CN117936408A - 裸片键合机以及裸片键合机的缓冲装置 - Google Patents
裸片键合机以及裸片键合机的缓冲装置 Download PDFInfo
- Publication number
- CN117936408A CN117936408A CN202310859945.8A CN202310859945A CN117936408A CN 117936408 A CN117936408 A CN 117936408A CN 202310859945 A CN202310859945 A CN 202310859945A CN 117936408 A CN117936408 A CN 117936408A
- Authority
- CN
- China
- Prior art keywords
- die
- transfer
- camera module
- transfer position
- bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012546 transfer Methods 0.000 claims abstract description 250
- 238000007689 inspection Methods 0.000 claims abstract description 84
- 230000004438 eyesight Effects 0.000 claims abstract description 36
- 230000002093 peripheral effect Effects 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 33
- 230000000149 penetrating effect Effects 0.000 claims description 13
- 235000012431 wafers Nutrition 0.000 description 61
- 238000000034 method Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 19
- 238000011179 visual inspection Methods 0.000 description 6
- 239000000470 constituent Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220138707A KR20240057908A (ko) | 2022-10-25 | 2022-10-25 | 다이 본더 |
| KR10-2022-0138707 | 2022-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117936408A true CN117936408A (zh) | 2024-04-26 |
Family
ID=90767337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310859945.8A Pending CN117936408A (zh) | 2022-10-25 | 2023-07-13 | 裸片键合机以及裸片键合机的缓冲装置 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20240057908A (ko) |
| CN (1) | CN117936408A (ko) |
| TW (1) | TW202418410A (ko) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170042955A (ko) | 2015-10-12 | 2017-04-20 | 세메스 주식회사 | 다이 본딩 장치 |
| KR102037950B1 (ko) | 2017-08-17 | 2019-10-29 | 세메스 주식회사 | 웨이퍼 공급 모듈 및 이를 포함하는 다이 본딩 장치 |
| KR102391432B1 (ko) | 2017-10-19 | 2022-04-27 | 세메스 주식회사 | 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치 |
-
2022
- 2022-10-25 KR KR1020220138707A patent/KR20240057908A/ko unknown
-
2023
- 2023-07-13 CN CN202310859945.8A patent/CN117936408A/zh active Pending
- 2023-07-27 TW TW112128166A patent/TW202418410A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202418410A (zh) | 2024-05-01 |
| KR20240057908A (ko) | 2024-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101838456B1 (ko) | 다이 본더, 본딩 방법 및 반도체 장치의 제조 방법 | |
| JP5989313B2 (ja) | ダイボンダ及びボンディング方法 | |
| JP5027210B2 (ja) | 電子構成要素、詳細には半導体チップを基板に配置するための方法および装置 | |
| KR101886923B1 (ko) | 다이본더 및 반도체 장치의 제조 방법 | |
| CN107180772B (zh) | 芯片贴装装置以及半导体器件的制造方法 | |
| JP4308772B2 (ja) | 部品供給ヘッド装置、部品供給装置、部品実装装置、及び実装ヘッド部の移動方法 | |
| US20120210554A1 (en) | Apparatus and method for picking up and mounting bare dies | |
| US9603294B2 (en) | Apparatus for mounting semiconductor chips | |
| KR20170042955A (ko) | 다이 본딩 장치 | |
| KR20200119971A (ko) | 반도체 본딩 장치 및 그 방법 | |
| CN117936408A (zh) | 裸片键合机以及裸片键合机的缓冲装置 | |
| JP7071839B2 (ja) | ボンディング装置 | |
| KR101278738B1 (ko) | 기판 상에 전자부품, 특히 반도체 칩을 실장하는 방법 및 장치 | |
| KR20170042957A (ko) | 반도체 다이들을 이송하기 위한 다이 셔틀 및 이를 포함하는 다이 본딩 장치 | |
| CN117912986A (zh) | 旋转裸片台装置以及包括其的裸片键合机 | |
| JP7139174B2 (ja) | 撮像装置、撮像方法、位置決め装置、及びダイボンダ | |
| JP5574193B2 (ja) | 載置方法及び装置 | |
| JPH09232407A (ja) | ワーク搬送装置およびそれを用いた半導体製造装置 | |
| KR101543843B1 (ko) | 다이 본딩 장치 | |
| KR102534527B1 (ko) | 렌즈 게이트 커팅 장치 | |
| JP7105954B1 (ja) | コレット検出装置、コレット位置補正装置、ボンディング装置、コレット検出方法、コレット位置補正方法 | |
| KR20190118360A (ko) | 듀얼 헤드 플립칩 본딩 방법 | |
| JP5479961B2 (ja) | 電子部品の実装装置及び実装方法 | |
| CN117995734A (zh) | 一种多功能芯片贴合设备 | |
| JP2013168566A (ja) | チップマウント方法およびチップマウント装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |