CN118086858A - Empty load prevention feeding system and feeding method for PVD equipment - Google Patents
Empty load prevention feeding system and feeding method for PVD equipment Download PDFInfo
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- CN118086858A CN118086858A CN202410236043.3A CN202410236043A CN118086858A CN 118086858 A CN118086858 A CN 118086858A CN 202410236043 A CN202410236043 A CN 202410236043A CN 118086858 A CN118086858 A CN 118086858A
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- 238000000034 method Methods 0.000 title claims description 21
- 230000002265 prevention Effects 0.000 title claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 121
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 114
- 239000010703 silicon Substances 0.000 claims abstract description 114
- 235000012431 wafers Nutrition 0.000 claims abstract description 98
- 238000011068 loading method Methods 0.000 claims abstract description 46
- 238000001179 sorption measurement Methods 0.000 claims description 22
- 238000000429 assembly Methods 0.000 claims description 13
- 230000000712 assembly Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 230000003139 buffering effect Effects 0.000 claims description 3
- 230000003028 elevating effect Effects 0.000 claims description 2
- 238000005240 physical vapour deposition Methods 0.000 description 25
- 238000010586 diagram Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 239000006004 Quartz sand Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G57/00—Stacking of articles
- B65G57/02—Stacking of articles by adding to the top of the stack
- B65G57/03—Stacking of articles by adding to the top of the stack from above
- B65G57/04—Stacking of articles by adding to the top of the stack from above by suction or magnetic devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an anti-idle loading system and an anti-idle loading method of PVD equipment, which relate to the technical field of silicon wafer processing and comprise the following steps: the device comprises a frame, wherein a carrier plate feeding area, a silicon wafer stacking area, an area to be processed and a carrier plate transferring device are arranged on the frame, and the silicon wafer stacking area and the area to be fed are respectively arranged on two sides of the carrier plate feeding area; the invention can stack the silicon wafers on the true carrier plate and simultaneously supply the false carrier plate to the PVD equipment, thereby avoiding the condition of no-load of the PVD equipment, improving the processing efficiency, and having compact structure and small occupied area.
Description
Technical Field
The invention relates to the technical field of silicon wafer processing, in particular to an anti-idle loading system and an anti-idle loading method for PVD equipment.
Background
Silicon is refined from quartz sand, silicon chips are purified as silicon elements, then the pure silicon is made into silicon crystal rods, and the silicon crystal rods become materials for manufacturing quartz semiconductors of integrated circuits.
When PVD (physical vapor deposition) equipment processes silicon wafers, the silicon wafers are generally arranged on a carrier plate through a feeding machine, and then the carrier plate is fed into the PVD equipment for processing, and as the feeding speed of the feeding machine cannot be matched with the processing speed of the PVD equipment, the PVD equipment can be caused to have no load, so that the equipment is problematic, in order to prevent the PVD equipment from having no load in the processing process, the mode of a dummy carrier plate is adopted to prevent no load, namely, when a real carrier plate (the carrier plate for loading the silicon wafers) is not loaded, and when the silicon wafers in the PVD equipment are processed, the dummy carrier plate (the carrier plate for not loading the silicon wafers) is fed into the PVD equipment, so that the PVD equipment is prevented from no load.
In the prior art, the PVD equipment is generally conveyed with a true carrier plate and a false carrier plate in two ways, and the true carrier plate and the false carrier plate are respectively fed by two feeding machines, so that the PVD equipment is very inconvenient and occupies a large area; secondly, the dummy carrier plate and the real carrier plate are fed through a feeding machine, and the feeding machine occupies a small area, but the motion track of the feeding of the dummy carrier plate and the feeding of the real carrier plate is consistent, so that the silicon wafer stacking efficiency of the real carrier plate is affected.
Disclosure of Invention
The present invention solves the problems of the prior art with the following technical structure.
In order to achieve the above purpose, the invention adopts the following technical scheme:
no-load feed system is prevented to PVD equipment includes: the device comprises a frame, wherein a carrier plate feeding area, a silicon wafer stacking area, an area to be processed and a carrier plate transferring device are arranged on the frame, and the silicon wafer stacking area and the area to be fed are respectively arranged on two sides of the carrier plate feeding area;
The carrier plate feeding area is used for receiving the real carrier plate or the false carrier plate and transferring the real carrier plate to the silicon wafer stacking area;
the silicon chip stacking area is used for stacking the silicon chips on the real carrier plate and transferring the real carrier plate filled with the silicon chips back to the carrier plate loading area;
The carrier plate transferring device is used for transferring the true carrier plate provided with the false carrier plate or the silicon wafer at the carrier plate feeding area to the area to be processed.
It is further characterized in that,
The silicon wafer stacking area comprises a buffer area, a stacking area, a lifting area and a silicon wafer feeding device, wherein the stacking area is arranged above the buffer area, the buffer area and the stacking area are arranged on one side of the loading area of the carrier, and the lifting area is arranged on one side of the buffer area far away from the loading area of the carrier;
The buffer area is used for buffering the real carrier plate from the carrier plate feeding area and transferring the real carrier plate to the lifting area;
The lifting area is used for lifting the true carrier plate from the buffer area and transferring the true carrier plate to the material stacking area;
the stacking area is used for placing the true carrier plate from the lifting area and transferring the true carrier plate filled with the silicon wafer to the carrier plate feeding area;
the silicon wafer feeding device is used for transferring the silicon wafer to a true carrier plate at the stacking area.
The buffer area comprises a plurality of first conveying rollers which are rotatably arranged, and the first conveying rollers are respectively arranged at two sides of the buffer area.
The stacking area comprises a plurality of second conveying rollers which are arranged in a rotating mode and two silicon wafer alignment assemblies which are arranged in parallel, the second conveying rollers are respectively arranged on two sides of the stacking area, and each silicon wafer alignment assembly comprises a plurality of UVW alignment platforms which are equally divided into two rows.
The UVW alignment platforms in the same column in the same silicon wafer alignment assembly are in interval correspondence with the silicon wafer grooves in the same column on the carrier plate;
And the UVW alignment platforms on the two silicon wafer alignment assemblies are arranged in a staggered mode.
The lifting zone comprises two first supporting frames, a first lifting frame arranged between the two first supporting frames in a sliding mode, a first driving assembly used for driving the first lifting frame to do lifting motion, and a plurality of third conveying rollers, wherein the third conveying rollers are respectively arranged on two sides of the top surface of the first lifting frame in a rotating mode.
The silicon wafer feeding device comprises a plurality of first sliding rails, a sliding frame arranged on the plurality of first sliding rails in a sliding manner, a second driving assembly for driving the sliding frame to slide, and a plurality of adsorption assemblies arranged on the sliding frame in parallel;
the adsorption assembly comprises a plurality of silicon wafer adsorption parts which are distributed in a straight line, and each silicon wafer adsorption part comprises a plurality of silicon wafer adsorption heads;
the first sliding rail extends from the upper part of the stacking area to the position of an external silicon wafer feeding device.
The carrier plate material loading district includes two second support frames, slides and sets up the second crane between two second support frames, is used for driving the third drive assembly and a plurality of fourth conveying roller that the second crane is elevating movement, and is a plurality of the fourth conveying roller rotates respectively and sets up in the top surface both sides of second crane.
The loading area of the carrier plate further comprises a sensor which is arranged on the second lifting frame and used for judging whether the carrier plate is a true carrier plate or a false carrier plate, and the sensor judges through the number of marking holes on the carrier plate.
The carrier plate transferring device comprises a plurality of second sliding rails, a transferring frame arranged on the second sliding rails in a sliding manner, a fourth driving assembly for driving the transferring frame to slide, and a plurality of carrier plate adsorption heads arranged on the transferring frame;
The second sliding rail extends from the upper part of the loading area of the carrier plate to the area to be processed.
The no-load feeding preventing method for PVD equipment includes the following steps: placing a carrier plate at the loading area of the carrier plate, and detecting the number of carrier plate marking holes by the sensor;
If the real carrier plate is arranged at the carrier plate feeding area, the carrier plate feeding area transfers the real carrier plate to the silicon wafer stacking area, the silicon wafer stacking area stacks the silicon wafer on the real carrier plate, and transfers the real carrier plate filled with the silicon wafer to the carrier plate feeding area, and the carrier plate transferring device transfers the real carrier plate filled with the silicon wafer at the carrier plate feeding area to the area to be processed;
And if the dummy carrier is arranged at the carrier loading area, the carrier transferring device transfers the dummy carrier at the carrier loading area to the area to be processed.
The structure of the invention can achieve the following beneficial effects:
1) The device can stack the silicon wafers on the true carrier plate and supply the false carrier plate to the PVD equipment at the same time, thereby avoiding the condition of no-load of the PVD equipment and improving the processing efficiency;
2) The device carries out transition and judgement to true and false carrier plates through the carrier plate loading area, if true carrier plates, then transfers to the silicon chip stacking area for stacking silicon chips, if false carrier plates, then is directly absorbed by the carrier plate transferring device and transferred to the area to be processed, finally, the PVD equipment is sent into, the motion track of the false carrier plates is short, and the motion of the true carrier plates is not interfered, so that the device has a compact structure and small occupied area.
Drawings
Fig. 1 is a schematic perspective view of the present embodiment;
Fig. 2 is a schematic view of the structure of the inside of the frame in the present embodiment;
FIG. 3 is a schematic diagram of the buffer area and the code area in the present embodiment;
FIG. 4 is an enlarged schematic view of the structure shown at A in FIG. 3;
FIG. 5 is a schematic diagram of the structure of the lifting area in the present embodiment;
FIG. 6 is a schematic structural diagram of a silicon wafer loading device in this embodiment;
fig. 7 is a schematic structural diagram of a loading area of the carrier plate in this embodiment;
fig. 8 is a schematic structural diagram of a carrier board transferring device in this embodiment.
In the figure: 1. a buffer area; 11. a first conveying roller; 2. a material stacking area; 21. a second conveying roller; 22. a UVW alignment platform; 3. a lifting area; 31. a first support frame; 32. a first lifting frame; 33. a third conveying roller; 4. a silicon wafer feeding device; 41. a first slide rail; 42. a carriage; 43. a silicon wafer adsorption piece; 5. a loading area of the carrier plate; 51. a second support frame; 52. a second lifting frame; 53. a fourth conveying roller; 54. a sensor; 6. a carrier plate transfer device; 61. a second slide rail; 62. a transfer rack; 63. a carrier plate adsorption head; 7. and (5) a region to be processed.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It is noted that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of the present invention and in the foregoing figures, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus.
The application is described in further detail below in connection with figures 1-8.
In a first embodiment, as shown in fig. 1 and 2, an anti-idle loading system of a PVD apparatus includes: the device comprises a frame, wherein a carrier plate feeding area 5, a silicon wafer stacking area, an area to be processed 7 and a carrier plate transferring device 6 are arranged on the frame, and the silicon wafer stacking area and the area to be fed are respectively arranged on two sides of the carrier plate feeding area 5;
Based on the structure, during loading, the carrier plate is placed in the carrier plate loading area 5, when the carrier plate is a real carrier plate, the carrier plate loading area 5 transfers the real carrier plate to the silicon wafer stacking area, the silicon wafer stacking area stacks the silicon wafer on the real carrier plate, then the real carrier plate filled with the silicon wafer is transferred to the carrier plate loading area 5, and then the carrier plate transferring device 6 transfers the real carrier plate filled with the silicon wafer at the carrier plate loading area 5 to the area to be processed 7; when the carrier plate is a false carrier plate, the carrier plate transferring device 6 directly transfers the false carrier plate at the carrier plate feeding area 5 to the to-be-processed area 7, and the true and false carrier plate is transited through the carrier plate feeding area 5, so that the feeding of the PVD equipment is completed, and the condition of no load of the PVD equipment is avoided.
As shown in fig. 2-5, the silicon wafer stacking area comprises a buffer area 1, a stacking area 2, a lifting area 3 and a silicon wafer feeding device 4, wherein the stacking area 2 is arranged above the buffer area 1, the buffer area 1 and the stacking area 2 are arranged on one side of a carrier plate feeding area 5, and the lifting area 3 is arranged on one side of the buffer area 1 away from the carrier plate feeding area 5;
In the actual use process, the buffer area 1 is used for buffering the true carrier plate from the carrier plate feeding area 5, transferring the true carrier plate to the lifting area 3, lifting the true carrier plate from the buffer area 1 to the position of the material stacking area 2 by the lifting area 3, and transferring the carrier plate to the material stacking area 2; then the silicon chip loading device 4 transfers the silicon chip to the true carrier plate at the position of the stacking area 2, and then the stacking area 2 transfers the true carrier plate filled with the silicon chip to the carrier plate loading area 5.
As shown in fig. 2 and 3, the buffer area 1 includes a plurality of first conveying rollers 11 rotatably disposed, and the plurality of first conveying rollers 11 are disposed on two sides of the buffer area 1.
In the actual use process, the first conveying rollers 11 which are rotatably arranged on two sides form a carrier plate placing platform, and when the first conveying rollers 11 rotate, the carrier plate is moved.
As shown in fig. 3 and 4, the stacking area 2 includes a plurality of second conveying rollers 21 that rotate and set up and two silicon wafer alignment assemblies that are set up side by side, the two sides of the stacking area 2 (the same function as the first conveying roller 11) are respectively placed in to a plurality of second conveying rollers 21, the silicon wafer alignment assemblies include a plurality of UVW alignment platforms 22 that are equally divided into two rows (the UVW alignment platforms 22 are one of the prior art, and are composed of an upper plate, a lower plate and four monomer groups, UVW corresponds to three power shafts, two motors (VW shafts) in the X-axis direction, one motor (U) in the Y-axis direction, and two motors in the X-axis move together to realize X-axis movement, and movement of X and Y is realized by controlling the three motors, and rotation of θ -axis to realize alignment.
The UVW alignment platforms 22 in the same column in the same silicon wafer alignment assembly correspond to the silicon wafer grooves in the same column on the carrier plate at intervals; the UVW alignment platforms 22 on the two silicon wafer alignment assemblies are arranged in a staggered manner (respectively corresponding to the odd-numbered and even-numbered silicon wafer grooves on the carrier).
In the actual use process, due to the process requirement, when the lifting area 3 conveys the carrier plate to the plurality of second conveying rollers 21, the carrier plate stacks the silicon wafers on the silicon wafer grooves corresponding to the plurality of UVW alignment platforms 22 when passing through the two silicon wafer alignment assemblies, the silicon wafer loading device 4 respectively completes the placement of the silicon wafers in the odd-numbered and even-numbered silicon wafer grooves on the carrier plate, and the position of the silicon wafers on the silicon wafer grooves is adjusted through the UVW alignment platforms 22.
As shown in fig. 3, the lifting area 3 includes two first supporting frames 31, a first lifting frame 32 slidably disposed between the two first supporting frames 31, a first driving assembly (the first driving assembly includes a plurality of chains and a plurality of motors, the chains are driven by the motors to rotate, so that the first lifting frame 32 connected with the chains performs lifting motion), and a plurality of third conveying rollers 33, and the plurality of third conveying rollers 33 are respectively rotatably disposed on two sides of the top surface of the first lifting frame 32 (with the same function as the first conveying rollers 11).
In the actual use process, when the plurality of first conveying rollers 11 of the buffer area 1 rotate, the carrier plate is transferred to above the plurality of third conveying rollers 33, and then the first driving assembly drives the first lifting frame 32 to move upwards until the third conveying rollers 33 and the second conveying rollers 21 are in the same horizontal plane, at this time, the third conveying rollers 33 rotate, and the carrier plate is transferred to the second conveying rollers 21.
As shown in fig. 6, the silicon wafer feeding device 4 includes a plurality of first slide rails 41, a slide frame 42 slidably disposed on the plurality of first slide rails 41, a second driving assembly (same as the first driving assembly in structure) for driving the slide frame 42 to slide, and a plurality of parallel adsorption assemblies disposed on the slide frame 42; the adsorption assembly comprises a plurality of silicon wafer adsorption parts 43 which are distributed in a straight line, and each silicon wafer adsorption part 43 comprises a plurality of silicon wafer adsorption heads; the first slide rail 41 extends from above the stacking area 2 to the position of the external silicon wafer feeding device.
In the actual use process, the sliding frame 42 is driven to slide on the first sliding rail 41 through the second driving assembly, the plurality of parallel adsorption assemblies acquire silicon wafers from the outside and then transfer the silicon wafers to the stacking area 2, and the carrier plate at the stacking area 2 is loaded.
As shown in fig. 7, the carrier loading area 5 includes two second supporting frames 51, a second lifting frame 52 slidably disposed between the two second supporting frames 51, a third driving assembly (same as the first driving assembly) for driving the second lifting frame 52 to perform lifting movement, and a plurality of fourth conveying rollers 53, where the plurality of fourth conveying rollers 53 are respectively rotatably disposed on two sides of the top surface of the second lifting frame 52.
The carrier plate loading area 5 further comprises a sensor 54 arranged on the second lifting frame 52 for judging whether the carrier plate is a true carrier plate or a false carrier plate, and the sensor 54 judges through the number of marking holes on the carrier plate (the sensor 54 is an infrared sensor, and the purpose of detecting the true carrier plate and the false carrier plate is achieved by detecting that the number of detecting holes on the true carrier plate is different from the number of detecting holes on the false carrier plate).
In the actual use process, the real carrier plate or the fake carrier plate is placed on the plurality of fourth conveying rollers 53, whether the real carrier plate or the fake carrier plate is detected through the sensor 54, if the real carrier plate is the fake carrier plate, the second lifting frame 52 is driven by the third driving component to lift, the carrier plate is adsorbed by the carrier plate transferring device 6 and transferred to the to-be-processed area 7, when the real carrier plate is the real carrier plate, the real carrier plate is transferred to the buffer area 1 (at the moment, the fourth conveying rollers 53 and the first conveying rollers 11 are at the same height) through rotating the plurality of fourth conveying rollers 53, after the real carrier plate is stacked with the silicon wafers in the stacking area 2, the second lifting frame 52 is driven by the third driving component to lift, the fourth conveying rollers 53 and the second conveying rollers 21 are at the same height, and the carrier plate with the silicon wafers is transferred to the carrier plate loading area 5 at the moment, and finally the carrier plate transferring device 6 is transferred to the to-be-processed area 7.
As shown in fig. 8, the carrier board transferring device 6 includes a plurality of second slide rails 61, a transferring frame 62 slidably disposed on the plurality of second slide rails 61, a fourth driving assembly for driving the transferring frame 62 to slide, and a plurality of carrier board adsorption heads 63 disposed on the transferring frame 62;
The second slide rail 61 extends from above the carrier plate loading area 5 to the area to be processed 7.
In the actual use process, the carrier plate is adsorbed by the carrier plate adsorption heads 63, and then the fourth driving assembly drives the transfer frame 62 to slide on the second slide rail 61, so that the carrier plate is transferred to the to-be-processed area 7.
In a second embodiment, a feeding method based on an anti-idle feeding system of a PVD apparatus includes the steps of: when the carrier plate is placed at the carrier plate feeding area 5, the sensor 54 detects the number of carrier plate marking holes (judging according to the difference of the number of holes on the real carrier plate and the number of holes on the false carrier plate, for example, one hole is formed in the real carrier plate, two holes are formed in the false carrier plate, when the sensor 54 detects the two holes, the false carrier plate is the false carrier plate, and when one hole is detected, the detection is performed through the marking holes, the judging method is simple and easy to realize, the processing process is not influenced, the size of the carrier plate is not required to be changed, and the stacking silicon chips are not influenced);
if the real carrier plate is placed at the carrier plate feeding area 5, the carrier plate feeding area 5 transfers the real carrier plate to the silicon wafer stacking area, the silicon wafer stacking area stacks the silicon wafers on the real carrier plate, and transfers the real carrier plate filled with the silicon wafers to the carrier plate feeding area 5, and the carrier plate transferring device 6 transfers the real carrier plate filled with the silicon wafers at the carrier plate feeding area 5 to the area to be processed 7;
If the dummy carrier is placed at the carrier loading area 5, the carrier transfer device 6 transfers the dummy carrier at the carrier loading area 5 to the area to be processed 7.
In conclusion, the device can stack the silicon wafers on the true carrier plate and supply the false carrier plate to the PVD equipment at the same time, so that the condition of no-load of the PVD equipment is avoided, and the processing efficiency is improved;
the device carries out transition and judgment on the true and false carrier plates through the carrier plate feeding area 5, if the carrier plate is true, the carrier plate is transferred to the silicon wafer stacking area for stacking silicon wafers, if the carrier plate is false, the carrier plate is directly adsorbed by the carrier plate transferring device 6 and transferred to the area 7 to be processed, and finally the carrier plate is sent to PVD equipment, so that the motion trail of the carrier plate is short, the motion of the carrier plate is not interfered, the device is compact in structure and small in occupied area;
The above is only a preferred embodiment of the present application, and the present application is not limited to the above examples. It is to be understood that other modifications and variations which may be directly derived or contemplated by those skilled in the art without departing from the spirit and concepts of the present application are deemed to be included within the scope of the present application.
Claims (10)
1. No-load feed system is prevented to PVD equipment, characterized by comprising: the device comprises a frame, wherein a carrier plate feeding area (5), a silicon wafer stacking area, an area to be processed (7) and a carrier plate transferring device (6) are arranged on the frame, and the silicon wafer stacking area and the area to be fed are respectively arranged at two sides of the carrier plate feeding area (5);
The carrier plate feeding area (5) is used for receiving the real carrier plate or the false carrier plate and transferring the real carrier plate to the silicon wafer stacking area;
The silicon chip stacking area is used for stacking the silicon chips on the real carrier plate and transferring the real carrier plate filled with the silicon chips back to the carrier plate feeding area (5);
The carrier plate transferring device (6) is used for transferring the true carrier plate provided with the false carrier plate or the silicon wafer at the carrier plate feeding area (5) to the area to be processed (7).
2. The PVD apparatus no-load prevention loading system of claim 1, wherein: the silicon wafer stacking area comprises a buffer area (1), a stacking area (2), a lifting area (3) and a silicon wafer feeding device (4), wherein the stacking area (2) is arranged above the buffer area (1), the buffer area (1) and the stacking area (2) are arranged on one side of a carrier plate feeding area (5), and the lifting area (3) is arranged on one side of the buffer area (1) away from the carrier plate feeding area (5);
The buffer area (1) is used for buffering the true carrier plate from the carrier plate feeding area (5) and transferring the true carrier plate to the lifting area (3);
The lifting area (3) is used for lifting the true carrier plate from the buffer area (1) and transferring the true carrier plate to the material stacking area (2);
the stacking area (2) is used for placing the true carrier plate from the lifting area (3) and transferring the true carrier plate filled with the silicon wafer to the carrier plate feeding area (5);
the silicon wafer feeding device (4) is used for transferring the silicon wafers to a true carrier plate at the material stacking area (2).
3. The PVD apparatus no-load prevention loading system of claim 2, wherein: the buffer area (1) comprises a plurality of first conveying rollers (11) which are rotatably arranged, and the first conveying rollers (11) are respectively arranged at two sides of the buffer area (1).
4. The PVD apparatus no-load prevention loading system of claim 2, wherein: the material stacking area (2) comprises a plurality of second conveying rollers (21) which are rotatably arranged and two silicon wafer alignment assemblies which are arranged in parallel, the second conveying rollers (21) are respectively arranged on two sides of the material stacking area (2), and the silicon wafer alignment assemblies comprise a plurality of UVW alignment platforms (22) which are equally divided into two rows;
The UVW alignment platforms (22) in the same column in the same silicon wafer alignment assembly are corresponding to the silicon wafer grooves in the same column on the carrier plate at intervals;
The UVW alignment platforms (22) on the two silicon wafer alignment assemblies are arranged in a staggered mode.
5. The PVD apparatus no-load prevention loading system of claim 2, wherein: the lifting area (3) comprises two first supporting frames (31), a first lifting frame (32) arranged between the two first supporting frames (31) in a sliding mode, a first driving assembly used for driving the first lifting frame (32) to do lifting motion, and a plurality of third conveying rollers (33), wherein the third conveying rollers (33) are respectively arranged on two sides of the top surface of the first lifting frame (32) in a rotating mode.
6. The PVD apparatus no-load prevention loading system of claim 2, wherein: the silicon wafer feeding device (4) comprises a plurality of first sliding rails (41), a sliding frame (42) arranged on the plurality of first sliding rails (41) in a sliding manner, a second driving assembly for driving the sliding frame (42) to slide, and a plurality of adsorption assemblies arranged on the sliding frame (42) in parallel;
The adsorption assembly comprises a plurality of silicon wafer adsorption parts (43) which are distributed in a straight line, and each silicon wafer adsorption part (43) comprises a plurality of silicon wafer adsorption heads;
the first sliding rail (41) extends from the upper part of the stacking area (2) to an external silicon wafer feeding device.
7. The PVD apparatus no-load prevention loading system of claim 1, wherein: the carrier plate material loading district (5) include two second support frames (51), slide second crane (52) that set up between two second support frames (51), be used for driving second crane (52) and do elevating movement's third drive assembly and a plurality of fourth conveying roller (53), a plurality of fourth conveying roller (53) rotate respectively and set up in the top surface both sides of second crane (52).
8. The PVD apparatus no-load prevention feed system of claim 7, wherein: the carrier plate loading area (5) further comprises a sensor (54) which is arranged on the second lifting frame (52) and used for judging whether the carrier plate is a true carrier plate or a false carrier plate, and the sensor (54) judges through the number of marking holes on the carrier plate.
9. The PVD apparatus no-load prevention loading system of claim 1, wherein: the carrier plate transferring device (6) comprises a plurality of second sliding rails (61), a transferring frame (62) arranged on the second sliding rails (61) in a sliding manner, a fourth driving assembly for driving the transferring frame (62) to slide and a plurality of carrier plate adsorption heads (63) arranged on the transferring frame (62);
the second sliding rail (61) extends from the upper part of the loading area (5) of the carrier plate to the area (7) to be processed.
10. An anti-idle feeding method for PVD equipment, which is applied to the anti-idle feeding system for PVD equipment as claimed in claim 8, is characterized by comprising the following steps: placing a carrier plate at the carrier plate feeding area (5), and detecting the number of carrier plate marking holes by the sensor (54);
if the real carrier plate is arranged at the carrier plate feeding area (5), the carrier plate feeding area (5) transfers the real carrier plate to a silicon chip stacking area, the silicon chip stacking area stacks the silicon chip on the real carrier plate, the real carrier plate filled with the silicon chip is transferred to the carrier plate feeding area (5), and the carrier plate transferring device (6) transfers the real carrier plate filled with the silicon chip at the carrier plate feeding area (5) to the area to be processed (7);
If the dummy carrier is arranged at the carrier loading area (5), the carrier transferring device (6) transfers the dummy carrier at the carrier loading area (5) to the area to be processed (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410236043.3A CN118086858A (en) | 2024-03-01 | 2024-03-01 | Empty load prevention feeding system and feeding method for PVD equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410236043.3A CN118086858A (en) | 2024-03-01 | 2024-03-01 | Empty load prevention feeding system and feeding method for PVD equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118086858A true CN118086858A (en) | 2024-05-28 |
Family
ID=91150269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410236043.3A Pending CN118086858A (en) | 2024-03-01 | 2024-03-01 | Empty load prevention feeding system and feeding method for PVD equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118086858A (en) |
-
2024
- 2024-03-01 CN CN202410236043.3A patent/CN118086858A/en active Pending
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