CN117884366A - Chip position deviation detection device and sorting machine - Google Patents
Chip position deviation detection device and sorting machine Download PDFInfo
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- CN117884366A CN117884366A CN202410091225.6A CN202410091225A CN117884366A CN 117884366 A CN117884366 A CN 117884366A CN 202410091225 A CN202410091225 A CN 202410091225A CN 117884366 A CN117884366 A CN 117884366A
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- 230000007246 mechanism Effects 0.000 claims abstract description 83
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- 230000003287 optical effect Effects 0.000 claims abstract description 18
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 10
- 238000009434 installation Methods 0.000 description 7
- 238000005299 abrasion Methods 0.000 description 4
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Abstract
The invention relates to a chip position deviation detection device and a sorting machine. The chip position deviation detection device comprises a first detection mechanism, a second detection mechanism, a transfer mechanism and a reflection mechanism; the first detection mechanism comprises a first photoelectric sensor, and the first photoelectric sensor comprises a first transmitting end and a first receiving end; the second detection mechanism comprises a second photoelectric sensor, and the second photoelectric sensor comprises a second transmitting end and a second receiving end; the transfer mechanism conveys the material shuttle carrying the chip to be tested to the detection station, so that the chip to be tested is positioned on the optical path of the first transmitting end and the optical path of the second transmitting end; the first transmitting end transmits a first light beam to the first receiving end; the second transmitting end transmits a second light beam to the reflector, and the second light beam is reflected by the reflector and then irradiates to the second receiving end; if the first receiving end and the second receiving end can both receive the light beam, the position of the chip to be detected is stable. The invention can accurately detect whether the position of the chip is stable or not, and the service life of the detection mechanism is prolonged.
Description
Technical Field
The invention relates to a translational sorting machine in chip testing equipment, in particular to a chip position deviation detection device and a sorting machine.
Background
The chip testing industry often adopts a translational sorting machine to test the quality of chips in normal temperature, high temperature and low temperature environments. During testing, chips in the tray are sucked by the feeding manipulator and placed in the blank of the movable shuttle; then, detecting whether the chip in the blank of the material shuttle is horizontally placed and does not tilt back and forth, left and right, if yes, moving the material shuttle to a position to be detected; then, the mechanical arm in the pressure measuring area absorbs the chips in the material shuttle and then moves to the pressure measuring area, and the chips are pressed down for testing; after the test is finished, the chip is placed in the movable material shuttle by the manipulator in the pressure measuring area, the chip in the material shuttle is sucked by the feeding manipulator and then placed in the tray marked as the tested, and a test flow is finished.
The movable shuttle as the chip carrying mechanism is required to accurately detect whether the chip is stably placed in place in the space thereof. If the deflected chip in the shuttle space is not detected, the chip will be crushed when the next action, i.e. the chip is sucked from the shuttle by the load robot.
In the prior art, a method for detecting the position deviation of a chip adopts a group of photoelectric sensors comprising a transmitting end and a receiving end for detection. The emitting end and the receiving end of the photoelectric sensor are respectively arranged at two sides of the chip to be tested of the material shuttle along a horizontal direction, and if the light beam emitted from the emitting end does not pass through the surface of the chip to reach the receiving end, the chip is not placed stably in the horizontal direction. The disadvantages of this approach are: it is only possible to detect whether the chip is shifted in one horizontal direction, and it is impossible to detect whether the chip is shifted in the other horizontal direction, so that it is impossible to ensure whether the chip is stable.
The other existing chip position deviation detection method is that a group of photoelectric sensors is added on the basis of the method, a second group of photoelectric sensors are arranged along a second horizontal direction, and the emitting ends and the receiving ends of the second group of photoelectric sensors are fixedly arranged on the bottom plate of the material shuttle. The second group of photosensors detects whether the chip is offset in a second horizontal direction. Although the method can solve the defects of the first method, the receiving end of the second group of photoelectric sensors is fixed on the moving material shuttle, namely, the receiving end moves along with the material shuttle, so that the influence is that: the movement of one fabric shuttle causes the reduction of detection reliability and precision due to the vibration of a receiving end sensor, and the misjudgment rate is 1/1300 times of movement, so that misjudgment is generated; on the other hand, the frequent photoelectric sensor receiving end is connected with the cable along with the movement of the material shuttle, so that the cable is frequently bent, the service life of the cable is reduced to 23% of the fixed service life, the cable has to be replaced after being damaged, and the use cost is increased.
Disclosure of Invention
Aiming at the problems of poor reliability and low precision of the existing chip position deviation detection method, the invention provides a chip position deviation detection device and a sorting machine with high reliability and high precision.
In a first aspect, the present invention provides a chip position deviation detecting device, including a first detecting mechanism, a second detecting mechanism, a transfer mechanism and a reflecting mechanism; wherein:
The first detection mechanism comprises a first photoelectric sensor, the first photoelectric sensor comprises a first transmitting end and a first receiving end, the first transmitting end and the first receiving end are oppositely arranged at intervals along a first horizontal direction, and a detection station is formed between the first transmitting end and the first receiving end;
The second detection mechanism comprises a second photoelectric sensor, the second photoelectric sensor comprises a second transmitting end and a second receiving end, the second transmitting end is arranged on a first side of the detection station along a second horizontal direction, the second receiving end is arranged on a third side or a fourth side of the detection station along the first horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction;
the transfer mechanism comprises a bottom plate, wherein the bottom plate is used for bearing a material shuttle, and the material shuttle is used for bearing a chip to be tested;
the reflecting mechanism comprises a reflecting mirror, the reflecting mirror is arranged on the bottom plate, and the reflecting mirror is arranged on a second side of the material shuttle, which is far away from the second transmitting end, along a second horizontal direction;
The transfer mechanism is configured to transport the material shuttle carrying the chip to be tested to the detection station, so that the chip to be tested is positioned on the optical path of the first transmitting end and the optical path of the second transmitting end; the first transmitting end is configured to transmit a first light beam to the first receiving end; the second transmitting end is configured to transmit a second light beam to the reflector, and the second light beam is reflected by the reflector and irradiates towards the second receiving end; if the first receiving end and the second receiving end can both receive the light beam, the position of the chip to be detected is stable.
By configuring two detection mechanisms, the positions of the chips in the material shuttle are detected from two horizontal directions which are perpendicular to each other, and whether the positions of the chips are stable or not can be accurately detected; the optical path of one of the detection mechanisms is changed by configuring the reflection mechanism, so that the reflection end and the receiving end of the two detection mechanisms can be fixedly installed, the positions of the two detection mechanisms are fixed, and the two fixed detection mechanisms bring more stable and reliable optical signal detection; in addition, the connecting cables of the two detection mechanisms do not need to move along with the material shuttle, so that the abrasion of the cables can be avoided, and the service life of the detection mechanisms is prolonged.
Optionally, the first detection mechanism further includes a first transmitting end fixing bracket and a first receiving end fixing bracket, the first transmitting end is mounted on the first transmitting end fixing bracket, and the first receiving end is mounted on the first receiving end fixing bracket.
The first transmitting end and the first receiving end are respectively arranged on the fixed support, so that the position can be conveniently adjusted, and the installation is convenient.
Optionally, the second receiving end is mounted on the first transmitting end fixing bracket or the first receiving end fixing bracket.
The second receiving end is arranged on the first transmitting end fixing support or the first receiving end fixing support, and the shared support can be utilized, so that the equipment cost is reduced.
Optionally, the second detection mechanism further includes a second transmitting end fixing bracket, and the second transmitting end is mounted on the second transmitting end fixing bracket.
The second transmitting end is arranged on the second transmitting end fixing support, so that the position of the second transmitting end can be conveniently adjusted, and the installation is convenient.
Optionally, the reflecting mechanism further includes a mirror fixing bracket, the mirror is mounted on the mirror fixing bracket, and the mirror fixing bracket is mounted on the base plate.
The reflector is fixed by the reflector fixing support, so that the position of the reflector can be conveniently adjusted, and the installation is convenient.
Optionally, the reflecting mechanism further comprises an angle adjusting component, and the angle adjusting component is used for adjusting the reflecting angle of the reflecting mirror.
By configuring the angle adjusting component, the reflecting angle of the reflecting mirror can be finely adjusted, so that the light beam reflected by the reflecting mirror can accurately enter the second receiving end.
Optionally, the angle adjusting assembly includes a mirror support and a rotation shaft, the mirror is mounted on the mirror support through the rotation shaft, and the mirror support is mounted on the mirror fixing bracket.
The angle adjusting component adopts a manual rotating reflecting mirror to adjust, and has simple structure, convenient adjustment and low cost.
Optionally, the material shuttle includes two rows of spaces arranged along the second horizontal direction for accommodating the chip to be tested, and at least two columns of spaces arranged along the first horizontal direction for accommodating the chip to be tested;
The first detection mechanism comprises at least two groups of first photoelectric sensors, the second detection mechanism comprises two groups of second photoelectric sensors, and the reflection mechanism comprises two reflectors;
when the material shuttle is positioned at the detection station, the chip to be detected is respectively positioned on the optical path of the first transmitting end and the optical path of the second transmitting end.
By providing at least two groups of first photoelectric sensors, two groups of second photoelectric sensors and two reflectors, the detection of two rows and multiple columns of chips can be completed at the same time, and the detection efficiency is greatly improved.
Optionally, the first detection mechanism further includes a first transmitting end fixing bracket and a first receiving end fixing bracket, each first transmitting end and one second receiving end are all installed on the first transmitting end fixing bracket, and each first receiving end and the other second receiving end are all installed on the first receiving end fixing bracket;
The second detection mechanism further comprises a second transmitting end fixing bracket, and two second transmitting ends are arranged on the second transmitting end fixing bracket;
the reflecting mechanism further comprises a reflecting mirror fixing support, and the two reflecting mirrors are symmetrically arranged on the reflecting mirror fixing support.
The plurality of transmitting ends, the receiving ends and the reflecting mirror are all installed by adopting the bracket, so that the respective positions can be conveniently adjusted, and the installation is convenient.
In a second aspect, the present invention provides a sorter comprising a chip position deviation detecting device as in the first aspect.
The chip position deviation detection device can accurately detect whether the position of the chip is stable or not, can detect optical signals stably and reliably, and can avoid abrasion of the connecting cable, so that the sorting machine is high in reliability, high in precision and long in service life.
Drawings
FIG. 1 is a schematic diagram of an alternative embodiment of a chip position offset detection apparatus according to the present invention;
FIG. 2 is a schematic view of the transfer mechanism of FIG. 1 when not entering the inspection station;
FIG. 3 is a schematic diagram illustrating the pass of the position deviation detection of a chip to be detected in the present invention;
fig. 4, fig. 5, and fig. 6 are schematic diagrams illustrating three working states of the angle adjusting assembly according to the present invention.
Fig. 1 to 6 include:
A chip position deviation detecting device 1;
the device comprises a first detection mechanism 10, a first transmitting end 11, a first receiving end 12, a first transmitting end fixing bracket 13, a first receiving end fixing bracket 14 and a first light beam 15;
The second detection mechanism 20, a second transmitting end 21, a second receiving end 22, a second transmitting end fixing bracket 23 and a second light beam 25;
a transfer mechanism 30 and a bottom plate 31;
The reflecting mechanism 40, the reflecting mirror 41, the reflecting mirror fixing bracket 42, the angle adjusting component 43, the reflecting mirror support 431 and the rotating shaft 432;
A detection station 50, a first side 51, a second side 52, a third side 53, a fourth side 54;
A shuttle 60;
A chip 70 to be tested;
A first horizontal direction 101, a second horizontal direction 102.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
The invention discloses a sorting machine which is used for testing the quality of chips in normal temperature, high temperature and low temperature environments. The sorting machine includes a chip position deviation detecting device 1 as shown in fig. 1 and 2.
The chip position deviation detecting apparatus 1 shown in fig. 1 and 2 includes a first detecting means 10, a second detecting means 20, a transfer means 30, and a reflecting means 40.
Wherein: the first detection mechanism 10 comprises a first photoelectric sensor, the first photoelectric sensor comprises a first transmitting end 11 and a first receiving end 12, the first transmitting end 11 and the first receiving end 12 are oppositely arranged at intervals along a first horizontal direction 101, and a detection station 50 is formed between the first transmitting end 11 and the first receiving end 12;
The second detection mechanism 20 comprises a second photoelectric sensor, the second photoelectric sensor comprises a second transmitting end 21 and a second receiving end 22, the second transmitting end 21 is arranged on the first side 51 of the detection station 50 along a second horizontal direction 102, the second receiving end 22 is arranged on the third side 53 or the fourth side 54 of the detection station 50 along a first horizontal direction 101, and the second horizontal direction 102 is perpendicular to the first horizontal direction 101;
The transfer mechanism 30 comprises a bottom plate 31, the bottom plate 31 is used for bearing a material shuttle 60, and the material shuttle 60 is used for bearing a chip 70 to be tested;
The reflecting mechanism 40 comprises a reflecting mirror 41, the reflecting mirror 41 is mounted on the bottom plate 31, and the reflecting mirror 41 is arranged on a second side 52 of the material shuttle 60 away from the second transmitting end 21 along a second horizontal direction 102;
The transfer mechanism 30 is configured to transport the material shuttle 60 carrying the chip 70 to be tested to the detection station 50, so that the chip 70 to be tested is located on the optical path of the first transmitting end 11 and the optical path of the second transmitting end 21; the first transmitting end 11 is configured to transmit a first light beam 15 to the first receiving end 12; the second transmitting end 21 is configured to transmit a second light beam 25 to the mirror, and the second light beam 25 is reflected by the mirror and then irradiates the second receiving end 22; if the first receiving end 12 and the second receiving end 22 can both receive the light beam, the position of the chip 70 to be tested is stable. The chip 70 to be tested that is qualified in inspection is shown in fig. 3, that is, the first light beam 15 and the second light beam 25 can both pass through the chip surface normally.
By configuring two detection mechanisms to detect the position of the chip in the material shuttle 60 from two horizontal directions perpendicular to each other, whether the position of the chip is stable or not can be accurately detected; the reflection end and the receiving end of the two detection mechanisms can be fixedly installed by changing the light path of one detection mechanism through configuring the reflection mechanism 40, the positions of the two detection mechanisms are fixed, and the two detection mechanisms which are fixed bring more stable and reliable light signal detection; in addition, the connecting cables of the two detection mechanisms do not need to move along with the material shuttle 60, so that the abrasion of the cables can be avoided, and the service life of the detection mechanisms is prolonged.
In one embodiment, the first detection mechanism 10 optionally further includes a first transmitting end fixing bracket 13 and a first receiving end fixing bracket 14, the first transmitting end 11 is mounted on the first transmitting end fixing bracket 13, and the first receiving end 12 is mounted on the first receiving end fixing bracket 14.
The first transmitting end 11 and the first receiving end 12 are respectively arranged on the fixed support, so that the position can be conveniently adjusted, and the installation is convenient.
Optionally, the second receiving end 22 is mounted on the first transmitting end fixing bracket 13 or the first receiving end fixing bracket 14.
The second receiving end 22 is mounted on the first transmitting end fixing bracket 13 or the first receiving end fixing bracket 14, so that the sharing bracket can be utilized to reduce the equipment cost.
In one embodiment, the second detection mechanism 20 optionally further includes a second emitter end mounting bracket 23, and the second emitter end 21 is mounted on the second emitter end mounting bracket 23.
The second transmitting end 21 is mounted on the second transmitting end fixing bracket 23, so that the position of the second transmitting end 21 can be conveniently adjusted, and the mounting is convenient.
In one embodiment, the reflector mechanism 40 optionally further includes a reflector mounting bracket 42, the reflector 41 being mounted on the reflector mounting bracket 42, the reflector mounting bracket 42 being mounted on the base plate 31.
The reflector 41 is fixed by the reflector fixing support 42, so that the position of the reflector 41 can be conveniently adjusted, and the installation is convenient.
In one embodiment, the reflection mechanism 40 optionally further includes an angle adjustment assembly 43, and the angle adjustment assembly 43 is used to adjust the reflection angle of the mirror 41.
By configuring the angle adjusting component 43, the reflection angle of the reflecting mirror 41 can be finely adjusted, so that the light beam reflected by the reflecting mirror 41 can accurately enter the second receiving end 22.
As shown in fig. 4, 5 and 6, the angle adjusting assembly 43 optionally includes a mirror support 431 and a rotation shaft 432, the mirror 41 is mounted on the mirror support 431 through the rotation shaft 432, and the mirror support 431 is mounted on the mirror fixing bracket 42. Alternatively, the reflecting mirror 41 employs a total reflection mirror triangular prism.
The angle adjusting component 43 adopts the manual rotation of the reflecting mirror 41 for adjustment, and has simple structure, convenient adjustment and low cost.
Referring again to fig. 1 and 2, in one embodiment, the shuttle 60 optionally includes two rows of spaces for receiving the chip 70 under test arranged along the second horizontal direction 102, and at least two columns of spaces for receiving the chip 70 under test arranged along the first horizontal direction 101; two rows and four columns are shown;
The first detection mechanism 10 includes at least two sets of first photosensors, the second detection mechanism 20 includes two sets of second photosensors, and the reflection mechanism 40 includes two reflection mirrors 41;
when the material shuttle 60 is located at the detecting station 50, the chip 70 to be detected is located on the optical path of the first transmitting end 11 and the optical path of the second transmitting end 21 respectively.
By providing at least two sets of first photosensors, two sets of second photosensors and two mirrors 41, the detection of two rows and columns of chips can be completed simultaneously, greatly improving the detection efficiency.
In this embodiment, optionally, the first detecting mechanism 10 further includes a first transmitting end fixing bracket 13 and a first receiving end fixing bracket 14, where each of the first transmitting end 11 and one of the second receiving ends 22 is mounted on the first transmitting end fixing bracket 13, and each of the first receiving end 12 and the other of the second receiving ends 22 is mounted on the first receiving end fixing bracket 14;
the second detection mechanism 20 further comprises a second transmitting end fixing bracket 23, and two second transmitting ends 21 are arranged on the second transmitting end fixing bracket 23;
the reflecting mechanism 40 further includes a mirror fixing bracket 42, and the two mirrors 41 are symmetrically mounted on the mirror fixing bracket 42.
The plurality of transmitting ends, the receiving ends and the reflecting mirror 41 are all installed by adopting brackets, so that the respective positions can be conveniently adjusted, and the installation is convenient.
The first photoelectric sensor and the second photoelectric sensor in the invention adopt any structure in the prior art.
The sorting machine of the invention can accurately detect whether the position of the chip is stable or not, can stably and reliably detect the optical signal, and can avoid the chip position deviation detection device 1 of the abrasion of the connecting wire, so that the sorting machine has high reliability, high precision and long service life.
The invention has been described above in sufficient detail with a certain degree of particularity. It will be appreciated by those of ordinary skill in the art that the descriptions of the embodiments are merely exemplary and that all changes that come within the true spirit and scope of the invention are desired to be protected. The scope of the invention is indicated by the appended claims rather than by the foregoing description of the embodiments.
Claims (10)
1. The chip position deviation detection device is characterized by comprising a first detection mechanism, a second detection mechanism, a transfer mechanism and a reflection mechanism; wherein:
The first detection mechanism comprises a first photoelectric sensor, the first photoelectric sensor comprises a first transmitting end and a first receiving end, the first transmitting end and the first receiving end are oppositely arranged at intervals along a first horizontal direction, and a detection station is formed between the first transmitting end and the first receiving end;
The second detection mechanism comprises a second photoelectric sensor, the second photoelectric sensor comprises a second emitting end and a second receiving end, the second emitting end is arranged on a first side of the detection station along a second horizontal direction, the second receiving end is arranged on a third side or a fourth side of the detection station along the first horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction;
the transfer mechanism comprises a bottom plate, wherein the bottom plate is used for bearing a material shuttle, and the material shuttle is used for bearing a chip to be tested;
The reflecting mechanism comprises a reflecting mirror, the reflecting mirror is mounted on the bottom plate, and the reflecting mirror is arranged on a second side, away from the second emitting end, of the material shuttle along the second horizontal direction;
The transfer mechanism is configured to transport the material shuttle carrying the chip to be tested to the detection station, so that the chip to be tested is located on the optical path of the first transmitting end and the optical path of the second transmitting end; the first transmitting end is configured to transmit a first light beam to the first receiving end; the second transmitting end is configured to transmit a second light beam to the reflector, and the second light beam irradiates the second receiving end after being reflected by the reflector; if the first receiving end and the second receiving end can both receive the light beam, the position of the chip to be detected is stable.
2. The chip position deviation detecting apparatus of claim 1, wherein the first detecting mechanism further comprises a first transmitting end fixing bracket and a first receiving end fixing bracket, the first transmitting end being mounted on the first transmitting end fixing bracket, the first receiving end being mounted on the first receiving end fixing bracket.
3. The chip position deviation detecting apparatus according to claim 2, wherein the second receiving end is mounted on the first transmitting end fixing bracket or the first receiving end fixing bracket.
4. The chip position deviation detecting apparatus according to claim 1, wherein the second detecting mechanism further comprises a second transmitting end fixing bracket, the second transmitting end being mounted on the second transmitting end fixing bracket.
5. The chip position deviation detecting apparatus according to claim 1, wherein the reflecting mechanism further comprises a mirror fixing bracket on which the mirror is mounted, the mirror fixing bracket being mounted on the base plate.
6. The chip position deviation detecting apparatus of claim 5, wherein the reflecting mechanism further comprises an angle adjusting assembly for adjusting the reflecting angle of the reflecting mirror.
7. The chip position deviation detecting apparatus according to claim 6, wherein the angle adjusting assembly includes a mirror support and a rotation shaft, the mirror is mounted on the mirror support through the rotation shaft, and the mirror support is mounted on the mirror fixing bracket.
8. The chip positional deviation detecting apparatus according to claim 1, wherein the material shuttle includes two rows of spaces for accommodating the chip to be measured arranged along the second horizontal direction, and at least two columns of the spaces for accommodating the chip to be measured arranged along the first horizontal direction;
The first detection mechanism comprises at least two groups of first photoelectric sensors, the second detection mechanism comprises two groups of second photoelectric sensors, and the reflection mechanism comprises two reflection mirrors;
when the material shuttle is positioned at the detection station, the chip to be detected is respectively positioned on the optical path of the first transmitting end and the optical path of the second transmitting end.
9. The chip position deviation detecting apparatus according to claim 8, wherein the first detecting mechanism further comprises a first transmitting-end fixing bracket and a first receiving-end fixing bracket, each of the first transmitting end and one of the second receiving ends being mounted on the first transmitting-end fixing bracket, each of the first receiving end and the other of the second receiving ends being mounted on the first receiving-end fixing bracket;
the second detection mechanism further comprises a second transmitting end fixing bracket, and the two second transmitting ends are arranged on the second transmitting end fixing bracket;
The reflecting mechanism further comprises a reflecting mirror fixing support, and the two reflecting mirrors are symmetrically arranged on the reflecting mirror fixing support.
10. A sorter comprising the chip position deviation detecting apparatus according to claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410091225.6A CN117884366A (en) | 2024-01-22 | 2024-01-22 | Chip position deviation detection device and sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410091225.6A CN117884366A (en) | 2024-01-22 | 2024-01-22 | Chip position deviation detection device and sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117884366A true CN117884366A (en) | 2024-04-16 |
Family
ID=90650944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410091225.6A Pending CN117884366A (en) | 2024-01-22 | 2024-01-22 | Chip position deviation detection device and sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117884366A (en) |
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2024
- 2024-01-22 CN CN202410091225.6A patent/CN117884366A/en active Pending
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