CN118080289A

CN118080289A - Glue smearing method for bonding workpieces

Info

Publication number: CN118080289A
Application number: CN202211425105.2A
Authority: CN
Inventors: 毕鹏帆; 李彦南; 艾传令; 孙毅; 付少华; 张悦; 岑红霞; 辛超; 魏辉
Original assignee: Tianjin Huanou New Energy Technology Co ltd
Current assignee: Tianjin Huanou New Energy Technology Co ltd
Priority date: 2022-11-15
Filing date: 2022-11-15
Publication date: 2024-05-28

Abstract

The invention provides a glue smearing method for bonding workpieces, which is used for acquiring thickness differences of glued workpieces in each route based on preset tracks; and (3) carrying out height compensation on the thickness of the adhesive layer in each route during adhesive coating based on the obtained thickness difference. According to the glue smearing method for bonding the workpiece, the glue smearing track and the glue layer thickness can be independently controlled, the glue layer can be subjected to thickness compensation in real time, the glue layer is arranged close to the surface of the workpiece, and the thicknesses of all the glue layers are kept consistent; the adhesive layer with a certain line width can be obtained, and the problems of no adhesive, adhesive breaking or adhesive empty can be effectively solved.

Description

Glue smearing method for bonding workpieces

Technical Field

The invention belongs to the technical field of silicon wafer processing, and particularly relates to a glue smearing method for bonding workpieces.

Background

The existing glue applying method for bonding the silicon rod adopts a glue injecting pipe glue applying method, but the round point type glue applying method is extremely easy to have the technical problem that glue cannot be discharged, and the flatness of the surface of a workpiece is not considered during glue applying, so that glue at individual positions is easy to have the technical problem of glue overflow or glue breakage during glue applying of the silicon rod; thus, gaps can appear in the adhesion of the silicon rod and the material plate, so that the adhesion is unstable, and the subsequent piece falling or the waste piece which is not cut thoroughly appear when the slice is received.

Disclosure of Invention

The invention provides a glue smearing method for bonding workpieces, which solves the technical problems that glue cannot be produced, glue is broken or glue is empty easily caused by adopting a round point type glue dispensing method in the prior art, so that poor bonding quality of the workpieces affects slicing processing.

In order to solve at least one of the technical problems, the invention adopts the following technical scheme:

a glue smearing method for bonding workpieces comprises the following steps:

acquiring thickness differences of the glued workpieces in each route based on a preset track;

And (3) carrying out height compensation on the thickness of the adhesive layer in each route during adhesive coating based on the obtained thickness difference.

Further, the preset track comprises a plurality of linear routes set along the length direction of the workpiece to be plastered, and the width of the adhesive layer on each route on the workpiece to be plastered is not smaller than 10mm and not larger than 80mm.

Further, the linear route is consistent with the length of the adhered workpiece; and all of the straight lines are identical.

Further, the obtaining the thickness difference of the glued workpiece in each route includes:

controlling a scanner to scan along the length of a route towards the surface of a workpiece to be glued, and obtaining the reflection distance of each scanning point on the route;

The thickness difference of each scanning point in other positions can be obtained with the position of the starting point on the route as a reference.

Further, the thickness difference is a height compensation value performed relative to the thickness of the adhesive layer during adhesive coating; and the thickness differences for all routes are obtained before the application of the glue.

Further, the step of highly compensating the thickness of the adhesive layer in each path during the adhesive coating based on the obtained thickness difference includes:

A glue smearing block for smearing is controlled to be positioned right above the starting point of each route;

the height from the lower end surface of the glue smearing block to the starting point is fixed based on the thickness of the glue layer;

Controlling the glue smearing block to move up and down to compensate the thickness of the glue layer when being positioned at the corresponding position based on the thickness difference of all the positions on the route relative to the starting point, and enabling the vertical height from the lower end surface of the glue smearing block to the surface of the glued workpiece in the whole glue smearing process to be always constant;

And (3) spreading glue and scraping glue along a preset track from the starting point of each route, so that the width of the glue layer completely covers the width of the route.

Further, the glue spreading block is arranged vertically on the surface of the glued workpiece, a gap for circulating glue solution is arranged on the lower end face of the glue spreading block, the gap is arranged along the width of the glued workpiece, and the lower end face of the glue spreading block and the surface of the glued workpiece are arranged in parallel.

Furthermore, the glue smearing block is of a split type structure, the lower end face of the glue smearing block is a flat face, a containing cavity for containing glue solution is formed in the glue smearing block, and the gap is communicated with the lower end face of the containing cavity.

Further, in the whole glue smearing process, the glue smearing sequence is to operate each route one by one from the outer side to the inner side along the width direction of the glued workpiece; and the glue outlet speed of the glue solution in the glue smearing block is constant.

Further, the sequence of scanning the preset track when the thickness difference is obtained is the same as the sequence of plastering the preset track when plastering.

By adopting the glue smearing method for bonding the workpieces, which is designed by the invention, the glue smearing track and the glue layer thickness can be independently controlled, the glue layer thickness can be compensated in real time, the glue layer is arranged close to the surface of the workpiece, and the thicknesses of all the glue layers are kept consistent; the adhesive layer with a certain line width can be obtained, and the problems of no adhesive, adhesive breaking or adhesive empty can be effectively solved.

Drawings

FIG. 1 is a flow chart of a method of applying glue to a bonded workpiece according to one embodiment of the invention;

FIG. 2 is a diagram showing the relative positions of a scanner, a dispensing block and a workpiece to be dispensed according to an embodiment of the present invention;

FIG. 3 is a schematic illustration of a dispensing trace according to an embodiment of the present invention;

FIG. 4 is a perspective view of a glue stick according to an embodiment of the invention;

FIG. 5 is a cross-sectional view of a block of glue according to an embodiment of the invention.

In the figure:

10. scanner 20, glue block 21, body

22. Slit 23, cavity 30, and rubber injection tube

40. Fixing frame 50 and workpiece to be glued

Detailed Description

The invention will now be described in detail with reference to the drawings and specific examples.

The embodiment provides a glue smearing method for bonding workpieces, as shown in fig. 1, comprising the following steps:

s1, acquiring the thickness difference of the glued workpiece 50 in each route based on a preset track.

The preset track comprises a plurality of linear routes set along the length direction of the glued workpiece 50, and all the linear routes are consistent with the length of the glued workpiece 50; at least one group of straight lines; and the width of the glue layer on each path on the workpiece 50 to be glued is not less than 10mm and not more than 80mm. The glue line with certain width is compared with the prior glue line of fine line of glue, not only can increase the bonding area between the glued work piece and the glued work piece 50, but also can solve the technical problem that glue is not produced because of glue blockage in the glue line, and can also avoid the problem of glue leakage and glue breakage which are very easy to occur because of the prior glue line of fine line of glue.

Further, the thickness difference in the length direction of the glued workpiece 50 in each route is obtained, and specifically, the scanner 10 suspended in the air is required to scan and collect data, and the external controller is required to process the data. The specific structure is shown in fig. 2, and comprises:

The fixing frame 40, the glue smearing block 20, the scanner 10 and the glue injection pipe 30 for injecting glue into the glue smearing block 20 are arranged on the fixing frame 40, wherein the fixing frame 40 can drive the glue smearing block 20 and the scanner 10 to move along the vertical direction, the width direction and the length direction of a glued workpiece 50. The glue injection pipe 30 is arranged on the fixing frame 40 and is directly communicated with the glue injection port of the glue applying block 20. The fixing frame 40 has an L-shaped structure, and the lower end surface of the fixing frame is directly and fixedly connected with the plastering block 20. The glue smearing block 20 and the glue injection pipe 30 are vertically arranged, the glue injection pipe 30 is directly communicated with the glue injection port in a seamless mode, and the glue injection pipe 30 is also fixed on the fixing frame 40 through a connecting piece. The fixing frame 40 is driven to be connected with a displacement transmission device connected with the fixing frame, and can move up and down along the vertical direction or reciprocate along the length or width direction of the workpiece 50 to be smeared, so that the smeared block 20, the glue injection pipe 30 and the scanner 10 synchronously move.

The scanner 10 is a sensor for measuring the thickness of the workpiece 50 being glued, and may be a laser position sensor or an infrared position sensor or other type of position sensor or the like. Controlling the scanner 10 to scan along the length of the route towards the surface of the workpiece to be glued, and obtaining the reflection distance of each scanning point on the route; the scanner 10 is fixedly arranged on the fixing frame 40 through a connecting frame, and the position of the scanner is positioned right in front of the glue smearing block 20 along the moving direction of the glue smearing track.

The scanner 10 can directly irradiate onto the upper surface of the workpiece 50 to be coated, and the reflected light projected onto the workpiece 50 to be coated can be absorbed by the scanner 10 due to the reflection of the surface of the workpiece 50 to be coated, so that the height from the scanning point on the surface of the workpiece to the transmitting end of the scanner 10 can be calculated based on the reflection time and speed of the scanning point. Based on this principle of the present invention,

Before the glue is applied, the fixing frame 40 is controlled in advance to drive the scanner 10 to perform projection scanning along the path of the preset track according to the path of the preset track, so as to obtain the thickness difference of the workpiece 50 to be applied on each path, wherein the thickness difference is the height compensation value performed relative to the thickness of the glue layer during the glue application, and the measurement of the thickness difference of all the paths is obtained before the glue application.

Specifically, a plurality of scanning points can be moved on each route to the vertical height of the transmitting end of the scanner 10; the position of the starting point on the route is taken as a reference, the position height from the transmitting end of the scanner 10 to the scanning point at the starting point is taken as a standard position, and meanwhile, the vertical position difference of other scanning points except the starting point relative to the starting point can be obtained as the thickness difference of each scanning point in other positions except the starting point on the route because the position height of the transmitting end of the scanner 10 is unchanged. Based on this thickness difference, other positions on the path than the starting point can be highly compensated for in subsequent dispensing to ensure that the thickness of the glue layer is uniform in dispensing.

All the collection, processing and calculation of the test data are preset in the controller in advance, the controller can judge the distance from the glue applying block 20 to the surface of the glued workpiece 50 when the glue is applied to the route, so that the vertical distance from the lower end face of the glue applying block 20 to the surface of the glued workpiece 50 is controlled by controlling the vertical position of the fixing frame 40, and then the glue layers with equal thickness can be obtained, thereby ensuring that the glue layer thicknesses on all the routes on the glued workpiece 50 are uniform and consistent, ensuring that the lower end face of the glue applying block 20 has good bonding degree with the glued workpiece 50, and effectively avoiding the problem of empty glue or glue overflow.

S2, based on the obtained thickness difference, the thickness of the adhesive layer in each route is subjected to height compensation during adhesive coating.

Specifically, the glue applying block 20 for controlling the glue application is located right above the starting point of each route.

In this embodiment, the preset track is provided with three straight lines, as shown in fig. 3, which are located on the upper surface of the workpiece 50 to be glued, and are sequentially arranged along the width of the workpiece, wherein the lengths and the widths of the three lines are the same, one line is located at the center line position of the workpiece 50 to be glued, and the other two lines are symmetrically arranged relative to the center line position. Because some of the bonded workpieces are standard components, the lengths of the bonded workpieces are certain, and some of the bonded workpieces are non-standard components, and are formed by splicing a plurality of non-standard components, the lengths of the bonded workpieces are smaller than the standard lengths.

Therefore, the lengths of all the routes are the same as the lengths of the actual glued workpieces, and the lengths of the tracks are preset in advance, so that the scanner 10 scans along the preset routes to determine the thickness difference of the glued workpiece 50, and the glue applying block 20 applies glue along the preset routes during glue application.

In the dispensing, the dispensing sequence is such that the respective routes are operated one by one from the outside to the inside in the width direction of the workpiece 50 to be dispensed. The sequence of scanning the preset track when the thickness difference is obtained is the same as the sequence of plastering the preset track when plastering. When a route is scanned, the scanner 10 works, and the glue smearing block 20 and the glue injecting pipe 30 stop working; when the glue is smeared, the scanner 10 stops working, and only the glue smearing block 20 and the glue injecting pipe 30 work.

In order to ensure that the glue line thickness is the same in all the routes, i.e. based on the glue line thickness, the height of the lower end surface of the glue block 20 from the starting point is constant at the starting point of each route.

Based on the thickness difference between all positions on the route and the starting point, the fixing frame 40 is used for controlling the glue smearing block 20 to move up and down on the corresponding positions so as to compensate the thickness of the glue layer, and the vertical height from the lower end surface of the glue smearing block 20 to the surface of the glued workpiece 50 in the whole glue smearing process is always constant, so that the thickness of the glue layer on all routes can be ensured to be consistent.

In the whole glue smearing process, the starting points of the three routes are at the same end of the glued workpiece 50, namely, the first route at the outermost side is smeared along the glue smearing direction, and then the first route rises and returns to the starting point of the first route; then horizontally moving to the starting point of the second route of the middle position along the width direction of the workpiece 50 to be glued; and then the glue smearing block 20 is controlled to descend to the glue smearing position to ensure that the thickness of the glue layer at the position of the starting point is standard, and the thickness of the glue layer at the corresponding position is compensated based on the thickness difference of all the positions on the line relative to the starting point, so that the glue smearing of the glue layer is completed along the second line along the glue smearing direction. Repeating the steps, and processing the adhesive layer on the third route until the adhesive smearing is finished.

The plastering block 20 is used for spreading the adhesive while scraping the adhesive along a preset track from the starting point of each route in the whole plastering process, and the width of the adhesive layer completely covers the width of the route.

Further, as shown in fig. 4, the structure of the glue spreading block 20 is that the glue spreading block 20 is always arranged vertically to the surface of the workpiece 50 to be glued, and is provided with a body 21 with a split structure, the lower end surface of the body is a flat surface, and two sides of the body are connected through a connecting hole 24 arranged on the side surface of the body; a gap 22 for circulating glue solution is arranged at the lower end surface, a containing cavity 23 for containing glue solution is arranged in the gap 22, and the gap 22 is communicated with the lower end surface of the containing cavity 23. In operation, the gap 22 is disposed along the width of the workpiece 50 being glued, and the lower end face of the glue block 20 is disposed in parallel with the surface of the workpiece 50 being glued.

As shown in fig. 5, the cross-section of the glue spreading block 20 is a linear strip structure arranged along the length direction of the body 21 and configured at the center line position of the lower end surface of the body 21, and the strip structure can prevent the lower end surface of the body 21 from being blocked by glue solution, and can also partially perform glue discharge, so as to avoid complete blocking. Because the length of the body 21 is fixed and the body is of a long strip structure, the obtained glue solution route is a track with equal width, and the consistency and stability of the bonding strength can be ensured.

The accommodating cavity 23 is constructed as a flat groove structure, which is convenient for the circulation and storage of the accommodating glue solution, and the structure is isosceles triangle and is arranged in a penetrating way along the height direction of the body 21. The lower end surface of the cavity 23 is matched with the length of the gap 22, and the length of the gap 22 is the same as the length of the lower end surface of the body 21 and is positioned in the middle of the lower end surface of the body 21.

The upper end surface of the containing cavity 23 is directly communicated with the liquid injection port of the glue smearing block 20; the filling port is disposed at a top intermediate position of the body 21 and communicates with the filling pipe 30. The two sides of the containing cavity 23 are inclined structures, and the liquid injection port at the top directly descends to the outer end of the lower end face of the body 21, so that the length of the body 21 can be used to set the length of the gap 22 to the maximum extent.

The cavity 23 may be configured on a single side wall surface inside the body 21, that is, a flat plane is formed on the single side wall surface of the cavity 23, and a groove of the cavity 23 is formed on the wall surface on the other side of the cavity; however, the liquid injection ports are symmetrically arranged on the wall surfaces at two sides, so that the glue injection speed and the circulation speed of the glue solution can be increased. On the basis of ensuring that the groove in the containing cavity 23 can be filled, the structure can further prevent glue solution from overflowing, improves the circulation safety of the glue solution, and is easy to distinguish the circulation surface and the glue smearing surface of the glue solution. In this embodiment, the body 21 on one side of the glue spreading direction is a wall surface with a groove, which is more beneficial to circulation of glue solution and can prevent backflow of glue solution.

In order to ensure that the glue spreading block 20 is convenient for spreading glue when the glue is spread, a section of the outer side wall surface of the body 21, which is close to the lower end surface of the body, is an inclined surface, and the inclined surfaces are inclined towards one side of the gap 22, so that the whole weight can be reduced, the glue spreading effect can be improved, and a glue solution track with a certain width can be obtained more quickly and uniformly.

Further, the glue-out speed of the glue solution in the glue-applying block 20 is constant and the moving speed of the glue-applying block 20 is also constant throughout the whole glue-applying process.

The foregoing detailed description of the embodiments of the invention has been presented only to illustrate the preferred embodiments of the invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.

Claims

1. A method of applying glue to a bonded workpiece, the steps comprising:

2. A method of applying a paste to a workpiece according to claim 1, wherein the predetermined trajectory comprises a plurality of straight lines defined along a length of the workpiece to be applied, and wherein a width of the paste layer on each line on the workpiece to be applied is not less than 10mm and not more than 80mm.

3. A method of plastering a bonded workpiece according to claim 2, wherein the linear path is consistent with the length of the bonded workpiece; and all of the straight lines are identical.

4. A method of plastering a bonded workpiece according to any one of claims 1 to 3, wherein said obtaining the thickness difference of the workpiece to be plastered in each course comprises:

5. A method of applying a paste to a workpiece according to claim 4, wherein the thickness difference is a height compensation value performed with respect to a thickness of the paste layer; and the thickness differences for all routes are obtained before the application of the glue.

6. A method of plastering a workpiece according to any one of claims 1 to 3 and 5, wherein the step of highly compensating the thickness of the adhesive layer in each course during plastering based on the obtained thickness difference comprises:

7. A method of plastering a workpiece according to claim 6, wherein the plastering block is arranged vertically to the surface of the workpiece to be plastered, a slit through which the glue solution flows is provided in the lower end face thereof, the slit is provided along the width of the workpiece to be plastered, and the lower end face of the plastering block is provided in parallel with the surface of the workpiece to be plastered.

8. The glue smearing method for bonding workpieces according to claim 7, wherein the glue smearing block is of a split type structure, the lower end face of the glue smearing block is a flat face, a containing cavity for containing glue solution is formed in the glue smearing block, and the gap is communicated with the lower end face of the containing cavity.

9. A method of applying a paste to a workpiece according to claim 7 or 8, wherein the paste sequence is such that the respective routes are operated one by one from the outside to the inside in the width direction of the workpiece to be applied throughout the paste process; and the glue outlet speed of the glue solution in the glue smearing block is constant.

10. A method of applying a paste to a workpiece according to claim 9, wherein the sequence of scanning the predetermined trajectory when the thickness difference is obtained is the same as the sequence of applying the paste to the predetermined trajectory when the thickness difference is obtained.