CN118001574A - Ultra-high needle nano-wafer - Google Patents

Abstract

The invention relates to a transdermal microneedle product in the technical field of transdermal drug delivery, in particular to a nano-wafer with an ultrahigh needle. The ultra-high needle nano wafer comprises a substrate, wherein a micro needle unit is formed on the substrate, and the ultra-high needle nano wafer is characterized in that the micro needle unit is provided with a base column, the bottom end of the base column is connected with the substrate, and a pointed cone is formed on the top end of the base column. The ultra-high needle nano-wafer has a unique micro-needle unit structure, can obviously improve the structural strength of the needle body, reduce the breakage rate of the needle body, and simultaneously ensure the efficient implementation of the processing technology. The ultra-high needle nano-wafer can form a higher depth-to-width ratio and has wider application prospect.

Description

Ultra-high needle nano-wafer

Technical Field

The invention belongs to a transdermal microneedle product in the technical field of transdermal drug delivery, and in particular relates to a nano-wafer with an ultrahigh needle.

Background

The skin structure of human skin is divided into multiple layers, wherein the outermost layer is a stratum corneum, and the stratum corneum plays a role of barrier protection, so that substances such as bacteria and microorganisms can be effectively prevented from entering the body, but a lot of beneficial active ingredients are difficult to absorb transdermally.

In the current transdermal drug delivery technology, the traditional method is to use chemical means to promote the absorption of the active ingredients, such as plaster, wherein chemical penetration promoters are doped to improve the absorption efficiency of the active ingredients, but the chemical penetration promoters have side effects, which are easy to cause skin redness and swelling, itching and even generate serious allergic reactions. The relatively advanced transdermal administration method adopts a physical mode, namely, a transdermal microneedle product is used for dredging the skin, the absorption effect of the skin is improved in a short time, and the dredging area can quickly restore the original barrier function. The mode is safer and more efficient, the operation is relatively simple, the use is more convenient, and the mode is favored by domestic and foreign specialists and medical and cosmetic institutions.

The existing transdermal microneedle products are often made of materials such as metal, monocrystalline silicon, high polymer and the like. However, the structure strength of the needle body of the existing transdermal microneedle is not high due to the limitation of the processing technology and the material characteristics, and the needle body is easy to break and break in the production, processing and using processes, so that the yield and the use safety of the product are not high, and the popularization of the product is affected.

In addition, the depth-to-width ratio (ratio of the height of the needle body to the maximum width at the bottom of the needle body) of the existing transdermal microneedle products is concentrated below 15, and under the premise that the needle body is thinner, the height of the needle body is limited, so that the acting area of the transdermal microneedle products is shallower, and more medical and cosmetic requirements cannot be met.

Thus, there is an improvement in the current transdermal microneedle articles.

Disclosure of Invention

In order to further improve the structural strength of the transdermal microneedle product and the upper limit of the depth-to-width ratio of the needle body, so as to improve the safety and the yield of the transdermal microneedle product and expand the application range of the transdermal microneedle product, the invention provides an ultrahigh-needle nano wafer. The ultra-high needle nano wafer comprises a substrate, wherein a micro needle unit is formed on the substrate, the micro needle unit is provided with a base column, the bottom end of the base column is connected with the substrate, a pointed cone is formed on the top end of the base column, the area of the cone bottom of the pointed cone is smaller than that of the top end of the base column, and the part of the top end which is not covered by the cone bottom forms a shoulder part of the base column.

In the technical scheme, the main body of the microneedle unit is composed of the base column, the base column is regular in structure on the whole, higher structural strength can be provided, and the breakage rate of the needle body is effectively reduced. The shape of the base column may be a polygonal column such as a quadrangular column, a hexagonal column, an eight-square column, or the like, or may be a cylinder. The process flow is convenient to control during production and processing, and the process flow can be effectively simplified and the processing difficulty can be reduced. The base column structure in the technical scheme has simple requirements on the etching process; taking 3D engraving as an example, the base column structure pair in the technical scheme can be obtained by dry etching or wet etching, and has low requirements on the production process. The pointed cone structure forms on the top of foundation column for break through the barrier of skin stratum corneum, guarantee the holistic sharp degree of microneedle unit, pointed cone forms on the top of foundation column, in the production and processing process, can only carry out local processing to the top of foundation column and can form, this structural design can effectively reduce the degree of difficulty of production and processing, improves production efficiency.

Therefore, the unique structure of the microneedle unit can effectively improve the structural strength of the needle body on the premise of considering the production and processing difficulty. More importantly, because the processing difficulty of the base column is controllable, the integral structural strength of the microneedle unit is high, and the depth-to-width ratio of the microneedle unit can be further improved by lengthening the height of the base column, so that the application range of the ultra-high needle nano wafer is expanded. In summary, the invention not only can improve the safety and the yield of the transdermal microneedle products, but also can provide the transdermal microneedle with ultra-high depth-to-width ratio, thereby providing wider possibility for the application of the transdermal microneedle in the fields of medical treatment, cosmetology and the like.

Preferably, the shoulder is annular about the spike. The pointed cone is positioned at the center of the top end of the base column, and the part of the periphery of the top end of the base column, which is not covered by the pointed cone, forms an annular shoulder. In the preferred technical scheme, the position of the pointed cone is centered, so that the structure of the microneedle unit is more regular, the stress is more uniform, and the microneedle unit has more advantages in the structural stability and the application process.

Preferably, the shoulder portion extends obliquely to the surface of the substrate to form a base. In the preferred technical scheme, the inclined shoulder structure not only can reduce the resistance of the microneedle unit when breaking through the stratum corneum barrier, so that the dredging process of the microneedle unit is smoother, but also can promote the opening and expansion of a dredging channel. In addition, the novel structure can effectively relieve uncomfortable feeling of the nano-wafer to a human body in the application process, and further the comfort level of user experience is effectively improved.

Preferably, the microneedle unit further comprises a base formed at a bottom end of the base column and connected with the substrate. In the preferred technical scheme, the structural strength of the micro-needle unit can be remarkably enhanced by the design of the base, and the overall height of the micro-needle unit can be effectively increased, so that the depth-to-width ratio of the micro-needle unit is further improved, and the performance of the micro-needle unit is comprehensively optimized.

Preferably, the base is in a stair platform structure, and the end surface connected with the base plate is larger than the end surface connected with the base column. In the preferred technical scheme, one end of the base is in smooth transition connection with the base column, the two parts of the base can be integrally formed, the whole size of the base gradually expands and forms a stair-table shape gradually as the base is closer to the base plate. At this moment, the whole microneedle unit is high tower-shaped, and the structural strength of the microneedle unit can be further enhanced through the structure, and meanwhile, the gradually changed size can enable the dredging process of the microneedle unit to be smoother, and meanwhile, the uncomfortable feeling of the nano-wafer to a human body in the application process is relieved.

Preferably, a chamfer structure is formed at the joint of the base and the substrate. The chamfer structure is used for transitional connection between the base and the substrate.

Preferably, the angle of the chamfer structure is 54.7 °. I.e. the angle between the bevel of the chamfer structure and the substrate surface is 54.7 deg..

Preferably, the cross section of the microneedle unit is quadrilateral, hexamorph, octamorph or circular. In the preferred solution, the microneedle units on the ultra-high needle nano-wafer have a high aspect ratio, and their overall shape is sharp. The microneedle unit may be in a polygonal column shape or a cylindrical shape as a whole according to the need and the processing process. Taking the example that the microneedle unit is a quadrangular prism as a whole, namely, the base column is a quadrangular prism, the base is formed at the bottom end of the base column and is in a quadrangular trapezoid shape, and the pointed cone is formed at the top end of the base column and is in a quadrangular cone shape, such as a pyramid shape. In some embodiments, the shoulder at the top of the base post is sloped to form a quadrangular base. At this time, the cross section at each portion of the microneedle unit is quadrangular. It is easy to think that the cross section of the microneedle unit is of other shapes, and corresponding understanding can be made, and detailed description is omitted here. It will be readily appreciated that in other embodiments, the cross-sectional shape of the base post may be dissimilar to the cross-sectional shape of the spike, e.g., the base post is a quadrangular prism having a quadrilateral cross-section; the pointed cone is in an octagon shape, and the cross section of the pointed cone is in an octagon shape. In addition, the shapes of the base post, the pointed cone and the base can be combined in other ways.

Preferably, the base column is in a quadrangular column shape.

Further preferably, the pointed cone is pyramid-shaped or octagon-shaped. In the preferred technical scheme, on the basis that the base column is in a quadrangular prism shape, the pointed cones can be in a pyramid shape (quadrangular pyramid shape), the number of the base column and the number of the edges of the pointed cones in the structure are the same, and the edges of the pointed cones can be aligned with the edges of the base column one by one. In addition, on the basis that the base column is in a quadrangular prism shape, the pointed cone can also be in an octagon shape, and the number of edges of the pointed cone is inconsistent with that of the base column.

Preferably, the pointed cone is pyramid-shaped or octagon-shaped.

Preferably, the height of the pointed cone is not less than 1 micron and not more than 800 microns.

Preferably, the aspect ratio of the pointed cone is not less than 0.5.

Preferably, the height of the pillars is not less than 5 microns and not more than 5000 microns.

Preferably, the height ratio of the pointed cone to the base column is not less than 0.01 and not more than 10.

Preferably, the height of the susceptor is not less than 5 microns.

Preferably, the aspect ratio of the microneedle unit is not less than 3.

Preferably, the microneedle unit is formed of metal, monocrystalline silicon, ceramic, or a polymer material.

Preferably, the microneedle units are arranged on the substrate in a grid, honeycomb or circular shape.

Preferably, when the microneedle units are arranged on the substrate in a grid shape, the array pattern is 3*3, 3×4, 3*5, 3*6, 3*7, 3*8, 4*4, 4*5, 5*5, 6*6, 7*7 or 8×8.

Preferably, the gap between adjacent microneedle units is not less than 200 microns.

Preferably, the thickness of the substrate is not less than 50 μm.

The beneficial effect of this technical scheme: the ultra-high needle nano-wafer provided by the invention has a unique micro-needle unit structure, can obviously improve the structural strength of the needle body, reduce the breakage rate of the needle body, and simultaneously ensure the efficient implementation of the processing technology. The ultra-high needle nano-wafer can form a higher depth-to-width ratio and has wider application prospect. In the field of beauty care, the ultrahigh-needle nano-wafer can accurately create a controllable wound, deeply stimulate the bottom layer of the skin, promote the generation of collagen, and simultaneously ensure that the wound is accurately and mildly repaired. In the medical field, the ultra-high needle nano-wafer can also be used as a sampler for skin biopsy, so that more comfortable and efficient experience is brought to the diagnosis and treatment process.

Drawings

Fig. 1 is a schematic perspective view of a microneedle unit according to a first embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 2 is a schematic cross-sectional structure of a microneedle unit in a first embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 3 is a schematic perspective view of a microneedle unit in a second embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 4 is a schematic cross-sectional structure of a microneedle unit in a second embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 5 is a schematic perspective view of a microneedle unit in a third embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 6 is a schematic cross-sectional structure of a microneedle unit in a third embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 7 is a schematic perspective view of a microneedle unit in a fourth embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 8 is a schematic cross-sectional structure of a microneedle unit in a fourth embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 9 is an electron microscope image of a first embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 10 is a partial enlarged view of the electron microscope of fig. 9.

Fig. 11 is a schematic perspective view of a microneedle unit in a sixth embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 12 is a schematic cross-sectional structure of a microneedle unit in a sixth embodiment of the ultra-high needle nano-wafer of the present invention.

Fig. 13 is a schematic perspective view of a microneedle unit in an embodiment eight of the ultra-high needle nano-wafer of the present invention.

Fig. 14 is a schematic cross-sectional structure of a microneedle unit in an eighth embodiment of the ultra-high needle nano-wafer of the present invention.

List of reference numerals:

T, ultra-high needle nano-wafer; 1. a substrate; 2. a microneedle unit; 21. a base post, 211 bottom end, 212 top end, 212a shoulder; 22. a pointed cone; 221. the bottom of the pointed cone; 23. a base; 231. chamfering structure.

Detailed Description

Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be noted that, the term "connected" in this document includes a direct connection, that is, two structures are directly connected in contact; also included are indirect connections, i.e., two structures are indirectly connected together through a third structure. It should be understood by those skilled in the art that these embodiments are merely for explaining the technical principles of the present invention, and are not intended to limit the scope of the present invention.

Common manufacturing materials of the transdermal microneedle product comprise metal, monocrystalline silicon, high polymer and the like, the structure of the needle body is in a conical or pyramid shape, the whole size of the needle body is relatively sharp, and the depth-to-width ratio is concentrated below 15. The existing transdermal microneedle products have shallow acting areas and cannot meet more medical and cosmetic requirements. To improve these technical problems, the present invention provides a new ultra-high needle nano-wafer T, which comprises a substrate 1, a micro needle unit 2 formed on the substrate 1, the micro needle unit 2 having a base pillar 21, a bottom end 211 of the base pillar 21 connected to the substrate 1, and a tip cone 22 formed on a top end 212 of the base pillar 21. The unique needle body structure can obviously improve the height of the needle body while ensuring the structural strength, thereby expanding the transdermal depth and the action area. The aspect ratio of the microneedle unit of the technical scheme is not less than 3, and particularly, the aspect ratio of the microneedle unit can reach 10, 15, 20, 50 or more according to requirements.

Example 1

Fig. 1 is a schematic perspective view of a microneedle unit according to a first embodiment of the ultra-high needle nano-wafer of the present invention. Fig. 2 is a schematic cross-sectional structure of a microneedle unit in a first embodiment of the ultra-high needle nano-wafer of the present invention.

In the first embodiment shown in fig. 1 and 2, the substrate 1 of the ultra-high needle nano-wafer T is made of single crystal silicon. Alternatively, the substrate 1 may be made of ceramics, polymers, plastics, metals, or the like. The overall shape of the substrate 1 is flexibly adjusted according to design requirements, and can be rectangular, diamond-shaped, pentagonal, hexagonal, octagonal, circular or other suitable shapes. The thickness of the substrate 1 is not less than 50 micrometers, for example, the thickness of the substrate 1 is 50-500 micrometers.

As shown in fig. 1 and 2, in the first embodiment, the ultra-high needle nano-wafer T is placed upward, and the microneedle unit 2 is formed on the upper surface of the substrate 1. The microneedle units may be formed of metal, monocrystalline silicon, ceramic, or a polymeric material. In the first embodiment, the material of the microneedle unit 2 is the same as that of the substrate 1, and the microneedle unit 2 is formed by etching, carving, or the like of the substrate 1. It is easily conceivable that the material of the microneedle unit 2 and the material of the substrate 1 may be different, and the two parts are formed by separate processes. For example, the microneedle unit 2 is made of a polymer material, the substrate 1 is made of a monocrystalline silicon material, and other material combinations are not exhaustive.

As shown in fig. 1 and 2, in the first embodiment, the microneedle units 2 are arranged in a grid on the substrate 1. The microneedle arrays may be arranged in 3*3, 3x 4, 3*5, 3*6, 3*7, 3*8, 4*4, 4*5, 5*5, 6*6, 7*7, 8 x 8 or other suitable format, depending on the shape or size of the substrate 1. It is easily understood that the microneedle units 2 may also be arranged in a honeycomb or circular ring shape on the substrate 1. The gap between adjacent microneedle units 2 is not less than 200 micrometers. In this embodiment, the gap between adjacent microneedle units 2 may be 200 microns, 300 microns, 350 microns, 460 microns, 500 microns, or 1000 microns.

As shown in fig. 1 and 2, the body of the microneedle unit 2 includes a base column 21 and a pointed cone 22. In the first embodiment, the base column 21 has a quadrangular prism shape. It is easily conceivable that the base column 21 may also be of a hexagonal prism type, an octagonal prism type or a cylindrical type. In the first embodiment, the base column 21 has a uniform thickness and a regular structure, and the structure can simplify the processing process and improve the structural strength of the microneedle unit 2, thereby improving the upper limit of the height of the microneedle unit 2. In the present embodiment, the height of the base pillar 21 is not less than 5 micrometers and not more than 5000 micrometers. The specific height specification may be selected according to the requirements of the use scenario, such as a height of the base pillar 21 of 5 microns, 100 microns, 500 microns, 1000 microns, 2000 microns, or 5000 microns.

As shown in fig. 1 and 2, the base column 21 has opposite bottom and top ends 211 and 212. In the first embodiment, the bottom end 211 of the base column 21 is directly connected to the substrate 1. In some embodiments, the connection of the bottom end 211 and the substrate 1 may further form a chamfer structure, which can enhance the structural strength between the microneedle unit 2 and the substrate 1.

As shown in fig. 1 and 2, a pointed cone 22 is formed at the tip 212 of the base pillar 21. In the first embodiment, the pointed cone 22 is in the shape of a quadrangular pyramid, optionally, a pyramid. Alternatively, the tip 22 may be hexagonal, octagonal, or conical. As shown in fig. 1 and 2, in the present embodiment, the edges of the spikes 22 are aligned with and the same number as the edges of the base posts 21. It will be readily appreciated that in other embodiments, the edges of the base post 21 are not in one-to-one alignment with the edges of the pointed cone 22. In some embodiments, the material of the taper 22 is the same as that of the base pillar 21, and the taper 22 is directly machined from the top end 212 of the base pillar 21. In other embodiments, the material of the taper 22 may be different from that of the base pillar 21, for example, the taper 22 is made of a polymer material, and the base pillar 21 is made of a single crystal silicon material. In the present embodiment, the height of the tip 22 is not less than 1 micron and not more than 800 microns. Alternative height dimensions are 1 micron, 5 microns, 10 microns, 200 microns, 500 microns or 800 microns. The aspect ratio of the tip 22 is not less than 0.5. When the aspect ratio of the pointed cone 22 is smaller than 0.5, 0.6 or 0.8, the pointed cone 22 is flat as a whole, and the microneedle unit 2 is more beneficial to the massage treatment of the skin; when the aspect ratio of the pointed cone 22 is a value of 1, 1.5, 2 or more, the pointed cone 22 is more sharp and the microneedle unit 2 is more advantageous for entering the skin.

As shown in fig. 1 and 2, in the first embodiment, the area of the bottom 221 of the pointed cone 22 is smaller than the area of the tip 212 of Yu Jizhu, and the portion of the tip 212 not covered by the bottom 221 forms a shoulder 212a. As shown in fig. 1, when the tip cone 22 is centered on the tip end 212, the shoulder 212a forms an annular enclosure cone bottom 221. In the first embodiment, the top end of the base pillar 21 is flat, and accordingly, the shoulder 212a forms a flat mesa. Alternatively, the shoulder 212a is parallel to the upper surface of the substrate 1. The height ratio of the pointed cone 22 to the base column 21 is not less than 0.01 and not more than 10. The height ratio of the pointed cone 22 to the base column 21 can be designed to be 5, 2, 1, 0.5, 0.2, 0.1, 0.05 or other values according to design requirements.

Example two

Fig. 3 is a schematic perspective view of a microneedle unit in a second embodiment of the ultra-high needle nano-wafer of the present invention. Fig. 4 is a schematic cross-sectional structure of a microneedle unit in a second embodiment of the ultra-high needle nano-wafer of the present invention.

As shown in fig. 3 and 4, unlike the first embodiment, in the second embodiment, the main body of the microneedle unit 2 includes a base 21, a pointed cone 22, and a base 23. The base 23 is formed at the bottom end 211 of the base column 21 below the base column 21, and the microneedle unit 2 is connected to the substrate 1 through the base 23. The base 23 has a small upper portion and a large lower portion, and an end surface connected to the substrate 1 is larger than an end surface connected to the base column 21, so that the entire base is in a terrace structure. As shown in fig. 3 and 4, in the second embodiment, the base 23 has a quadrangular trapezoidal shape. Alternatively, the base 23 may also have a six-sided step shape, an eight-sided step shape, or a round table shape. The height of the susceptor 23 is not less than 5 μm. Alternatively, the pedestals 23 may have a height of 5 microns, 8 microns, 10 microns, 100 microns or more.

Example III

Fig. 5 is a schematic perspective view of a microneedle unit in a third embodiment of the ultra-high needle nano-wafer of the present invention. Fig. 6 is a schematic cross-sectional structure of a microneedle unit in a third embodiment of the ultra-high needle nano-wafer of the present invention.

As shown in fig. 5 and 6, unlike the second embodiment, in the third embodiment, a chamfer structure 231 is formed at the junction of the base 23 and the substrate 1. In this embodiment, the angle between the bevel of the chamfer and the upper surface of the substrate 1 is 54.7 °. It will be readily appreciated that the chamfer structure may have other suitable angles. This structure can enhance the structural strength between the microneedle unit 2 and the substrate 1.

Example IV

Fig. 7 is a schematic perspective view of a microneedle unit in a fourth embodiment of the ultra-high needle nano-wafer of the present invention. Fig. 8 is a schematic cross-sectional structure of a microneedle unit in a fourth embodiment of the ultra-high needle nano-wafer of the present invention. Fig. 9 is an electron microscope image of a first embodiment of the ultra-high needle nano-wafer of the present invention. Fig. 10 is a partial enlarged view of the electron microscope of fig. 9.

As shown in fig. 7 to 10, in the fourth embodiment, unlike the third embodiment, the shoulder 212a is further modified to form a slope extending toward the substrate 1, and a certain inclination angle is formed between the shoulder 212a and the upper surface of the substrate 1. Accordingly, shoulder 212a forms a base to lift spike 22. In the fourth embodiment, the base column 21 has a quadrangular prism shape, and accordingly, the base is a quadrangular landing. It will be readily appreciated that when the base 21 is hexagonally, octagonally or cylindrically shaped, the base is correspondingly hexagonally, octagonally or round. In some embodiments, the shoulder 212a is angled no more than 45 degrees relative to the upper surface of the substrate. This angular range can provide the microneedle unit 2 with better structural strength.

Example five

Unlike the first embodiment, in the fifth embodiment, the shoulder is further modified to form a slope having a certain inclination angle with the upper surface of the substrate, and the shoulder extends toward the substrate to form a base.

Example six

Fig. 11 is a schematic perspective view of a microneedle unit in a sixth embodiment of the ultra-high needle nano-wafer of the present invention. Fig. 12 is a schematic cross-sectional structure of a microneedle unit in a sixth embodiment of the ultra-high needle nano-wafer of the present invention. As shown in fig. 11 and 12, in the sixth embodiment, the shoulder is further modified to form a slope having a certain inclination angle with the upper surface of the substrate, and the shoulder extends toward the substrate to form a base.

Example seven

Unlike the first embodiment, in the seventh embodiment, the base column is in a stepped shape, that is, the area of the bottom end of the base column is larger than the area of the top end, and the structure can effectively enhance the structural strength of the microneedle unit as well.

Example eight

Fig. 13 is a schematic perspective view of a microneedle unit in an embodiment eight of the ultra-high needle nano-wafer of the present invention. Fig. 14 is a schematic cross-sectional structure of a microneedle unit in an eighth embodiment of the ultra-high needle nano-wafer of the present invention. As shown in fig. 13 and 14, in the eighth embodiment, the main body of the microneedle unit 2 includes a base column 21, a pointed cone 22, and a base 23. Unlike the fourth embodiment, in the present embodiment, the base pillar 21 has a quadrangular prism shape, and the pointed cone 22 has an octagon shape. An alternative process flow is to etch the top end 212 of the base pillar 21 to form the octagon-shaped taper 22. In this eighth embodiment, the number of edges of the pointed cone 22 is greater than the number of edges of the base post 21, and the edges of the base post 21 are not perfectly aligned with the edges of the pointed cone 22. It will be readily appreciated that in other embodiments, the edges of the base post 21 are not in one-to-one alignment with the edges of the tip cone 22.

It should be noted that the foregoing is a specific embodiment of the present invention, but the present invention is not limited to the foregoing embodiment, and any modifications and substitutions in the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (22)

1. The ultra-high needle nano wafer comprises a substrate, wherein a micro needle unit is formed on the substrate, and the ultra-high needle nano wafer is characterized in that the micro needle unit is provided with a base column, the bottom end of the base column is connected with the substrate, a pointed cone is formed on the top end of the base column, the area of the cone bottom of the pointed cone is smaller than that of the top end of the base column, and the part of the top end which is not covered by the cone bottom forms a shoulder part of the base column.

2. The ultra-high needle nano-wafer of claim 1, wherein the shoulder is annular surrounding the spike cone.

3. The ultra-high needle nano-wafer of claim 1, wherein the shoulder extends obliquely relative to the surface of the substrate forming a base.

4. The ultra-high needle nano-wafer of claim 1, wherein the microneedle unit further comprises a base formed at a bottom end of the base column and connected to the substrate.

5. The ultra-high needle nano-wafer according to claim 4, wherein the susceptor has a stepped structure and an end surface connected to the substrate is larger than an end surface connected to the base column.

6. The ultra-high needle nano-wafer of claim 5, wherein the junction of the base and the substrate forms a chamfer structure.

7. The ultra-high needle nano-wafer of claim 6, wherein the chamfer structure has an angle of 54.7 °.

8. The ultra-high needle nano-wafer according to any one of claims 1-7, wherein the cross section of the microneedle unit is quadrilateral, hexamorph, octamorph or circular.

9. The ultra-high needle nano-wafer of claim 8, wherein the base pillar has a quadrangular prism shape.

10. The ultra-high needle nano-wafer according to claim 9, wherein the pointed cone is pyramid-shaped or octagon-shaped.

11. The ultra-high needle nano-wafer according to claim 8, wherein the pointed cone is pyramid-shaped or octagon-shaped.

12. The ultra-high needle nanoplate according to any one of claims 1-7, wherein the height of the pointed cone is not less than 1 micron and not more than 800 microns.

13. The ultra-high needle nano-wafer according to claim 12, wherein the aspect ratio of the tip cone is not less than 0.5.

14. The ultra-high needle nanoplate according to any one of claims 1-7, wherein the height of the base pillar is not less than 5 microns and not more than 5000 microns.

15. The ultra-high needle nano-wafer of claim 14, wherein a height ratio of the pointed cone to the base pillar is not less than 0.01 and not more than 10.

16. The ultra-high needle nanoplate according to any one of claims 1-7, wherein the height of the susceptor is not less than 5 microns.

17. The ultra-high needle nano-wafer according to any one of claims 1-7, wherein the aspect ratio of the microneedle unit is not less than 3.

18. The ultra-high needle nano-wafer according to any one of claims 1-7, wherein said microneedle unit is formed of a metal, single crystal silicon, ceramic or polymeric material.

19. The ultra-high needle nano-wafer according to any one of claims 1-7, wherein said microneedle units are arranged in a grid, honeycomb or ring-like arrangement on said substrate.

20. The ultra-high needle nanoplate according to any one of claims 1-7, wherein the microneedle units, when arranged in a grid-like fashion on the substrate, have an array pattern of 3*3, 3 x 4, 3*5, 3*6, 3*7, 3*8, 4*4, 4*5, 5*5, 6*6, 7*7, or 8 x 8.

21. The ultra-high needle nano-wafer according to any one of claims 1-7, wherein a gap between adjacent ones of said microneedle units is not less than 200 microns.

22. The ultra-high needle nanoplate according to any one of claims 1-7, wherein the thickness of the substrate is not less than 50 microns.