | Lifting appliance for camshaft machining |
| CN220189588U (en) * | 2023-07-06 | 2023-12-15 | 江苏文名石英科技有限公司 | Quartz boat assembly with inserting piece positioning mechanism |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115367470A (en) * | 2022-08-30 | 2022-11-22 | 江苏格林保尔光伏有限公司 | Graphite boat transfer device |
| CN117140762A (en) * | 2023-09-26 | 2023-12-01 | 万安县泰鑫电子有限责任公司 | Diamond wire cutting quartz wafer device and method |
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