CN216209633U - Electronic component detection device - Google Patents

Abstract

The utility model relates to the technical field of product detection, in particular to an electronic component detection device. The electronic component detection device comprises a material shuttle assembly, an emission assembly and a photosensitive assembly, wherein the material shuttle assembly is provided with a trough for placing the electronic component, the material shuttle assembly is provided with a first direction and a second direction, and the emission assembly can emit light rays towards the trough along the first direction and the second direction so as to detect the placing state of the electronic component; wherein the first direction and the second direction are positioned on the same horizontal plane, an included angle A exists between the first direction and the second direction, and A is more than 0 degree and less than 180 degrees; when the light is shielded by the electronic component, the photosensitive assembly cannot receive the signal; when light is not sheltered from by electronic components, photosensitive assembly can the received signal. The utility model has the advantages that: simple structure, detect accurate and detect more comprehensively.

Description

Electronic component detection device

Technical Field

The utility model relates to the technical field of product detection, in particular to an electronic component detection device.

Background

After the electronic components are produced, the electronic components need to be electrified with a testing machine through a sorting machine to be tested so as to judge whether the electronic components are good products. The most important link of the sorting machine is pressure measurement, and electronic components are conveyed to a test area through a material shuttle. Due to the fact that the required precision of the test is high, the electronic components need to be placed in order in the material shuttle, and the phenomenon of tilting is not allowed to occur.

The electronic component detection device is used for detecting whether the electronic components are horizontally placed in the material shuttle or not; however, the existing electronic component detection device can only detect the levelness of the electronic component along a certain direction, and when the electronic component is turned over towards other directions, the detection device cannot detect the levelness, so that the detection is not comprehensive enough, and the subsequent operation is adversely affected.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is desirable to provide an electronic component detecting apparatus with a simple structure, accurate detection and more comprehensive detection.

In order to solve the technical problem, the application provides the following technical scheme:

an electronic component detection device comprises a material shuttle assembly, an emission assembly and a photosensitive assembly, wherein the material shuttle assembly is provided with a material groove for placing an electronic component, the material shuttle assembly is provided with a first direction and a second direction, and the emission assembly can emit light rays towards the material groove along the first direction and the second direction so as to detect the placing state of the electronic component;

the first direction and the second direction are positioned on the same horizontal plane, an included angle A exists between the first direction and the second direction, and the included angle A is more than 0 degree and less than 180 degrees;

when the light is shielded by the electronic component, the photosensitive assembly cannot receive signals;

when the light is not shielded by the electronic component, the photosensitive assembly can receive signals.

In the application, light rays are emitted towards the material tank along a first direction and a second direction through the emission assembly, and the first direction and the second direction are positioned on the same horizontal plane and have an included angle; therefore, the placing state of the electronic components in the trough can be detected more comprehensively and accurately, and the situations of material stacking and material tilting of the electronic components are avoided.

In one embodiment, the electronic component detection device further comprises a reflection assembly, the reflection assembly is arranged on the material shuttle assembly, and light rays emitted by the emission assembly can be turned to the photosensitive assembly through the reflection assembly.

So set up, through setting up the reflection subassembly, can utilize the reflection principle of light, make the light of emission subassembly transmission can make the angle of light change through the reflection subassembly reflection to make the sensitization subassembly receive light signal, be convenient for detect electronic components's the state of placing.

In one embodiment, the first direction is a moving direction of the shuttle assembly, and the light emitted by the emitting assembly along the first direction can be turned to the second direction by the reflecting assembly; or, the light emitted by the emitting component along the second direction can be turned to the first direction by the reflecting component.

Due to the arrangement, as the first direction is the movement direction of the material shuttle assembly, if the photosensitive assembly is arranged on the material shuttle assembly, on one hand, when the distance between the material shuttle assembly and the emission assembly is too far or the length of the material shuttle assembly is too long, the probability that light emitted by the emission assembly is bent is high due to the influence of the operating environment, so that the photosensitive assembly cannot accurately receive the light; on the other hand, because the material shuttle assembly has high-temperature and other areas, the service life of the photosensitive assembly is reduced when the photosensitive assembly is placed in the areas; the arrangement of the reflection assembly enables the light emitted by the emission assembly to be turned to the photosensitive assembly through the reflection assembly, so that the detection is more accurate; meanwhile, the photosensitive assembly does not need to be arranged on the material shuttle assembly, so that the service life of the photosensitive assembly is prolonged, and the photosensitive assembly can be used on a machine table at high temperature, normal temperature and low temperature; and, the cost is greatly reduced.

In one embodiment, the emitting assembly comprises a first emitting unit, and the photosensitive assembly comprises a first photosensitive unit; the first emitting unit is positioned at one end of the material shuttle assembly along the length direction, and the first photosensitive unit is positioned at one side of the material shuttle assembly along the width direction; the material shuttle assembly is provided with the reflection assembly at one end far away from the first emission unit, and light emitted by the first emission unit can pass through the material groove to the reflection assembly and is turned to the first photosensitive unit through the reflection assembly.

So set up, silo to reflection subassembly can be passed to the light of first emission unit transmission, and the reflection subassembly can be convenient for detect electronic components's the state of placement with light turn to first sensitization unit.

In one embodiment, the first emitting unit is collinear with and disposed opposite the reflecting component.

By the arrangement, the light emitted by the first emitting unit can be transmitted to the reflecting assembly and then is turned to the first photosensitive unit through the reflecting assembly.

In one embodiment, the emitting assembly comprises a first emitting unit, and the photosensitive assembly comprises a first photosensitive unit; the first emitting unit and the first photosensitive unit are positioned on the same side of the material shuttle component along the width direction at intervals, and the two ends of the material shuttle component along the length direction are provided with the reflecting components; the light emitted by the first emitting unit can be turned by the reflecting assembly at one end of the material shuttle assembly and passes through the material groove to the reflecting assembly at the other end of the material shuttle assembly so as to turn the light to the first photosensitive unit.

The arrangement is that the first emitting unit is communicated with the first photosensitive unit through the reflection of the secondary light; the light that first emission unit transmitted can transmit the reflection assembly to material shuttle subassembly one end, and this reflection assembly can turn light to pass the reflection assembly of silo to the material shuttle subassembly other end, turn light again, make first sensitization unit can receive light signal, be convenient for detect electronic components's the state of placing.

In one embodiment, the reflecting assemblies at the two ends of the shuttle assembly are arranged in a line and oppositely.

So set up, make the reflection assembly of material shuttle subassembly one end can be with the reflection assembly of light turn to the material shuttle subassembly other end.

In one embodiment, the shuttle assembly comprises a mounting seat, a sliding groove is formed in the side wall of the mounting seat, and a part of the reflection assembly can extend into the sliding groove and move along the length direction of the sliding groove; the electronic component detection device further comprises a first fastener, wherein the first fastener can penetrate through the sliding groove and connect the reflection assembly with the mounting seat.

So set up, can adjust the position of reflection subassembly on the material shuttle subassembly, through the position of adjusting reflection subassembly, realize the intercommunication of emission subassembly and sensitization subassembly.

In one embodiment, the reflection assembly comprises an adjusting block and a prism, the adjusting block is connected with the mounting seat, and a first connecting part is arranged on one side surface of the adjusting block and can extend into the sliding groove; the prism is rotationally connected with the adjusting block.

So set up, the prism rotates the refraction angle that can adjust the light path, realizes the intercommunication of emission subassembly and sensitization subassembly light path.

In one embodiment, a connecting hole and a positioning hole are formed in the side surface of the adjusting block, which is adjacent to the side surface where the first connecting part is located, the prism is provided with a second connecting part, and the second connecting part extends into the positioning hole and can rotate in the positioning hole to drive the prism to rotate; the electronic component detection device further comprises a second fastener, wherein the second fastener can penetrate through the connecting hole to connect the prism with the adjusting block.

So set up, the second connecting portion of prism stretches into the locating hole to the locating hole is the centre of a circle, rotates the regulation, and after the angle modulation, through the second fastener with prism locking, thereby the realization is to the location of light path refraction angle.

Compared with the prior art, the electronic component detection device provided by the application emits light to the material groove along the first direction and the second direction through the emission assembly, the first direction and the second direction are located on the same horizontal plane, and an included angle exists; therefore, the placing state of the electronic components in the trough can be detected more comprehensively and accurately, and the situations of material stacking and material tilting of the electronic components are avoided.

Drawings

Fig. 1 is a schematic structural diagram of an electronic component detection apparatus provided in the present invention.

Fig. 2 is a schematic view of a part of the structure of the shuttle assembly moving to the launching assembly provided by the utility model.

Fig. 3 is a schematic structural diagram of the mounting base and the reflection assembly provided by the present invention.

Fig. 4 is a schematic structural view of the adjusting block and the prism assembly provided by the present invention.

Fig. 5 is a schematic structural diagram of a prism provided by the present invention.

In the figure, 100, an electronic component detection apparatus; 10. a material shuttle assembly; 11. a material shuttle; 111. a trough; 12. a mounting seat; 121. a chute; 20. a transmitting assembly; 21. a first transmitting unit; 22. a second transmitting unit; 30. a photosensitive assembly; 31. a first photosensitive unit; 32. a second photosensitive unit; 40. a sensor; 50. a base plate; 51. a support; 52. a transmission assembly; 60. a reflective component; 61. an adjusting block; 611. a first connection portion; 612. a first mounting hole; 613. connecting holes; 614. positioning holes; 62. a prism; 621. a second connecting portion; 622. a second mounting hole; 70. and (7) mounting the plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It will be understood that when an element is referred to as being "mounted on" another element, it can be directly mounted on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, the present application provides an electronic component detecting apparatus 100, which is used for detecting a placement state of an electronic component (not shown), so as to ensure that the electronic component is placed horizontally in a material shuttle 11, and a phenomenon of tilting or material stacking does not occur.

After the electronic components are produced, the electronic components need to be electrified with a testing machine through a sorting machine to be tested so as to judge whether the electronic components are good products. The most important link of the sorting machine is pressure measurement, and electronic components are conveyed to a test area through a material shuttle. Because the required precision of the test is higher, the electronic components need to be ensured to be placed horizontally in the material shuttle, and the phenomenon of tilting or material stacking is not allowed to occur.

Referring to fig. 2, the electronic component detecting apparatus 100 provided in the present application includes a material shuttle assembly 10, an emitting assembly 20 and a photosensitive assembly 30, the material shuttle assembly 10 has a trough 111 for placing the electronic component, the material shuttle assembly 10 has a first direction and a second direction, and the emitting assembly 20 can emit light toward the trough 111 along the first direction and the second direction to detect a placing state of the electronic component.

Wherein the first direction and the second direction are positioned on the same horizontal plane, an included angle A exists between the first direction and the second direction, and A is more than 0 degree and less than 180 degrees; when the light is shielded by the electronic component, the photosensitive assembly 30 cannot receive the signal; when the light is not blocked by the electronic component, the photosensitive assembly 30 can receive the signal. Therefore, the detection can be carried out at multiple angles, and the placement state of the electronic components in the material groove 111 can be detected more comprehensively and accurately; the surface levelness of the electronic components in the material groove 111 can be detected; the situation that the existing electronic component detection device can only detect the levelness of the electronic component along a certain direction and cannot detect the electronic component when the electronic component turns towards other directions is avoided; the problems of material stacking and material tilting of the electronic components are prevented. It should be noted that stacking means stacking a plurality of electronic components in one bin 111, and tilting means placing the electronic components in the bin 111 obliquely.

Further, the electronic component detection device 100 further comprises a bottom plate 50, a bracket 51 and a transmission assembly 52, wherein the transmission assembly 52 is mounted on the bottom plate 50, and the material shuttle assembly 10 is mounted on the transmission assembly 52 and can move under the driving of the transmission assembly 52; the support 51 is installed on the bottom plate 50, and the emission subassembly 20 and the photosensitive assembly 30 are installed on different supports 51, and the emission subassembly 20 and the photosensitive assembly 30 can all carry out lift adjustment on the support 51 to satisfy different types of electronic components's detection.

Referring to fig. 2 and 4, the electronic component detecting apparatus 100 further includes a reflective element 60, the reflective element 60 is disposed on the shuttle element 10, and the light emitted from the emitting element 20 can be turned to the photosensitive element 30 through the reflective element 60. Through setting up reflection assembly 60, utilize the reflection principle of light, the light that makes emission assembly 20 transmission can make the angle of light change through reflection assembly 60 reflection to make photosensitive assembly 30 receive light signal, be convenient for detect electronic components's the state of placing.

Preferably, the first direction is a moving direction of the shuttle assembly 10, and the light emitted by the emitting assembly 20 along the first direction can be turned to the second direction by the reflecting assembly 60; alternatively, the light emitted from the emitting element 20 along the second direction can be turned to the first direction by the reflecting element 60.

Because the first direction is the moving direction of the material shuttle assembly 10, the launching assembly 20 is installed on the bottom plate 50, and if the photosensitive assembly 30 is directly installed on the material shuttle assembly 10 to be matched with the launching assembly 20; on one hand, when the distance between the shuttle assembly 10 and the emitting assembly 20 is too far or the length of the shuttle assembly 10 is too long, the probability of bending the light emitted by the emitting assembly 20 is high due to the influence of the operating environment, so that the photosensitive assembly 30 cannot accurately receive the light; the reflection assembly 60 is disposed to enable the light emitted from the emitting assembly 20 to be deflected to the photosensitive assembly 30 mounted on the base plate 50 through the reflection assembly 60, thereby improving the detection accuracy.

On the other hand, because the shuttle assembly 10 has areas such as high temperature, the photosensitive assembly 30 and the emission assembly 20 are placed in the areas to be matched, the service life is reduced, and the reflection assembly 60 is arranged, so that the photosensitive assembly 30 does not need to be arranged on the shuttle assembly 10, the service life of the photosensitive assembly 30 is prolonged, and the photosensitive assembly can be used on a machine table with high temperature, normal temperature and low temperature; and, the cost can be greatly reduced.

The material shuttle assembly 10 comprises a mounting plate 70 and a material shuttle 11, the mounting plate 70 is mounted on the transmission assembly 52, the material shuttle 11 and the reflection assembly 60 are both mounted on the mounting plate 70, and the trough 111 is arranged on the material shuttle 11.

Example one

Referring to fig. 2, the emitting device 20 includes a first emitting unit 21, and the photosensitive device 30 includes a first photosensitive unit 31; the first emitting unit 21 is located at one end of the shuttle assembly 10 in the length direction, and the first photosensitive unit 31 is located at one side of the shuttle assembly 10 in the width direction; the shuttle assembly 10 is provided with a reflection assembly 60 at an end far away from the first emitting unit 21, and the light emitted by the first emitting unit 21 can pass through the trough 111 to the reflection assembly 60 and is turned to the first photosensitive unit 31 through the reflection assembly 60, so as to detect the placing state of the electronic component.

It should be noted that the length direction of the shuttle assembly 10 refers to the moving direction of the shuttle assembly 10, and the width direction of the shuttle assembly 10 is perpendicular to the moving direction of the shuttle assembly 10.

Specifically, the first emission unit 21 is disposed in line with and opposite to the reflection assembly 60. The light emitted from the first emitting unit 21 can be transmitted to the reflecting component 60 and then be turned to the first photosensitive unit 31 through the reflecting component 60.

The emitting assembly 20 further comprises a second emitting unit 22, the photosensitive assembly 30 further comprises a second photosensitive unit 32, the second emitting unit 22 is located on one side of the shuttle assembly 10 along the length direction, and the first photosensitive unit 31 is located on the other side of the shuttle assembly 10 along the length direction; the light emitted from the second emitting unit 22 can pass through the trough 111 and directly pass to the first photosensitive unit 31 to detect the placement state of the electronic component.

Wherein, second sensitization unit 32 and second emission unit 22 all include a plurality of sensors 40, and a plurality of sensors 40 distribute on bottom plate 50 one-to-one, and arrange with silo 111 one-to-one to detect electronic components's in silo 111 placement state.

In this embodiment, the trough 111 is opened on the shuttle 11 in two rows and four columns, and each row is provided with a reflection assembly 60 to cooperate with the first emitting unit 21, so as to realize the turning of the light path. Of course, in other embodiments, the arrangement and number of the troughs 111 may be changed according to actual requirements, such as two rows of six, three rows of four, or two rows of eight. The first emitting unit 21 also includes a plurality of sensors 40 disposed opposite the reflective member 60 such that light emitted from each sensor 40 passes through the trough 111 to the reflective member 60.

Example two

The structure (not shown) of the second embodiment is substantially the same as that of the first embodiment, and the same parts are not repeated herein, except for the arrangement positions of the first emitting unit 21 and the first photosensitive unit 31 and the number and distribution manner of the reflective elements 60 in the second embodiment.

In this embodiment, the first emitting unit 21 and the first photosensitive unit 31 are located at the same side of the shuttle assembly 10 along the width direction at intervals, and the two ends of the shuttle assembly 10 along the length direction are both provided with the reflective assemblies 60; the light emitted from the first emitting unit 21 can be deflected by the reflective member 60 at one end of the shuttle assembly 10 and pass through the trough 111 to the reflective member 60 at the other end of the shuttle assembly 10, so as to be deflected to the first photosensitive unit 31.

The communication between the first emitting unit 21 and the first light sensing unit 31 is realized by the reflection of the two lights; the light emitted by the first emitting unit 21 can be transmitted to the reflection assembly 60 at one end of the shuttle assembly 10, and the reflection assembly 60 can turn the light, pass through the trough 111 to the reflection assembly 60 at the other end of the shuttle assembly 10, and turn the light, so that the first photosensitive unit 31 can receive the light signal, and the placing state of the electronic component can be conveniently detected.

Specifically, the reflective members 60 at the two ends of the shuttle assembly 10 are arranged in a collinear manner and opposite to each other, so that the reflective member 60 at one end of the shuttle assembly 10 can divert light to the reflective member 60 at the other end of the shuttle assembly 10.

In the present application, referring to fig. 3, the shuttle assembly 10 further includes a mounting seat 12, the mounting seat 12 is mounted on the mounting plate 70, a sliding slot 121 is formed in a side wall of the mounting seat 12, and a portion of the reflection assembly 60 can extend into the sliding slot 121 and move along a length direction of the sliding slot 121. The electronic component detecting device 100 further includes a first fastening member (not shown) that can penetrate through the sliding slot 121 to connect the reflection assembly 60 with the mounting base 12. In this way, the position of the reflection assembly 60 on the shuttle assembly 10 can be adjusted, and the communication between the emission assembly 20 and the photosensitive assembly 30 is realized by adjusting the position of the reflection assembly 60.

In the present application, the first fastener is a screw; of course, in other embodiments, the first fastener may be other components having a locking function.

Further, in this embodiment, two sliding grooves 121 are formed in the side wall of the mounting base 12 along the height direction of the mounting base 12, a first connecting portion 611 is formed on a side surface of the reflection assembly 60 close to the sliding grooves 121, and the first connecting portion 611 can extend into one of the sliding grooves 121 and move along the length direction of the sliding groove 121. A first mounting hole 612 is further formed in one side surface of the reflection assembly 60 close to the sliding groove 121, and a first fastening member sequentially penetrates through the other sliding groove 121 and the first mounting hole 612 to lock the reflection assembly 60 and the mounting base 12, so that the position of the reflection assembly 60 is fixed.

Of course, in other embodiments, the number of the chutes 121 may be changed according to actual requirements, for example, the number of the chutes 121 may be one, three, four, or five or more.

Referring to fig. 4, the reflection assembly 60 includes a regulating block 61 and a prism 62, the regulating block 61 is connected to the mounting base 12, a first connecting portion 611 is formed on a side surface of the regulating block 61, and the first connecting portion 611 can extend into the sliding groove 121; prism 62 rotates with adjusting block 61 and is connected, and prism 62 rotates and can adjust the refraction angle of light path, realizes the intercommunication of emission subassembly 20 and photosensitive component 30 light path.

Further, referring to fig. 4 and 5, a connecting hole 613 and a positioning hole 614 are formed on a side surface adjacent to the side surface where the first connecting portion 611 is located on the adjusting block 61, the prism 62 has a second connecting portion 621 and a second mounting hole 622, and the second connecting portion 621 extends into the positioning hole 614 and can rotate in the positioning hole 614 to drive the prism 62 to rotate. The electronic component detecting apparatus 100 further includes a second fastening member (not shown) that can be inserted into the connecting hole 613 and the second mounting hole 622 to connect the prism 62 and the adjusting block 61. The second connecting portion 621 of the prism 62 extends into the positioning hole 614, and is rotated and adjusted around the positioning hole 614, and after the angle is adjusted, the prism 62 is locked by the second fastening member, so that the refraction angle of the light path is positioned.

In the present application, the second fastener is a screw; of course, in other embodiments, the second fastener may be other components having a locking function.

Specifically, the connection hole 613 is a long hole such as a waist-shaped hole, which facilitates fixing the rotation of the prism 62.

The work flow of the electronic component detection apparatus 100 provided in the present application is as follows:

first, the emitting assembly 20 and the photosensitive assembly 30 are adjusted to the proper height and position, and the prism 62 is adjusted to the proper angle. Secondly, when the material shuttle assembly 10 moves to a designated position, the manipulator waits for discharging, no electronic component exists in the material shuttle 11, the emission assembly 20 is communicated with the photosensitive assembly 30, and signal receiving is normal. When the manipulator places the electronic components on the material shuttle 11 from the feeding position, the detection is continued, if the signal reception of the photosensitive assembly 30 is normal, the electronic components are placed normally, and the next step is continued; if the emitting assembly 20 is not communicated with the photosensitive assembly 30 and the signal receiving is abnormal, the electronic components are placed abnormally, the light signal is blocked, the detection is stopped, and the machine alarms to perform manual intervention processing.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

The features of the above embodiments may be arbitrarily combined, and for the sake of brevity, all possible combinations of the features in the above embodiments are not described, but should be construed as being within the scope of the present specification as long as there is no contradiction between the combinations of the features.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that suitable changes and modifications of the above embodiments are within the scope of the claimed invention as long as they are within the spirit and scope of the present invention.

Claims (10)

1. An electronic component detection device is characterized by comprising a material shuttle assembly, an emission assembly and a photosensitive assembly, wherein the material shuttle assembly is provided with a material groove for placing an electronic component, the material shuttle assembly is provided with a first direction and a second direction, and the emission assembly can emit light rays towards the material groove along the first direction and the second direction so as to detect the placing state of the electronic component;

the first direction and the second direction are positioned on the same horizontal plane, an included angle A exists between the first direction and the second direction, and the included angle A is more than 0 degree and less than 180 degrees;

when the light is shielded by the electronic component, the photosensitive assembly cannot receive signals;

when the light is not shielded by the electronic component, the photosensitive assembly can receive signals.

2. The electronic component detection device according to claim 1, further comprising a reflection assembly, wherein the reflection assembly is disposed on the shuttle assembly, and light emitted by the emission assembly can be turned to the photosensitive assembly through the reflection assembly.

3. The device for detecting electronic components as claimed in claim 2, wherein the first direction is a moving direction of the shuttle assembly, and the light emitted by the emitting assembly along the first direction can be turned to the second direction by the reflecting assembly; or, the light emitted by the emitting component along the second direction can be turned to the first direction by the reflecting component.

4. The electronic component detection device as claimed in claim 3, wherein the emission assembly includes a first emission unit, and the photosensitive assembly includes a first photosensitive unit; the first emitting unit is positioned at one end of the material shuttle assembly along the length direction, and the first photosensitive unit is positioned at one side of the material shuttle assembly along the width direction; the material shuttle assembly is provided with the reflection assembly at one end far away from the first emission unit, and light emitted by the first emission unit can pass through the material groove to the reflection assembly and is turned to the first photosensitive unit through the reflection assembly.

5. The electronic component detection device as claimed in claim 4, wherein the first emission unit is arranged in line with and opposite to the reflection assembly.

6. The electronic component detection device as claimed in claim 3, wherein the emission assembly includes a first emission unit, and the photosensitive assembly includes a first photosensitive unit; the first emitting unit and the first photosensitive unit are positioned on the same side of the material shuttle component along the width direction at intervals, and the two ends of the material shuttle component along the length direction are provided with the reflecting components; the light emitted by the first emitting unit can be turned by the reflecting assembly at one end of the material shuttle assembly and passes through the material groove to the reflecting assembly at the other end of the material shuttle assembly so as to turn the light to the first photosensitive unit.

7. The apparatus as claimed in claim 6, wherein the reflective members at the two ends of the shuttle assembly are arranged in line and opposite to each other.

8. The electronic component detection device according to claim 4 or 6, wherein the shuttle assembly comprises a mounting seat, a sliding groove is formed in a side wall of the mounting seat, and a part of the reflection assembly can extend into the sliding groove and move along a length direction of the sliding groove; the electronic component detection device further comprises a first fastener, wherein the first fastener can penetrate through the sliding groove and connect the reflection assembly with the mounting seat.

9. The electronic component detection device according to claim 8, wherein the reflection assembly includes an adjustment block and a prism, the adjustment block is connected to the mounting base, and a first connection portion is provided on one side surface of the adjustment block and can extend into the sliding groove; the prism is rotationally connected with the adjusting block.

10. The electronic component detection device according to claim 9, wherein a connecting hole and a positioning hole are formed in a side surface of the adjusting block adjacent to the side surface where the first connecting portion is located, the prism has a second connecting portion, and the second connecting portion extends into the positioning hole and can rotate in the positioning hole to drive the prism to rotate; the electronic component detection device further comprises a second fastener, wherein the second fastener can penetrate through the connecting hole to connect the prism with the adjusting block.

Images