CN117916872A - 用于转移及准备组件的方法及装置 - Google Patents
用于转移及准备组件的方法及装置 Download PDFInfo
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- CN117916872A CN117916872A CN202180102269.9A CN202180102269A CN117916872A CN 117916872 A CN117916872 A CN 117916872A CN 202180102269 A CN202180102269 A CN 202180102269A CN 117916872 A CN117916872 A CN 117916872A
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Classifications
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Abstract
本发明涉及一种用于在载体基板(6)上准备组件(4、4’)的方法及装置以及一种用于将组件(4、4’)从载体基板(6)转移至产品基板(8)上的方法及装置。
Description
【技术领域】
本发明涉及一种用于转移组件的方法及装置以及一种用于准备组件的方法及装置。特别是,组件是电子组件,优选地是功能组件,诸如芯片或MEMS。在此范围内,本发明涉及一种用于转移或准备特别精确地对准、转移及处理的非常小组件的方法及装置。
本发明描述一种将多个组件(特别是,芯片)从第一基板(转移基板)转移至第二基板(产品基板)上的方法及装置。此外,本发明描述一种用于在转移基板上准备多个(特别是结构相同)组件的方法及装置。
【背景技术】
在现有技术中,特定电子组件由组件基板或在基板上产生。此过程通常在大气下发生。在大气中,组件表面连续曝露于反应性物质,诸如氧或氮。在转移及准备组件时,尤其重要的是组件的待接合的表面无污染物质。
在现有技术中,描述其中可处理或清洁组件表面上的氧化合物及/或氮化合物的装置及方法。在此,组件表面的处理及清洁部分在可在真空下工作的各一个装置中发生。然而,接着,将组件再次从此装置中移除且因此曝露于大气。随后,组件在另一装置中接合至产品基板上。沿此路径,组件表面可能再次受到污染。由于污染,缺陷组件的数目及处理花费增加。
【发明内容】
因此,本发明的任务是阐明一种用于转移及准备组件的方法及装置,该方法及装置至少部分地消除、特别是完全消除现有技术中提及的缺点。本发明的任务尤其是阐明一种用于转移及准备组件的改良方法及改良装置。特别是,本发明的任务是阐明一种用于转移及准备组件的方法及装置,其降低组件的排除率。此外,本发明的任务是阐明一种用于转移及准备组件的方法及装置,其可特别是可靠且无污染实施或工作。
当前任务利用并列权利要求的特征解决。在从属权利要求中说明本发明的有利发展。在说明书、权利要求及/或附图中说明的特征的至少两个的所有组合也落入本发明的范畴内。对于所说明的值范围,在所提及的极限内的值也应该作为极限值公开并且可以以任意组合要求保护。
因此,本发明涉及一种用于在载体基板上准备组件的方法,其至少具有以下步骤:
a1)准备组件基板,
a2)在该组件基板的第一表面上施加接合层,且接着
b)将该组件基板分割成组件,
c)将所述组件定位于载体基板上,
其中所述组件以具有接合层的第一组件表面固定于该载体基板上。
由于在将该组件基板分割成组件之前,将该接合层特别是整面施加于所准备组件基板的第一表面上,因此有利地确保污染最小化。因此,不需要在该载体基板上施加接合层以将所述组件接合或固定于该载体基板上。通过此方式,可有利地免除在该载体基板上施加接合层。由于在施加该接合层之后将该组件基板分割成组件,因此确保该载体基板仅在所述组件的区域中与该接合层的材料接触。此外,有利地确保定位于该载体基板上的所述组件之间不存在接合材料。
就此而言,总体上用于将所述组件固定于该载体基板上的该接合层的材料较少。另外,当对在该载体基板上准备的所述组件实施处理、特别是在整个区域上处理时,确保所述组件之间的间隙中未带走或处理接合层。因此,当移除该接合层时,也可减少该接合材料的污染。由于该方法优选地在真空环境中或真空下实施,因此减少污染,特别是由该接合材料引起的污染,是特别重要的。
此外,在步骤c)中优选借助取置方法的定位期间,可以确保在之前分割的组件上已提供该接合层。依此方式,该载体基板上的对准标记可有利地保持可见以将所述组件精确地定位于该载体基板上,因为对准标记未由接合层遮盖。因此,该载体基板总体上不太受污染。在步骤c)中的定位中,所有组件或仅分割组件的一部分可定位于该载体基板上。若并非所有由该组件基板分割的组件均定位于该载体基板上,则它们例如可以转移至另一载体基板上或在从载体基板转移或剥离之前定位的组件之后,可在后续方法步骤中定位或固定于相同载体基板上。
在用于在载体基板上准备组件的方法的优选实施方式中规定,在步骤a2)中,附加地在该组件基板的第二表面上施加保护层。该保护层在此可以在以该接合层涂布相对的基板侧之前、期间或同时施加于该组件基板上。在此,该保护层在所述组件被分割之前施加,使得组件有利地具有该接合层及该保护层。依此方式,可有利地确保将该污染,特别是该载体基板及该方法步骤中使用的其他组件的污染利用该保护层的材料最小化。尤其在后续从在该载体基板上准备的所述组件移除该保护层期间,有利地不移除该接合层,因为在所述组件之间的所述间隙中,没有接合层布置在该载体基板上且另外,施加于该第一组件表面上的该接合层由所述组件遮盖。
在用于在载体基板上准备组件的方法的优选实施方式中规定,除所述组件的外,在步骤c)中,至少一个支撑组件定位于该载体基板上。特别是,该支撑组件并非功能组件。相反地,该支撑组件同样定位于该载体基板上以防止该产品基板在后续接合过程中弯曲,特别是在边缘处弯曲。
在用于在载体基板上准备组件的方法的优选实施方式中规定,该至少一个支撑组件定位于该载体基板上的组件定位区域外部。该组件定位区域是之前分割的组件所定位的载体基板上的区域。该组件定位区域优选地居中布置于该载体基板或载体基板表面上。在此,所述支撑组件特别优选地定位于该载体基板表面的外边缘。
在用于在载体基板上准备组件的方法的优选实施方式中规定,通过在步骤b)中将该组件基板分割来产生该至少一个支撑组件。依此方式,该至少一个支撑组件可以有利地随着所述组件从该组件基板上产生或分割而成。因此,该至少一个支撑组件有利地同样具有之前施加的接合层。因此,该至少一个支撑组件可以同样特别少污染地定位且固定于该载体基板上。因此,可以特别简单及有效地准备该支撑组件。
在用于在载体基板上准备组件的方法的优选实施方式中规定,该至少一个支撑组件具有相同于所述组件的高度。依此方式,该至少一个支撑组件可在接合过程期间或在所述组件的转移期间特别有效地支撑该产品基板及该载体基板的外部区域。若通过在步骤b)中将所述组件基板分割来共同产生该支撑组件,则可特别有利地确保所述支撑组件的高度对应于所述组件的高度。特别是,该高度在此被理解为从具有该接合层的该第一组件表面至该载体基板的距离。该至少一个支撑组件在此尤其优选地同样具有该接合层。
在用于在载体基板上准备组件的方法的优选实施方式中规定,至少两个、优选地至少四个支撑组件均匀地交错定位于该组件定位区域外部。在此,所述支撑组件尤其优选地规则地交错布置于该载体基板的周边周围或该组件定位区域的边缘周围,使得所述支撑组件可有利地带来特别均匀的支撑效应。
在用于在载体基板上准备组件的方法的优选实施方式中规定,在将所述组件从该载体基板剥离之后,该至少一个支撑组件保留在该载体基板上。当所述组件剥离时,该支撑组件尤其优选地保持固定或接合于该载体基板上。在从该载体基板剥离期间,该定位区域中的所述组件从该载体基板释放,使得将所述组件转移至产品基板。归因于该至少一个支撑组件保留在该载体基板上,可有利地再使用该载体基板。
此外,本发明涉及一种用于将组件从载体基板转移至产品基板上的方法,其至少具有以下步骤,特别是以以下顺序:
i)特别是根据用于在载体基板上准备组件的方法,在载体基板上准备组件,其中所述组件分别具有第一组件表面及第二组件表面,且其中所述组件以该第一组件表面固定于该载体基板上,
ii)处理所述组件的第二组件表面,
iii)将所述组件的第二组件表面接合于该产品基板上,
其中步骤ii)及iii)在真空下实施,其特征在于,在步骤ii)与步骤iii)之间维持真空。
在用于转移组件的方法中,尤其优选地使用用于在载体基板上准备基板的方法在该载体基板上准备所述组件。接着,处理背向该载体基板的自由的第二组件表面。该组件表面的处理优选地包括组件表面的清洁,特别是清洁氧化层及其他污染材料。优选地通过使所有组件的组件表面与产品基板或与该产品基板的表面接触来引入以下接合过程。
由于有利地维持步骤ii)中的第二组件表面的处理及步骤iii)中的第二组件表面与产品基板的接合之间的真空,经处理的组件表面有利地无污染材料。因此,在接合之前,经处理的组件表面不与大气接触。相同情况尤其优选地适用于该载体基板。因此,所述组件的经处理的表面特别适合于接合于该产品基板上。在此,处理也可在于移除保护层,或包括移除保护层。依此方式,可特别容易地实施接合。另外,可降低组件的缺陷率或可减少该产品基板上的缺陷组件的数目。该真空在此低于1毫巴,还更优选地低于10-5毫巴,最优选地低于10-9毫巴,最大优选地高达10-12毫巴。
在用于将组件从载体基板转移至产品基板上的方法的优选实施方式中规定,用于将组件从载体基板转移至产品基板的方法在步骤iii)之后额外具有以下步骤:
iv)使所述组件与该载体基板剥离,
其中步骤iv)中的剥离优选地在真空下实施。
特别是,在剥离中,所述组件从该载体基板上释放或分离。剥离优选地也在真空环境中发生。尤其优选地,在步骤iii)中的接合与步骤iv)中的剥离之间也维持该真空。由于在真空中所述组件的后续剥离、特别是通过弱化施加于该第一组件表面与该载体基板之间的接合层的黏着特性,有利地进一步减少所述组件或所述组件表面的污染。
在用于将组件从载体基板转移至产品基板上的方法的优选实施方式中规定,在步骤iii)中的接合期间同时接合所有组件。通过维持处理与接合之间的真空,有利地可以将所有组件与该产品基板接合、优选地并行接合。因此,尤其有效且无误差实现将所述组件从该载体基板转移至该产品基板上。
在用于将组件从载体基板转移至产品基板上的方法的优选实施方式中规定,在步骤ii)中的处理之前,移除布置于该第二组件表面上的保护层。组合该真空中的处理及后续接合,可因此准备特别无污染的组件表面。另外,也可在处理所述第二组件表面的所述表面之前立即实施该保护层的移除。此外,该表面的处理也可在于移除该保护层。
此外,本发明涉及一种用于根据用于在载体基板上准备组件的方法在载体基板上准备组件的装置,其特征在于,该装置在真空下工作。尤其优选地,该装置完全在真空下工作,使得该载体基板及所述组件不与大气接触。在此,该装置优选地包括涂布模块及分割模块。
此外,本发明涉及一种用于将组件从载体基板转移至产品基板上的装置,其中该装置经设计使得可在真空下根据用于将组件从载体基板转移至产品基板上的方法将在该载体基板上准备的组件从该载体基板转移至该产品基板上。
尤其优选地,该装置经设计以在真空下实施所有工作步骤。在此,在该载体基板上准备的所述组件可在维持该真空的情况下转移至该产品基板上。
在用于将组件从载体基板转移至产品基板上的装置的优选实施方式中规定,该装置经设计使得具有所述组件的该载体基板可在维持该真空的情况下从表面处理模块单元转移至接合模块单元。依此方式,可确保减少所述组件的污染,特别是该第二及经处理的组件表面的污染。因此,使用该装置可实现明显改进的接合结果。
本发明的一个方面在于,将所述组件放入装置或模块系统中,将所述组件对准且接合于该载体基板上且进入该模块系统中才移除保护层以能够接着清洁该表面的例如氧化合物及/或氮化合物。接着,所述组件优选地还在该模块系统中与产品基板接合且从该载体基板移除(即,由剥离过程分离)。因此,该方法优选地涉及并行组件转移,其中多个组件同时转移。在此,所述组件优选地具有相同的尺寸,特别是相同高度。
在此,另一方面还在于,在模块系统中实施这些方法,其中清洁所述组件表面而不再次与污染大气接触,至少直至所述组件与该产品基板接触。
因此,特别是,所述组件表面在该模块系统内时才清洁,例如清洁氧化合物及/或氮化合物且还在该模块系统中接合于产品基板上。
在一个实施方式中,各个组件对准且高度精确地预固定于载体基板上以在稍后方法步骤中同时转移至产品基板上。在此,优选地首先通过取置系统以相对于该载体基板上的对准标记的高度精确方式固定所述组件。接着,进行产品基板与该载体基板的对准,该载体基板具有为此目的专门提供的其他对准标记。
在一个实施方式中,该组件与该产品基板之间的界面是光学透明及/或导电的。所述物理特性通过在将所述组件接合于该产品基板上之前的相应表面处理来保证。可对此实施其他方法步骤或使用其他模块单元。一般而言,所形成界面可被视为光学及/或机械及/或热及/或电理想。理想在此意味着,可达成的最佳可能光学及/或机械及/或热及/或电特性是通过表面处理,特别是通过移除有害的氧化物及/或氮化物来达成。
机械理想意味着,界面的机械特性,特别是接合强度实现组件与产品基板之间的尽可能有效接合。尤其针对亲水熔融接合(其优选地通过组件的氧化物表面及/或产品基板上的氧化物表面的接触而产生),组件与产品基板之间的接合强度借助在分离一平方米的单位面积所需的表面能量来特征化。接合强度尤其大于0.5J/m2,优选大于1.0J/m2,又更优选大于1.5J/m2,最佳大于2.5J/m2,最最佳大于2.5J/m2。
光学理想意味着,电磁辐射可以最佳可能方式通过界面,即,优选地不具有或只有很小强度损耗。透射率尤其大于10%,优选大于50%,优选大于75%,最佳大于95%,最最佳大于99%。
热理想意味着,热流可以最佳可能方式通过界面,即,优选地不具有或只有很小热量损耗。热量损耗尤其小于50%,优选小于25%,优选小于10%,最佳小于5%,最最佳小于1%。
电理想意味着,经由界面的导电率尽可能高。导电率应大于1S/m,优选大于10S/m,优选大于102S/m,最佳大于104S/m,最最佳大于106S/m。若组件的表面及/或产品基板的其上接合组件的区域是混合表面,则导电率的结论仅适用于电区域。
在一优选实施方式中,所述组件在分割之前涂布有接合层,使得在将所述组件接合于载体基板上之后,所述组件之间不存在可能不必要地污染该模块系统的模块的接合材料。
在另一实施方式中,组件位于该载体基板的边缘处,其任务在于防止该产品基板在接合于该组件定位区域中的所述组件上期间发生周边弯曲。特别是,对应载体基板可与用于压力吸收的组件一起已经预制造且引入模块系统中。在此特殊实施方式中,若用于压力吸收的所述组件永久连接至该载体基板,则特别有用。然而,在所述组件的另一实施方式中,用于压力吸收的所述组件也可由组件基板或在组件基板上产生,由该相同组件基板或从该相同组件基板产生实际上待转移以定位于该组件定位区域中的优选功能组件。在此情况中,可设想用于压力吸收的所述组件同样在将所述组件从该载体基板转移至该产品基板上期间转移。
组件
在本发明的范畴内,组件被理解为接合于基板上的特别是功能对象。所述组件优选地是芯片、MEMS、LED、微芯片或类似组件。在此,所述组件优选地由组件基板产生。也可设想所述组件在基板上产生。该组件本身具有组件对准标记或几何特征(如该组件上的角、线或结构)用作为组件对准标记。
用于压力吸收的组件
在本发明的范畴内,用于压力吸收的组件或支撑组件被理解为可在该载体基板上布置或准备的具有稳定机械功能的组件。与实际上待转移的组件相比,其对转移及接合过程尤其执行稳定任务。尤其优选地,其具有相同于待转移的组件的高度且可与所述组件一起产生。用于压力吸收的组件优选地定位且特别是接合于该载体基板的周边,特别是接合于该基板保持表面的中心点外部的区域中。支撑组件防止与预先固定于该载体基板上的组件接触的产品基板在其周边弯曲。由于待转移的组件通常不分布于该载体基板的整个表面上而仅固定于组件定位区域中,因此使用用于压力吸收的组件是尤其优选的。
组件基板
组件基板被理解为用于产生组件的基板。后续组件的功能区域优选地在晶圆级方法中产生。在此方法中,可执行多个方法步骤以能够保证后续组件的功能性。在此,特别是在方法结束时,分割该组件基板。该组件基板分割成所述组件且必要时分割成支撑组件例如借助锯、线、激光或类似辅具进行。
载体基板
载体基板被理解为所述组件相对于其对准且暂时接合的基板。载体基板尤其仅仅用于暂时容纳所述组件或所述支撑组件。该载体基板优选地具有沿该载体基板表面的多个对准标记,所述对准标记用于相对于该载体基板对准所述组件。因此,所述对准标记也可称为组件对准标记。此外,该载体基板具有对准标记以能够相对于该产品基板对准该载体基板。因此,这些其他对准标记也可称为基板对准标记。在一个实施方式中,该载体基板已具有用于压力吸收的一或多个组件或支撑组件。所述支撑组件优选地永久连接至该载体基板。该载体基板有利地可由任何材料制成。一旦实施用于准备组件的方法,还可有利地免除该载体基板上的接合层。
产品基板
该产品基板是将所述组件从该载体基板转移至其上的基板。该产品基板具有对准标记以能够相对于该载体基板对准。如在该载体基板中那样,所述对准标记可称为基板对准标记。
模块系统
模块系统(有时也称为真空装置或集群)被理解为若干相关联的模块或模块单元。真空可优选地产生或提供于所述模块中。所提出的模块系统的一个尤其优选特征是所述基板在不同方法步骤之间不曝露于大气且因此可能在真空下持续工作。一旦基板位于该模块系统内部,则其特别在最优真空环境下进一步处理或准备。在此,该模块系统的所有模块可优选地单独抽真空。尤其优选地,该模块系统具有用于引入所述基板或用于准备所述组件的至少一个锁。
为能够构成所述装置或实施所述方法,下文描述一些特殊模块,其优选是所述装置或该模块系统的部分。因此,特别是,所述模块依在方法中的使用顺序列出。
该模块系统中的基板或基板堆栈的运输优选地通过机器人进行,机器人位于该模块系统的中心或可沿轨道系统对应地移动。
涂布模块
若用于转移或准备的该模块系统或所述装置具有涂布模块,则可将该接合层及/或该保护层施加于该组件基板上。该涂布模块是可选的。例如也可设想该组件基板在该模块系统外部涂布有该接合层及/或该保护层且接着引入该模块系统中。当功能化组件基板的生产者在功能化之后立即用该保护层配备该组件基板时,这是尤其有利的。若涂布模块应该存在于该模块系统中,则可因此施加至少一个接合层。与该保护层相反,接合层在从该功能化组件基板从生产者至该模块系统的运输期间可能受到污染。
分割模块
若该模块系统具有分割模块,则该组件基板可在该模块系统中分割。也可设想分割同样在该模块系统外部进行且将已分割的组件输送至该模块系统中。尤其当使用用于准备组件的方法或使用用于准备组件的装置时(其中在分割之前在该组件基板上施加接合层),则该模块系统内部的分割模块是有利的。
取置模块
该取置模块具有将各个组件对准、定位及接合或固定于该载体基板上的任务。尤其在该组件基板在分割之前涂布有接合层的情况中,该取置模块可容易拾取、对准、放置及接合或固定所述组件。在此情况中有利地,在该载体基板上准备的组件之间不存在接合材料。
若该载体基板本身应该整面涂布有接合层,则所述组件直接接合于该载体基板上的该接合层上。在此情况中,所述组件之间不利地存在接合材料,其在随后通过的模块中引起非所要额外污染。
清洁模块
该清洁模块用于从所述组件移除该保护层。可设想该清洁模块位于该模块系统外部。在此情况中,所述组件将在无保护层的情况中输送至该模块系统中。然而,在尤其优选实施方式中,该清洁模块同样是该模块系统的部分。
表面处理模块
该表面处理模块或表面处理模块单元是用于转移组件的装置或模块系统的部分。因此,该表面处理模块是该模块系统的其中处理无该保护层的组件表面的部分。然而,也可设想清洁模块整合于该表面处理模块中。在此,所述组件表面的处理或处置尤其理解为移除干扰材料,特别是氧化合物及/或氮化合物。由于在移除氧化合物及/或氮化合物之后,所述第一组件表面仍更具活性且在与该产品基板接触之前不应再曝露于大气,因此该表面处理模块优选地是该模块系统的一部分。该表面处理模块例如可为等离子室或离子束室。优选地是离子束室,如公开案WO2015197112A1中那样。
也可设想所述组件表面的活化在该表面处理模块中进行。此外,可设想所述组件表面的亲水化在该表面处理模块中进行。另外,可设想在该表面处理模块中施加特殊层,其改良所述组件与该产品基板之间的接合。
接合模块
在该表面处理模块中已处理或处置所述组件表面之后,进行产品基板与经处理的组件表面的接合。为此,该产品基板相对于该载体基板对准且接合。在此,对准优选地通过位于该载体基板及该产品基板上的对准标记进行。因此,该接合模块优选地具有尤其优选地光学对准设施。此外,该接合模块具有用于使该产品基板与所述组件或面向该产品基板的组件表面接触的装置。
剥离模块
在该产品基板与所述组件接触之后,所述组件与该载体基板之间的连接优选地弱化或完全移除。这优选地在单独剥离模块或剥离模块单元中发生。也可设想将对应剥离装置整合于该接合模块中,使得该载体基板-组件-产品基板堆栈不必运输至另一模块中。
下文描述的方法具有重要方法步骤。在此,在示例性方法中描述用于转移及准备所述组件的方法的各个方法步骤。就此而言,所述示例性方法包括用于转移所述组件的方法及用于准备所述组件的方法的方面。本领域技术人员知道,多个其他、未明确提及的方法步骤当然可为该方法的部分。由于这些方法步骤对于理解示例性方法不重要且部分也无法预先明确确定,因此所述示例性方法仅借助以下方法步骤描述。
示例性方法
在示例性方法的第一方法步骤中,使用保护层涂布该第一组件基板表面且使用接合层涂布该第二组件基板表面。该接合层优选地允许在室温与约300℃之间接合。此外,该接合层应优选地不具有或仅具有很少放气。该接合层的厚度介于1nm与100μm之间,优选地介于1nm与50μm之间、还更优选地介于1nm与10μm之间,最优选地介于1nm与1μm之间,最最优选地介于1nm与100nm之间。该接合层具有将所述组件保持在原位直至所述组件以其与接合层相对的一侧接合于该产品基板上的重要任务。
在示例性方法的第二方法步骤中,将组件基板分割成各个组件。特别是,分割借助于锯及/或线及/或激光及/或粒子束,特别是离子束进行。用于准备组件的方法的一个重要方面是在将所述组件分割之前在该组件基板上施加该接合层。在现有技术中,该接合层通常施加于该载体基板上。在后续第五方法步骤(即,该清洁步骤)中,由此发生污染。
在示例性方法的第三方法步骤中,至少一个组件、优选地所有组件的对准及接合过程是相对于载体基板进行。所述组件相对于该载体基板的对准尤其相对于位于该载体基板上的对准标记进行。因此,实现所述组件相对于该载体基板的精确定位。优选地,借助于光学设施进行对准。接着,在该接合过程中,所述组件与该载体基板接触。
在示例性方法的第四方法步骤中,从所述第一组件表面移除所述保护层,使得所述第一组件表面裸露。此方法步骤尤其在单独清洁模块中进行。
在示例性方法的第五方法步骤中,清洁所述第一组件表面。特别是,清洁被理解为移除氧化合物及/或氮化合物。此清洁优选地在真空下(即,在真空装置中,特别是在单独模块中)进行。在此也可设想第四及第五方法步骤将在相同模块、尤其是也使用相同装置实施。然而,为此,该装置必须经设计使得其可移除该保护层及所述氧化合物及/或氮化合物。由于一方面该保护层及另一方面所述氧化合物及/或氮化合物通常由不同材料构成,因此优选地在不同模块中实施所述两个方法步骤。
在示例性方法的第六方法步骤中,将该产品基板接合于该载体基板的所述组件上。在此,该产品基板相对于该载体基板的对准借助于基板对准标记进行。
在示例性方法的第七方法步骤中,将该产品基板从该载体基板上升起。所述组件保留在该产品基板上,因为该第一组件表面与该产品基板表面之间的永久接合比该第二组件表面与该载体基板表面之间的临时接合更强。特别是,可通过剥离过程辅助所述组件从该载体基板分离。可设想热效应,以便特别是软化接合层,或尤其是激光的电磁辐射效应。
修改方法
通过对示例性方法的修改,产生该修改方法。该修改方法的不同之处在于:舍去根据该第二方法步骤在该组件基板上施加接合层。为此,在该载体基板上特别是整面施加接合层。此方法的缺点是裸露接合材料可污染方法的要通过的后续模块。由于接合材料通常是有机聚合物,因此不期望受到此有机聚合物的污染。尤其在清洁及移除所述氧化合物及/或所述氮化合物的模块中,可通过以下方法步骤移除所述接合组件之间的非常大比例的接合材料且可污染所述模块及因此所述组件。为完整起见,仅提及此修改方法且与示例性方法相比,此方法没那么优选。
【附图说明】
本发明的进一步优点、特征及细节从优选实施例的以下描述以及借助附图得出。示意性地:
图1a展示示例性方法的第一方法步骤,
图1b展示示例性方法的第二方法步骤,
图1c展示示例性方法的第三方法步骤,
图1d展示示例性方法的第四方法步骤,
图1e展示示例性方法的第五方法步骤,
图1f展示示例性方法的第六方法步骤,
图1g展示示例性方法的第七方法步骤,
图2展示示例性载体基板的俯视图,
图3展示示例性模块系统的俯视图,及
图4展示具有预先固定的支撑组件的载体基板。
【实施方式】
相同部分或具有相同功能的部分在图中由相同附图标记表示。这些部分既不按尺寸又不按比例表示。特别是,组件4及支撑组件4’表示为厚得多以改良表示。相对薄的对准标记5、5’、5”同样表示为较厚。所有图均是示意图。
示例性方法在模块系统(有时也称为集群,其可抽真空)中在真空下实施。模块系统优选地经设计使得所有模块彼此连接且可全部抽真空,使得载体基板6、产品基板8及组件4、4’也优选地不再与大气接触,直至方法完全完成。
在一个非常尤其优选实施方式中,示例性方法从第一方法步骤起已经在所提及的模块系统中实施。在此情况中,负责涂布及分割的模块必须能够尽可能好地与其他模块分离,使得尽可能避免或至少最小化其他模块的污染,因为组件基板1分割成组件4、4’尤其伴有大量粒子。
图1a展示示例性方法的第一方法步骤,其中充当随后产生的组件4的初始基板的组件基板1在两侧上涂布。组件基板1在此优选地已具有对准标记5,借助对准标记可正确定位随后产生的组件4。组件4在其尚未分割的状态优选地已功能化(即,具有所有必要特性)。例如可设想组件4是微芯片。在此情况中,所有电路均已在组件基板1中产生。若组件是MEMS,则已产生所有机械组件及/或电气组件。保护层2施加于组件基板表面1o上。接合层3施加于组件基板表面1u上。在此,接合层3的施加在方法步骤2中的分割之前(参阅图1b)进行。
图1b展示示例性方法的第二方法步骤,其中将组件基板1分割成各个组件4。组件4’可从产生组件4的基板组件1或具有对应必要物理(特别是机械)特性的任何其他基板(图中未展示)中产生。组件4’可在后续方法步骤中用作为支撑组件。组件4’同样可具有对准标记5。为将组件4’与实际功能组件4区分且因为其定位不必像组件4的定位那样精确,因此舍去在组件4’上的对准标记的表示。组件4’通常具有另一接合层3’,其优选地将组件4’永久连接至载体基板6(参阅图1c)。然而,也可设想接合层3,3’是相同。在此情况中,应具有优选支撑效用的组件4’可如组件4那样转移至后续产品基板8。然而,为了通用性,在下文中假定组件4’仍固定地连接至载体基板6。组件4’优选地具有相同于组件4的厚度,其中所有组件4、4’的高度尤其优选地相对于载体基板表面6o相同。
图1c展示示例性方法的第三方法步骤,其中载体基板6装备有各个组件4、4’。组件4优选地具有对准标记5。接着,组件4优选地使用对准标记5相对于位于载体基板6上的对准标记5’对准。对准标记5’尤其用于组件4的对准。替代地,组件4的几何特征(尤其是其角及边缘)可用于对准。在对准之后及/或对准期间,组件4、4’与载体基板6接触。附加地,对准标记5”位于载体基板6上,产品基板8在后续方法步骤中相对于对准标记5”对准。在此,组件4’可特别定位于载体基板6的边缘,所述组件4’在后续方法步骤中具有支撑效应。组件4’的定位同样可使用对准标记5(未展示)进行。然而,也可设想,在无对准过程的情况中,为载体基板6装备组件4’。组件4’优选地定位于载体基板6的至少两点、还更优选地至少三点、最优选地至少四点处以保证最优支撑效应。
图1d展示示例性方法的第四方法步骤,其中进行组件表面4o的清洁步骤。可通过任何方法将组件表面4o的保护层2清除。例如可设想湿式化学方法。若保护层2是固体层(特别是电介质,优选地氧化合物及/或氮化合物),则可由离子束或一般而言通过溅镀移除。由于在分割过程(参阅图1b)之前已在组件基板1上施加接合层3(参阅图1a)的尤其优选方面,因此产生尤其优选效应,载体基板表面6o在无组件4、4’定位的点上无接合材料。因此,模块系统9的模块(参阅图3)不会受到不必要污染。因此,在分割过程之前,组件基板1涂布有接合层3的特征表示一个重要方面。
图1e展示示例性方法的第五方法步骤及因此表面处理。表面处理可理解为移除氧化合物及/或氮化合物及/或表面活化及/或沉积用于使组件4与后续方法中可用的产品基板8接合的层。若保护层2是氧化合物及/或氮化合物,则此方法步骤尤其可与之前方法步骤同时实施。
由于示例性方法已在抽真空的模块系统中进行(参阅图3),因此在移除氧化合物及/或氮化合物之后,(第二)组件表面4o无法再次污染。氧化合物及/或氮化合物的移除可使用适合于此的任何方法或适合于此的任何装置进行。然而,尤其优选地,通过粒子束、特别是离子束来移除氧化合物及/或氮化合物。类似考虑适用于氮移除。
尤其在移除氧化合物及/或氮化合物期间及/或之后,可进行表面的活化。也可设想组件表面4o的有意亲水化以改良组件4与后续产品基板8之间的所谓的预接合。
也可设想故意沉积特殊有机及/或无机层以在组件4与产品基板8之间产生连接。特别是,组件4具有优选原生氧化物。在一个尤其优选实施方式中,组件4具有混合接合表面。混合接合表面是一种主要由氧化物组成的表面,金属区域、特别是铜构成的金属区域位于其中。金属区域表示与组件4的功能区域电接触的接触点。
尤其在组件4与产品基板8之间的直接接合的情况中,使用相应选择的材料,因此产生的界面可光学透明及/或导电。也可设想,电及介电区域位于组件表面4o及产品基板8上,所述电及介电区域分别彼此接合。电区域优选地是接触点,其在产品基板8与组件4之间产生导电连接。具有电及介电区域或表面的两个组件之间的这种接合称为混合接合。其详细结构及用途为本领域技术人员已知且此处不作详细解释。然而公开了,该方法特别适合产生混合接合且甚至为此而设计。
图1f展示示例性方法的第六方法步骤,其中产品基板8相对于载体基板6对准且接触。用于将产品基板8按压于组件4、4’及因此载体基板6上的力介于1N与100kN之间,优选地1N与10kN之间,还更优选地1N与1kN之间,最优选地1N与100N之间,最最优选地1N与10N之间。因此,优选地使用小的力以尽可能不损坏组件4、4’及/或产品基板8。
对准在此通过载体基板6及产品基板8的对准标记5”进行。在此,所提供的组件4’可在此接触过程中充当支撑组件。此方法步骤之后接着可选地又一方法步骤,其中增加组件表面4o与产品基板表面8o之间的黏着效应。例如,可设想在50℃以上、优选地75℃以上、还更优选地100℃以上、最优选地150℃以上进行热处理步骤。然而,优选地,直接接触应产生足够强的黏着性以在下一方法步骤中沿接合层3分离组件4。接着,优选地可免去温度处理,其将是不利的,因为接合层3的材料可能排气。
图1g展示示例性方法的第七方法步骤,其中将产品基板8与载体基板6分离。
在一个实施方式中,分离可纯机械地进行。在此使用以下事实:组件4相对于产品基板8的黏着效应大于组件相对于载体基板6的静摩擦。
替代地及优选地,可弱化组件4与载体基板6之间的接合层。此弱化可整面进行或针对每个组件4选择性地进行。
可设想通过对所有组件进行热处理(例如在熔炉中)对接合层3进行热作用。
替代地,可设想选择性热作用,特别是通过激光。在此,激光选择性地聚焦于接合层上且弱化接合层。所使用的激光的波长介于140nm与6000nm之间(即,包含具有UV至红外范围内的波长的激光)。精确使用的激光波长取决于用于接合层8的材料。
可设想使用电磁辐射,其通过以下方式弱化接合层3的黏着性:大分子的键被破坏。
替代地,可设想通过微波辐射降低接合层3的黏着性。
当移除产品基板8时,接合层3优选地且通常部分保留在组件4上且部分保留在载体基板6上且可在后续清洁步骤中移除。
在此方法步骤结束时,在产品基板8上获得多个组件4。
图2展示载体基板6的俯视图。例如,在载体基板6上存在充当支撑组件的四个组件4’。在根据图1e的方法步骤中,组件4’具有支撑效应。多个对准标记5’分布于载体基板6上。举例而言,已展示16个对准标记5’。第一对准标记5’由具有对准标记5的组件4遮盖。还有两个对准标记5”位于载体基板6上,这两个对准标记5”用于载体基板6相对于产品基板8的对准(未展示,参阅图1e)。为清晰起见,对准标记5(白色)、5’(黑色)及5”(灰色)不同着色,以便于清晰绘示。组件4仅仅定位且接合于组件定位区域12中。若现在在第六方法步骤(参阅图1f)中,将产品基板8接合于组件4上且组件4’不位于载体基板6上,则产品基板8可在施加过大压力的情况中周边朝着载体基板6的方向上按压且在最差情况中甚至折断。通过使用组件4’作为支撑组件,可防止此情况。因此,组件4’是一个重要方面。
图3展示由多个模块10、10’、10”、10”’、10””组成的示例性模块系统9的俯视图。模块的数目是任意的。示例性且不受限制,模块10、10’、10”、10”’及10””如下设计。模块10表示涂布模块,其中可施加接合层3及/或保护层2(参阅图1a)。模块10’表示分割模块,其中可分割组件基板1(参阅图1b)。模块10”表示对准及接合模块,其中各个组件4、4’可对准且定位于载体基板6上。因此,在此模块中,优选地存在一种取置装置。模块10”’表示清洁模块,其中保护层2可移除。模块10””表示对准及接合模块,其中基板、特别是装备有组件4、4’的载体基板6及产品基板8可彼此对准且彼此接合。在此,任务也可由一个模块完成,在该模块中应该存在所需装置。也可设想模块系统9具有其他模块。特别是,涂布及分割也可在模块系统9外部进行,使得仅已分割的组件4,4’引入模块系统9中。在此情况中,前述两个模块10,10’可省略。在此重要的是模块系统9、特别是各个模块彼此间允许组件4、4’及基板6、8的转移而不将它们曝露于大气。
因此,整个模块系统9可抽真空且与周围大气隔离。所有必要对象的装载及卸除优选地经由锁11进行,使得模块系统9的内部空间优选地尽可能长时间保持抽真空。
模块系统9或各个模块10、10’、10”、10”’、10””可抽真空至小于1巴、优选地小于1毫巴、还更优选地小于10-5毫巴、最优选地小于10-9毫巴,最最优选地高达10-12毫巴的压力。所述说明对应于盛行真空的所提出的值。
图4展示预制造载体基板6的侧视图,具有已经装备的组件4’,其在示例性方法中用于稳定及压力分布。这种预制造载体基板6可装载至模块系统9中且立即使用。尤其当根据示例性方法,组件4在其分割之前已涂布有接合层3时,预制造载体基板6可快速装备其他组件4。在将组件4转移至产品基板8上(参阅图1g)之后,载体基板6、特别是在清洁之后,可重新使用。
附图标记列表
1:组件基板
1o:(第二)上组件基板表面
1u:(第一)下组件基板表面
2:保护层
3:接合层
4,4’:组件,支撑组件
4o:组件表面
5,5’,5”:对准标记
6:载体基板
6o:载体基板表面
7:表面处理构件
8:产品基板
9:模块系统
10,10’,10”,10”’,10””:模块
11:锁
12:组件定位区域
Claims (15)
1.一种用于在载体基板(6)上准备组件(4、4’)的方法,其至少具有以下步骤:
a1)准备组件基板(1),
a2)在所述组件基板(1)的第一表面(1u)上施加接合层(3),且接着
b)将所述组件基板(1)分割成组件(4、4’),
c)将所述组件(4、4’)定位于载体基板(6)上,
其中所述组件(4、4’)以具有所述接合层(3)的第一组件表面固定于所述载体基板(6)上。
2.根据权利要求1所述的方法,其中在步骤a2)中,附加地将保护层(2)施加于所述组件基板(1)的第二表面(1o)上。
3.根据前述权利要求中至少一项所述的方法,其中在步骤c)中,除所述组件(4、4’)之外,至少一个支撑组件(4’)定位于所述载体基板(6)上。
4.根据前述权利要求中至少一项所述的方法,其中所述至少一个支撑组件(4’)定位于所述载体基板(6)上的组件定位区域(12)外部。
5.根据前述权利要求中至少一项所述的方法,其中所述至少一个支撑组件(4’)通过在步骤b)中分割所述组件基板(1)来产生。
6.根据前述权利要求中至少一项所述的方法,其中所述至少一个支撑组件(4’)具有相同于所述组件(4)的高度。
7.根据前述权利要求中至少一项所述的方法,其中至少两个、优选地至少四个支撑组件(4’)均匀地错开地定位于所述组件定位区域(12)外部。
8.根据前述权利要求中至少一项所述的方法,其中在将所述组件(4、4’)从所述载体基板(6)剥离之后,所述至少一个支撑组件(4’)保留在所述载体基板(6)上。
9.一种用于将组件(4、4’)从载体基板(6)转移至产品基板(8)上的方法,其至少具有依以下顺序的以下步骤:
i)特别是根据前述权利要求1-8的方法,在载体基板(6)上准备组件(4、4’),其中所述组件(4,4’)分别具有第一组件表面及第二组件表面(4o),且其中所述组件(4、4’)以所述第一组件表面固定于所述载体基板(6)上,
ii)处理所述组件(4、4’)的所述第二组件表面(4o),
iii)将所述组件(4、4’)的所述第二组件表面(4o)接合于产品基板(8)上,
其中所述步骤ii)及iii)在真空下实施,其特征在于,在步骤ii)与步骤iii)之间维持所述真空。
10.根据权利要求9所述的方法,其中所述方法在步骤iii)之后附加地具有以下步骤:
iv)将所述组件(4、4’)与所述载体基板(6)剥离,
其中步骤iv)中的剥离在真空下实施。
11.根据前述权利要求9或10中至少一项所述的方法,其中在步骤iii)中的接合中同时接合所有组件(4、4’)。
12.根据前述权利要求9至11中至少一项所述的方法,其中在步骤ii)中的所述处理之前,实施布置于所述第二组件表面(4o)上的保护层(2)的移除。
13.一种用于在载体基板(6)上准备组件(4、4’)的装置(9),其经设计用于执行根据权利要求1至8中至少一项所述的方法,其特征在于,所述装置(9)在真空下工作。
14.一种用于将组件(4、4’)从载体基板(6)转移至产品基板(8)上的装置(9),其中所述装置(9)经设计使得能够在真空下根据权利要9至12中至少一项所述的方法将在所述载体基板(6)上准备的所述组件(4、4’)从所述载体基板(6)转移至产品基板(8)上。
15.根据权利要求14所述的装置(9),其中所述装置(9)经设计使得所述载体基板(6)能够在维持所述真空的情况下从表面处理模块单元转移至接合模块单元。
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