CN117984631A - 缓冲垫结构 - Google Patents
缓冲垫结构 Download PDFInfo
- Publication number
- CN117984631A CN117984631A CN202211434107.8A CN202211434107A CN117984631A CN 117984631 A CN117984631 A CN 117984631A CN 202211434107 A CN202211434107 A CN 202211434107A CN 117984631 A CN117984631 A CN 117984631A
- Authority
- CN
- China
- Prior art keywords
- fiber cloth
- layer
- foaming
- composite fiber
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004744 fabric Substances 0.000 claims abstract description 164
- 239000000835 fiber Substances 0.000 claims abstract description 132
- 239000002131 composite material Substances 0.000 claims abstract description 69
- 238000005187 foaming Methods 0.000 claims abstract description 63
- 239000012210 heat-resistant fiber Substances 0.000 claims abstract description 37
- 238000007731 hot pressing Methods 0.000 claims abstract description 37
- 238000011084 recovery Methods 0.000 claims abstract description 14
- 238000005096 rolling process Methods 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 166
- 230000003014 reinforcing effect Effects 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 17
- 229920001973 fluoroelastomer Polymers 0.000 claims description 14
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 11
- 239000002033 PVDF binder Substances 0.000 claims description 10
- 239000011229 interlayer Substances 0.000 claims description 10
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 8
- 239000003365 glass fiber Substances 0.000 claims description 8
- 229920002530 polyetherether ketone Polymers 0.000 claims description 8
- -1 polytetrafluoroethylene Polymers 0.000 claims description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 7
- 229920002379 silicone rubber Polymers 0.000 claims description 7
- 239000004945 silicone rubber Substances 0.000 claims description 7
- 238000005728 strengthening Methods 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims 1
- 230000003139 buffering effect Effects 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 20
- 230000000694 effects Effects 0.000 description 16
- 239000000203 mixture Substances 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000004088 foaming agent Substances 0.000 description 9
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 8
- 239000008096 xylene Substances 0.000 description 8
- 238000003475 lamination Methods 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
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- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000005543 nano-size silicon particle Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- ICGLPKIVTVWCFT-UHFFFAOYSA-N 4-methylbenzenesulfonohydrazide Chemical compound CC1=CC=C(S(=O)(=O)NN)C=C1 ICGLPKIVTVWCFT-UHFFFAOYSA-N 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- ICXAPFWGVRTEKV-UHFFFAOYSA-N 2-[4-(1,3-benzoxazol-2-yl)phenyl]-1,3-benzoxazole Chemical compound C1=CC=C2OC(C3=CC=C(C=C3)C=3OC4=CC=CC=C4N=3)=NC2=C1 ICXAPFWGVRTEKV-UHFFFAOYSA-N 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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Abstract
本发明公开一种缓冲垫结构,缓冲垫结构包括:发泡中间层以及两个复合纤维布层。发泡中间层设置于两个复合纤维布层之间,每一复合纤维布层是由耐热纤维布以及蓬松纱纤维布所制成,耐热纤维布通过针轧方式与蓬松纱纤维布结合。缓冲垫结构于190℃的温度下热压的缓冲率大于30%,缓冲垫结构于190℃的温度下热压的复原率大于95%。本发明的缓冲垫结构具有良好的缓冲效果,且可承受多次热压使用。
Description
技术领域
本发明涉及一种缓冲垫结构,特别是涉及一种可多次使用的缓冲垫结构。
背景技术
制造铜箔基板(copper clad laminate,CCL)或印刷多层板的过程中,一般会使用热压机进行成型作业,并于机台与基板之间设置热压缓冲垫,作为缓冲,以达到保护基板的效果。
随着基板薄型化的趋势,对基板表面的平整均匀性的要求也逐渐提高,热压缓冲垫需具有更佳的缓冲特性及耐热效果,才可保有竞争性。另外,为了因应环保需求,相关技术领域也期望热压缓冲垫的热压使用次数可以提升,以避免浪费。
现有的热压缓冲垫,一般是使用牛皮纸,或使用胶合剂(例如:橡胶)接合有机纤维或无机纤维(例如:不织布)而制成。然而,现有的热压缓冲垫的缓冲效果有限,且可承受的热压次数较低(约200至300次)。因此,市面上期许提供一种热压缓冲垫,具有良好的耐热性与缓冲效果,且可重复使用多次。
发明内容
本发明所要解决的技术问题在于,针对现有技术的不足提供一种缓冲垫结构。
为了解决上述的技术问题,本发明所采用的其中一技术方案是提供一种缓冲垫结构。缓冲垫结构包括发泡中间层与两个复合纤维布层。发泡中间层设置于两个复合纤维布层之间,每一复合纤维布层是由耐热纤维布及蓬松纱纤维布所制成,耐热纤维布通过针轧方式与蓬松纱纤维布结合。缓冲垫结构于190℃的温度下热压的缓冲率大于30%,缓冲垫结构于190℃的温度下热压的复原率大于95%。
更进一步地,蓬松纱纤维布中的蓬松纱集中设置于耐热纤维布的多个节点上,蓬松纱纤维布是玻璃纤维蓬松纱纤维布。
更进一步地,两层蓬松纱纤维布与一层耐热纤维布构成一个叠层单位,耐热纤维布设置于两层蓬松纱纤维布之间。
更进一步地,复合纤维布层与发泡中间层的厚度比值为0.5至0.9。
更进一步地,发泡中间层是以热压合的方式设置于复合纤维布层上。
更进一步地,发泡中间层的发泡倍率为0.6至3.0。
更进一步地,发泡中间层的材料是选自于由下列所构成的群组:硅橡胶、氟橡胶、聚偏二氟乙烯及聚醚醚酮。
更进一步地,缓冲垫结构进一步包括:两个表面补强层,两个表面补强层分别设置于两个复合纤维布层上,使得发泡中间层与两个复合纤维布层设置于两个表面补强层之间。
更进一步地,表面补强层的材料是选自于由下列所构成的群组:聚四氟乙烯、聚偏二氟乙烯、氟橡胶及聚醚醚酮。
本发明的其中一有益效果在于,本发明所提供的缓冲垫结构,其能通过“缓冲垫结构具有发泡中间层”以及“复合纤维布层是由耐热纤维布及蓬松纱纤维布所制成”的技术方案,以提升缓冲垫结构的缓冲及热压使用次数效果。
为使能更进一步了解本发明的特征及技术内容,请参阅以下有关本发明的详细说明与附图,然而所提供的附图仅用于提供参考与说明,并非用来对本发明加以限制。
附图说明
图1为本发明第一实施例的缓冲垫结构的剖面示意图。
图2为本发明的缓冲垫结构剖面的电子显微镜图。
图3为本发明第二实施例的缓冲垫结构的剖面示意图。
图4为本发明的缓冲垫结构于测试时的俯视示意图。
具体实施方式
以下是通过特定的具体实例来说明本发明所公开有关“缓冲垫结构”的实施方式,本领域技术人员可由本说明书所公开的内容了解本发明的优点与效果。本发明可通过其他不同的具体实施例加以施行或应用,本说明书中的各项细节也可基于不同观点与应用,在不悖离本发明的构思下进行各种修改与变更。另外,本发明的附图仅为简单示意说明,并非依实际尺寸的描绘,事先声明。以下的实施方式将进一步详细说明本发明的相关技术内容,但所公开的内容并非用以限制本发明的保护范围。另外,本文中所使用的术语“或”,应视实际情况可能包括相关联的列出项目中的任一个或者多个的组合。
[第一实施例]
请参阅图1所示,本发明第一实施例提供一种用于铜箔基板或印刷多层板热压成型的缓冲垫结构,其为三层结构。本发明的缓冲垫结构具有良好的缓冲性,可承受的热压次数大于300次(甚至可达400次至600次),且特别适用于250℃以下的热压制造过程。
如图1所示,缓冲垫结构包括发泡中间层10以及两个复合纤维布层20。发泡中间层10与两个复合纤维布层20可通过热压合的方式,形成一体化的结构。发泡中间层10具有相对的第一表面11以及第二表面12,且两个复合纤维布层20分别设置于第一表面11以及第二表面12上。
于一示范实施例中,发泡中间层10是由一发泡组成物,经发泡制造过程而形成。发泡组成物中包括:100重量份至80重量份的树脂材料、10重量份至5重量份的溶剂、0.1重量份至1重量份的发泡剂与0.1重量份至3重量份的导热粒子。溶剂可以是甲苯、二甲苯或小分子硅油。发泡剂可以是偶氮化合物(例如:偶氮二异丁腈)、酰肼合物(例如:对甲苯磺酰肼(p-toluenesulfonyl hydrazide,TSH))、亚硝基化合物或胺基化合物(例如:尿素或碳酸氢铵)。或者,也可导入压缩气体或是可溶性气体,以物理性方式进行发泡。导热粒子可以是导热碳黑、导热石墨、纳米氮化硅镁、纳米碳化硅、纳米氮化铝、纳米氮化硼、高纯度球形氧化铝、纳米氮化硅或其组合,但本发明不以此为限。
发泡中间层10的树脂材料为是选自于由下列所构成的群组:硅橡胶、氟橡胶、聚偏二氟乙烯(polyvinylidene difluoride,PVDF)及聚醚醚酮(polyetheretherketone,PEEK)。详细来说,树脂材料的分子量可以为30000g/mol至100000g/mol。
通过调整发泡组成物的成分含量以及发泡制造过程中的参数,发泡中间层10的发泡倍率可以控制为0.6至3.0,例如0.7、0.9、1.1、1.3、1.5、1.7、1.9、2.1、2.3、2.5、2.7或2.9。若发泡倍率过高,过多的空气层会使缓冲垫结构的导热效果降低,且缓冲垫结构的缓冲率会有结构强度不足的问题。若发泡倍率过低,又无法有效提升缓冲垫结构的缓冲率。
于一示范实施例中,发泡中间层10的厚度为1.2毫米至5毫米,例如1.5毫米、2.0毫米、2.5毫米、3.0毫米、3.5毫米、4.0毫米或4.5毫米。若发泡中间层10的厚度太薄,则缓冲垫结构的缓冲效果不佳,若发泡中间层10的厚度太厚,则会导致热压效果不佳。
本发明的复合纤维布层20是由耐热纤维布与蓬松纱纤维布(或称为膨体纱纤维布,bulky fiber cloth)所制成。耐热纤维布可提升复合纤维布层20的耐热性,进而增加缓冲垫结构的热压使用次数。耐热纤维布可通过针轧方式与蓬松纱纤维布结合,构成一体成型的复合纤维布层20,使复合纤维布层20兼具耐热、高缓冲以及耐用的特性。
详细来说,将一层耐热纤维布设置于两层蓬松纱纤维布之间,以蓬松纱纤维布作为夹网,堆叠形成一个叠层单位。另可根据耐热纤维布的厚度或是产品需求,选择要将几个叠层单位,堆叠针轧制成复合纤维布层20。也就是说,复合纤维布层20可包括一个或多个叠层单位。
微观复合纤维布层20的结构,蓬松纱纤维布的蓬松纱集中设置于耐热纤维布的多个节点上(请参阅图2所示),此为使用平织纤维布无法形成的结构。因此,相较于平织纤维布,本发明的复合纤维布层20更具有良好的耐用性与缓冲性。
详细来说,每一复合纤维布层20可以包括不只一层蓬松纱纤维布。通过针轧的方式,可将多层蓬松纱纤维布与耐热纤维布结合,形成一体成型的结构,达到更佳的缓冲效果。具体来说,蓬松纱纤维布可以是玻璃纤维蓬松纱纤维布(bulk yarn fiberglasscloth),但本发明不以此为限。
耐热纤维布可以是由芳香族聚酰胺纤维、聚对苯撑苯并二恶唑纤维(poly-p-phenylene benzobisoxazole,PBO)纤维、聚四氟乙烯纤维、聚酰亚胺纤维、金属纤维、氮化硼纤维、陶瓷纤维等或石墨纤维所制成。
于一示范实施例中,复合纤维布层20的基重为300g/cm3至900g/cm3。复合纤维布层20的厚度为0.5毫米至1.5毫米,例如0.6毫米、0.8毫米、1.0毫米、1.2毫米或1.4毫米。若复合纤维布层20的厚度太薄,则缓冲垫结构的缓冲效果不佳,若发泡中间层10的厚度太厚,则会导致热压效果不佳。
值得说明的是,本发明特别选用发泡中间层10及含有蓬松纱纤维布的复合纤维布层20,可提升缓冲垫结构的耐用性。相较于以往只使用发泡材料的缓冲垫结构而言,本发明设置复合纤维布层20,并搭配特定厚度比例的发泡中间层10,可进一步提升缓冲垫结构的缓冲率与复原率,即便经多次热压使用之后,缓冲垫结构仍可具有良好的复原率。
具体来说,本发明调整复合纤维布层20相对于发泡中间层10的厚度比值为0.5至0.9,较佳为0.6至0.8。在此厚度比例下,复合纤维布层20可进一步提升缓冲垫结构的复原率,并可提升缓冲垫结构的耐用性。
当复合纤维布层20相对于发泡中间层10的厚度比值低于0.5时,复合纤维布层20无法对缓冲垫结构提供显著的改善。当复合纤维布层20相对于发泡中间层10的厚度比值高于0.9时,缓冲垫结构的结构强度会过低,而无法作为缓冲垫结构。
[第二实施例]
请参阅图3所示,本发明第二实施例提供一种用于铜箔基板或印刷多层板热压成型的缓冲垫结构,其为五层结构。第二实施例的缓冲垫结构与第一实施例的缓冲垫结构相似,其差异在于:缓冲垫结构进一步包括两个表面补强层30。
如图3所示,发泡中间层10设置于两个复合纤维布层20之间。两个表面补强层30可通过热贴合的方式,分别设置于两个复合纤维布层20上,形成一体化的结构。也就是说,两个表面补强层30为缓冲垫结构的最外层,发泡中间层10与两个复合纤维布层20夹设于两个表面补强层30之间。
表面补强层30的设置,可提升缓冲垫结构的耐热效果,还可提升缓冲垫结构表面的平坦性。当本发明的缓冲垫结构用于热压基板时,可维持基板热压表面的平整性。详细来说,基板经热压后表面的平坦性大于90%(较佳为91%至97%),具体测量方式将于后叙述。
表面补强层30的材料是选自于由下列所构成的群组:聚四氟乙烯、聚偏二氟乙烯、氟橡胶及聚醚醚酮。
于一些实施例中,表面补强层30可以是使用一树脂组成物经由涂布、再烘干的方式形成。当表面补强层30是以涂布的方式形成时,一部分的树脂组成物会渗入复合纤维布层20内。因此,当形成表面补强层30之后,缓冲垫结构可具有较佳的耐用性。
于另一些实施例中,表面补强层30也可以是将事先成型的薄膜,热贴合于复合纤维布层20上而形成。在热贴合的过程中,一部分的表面补强层30会渗入复合纤维布层20内。因此,当形成表面补强层30之后,缓冲垫结构可具有较佳的耐用性。
举例来说,表面补强层30可以是将氟橡胶涂布于复合纤维布层20上,经干燥后形成。或者,表面补强层30也可以是将聚四氟乙烯玻璃纤维布或聚偏二氟乙烯含浸布,贴合于复合纤维布层20上而形成。
于一示范实施例中,表面补强层30的厚度为0.05毫米至0.2毫米,例如0.06毫米、0.08毫米、0.10毫米、0.12毫米、0.14毫米、0.16毫米或0.18毫米。若表面补强层30的厚度太薄,则难以达到提升缓冲垫结构的表面平坦性的效果,若表面补强层30的厚度太厚,则会导致热压效果降低。
为了证实本发明缓冲垫结构的优势,本发明分别制造了实验例1至3以及比较例1至3的缓冲垫结构。在实验例1至3以及比较例1至3中,先根据表1中的成分及条件,分别制备发泡中间层、复合纤维布层以及表面补强层,再以230℃的温度、30kg/m2的压力进行热压合,以制得实验例1至3与比较例1至3的缓冲垫结构。
[实验例1]
配制发泡组成物,发泡组成物包含100重量份的硅橡胶、5重量份的二甲苯以及0.1重量份的发泡剂。使用发泡组成物进行发泡,制得发泡倍率为2、厚度为1.6毫米的发泡中间层。
将一层耐热纤维布置于两层蓬松纱纤维布之间(以蓬松纱纤维布作为夹网),作为一个叠层单位。叠层的基重为800克/平方公分、叠层的厚度为1.2毫米。以针轧的方式,结合一个叠层单位的耐热纤维布与蓬松纱纤维布,制得复合纤维布层。
接着,根据第二实施例的结构,依序将一PTFE玻纤布、复合纤维布层、发泡中间层、复合纤维布层以及另一PTFE玻纤布堆叠形成叠层结构,并于230℃的温度、30kg/m2的压力进行热压合,以制得缓冲垫结构。
[实验例2]
实验例2的步骤与实验例1相似,其差异在于:发泡组成物包含100重量份的氟橡胶、5重量份的二甲苯以及0.2重量份的发泡剂。发泡中间层的发泡倍率为1、厚度为2.2毫米。
将一层耐热纤维布置于两层蓬松纱纤维布之间(以蓬松纱纤维布作为夹网),作为一个叠层单位。叠层的基重为600克/平方公分、叠层的厚度为0.9毫米。堆叠两个叠层单位的耐热纤维布与蓬松纱纤维布,以针轧的方式结合制得复合纤维布层。
接着,依序将一PVDF含浸布、复合纤维布层、发泡中间层、复合纤维布层以及另一PVDF含浸布堆叠形成叠层结构,并于230℃的温度、30kg/m2的压力进行热压合,以制得缓冲垫结构。
[实验例3]
实验例3的步骤与实验例1相似,其差异在于:发泡组成物包含100重量份的聚醚醚酮、5重量份的二甲苯以及0.5重量份的发泡剂。发泡中间层的发泡倍率为0.8、厚度为2.8毫米。
将一层耐热纤维布置于两层蓬松纱纤维布之间(以蓬松纱纤维布作为夹网),作为一个叠层单位。叠层的基重为400克/平方公分、叠层的厚度为0.6毫米。堆叠三个叠层单位的耐热纤维布与蓬松纱纤维布,以针轧的方式结合制得复合纤维布层。
接着,依序将一氟橡胶层、复合纤维布层、发泡中间层、复合纤维布层以及另一氟橡胶层堆叠形成叠层结构,并于230℃的温度、30kg/m2的压力进行热压合,以制得缓冲垫结构。氟橡胶层是由一氟橡胶树脂所形成,氟橡胶树脂中包括100重量份的氟橡胶、5重量份的二甲苯及1重量份的发泡剂。
[比较例1]
比较例1的步骤与实验例1相似,其差异在于:发泡中间层的发泡倍率与厚度不同,复合纤维布层中不包含蓬松纱纤维布,且使用不同材料的表面补强层。
详细来说,比较例1中的发泡组成物包含100重量份的硅橡胶、5重量份的二甲苯以及0.1重量份的发泡剂。使用发泡组成物进行发泡,制得发泡倍率为3、厚度为1.3毫米的发泡中间层。另外,比较例1中的复合纤维布层不包含蓬松纱纤维布,只包含基重为1000克/平方公分、厚度为1.5毫米的耐热纤维布。
[比较例2]
比较例2的步骤与实验例1相似,其差异在于:发泡中间层的发泡倍率与厚度不同,复合纤维布层中不包含蓬松纱纤维布,且使用不同材料的表面补强层。
详细来说,比较例2中的发泡组成物包含100重量份的硅橡胶、5重量份的二甲苯以及0.1重量份的发泡剂。使用发泡组成物进行发泡,制得发泡倍率为2.5、厚度为1.6毫米的发泡中间层。另外,比较例2中以平织纤维布作为夹网,将一层耐热纤维布设置于两层平织纤维布之间,作为一个叠层单位。叠层的基重为800克/平方公分、叠层的厚度为1.2毫米。以针轧的方式结合一个叠层单位的耐热纤维布与平织纤维布,制得复合纤维布层。
接着,依序将纸、复合纤维布层、发泡中间层、另一复合纤维布层以及另一/>纸堆叠形成叠层结构,并于230℃的温度、30kg/m2的压力进行热压合,以制得缓冲垫结构。
[比较例3]
比较例3的步骤与实验例1相似,其差异在于:发泡中间层的发泡倍率与厚度不同,且复合纤维布层中不包含蓬松纱纤维布。
详细来说,比较例2中的发泡组成物包含100重量份的氟橡胶、5重量份的二甲苯以及0.1重量份的发泡剂。使用发泡组成物进行发泡,制得发泡倍率为2、厚度为2.2毫米的发泡中间层。另外,比较例3中以平织纤维布作为夹网,将一层耐热纤维布设置于两层平织纤维布之间,作为一个叠层单位。叠层的基重为600克/平方公分、叠层的厚度为0.9毫米。以针轧的方式结合三个叠层单位的耐热纤维布与平织纤维布,制得复合纤维布层。
接着,依序将复合纤维布层、发泡中间层以及另一复合纤维布层堆叠形成叠层结构,并于230℃的温度、30kg/m2的压力进行热压合,以制得缓冲垫结构。
表1
另对实验例1至3与比较例1至3的缓冲垫结构,进行热压使用次数、缓冲率、复原率、升温速率、热压后基板平整性的特性测试,并将结果列于表2中。
热压使用次数的计算,是在190℃的温度、50kg/m2的压力的条件下热压,当缓冲率低于30%时停止计次。
关于缓冲率与复原率的测试方式,请参阅图4所示,先在缓冲垫结构上标记等间距的九个定位点(P1至P9),并测量九个定位点(P1至P9)的厚度,作为压合前厚度(A)。将铅块置于缓冲垫结构周围,但不与缓冲垫结构接触。在模拟压合过程中,将上加热板及下加热板的温度升高至190℃,以25kg/cm3的压力压合30分钟,再量测九个定位点(P1至P9)的厚度作为压合后厚度(C)。由于铅块的设置,上加热板会下压缓冲垫结构直至抵顶到铅块,因此,铅块的厚度即为缓冲垫结构的压合时厚度(B)。
在表2中,复原率与缓冲率的计算方式为:
复原率的计算公式=回复率/缓冲率;
回复率的计算公式=(压合后厚度(C)-压合时厚度(B))/压合后厚度(C);
缓冲率的计算公式=(压合前厚度(A)-压合时厚度(B))/压合前厚度(A)。
在测量升温速率的实验中,堆叠60张玻纤布(型号7628)当作模拟基板。将缓冲垫结构以及仿真基板置于上加热板及下加热板之间,上加热板与缓冲垫结构接触,下加热板与模拟基板接触。于缓冲垫结构与玻纤布之间设置第一料温线,于玻纤布与下加热板之间设置第二料温线,以测量模拟压合过程中,玻纤布的升温速率。接着,将上加热板的温度升高至190℃,下加热板的温度控制为30℃,以25kg/cm3的压力压合10分钟,纪录第一料温线与第二料温线显示的温度(T1、T2)。
升温速率的计算公式=(第一料温线显示的温度(T1)-第二料温线显示的温度(T2))/10分钟
关于热压后基板平整性的测试,是将上述实验例1至3以及比较例1至3的缓冲垫结构,覆于基板上进行热压。待基板冷却至室温后,将基板区分为九个区域,并测量每一区域中均分后九个定点的厚度。经计算平均后,可获得热压后基板平整性。
表2
由表1及表2的内容可得知,本发明的缓冲垫结构可承受的热压次数较高,并具有较高的缓冲率(大于34%)与复原率(大于95%)。当使用本发明的缓冲垫结构进行热压时,基板的升温速率较高(大于11.5℃/分钟),可避免热压时间的延长。经热压后,基板的表面可具有良好的平整性(大于90%),不会因热压制造过程而受影响,故特别适用于薄型基板。
根据实施例1与比较例1、2的内容,比较同样使用硅橡胶作为发泡材料时的情况。当复合纤维布层只具有耐热纤维布(比较例1)时,其缓冲率及复原率分别为18%与94%,且热压使用次数只有350次。为了提升热压使用次数,使用平织纤维布夹设耐热纤维布(比较例2)后,可使热压使用次数提升400次,缓冲率提升至20%,但整体缓冲垫结构的复原率却下降为92%。相比之下,实施例1中使用膨松纱纤维布夹设耐热纤维布,并搭配特定厚度的发泡中间层,可同时提升缓冲垫结构的热压使用次数、缓冲率及复原率。
[实施例的有益效果]
本发明的其中一有益效果在于,本发明所提供的缓冲垫结构,其能通过“缓冲垫结构具有发泡中间层”以及“复合纤维布层是由耐热纤维布及蓬松纱纤维布所制成”的技术方案,以提升缓冲垫结构的缓冲效果及热压使用次数。
更进一步来说,本发明的缓冲垫结构还包括两个表面补强层,表面补强层的设置,可提升缓冲垫结构的耐热效果,并可提升缓冲垫结构的平坦度。如此一来,在热压过程中,基板可以较快的速度达到热压温度,经热压后,基板也可具有较高的平坦性,此为以往热压缓冲垫无法达到的。
以上所公开的内容仅为本发明的优选可行实施例,并非因此局限本发明的权利要求书的保护范围,所以凡是运用本发明说明书及附图内容所做的等效技术变化,均包含于本发明的权利要求书的保护范围内。
Claims (10)
1.一种缓冲垫结构,其特征在于,所述缓冲垫结构包括:
一发泡中间层;以及
两个复合纤维布层,所述发泡中间层设置于两个所述复合纤维布层之间,每一所述复合纤维布层是由耐热纤维布及蓬松纱纤维布所制成,所述耐热纤维布通过针轧方式与所述蓬松纱纤维布结合;
其中,所述缓冲垫结构于190℃的温度下热压的缓冲率大于30%,所述缓冲垫结构于190℃的温度下热压的复原率大于95%。
2.根据权利要求1所述的缓冲垫结构,其特征在于,所述蓬松纱纤维布中的蓬松纱集中设置于所述耐热纤维布的多个节点上,所述蓬松纱纤维布是玻璃纤维蓬松纱纤维布。
3.根据权利要求1所述的缓冲垫结构,其特征在于,两层所述蓬松纱纤维布与一层所述耐热纤维布构成一个叠层单位,所述耐热纤维布设置于两层所述蓬松纱纤维布之间。
4.根据权利要求1所述的缓冲垫结构,其特征在于,所述复合纤维布层与所述发泡中间层的厚度比值为0.5至0.9。
5.根据权利要求1所述的缓冲垫结构,其特征在于,所述发泡中间层是以热压合的方式设置于所述复合纤维布层上。
6.根据权利要求1所述的缓冲垫结构,其特征在于,所述发泡中间层的发泡倍率为0.6至3.0。
7.根据权利要求1所述的缓冲垫结构,其特征在于,所述发泡中间层的材料是选自于由下列所构成的群组:硅橡胶、氟橡胶、聚偏二氟乙烯及聚醚醚酮。
8.根据权利要求1所述的缓冲垫结构,其特征在于,所述缓冲垫结构进一步包括:两个表面补强层,两个所述表面补强层分别设置于两个所述复合纤维布层上,使得所述发泡中间层与两个所述复合纤维布层设置于两个所述表面补强层之间。
9.根据权利要求8所述的缓冲垫结构,其特征在于,所述表面补强层的材料是选自于由下列所构成的群组:聚四氟乙烯、聚偏二氟乙烯、氟橡胶及聚醚醚酮。
10.根据权利要求8所述的缓冲垫结构,其特征在于,一部分的所述表面补强层会渗入所述复合纤维布层内。
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