CN117912814A - Patch type electronic component and preparation method thereof - Google Patents
Patch type electronic component and preparation method thereof Download PDFInfo
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- CN117912814A CN117912814A CN202311849850.4A CN202311849850A CN117912814A CN 117912814 A CN117912814 A CN 117912814A CN 202311849850 A CN202311849850 A CN 202311849850A CN 117912814 A CN117912814 A CN 117912814A
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- 238000002360 preparation method Methods 0.000 title claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 238000010310 metallurgical process Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000003466 welding Methods 0.000 description 12
- 238000005476 soldering Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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Abstract
The invention discloses a patch type electronic component, which comprises a body, electrodes and a lead groove, wherein the body is provided with a plurality of lead grooves; an electrode is arranged on the body, a lead groove is arranged on the side wall of the electrode, and the lead groove is used for fixing a lead; the lead slots have a top opening and a bottom opening, the top opening being smaller than the bottom opening. The beneficial effects of the invention are as follows: the lead groove of the patch type electronic component can be adjusted as required, so that the lead can be fixed on the electrode, and the degree of freedom of the lead is limited.
Description
Technical Field
The invention relates to the field of electronic components, in particular to a patch type electronic component and a preparation method thereof.
Background
Patch electronic components are a common surface mount technology (Surface Mount Technology, SMT) assembly for electronic devices on circuit boards. The patch electronic component includes the following: chip resistor (Surface Mount Resistor): the chip resistor is used for limiting current flow, stabilizing voltage and regulating a circuit. They are typically made of ceramic or metallic film materials. Chip capacitor (Surface Mount Capacitor): the patch capacitor is used to store charge and provide a stable capacitance in the circuit. They are typically composed of ceramic or aluminum electrolytes. Patch diode (Surface Mount Diode): the patch diode is used to control the direction of the current. They help to perform functions such as rectification, switching, and protection circuits. Patch transistor (Surface Mount Transistor): a patch transistor is a semiconductor device for amplifying and switching an electrical signal. They are widely used in various electronic devices. Patch integrated circuit (Surface Mount Integrated Circuit): a patch integrated circuit is a highly integrated circuit that integrates a plurality of electronic components (such as transistors, capacitors, and resistors) onto one chip. They may implement complex functions such as microprocessors and memories.
With the continuous development of electronic components, in many fields of electronic component application, when some patch electronic components are connected to a PCB, the connection mode and design of the internal conductor leads and the electrode surface directly affect the difficulty of the product and the quality of the product, so it is needed to provide a lead groove on the electrode surface.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a patch type electronic component, wherein a lead groove of the patch type electronic component can be adjusted according to requirements, so that a lead can be fixed on an electrode, and the freedom degree of the lead is limited.
The technical scheme adopted for solving the technical problems is as follows: a patch type electronic component comprises a body, an electrode and a lead groove; an electrode is arranged on the body, a lead groove is arranged on the side wall of the electrode, and the lead groove is used for fixing a lead; the lead slots have a top opening and a bottom opening, the top opening being smaller than the bottom opening.
In the above structure, the lead groove includes a first region and a second region; the first region comprises a first lead and a second lead, and the first lead and the second lead extend from the top of the side surface of the electrode to the bottom edge of the side surface of the electrode; the second region includes a third lead connected to the first lead and having a third line extending toward a side or bottom edge of the electrode sidewall, and a fourth lead connected to the second lead and having a fourth line extending toward the side or bottom edge of the electrode sidewall.
In the above structure, the thickness of the lead groove is D, the thickness of the lead is D, D is 1.05×d is less than or equal to 1.20×d.
In the above structure, the second region is larger than the first region.
In the above structure, the included angle between the first side line and the third side line is A, and 90 degrees is less than A and less than 180 degrees, and the angle corresponding to the connection position of the electrode side wall side line and the first side line and the third side line is the included angle between the first side line and the third side line.
In the above structure, the included angle between the second side line and the fourth side line is B, and 90 degrees is less than 180 degrees, and the angle corresponding to the connection position of the electrode side wall side line and the second side line and the fourth side line is the included angle between the second side line and the fourth side line.
In the above structure, the first side line and the second side line have the same length.
A preparation method of a patch type electronic component comprises the following steps:
Step S10: forming an unwrapped magnetic core and an electrode surface through a metallurgical process, and carrying out finish machining on an electrode lead groove;
Step S20: winding on the magnetic core;
step S30: assembling a housing on the electrode face;
Step S40: and (5) pouring copper water for cooling and electroplating to form the electronic component.
The beneficial effects of the invention are as follows: the lead groove of the patch type electronic component can be adjusted as required, so that the lead can be fixed on the electrode, and the degree of freedom of the lead is limited.
Drawings
Fig. 1 is a schematic structural diagram of a patch-type electronic component according to the present invention.
Fig. 2 is a schematic structural diagram of a patch-type electronic component according to the present invention.
Fig. 3 is a schematic structural diagram of a patch-type electronic component according to the present invention.
Fig. 4 is a schematic structural diagram of a patch-type electronic component according to the present invention.
Fig. 5 is a schematic structural diagram of a patch-type electronic component according to the present invention.
Fig. 6 is a schematic structural diagram of a patch-type electronic component according to the present invention.
Fig. 7 to 10 are schematic diagrams illustrating a method for manufacturing a patch-type electronic component according to the present invention.
Detailed Description
The invention will be further described with reference to the drawings and examples.
The conception, specific structure, and technical effects produced by the present invention will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present invention. It is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present invention based on the embodiments of the present invention. In addition, all the coupling/connection relationships referred to in the patent are not direct connection of the single-finger members, but rather, it means that a better coupling structure can be formed by adding or subtracting coupling aids depending on the specific implementation. The technical features in the invention can be interactively combined on the premise of no contradiction and conflict.
Example 1
Referring to fig. 1 to 3, the present invention discloses a patch type electronic component, specifically, the electronic component includes a main body 10 and an electrode 20, the electrode 20 is attached to the main body 10, the electrode 20 is hexahedral, the electrode 20 has a top surface, a bottom surface and four side surfaces, the bottom surface of the electrode 20 is attached to the main body 10, and a lead groove 30 is provided on the side surface of the electrode 20, and the lead groove 30 is used for fixing a lead, so that the lead can be more stable when being mounted in the lead groove 30, and no falling off occurs.
Referring to fig. 4, fig. 4 is a front view of a side of the electrode 20, and the lead groove 30 includes a first region 305 and a second region 306. Specifically, the first region 305 of the lead groove 30 includes a first edge 301 and a second edge 302, the second region 306 includes a third edge 303 and a fourth edge 304, the first edge 301 and the second edge 302 are located at opposite positions, and the third edge 303 and the fourth edge 304 are located at opposite positions. The first edge 301, the second edge 302, and the top edge 201 on the side of the electrode 20 form a first region 305, and the third edge 303, the fourth edge 304, and the bottom edge 202 on the side of the electrode 20 form a second region 306.
As can be seen from the front view of fig. 4: the first side line 301 is parallel to the second side line 302, the first side line 301, the second side line 302, the third side line 303 and the fourth side line 304 are located on the side surface of the electrode 20, the first side line 301 and the second side line 302 are equal in length, the third side line 303 and the fourth side line 304 are equal in length, the first side line 301 and the second side line 302 extend from the top side line 201 of the electrode 20 toward the bottom side line 202 of the electrode 20, the third side line 303 is connected with the first side line 301 and the third side line 303 extends toward the bottom side line 202 of the electrode 20, and finally the third side line 303 is connected with the bottom side line 202 of the electrode 20; the second edge line 302 is connected to the fourth edge line 304 and the fourth edge line 304 also extends towards the bottom edge line 202 of the electrode 20, eventually the fourth edge line 304 is connected to the bottom edge line 202 of the electrode 20. The included angle formed between the first side line 301 and the third side line 303 is 160 °, the included angle formed between the second side line 302 and the fourth side line 304 is 160 °, the included angle formed between the first side line 301 and the third side line 303 is the angle between the first side line 301 and the third side line 303, which are opposite to the side wall of the electrode 20, the included angle between the second side line 302 and the fourth side line 304 is the angle between the second side line 302 and the fourth side line 304, which are opposite to the side wall of the electrode 20, the included angle formed between the first side line 301 and the third side line 303 and the included angle formed between the second side line 302 and the fourth side line 304 are in the range of 90 ° to 180 °, and the finally formed lead groove 30 is in the shape of a bell mouth, and the top opening of the lead groove 30 is smaller than the bottom opening. The top opening of the lead groove 30, which is an opening between the first side line 301 and the second side line 302 on the top side line 201 of the side surface of the electrode 30, is smaller than the bottom opening for mounting the lead into the lead groove 30, and the bottom opening of the lead groove 30, which is an opening between the second side line 302 and the fourth side line 304, is connected to the bottom side line 202 of the side surface of the electrode 30.
The thickness of the lead groove 30 may be modified according to the size of the lead, and specifically, referring to fig. 6, D in fig. 6 is the thickness of the lead groove 30, and the thickness of the lead groove 30 is between 105% and 120% of the thickness of the lead, and the thickness of the lead is defined as D, i.e. 1.05×d is less than or equal to 1.20×d.
The arrangement of the lead grooves 30 has the following advantages: ① And (3) guiding welding: the wire guiding groove can provide a positioning and welding guiding function. When the chip element is soldered to the circuit board, a soldering worker can accurately position the element according to the position and shape of the lead groove and adhere solder to the inside of the lead groove, thereby ensuring the accuracy and stability of soldering. ② Optimizing welding strength: the contact area of the welding spot can be increased through the lead groove, and the welding strength and reliability are improved. By adding a proper amount of solder in the lead groove, the surface area of the soldering area can be increased, thereby improving the mechanical strength of the soldering point and the reliability of electrical connection. ③ Stress is reduced: the patch element is subjected to temperature variations and mechanical stresses during operation, which may lead to solder joint breaks or component detachment. The lead grooves can relieve stress concentration to a certain extent, and reduce stress concentration at welding points, so that the reliability and the stress resistance of the element are improved. ④ The automatic production efficiency is improved: the presence of the lead slots can facilitate automated equipment identification and positioning of the patch elements. In the automatic chip mounting apparatus, the optical or mechanical sensor can accurately place the component at a predetermined position by detecting the position and shape of the lead groove, improving the production efficiency and consistency.
Example two
Referring to fig. 1 to 3, the present invention discloses a patch type electronic component, specifically, the electronic component includes a main body 10 and an electrode 20, the electrode 20 is attached to the main body 10, the electrode 20 is hexahedral, the electrode 20 has a top surface, a bottom surface and four side surfaces, the bottom surface of the electrode 20 is attached to the main body 10, and a lead groove 30 is provided on the side surface of the electrode 20, and the lead groove 30 is used for fixing a lead, so that the lead can be more stable when being mounted in the lead groove 30, and no falling off occurs.
Referring to fig. 5, fig. 5 is a front view of a side surface of the electrode 20, and the lead groove 30 includes a first region 305 and a second region 306. Specifically, the first region 305 of the lead groove 30 includes a first edge 301 and a second edge 302, the second region 306 includes a third edge 303 and a fourth edge 304, the first edge 301 and the second edge 302 are located at opposite positions, and the third edge 303 and the fourth edge 304 are located at opposite positions. The first edge 301, the second edge 302 and the top edge 201 of the side of the electrode 20 form a first region 305, and the third edge 303, the fourth edge 304, the bottom edge 202 of the side of the electrode 20 and the side edge 203 of the side of the electrode 20 form a second region 306.
As can be seen from the front view of fig. 5: the first side line 301 is parallel to the second side line 302, the first side line 301, the second side line 302, the third side line 303 and the fourth side line 304 are located on the side surface of the electrode 20, the first side line 301 and the second side line 302 are equal in length, the third side line 303 and the fourth side line 304 are equal in length, the first side line 301 and the second side line 302 extend from the top side line 201 of the electrode 20 toward the bottom side line 202 of the electrode 20, the third side line 303 is connected with the first side line 301 and the third side line 303 extends toward the side line 203 of the electrode 20, and finally the third side line 303 is connected with the side line 203 of the electrode 20; the second edge line 302 is connected to the fourth edge line 304 and the fourth edge line 304 also extends towards the side edge line 203 of the electrode 20, eventually the fourth edge line 304 is connected to the side edge line 203 of the electrode 20. The included angle formed between the first side line 301 and the third side line 303 is 120 °, the included angle formed between the second side line 302 and the fourth side line 304 is 120 °, the included angle formed between the first side line 301 and the third side line 303 is the angle between the first side line 301 and the third side line 303 which are opposite to the side wall of the electrode 20, the included angle between the second side line 302 and the fourth side line 304 is the angle between the second side line 302 and the fourth side line 304 which are opposite to the side wall of the electrode 20, the included angle formed between the first side line 301 and the third side line 303 and the included angle formed between the second side line 302 and the fourth side line 304 is in the range of 90 ° to 180 °, the finally formed lead groove 30 is in the shape of a horn mouth, the top opening of the lead groove 30 is smaller than the bottom opening, namely the opening formed between the first side line 301 and the second side line 302 on the side surface of the electrode 30, and the top opening is used for installing the lead into the lead groove 30; the bottom opening of the lead groove 30 is the opening between the second side line 302 and the fourth side line 304 on the bottom side line 202 of the side surface of the electrode 30.
The thickness of the lead groove 30 may be modified according to the size of the lead, and specifically, referring to fig. 6, D in fig. 6 is the thickness of the lead groove 30, and the thickness of the lead groove 30 is between 105% and 120% of the thickness of the lead, and the thickness of the lead is defined as D, i.e. 1.05×d is less than or equal to 1.20×d.
The arrangement of the lead grooves 30 has the following advantages: ① And (3) guiding welding: the wire guiding groove can provide a positioning and welding guiding function. When the chip element is soldered to the circuit board, a soldering worker can accurately position the element according to the position and shape of the lead groove and adhere solder to the inside of the lead groove, thereby ensuring the accuracy and stability of soldering. ② Optimizing welding strength: the contact area of the welding spot can be increased through the lead groove, and the welding strength and reliability are improved. By adding a proper amount of solder in the lead groove, the surface area of the soldering area can be increased, thereby improving the mechanical strength of the soldering point and the reliability of electrical connection. ③ Stress is reduced: the patch element is subjected to temperature variations and mechanical stresses during operation, which may lead to solder joint breaks or component detachment. The lead grooves can relieve stress concentration to a certain extent, and reduce stress concentration at welding points, so that the reliability and the stress resistance of the element are improved. ④ The automatic production efficiency is improved: the presence of the lead slots can facilitate automated equipment identification and positioning of the patch elements. In the automatic chip mounting apparatus, the optical or mechanical sensor can accurately place the component at a predetermined position by detecting the position and shape of the lead groove, improving the production efficiency and consistency.
Referring to fig. 7 to 10, the present invention further provides a method for manufacturing a patch-type electronic component, specifically, the method includes the following steps:
Step S10: forming an unwrapped magnetic core and an electrode surface through a metallurgical process, and carrying out finish machining on an electrode lead groove;
Step S20: winding on the magnetic core;
step S30: assembling a housing on the electrode face;
Step S40: and (5) pouring copper water for cooling and electroplating to form the electronic component.
While the preferred embodiment of the present application has been described in detail, the present application is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present application, and the equivalent modifications or substitutions are included in the scope of the present application as defined in the appended claims.
Claims (9)
1. A patch type electronic component is characterized by comprising a body, electrodes and a lead groove; an electrode is arranged on the body, a lead groove is arranged on the side wall of the electrode, and the lead groove is used for fixing a lead;
The lead slots have a top opening and a bottom opening, the top opening being smaller than the bottom opening.
2. The patch-type electronic component of claim 1, wherein the lead groove comprises a first region and a second region;
The first region comprises a first lead and a second lead, and the first lead and the second lead extend from the top of the side surface of the electrode to the bottom edge of the side surface of the electrode;
The second region includes a third lead connected to the first lead and having a third line extending toward a side or bottom edge of the electrode sidewall, and a fourth lead connected to the second lead and having a fourth line extending toward the side or bottom edge of the electrode sidewall.
3. The patch-type electronic component of claim 1, wherein the thickness of the lead groove is D, the thickness of the lead is D, and D is 1.05 x D is less than or equal to 1.20 x D.
4. A patch-type electronic component as claimed in claim 2, wherein the second region is larger than the first region.
5. The patch-type electronic component according to claim 2, wherein an included angle between the first side line and the third side line is a, and 90 ° < a < 180 °, and an angle corresponding to a junction between the electrode side wall side line and the first side line and the third side line is an included angle between the first side line and the third side line.
6. The patch-type electronic component according to claim 2, wherein an included angle between the second side line and the fourth side line is B, and 90 ° < B < 180 °, and an angle corresponding to a junction between the electrode side wall side line and the second side line and the fourth side line is an included angle between the second side line and the fourth side line.
7. A patch-type electronic component as claimed in claim 2, wherein the first and second side lines are of equal length.
8. A patch-type electronic component as claimed in claim 2, wherein the third and fourth edge lines are of equal length.
9. The preparation method of the patch type electronic component is characterized by comprising the following steps of:
Step S10: forming an unwrapped magnetic core and an electrode surface through a metallurgical process, and carrying out finish machining on an electrode lead groove;
Step S20: winding on the magnetic core;
step S30: assembling a housing on the electrode face;
Step S40: and (5) pouring copper water for cooling and electroplating to form the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311849850.4A CN117912814A (en) | 2023-12-28 | 2023-12-28 | Patch type electronic component and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311849850.4A CN117912814A (en) | 2023-12-28 | 2023-12-28 | Patch type electronic component and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117912814A true CN117912814A (en) | 2024-04-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311849850.4A Pending CN117912814A (en) | 2023-12-28 | 2023-12-28 | Patch type electronic component and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117912814A (en) |
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2023
- 2023-12-28 CN CN202311849850.4A patent/CN117912814A/en active Pending
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