CN110752168A - Wafer detection device, wafer transmission system and wafer detection method - Google Patents
Wafer detection device, wafer transmission system and wafer detection method Download PDFInfo
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- CN110752168A CN110752168A CN201910906361.5A CN201910906361A CN110752168A CN 110752168 A CN110752168 A CN 110752168A CN 201910906361 A CN201910906361 A CN 201910906361A CN 110752168 A CN110752168 A CN 110752168A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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Abstract
The application provides a wafer detection device, wafer transmission system and wafer detection method, set up on loading the cavity, include: a reflector plate, a transceiver, and a fixing plate; the fixed plate is arranged on the side wall of the loading chamber, and a light through hole is formed in the fixed plate; the transceiver is arranged on the fixing plate, emits laser into the loading chamber through the light through hole and receives reflected light of the laser through the light through hole; the reflecting plate is installed on an outer door of the loading chamber, the side wall is arranged opposite to the outer door, the reflecting plate is arranged opposite to the light through hole, and the reflecting plate is used for reflecting laser emitted by the transceiver; and the controller determines whether a wafer exists at a preset position in the loading chamber according to the reflected light received by the transceiver through the light through hole, so that the problem of wafer detection error is solved.
Description
Technical Field
The present disclosure relates to the field of semiconductor technologies, and in particular, to a wafer inspection apparatus, a wafer transmission system, and a wafer inspection method.
Background
The wafer transmission system is an important component of semiconductor special equipment and is responsible for transmitting wafers between different process modules quickly, efficiently and reliably.
The conventional wafer inspection structure is shown in fig. 1, and specifically includes: loading chamber 101, receiving sensor 102, transmitting sensor 103, outer door 104. The receiving sensor 102 is fixed to the side wall of the loading chamber 101 and the transmitting sensor 103 is mounted on an intermediate adjusting bracket inside the outer door 104 of the loading chamber 101.
When the wafer is detected and debugged, the protective plate on the outer side of the outer door needs to be detached, the angle of the transmitting sensor is repeatedly adjusted until laser emitted by the transmitting sensor directly irradiates the receiving sensor, and therefore the wafer detection can be successful. In the detection and debugging process, the angle of the laser needs to be debugged repeatedly, and the laser angle can not be measured, so that only repeated debugging can be realized, and the debugging difficulty is high and the time consumption is long.
The detection and debugging process has the defects that when a sealing rubber ring between the outer door and the loading chamber is abraded, the closed position of the outer door is changed, and at the moment, a laser path between the transmitting sensor and the receiving sensor is inclined, so that the receiving sensor cannot receive laser emitted by the transmitting sensor, and the detection of a wafer is wrong. Meanwhile, the loading chamber switches between normal pressure and vacuum for many times, so that the outer door is easy to deform, a laser path between the transmitting sensor and the receiving sensor is inclined, and the receiving sensor cannot receive laser emitted by the transmitting sensor, so that wafer detection errors are caused.
Disclosure of Invention
The application provides a wafer detection device, a wafer transmission system and a wafer detection method, which are used for solving the problem of wafer detection error caused by inclination of a laser path at present.
In order to solve the above problem, the present application discloses a wafer detection device, set up on loading the cavity, include: a reflector plate, a transceiver, and a fixing plate;
the fixed plate is arranged on the side wall of the loading chamber, and a light through hole is formed in the fixed plate;
the transceiver is arranged on the fixing plate, emits laser into the loading chamber through the light through hole and receives reflected light of the laser through the light through hole;
the reflecting plate is installed on an outer door of the loading chamber, the side wall is arranged opposite to the outer door, the reflecting plate is arranged opposite to the light through hole, and the reflecting plate is used for reflecting laser emitted by the transceiver;
and the controller is used for determining whether a wafer exists at a preset position in the loading chamber according to the reflected light received by the transceiver through the light through hole.
Optionally, the method further includes:
a first shielding plate and a second shielding plate which move along a first direction are arranged on two sides of the light through hole and are used for restricting the width of the laser and the width of the reflected light;
and a graduated scale is arranged in the first direction of the light through hole and used for calibrating the positions of the first shielding plate and the second shielding plate in the light through hole.
Optionally, the method further includes:
a first through hole is formed in the first shielding plate;
a second through hole is formed in the second shielding plate;
the light transmission width of the light transmission hole is adjusted by up-down movement of the first through hole and the second through hole along a second direction, wherein the first direction is vertical to the second direction.
Optionally, the reflection plate includes a plurality of corner cubes regularly arranged so that the reflected light is emitted as parallel light.
Optionally, the width range of the light passing hole is 0.05mm-0.75 mm.
Optionally, the controller is configured to obtain a light flux of the reflected light according to the reflected light received by the transceiver through the light-passing hole, and determine that the wafer exists at the predetermined position in the loading chamber when the light flux of the reflected light is smaller than a preset threshold.
Optionally, the transceiver is a retro-reflection laser sensor.
In order to solve the above problem, the present application further discloses a wafer transfer system comprising the wafer inspection apparatus of any one of claims 1 to 7;
the loading chamber is also internally provided with a lifting platform and a servo motor;
the lifting platform is used for placing a wafer box;
and the servo motor is used for controlling the lifting platform to move according to the position of the wafer box.
In order to solve the above problem, the present application further discloses a wafer inspection method applied to the wafer transfer system of claim 7, the method comprising:
loading the wafer into a loading chamber;
the servo motor controls the wafer box of the lifting platform to be at the initial position of wafer detection;
the transceiver transmits laser to the loading cavity through the light through hole, and receives reflected light reflected by the reflecting plate through the light through hole;
and the controller determines whether a wafer exists in a preset position in the wafer box according to the shielding signal of the reflected light, and if so, the servo motor controls the lifting table to move to detect the wafer at the next preset position.
Optionally, the blocking signal of the reflected light includes a luminous flux of the reflected light, and when the luminous flux of the reflected light is smaller than a preset threshold, it is determined that the wafer is present at the predetermined position.
Compared with the prior art, the method has the following advantages:
the wafer detection device comprises a reflecting plate, a transceiver and a fixing plate, wherein the fixing plate is installed on the side wall of the loading chamber and is provided with a light through hole; the transceiver is arranged on the fixing plate, emits laser into the loading chamber through the light through hole and receives reflected light of the laser through the light through hole; the reflecting plate is arranged on an outer door of the device chamber, the side wall is arranged opposite to the outer door, the reflecting plate is arranged opposite to the light through hole, and the reflecting plate is used for reflecting laser emitted by the transceiver; the controller determines whether a wafer exists in a preset position in the loading chamber or not according to the reflected light received by the transceiver through the light through hole, and the light through hole is arranged on the fixing plate and used for emitting laser and receiving the reflected light, so that repeated debugging of the angle of the emitted laser is avoided, meanwhile, the wafer scanning error caused by the change of the closed position of the loading cavity outer door or the deformation of the outer door can be effectively avoided, and the stability of a transmission system is improved.
Drawings
FIG. 1 is a schematic structural diagram of a wafer inspection apparatus according to the prior art;
fig. 2 is a schematic structural diagram of a wafer inspection apparatus according to an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a light-passing hole according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a light-passing hole according to an embodiment of the present application;
FIG. 5 is a schematic structural diagram of a reflector according to an embodiment of the present application;
FIG. 6 is a schematic view of a reflection principle of a reflection plate according to an embodiment of the present application;
fig. 7 is a flowchart of a wafer inspection method according to a third embodiment of the present application.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.
Example one
Referring to fig. 2, a schematic structural diagram of a wafer inspection apparatus according to an embodiment of the present disclosure is shown, the wafer inspection apparatus is disposed on a loading chamber 201, and specifically includes:
a reflective plate 202, a transceiver 203, and a fixed plate 204.
The fixing plate 204 is installed on the sidewall of the loading chamber 201, and the fixing plate 204 is provided with a light passing hole.
In practical applications, a wafer box for placing wafers may be further disposed in the loading chamber.
Fig. 3 shows a position diagram of the fixing plate 204 and the light-passing hole 301, and the light-passing hole 301 may be disposed at an intermediate position of the fixing plate 204, or may be disposed at another position, which is not limited in this application.
The transceiver 203 is mounted on the fixing plate 204, and the transceiver 203 emits laser light into the loading chamber 201 through the light transmitting hole and receives reflected light of the laser light through the light transmitting hole.
In practical application, a window may be disposed in the transceiver, and during installation, the window corresponds to a middle region of the light-through hole, and the window may emit laser light and may also receive reflected light of the laser light, that is, the emitted laser light and the reflected light of the laser light of the transceiver are the same window, so that the laser light emitted by the transceiver into the loading chamber first passes through the window of the transceiver and is transmitted to the loading chamber through the light-through hole, and similarly, when the transceiver receives the reflected light of the laser light, the laser light first passes through the light-through hole and is transmitted to the transceiver through the window.
It should be noted that the transceiver may be a laser sensor, or may be other sensors, as long as the functions of receiving and transmitting can be simultaneously realized.
The reflection plate 202 is installed on the outer door 205 of the loading chamber 201, the side wall is disposed opposite to the outer door 205, and the reflection plate 202 is disposed opposite to the light passing hole, the reflection plate 202 is used for reflecting the laser light emitted from the transceiver 203.
Because the reflecting plate is installed at the outer door of loading the chamber to the reflecting plate sets up with logical unthreaded hole relatively, during specific application, with the reflecting plate intermediate position aim at logical unthreaded hole can, need not adjust the position of reflecting plate during the debugging, the reflecting plate passes from the wafer central point that places in the wafer box of loading the chamber to the reverberation that the laser that the transceiver transmitted.
And a controller for determining whether a wafer exists at a predetermined position in the loading chamber 201 according to the reflected light received by the transceiver 203 through the light passing hole.
In practical applications, the predetermined position of the chamber of the apparatus is generally a position for placing a wafer, and in particular applications, the predetermined position may also be a position of a wafer in a wafer cassette, which is not particularly limited in this application.
Specifically, the controller is configured to acquire a light flux of the reflected light according to the reflected light received by the transceiver through the light-passing hole, and determine that the wafer exists at the predetermined position in the loading chamber when the light flux of the reflected light is smaller than a preset threshold.
The threshold may be set by a person skilled in the art in any appropriate manner, for example, the threshold may be set by manual experience, or the threshold may be set according to a difference value of historical data, which is not limited in this application.
Since the width of the transmitting window and the receiving window of the transceiver is about 15mm, and the thickness of the wafer is generally between.05 mm and 0.75mm, if the transceiver is directly used to irradiate the wafer, there is no obvious change in the luminous flux of the reflected light, so that the scanning result of the detection device is that no wafer exists, and in fact, the wafer may exist, but cannot be detected, therefore, the present application is provided with the first shielding plate 401 and the second shielding plate 402 on two sides of the light through hole, as shown in fig. 4.
In fig. 4, a first shielding plate 401 and a second shielding plate 402 moving in a first direction 405 are provided at both sides of the light passing hole to restrict the width of the laser light and the reflected light.
A graduated scale is arranged in the first direction 405 of the light hole for calibrating the positions of the first shielding plate 401 and the second shielding plate 402 in the light hole.
In practical applications, the width of the light passing hole is generally smaller than or equal to the thickness of the wafer, so the width of the light passing hole ranges from 0.05mm to 0.75 mm.
Further, a first through hole 403 is provided in the first shielding plate 401; the second shielding plate 402 is provided with a second through hole 404. The adjustment of the light transmission width of the light transmission hole is realized by the up and down movement of the first through hole 403 and the second through hole 404 along the second direction 406, wherein the first direction 405 and the second direction 406 are perpendicular. The light transmission width of the light transmission hole can be adjusted according to wafers with different thicknesses through the matching of the first through hole 403 and the second through hole 404, so that the detection of the wafers with different thicknesses is realized.
The first through hole and the second through hole may be one or two or more, and the shape of the first through hole and the second through hole may be a long strip shape or a square shape, which is not particularly limited in this application.
Specifically, in fig. 4, when the wafer thickness detected by the detecting device is different, the width of the light hole needs to be adjusted, specifically, the first through hole moves upward along the second direction, and when the first through hole moves to the set position, the first shielding plate is fixed by the bolt, the second through hole moves downward along the second direction, and when the first through hole moves to the set position, the second shielding plate is fixed by the bolt, so that the adjustment of the width of the light hole is completed.
Specifically, the transceiver is a retro-reflection type laser sensor, so that transmission and reception of laser light can be realized.
Specifically, the reflection plate includes a plurality of regularly arranged corner cubes to allow the reflected light to be emitted as parallel light, as shown in fig. 5, and in fig. 5, the reflection plate includes a plurality of regularly arranged corner cubes to allow the reflected light to be emitted as parallel light.
For example: in fig. 5, the corner cube is a shape in which 3 planes are combined at right angles to each other. If the light is projected towards the corner cube (from the surface A), fig. 6 is a schematic diagram of the prism reflection principle, the laser sent by the transceiver will repeatedly perform regular reflection, and the parallel light reflected by the laser irradiated on the reflecting plate is transmitted to the receiving window, and when the position of the parallel light is deviated, the luminous flux change of the receiving window of the transceiver is small. Therefore, when the closed position of the outer door is changed or the outer door is deformed, the light quantity of the laser sensor receiving window is basically unchanged.
In this embodiment, the wafer inspecting apparatus includes a reflection plate, a transceiver, and a fixing plate. The fixed plate is arranged on the side wall of the loading chamber, and a light through hole is formed in the fixed plate; the transceiver is arranged on the fixing plate, emits laser into the loading chamber through the light through hole and receives reflected light of the laser through the light through hole; the reflecting plate is arranged on an outer door of the device chamber, the side wall of the loading chamber is arranged opposite to the outer door of the device chamber, the reflecting plate is arranged opposite to the light through hole, and the reflecting plate is used for reflecting laser emitted by the transceiver; the controller determines whether a wafer exists in a preset position in the loading chamber or not according to reflected light received by the transceiver through the light through hole, and the light through hole is arranged on the fixing plate to emit laser and receive the reflected light by using the light through hole, so that repeated debugging of the angle of the emitted laser is avoided, meanwhile, the wafer scanning error caused by the change of the closed position of the loading cavity outer door or the deformation of the outer door can be effectively avoided, and the stability of a transmission system is improved.
It should be noted that the foregoing device embodiments are described as a series of acts or combinations for simplicity in description, but it should be understood by those skilled in the art that the present application is not limited by the order of acts or acts described, as some steps may occur in other orders or concurrently depending on the application. Further, those skilled in the art will also appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the invention.
Example two
The application also discloses a wafer transmission system, which comprises the wafer detection device in the first embodiment.
And a lifting platform and a servo motor are also arranged in the loading chamber.
And the lifting platform is used for placing the wafer box.
And the servo motor is used for controlling the lifting platform to move according to the position of the wafer box.
In practical application, the servo motor can be connected with the lifting platform through the rotating shaft, so that the servo motor can control the movement of the lifting platform according to the position information of the wafer box.
The wafer transferring system has all the advantages of the wafer inspecting apparatus in the first embodiment, and will not be described herein again.
EXAMPLE III
Referring to fig. 7, a flowchart of a wafer inspection method according to a third embodiment of the present application is shown, where the method is applied to a wafer transportation system, and specifically includes:
step 701: the wafer is loaded into the load chamber.
Step 702: the servo motor controls the wafer box of the lifting platform to be at the initial position of wafer detection.
Step 703: the transceiver transmits laser to the loading cavity through the light through hole, and receives reflected light reflected by the reflecting plate through the light through hole.
Step 704: the controller determines whether a wafer exists in a preset position in the wafer box according to the shielding signal of the reflected light, and if so, the servo motor controls the lifting table to move to detect the wafer at the next preset position.
Specifically, the servo motor controls the wafer box of the lifting platform to be located at the initial position of wafer detection, the transceiver emits laser into the loading chamber through the light through hole, reflected light reflected by the reflecting plate through the light through hole is received, the controller determines whether a wafer exists in a preset position in the wafer box according to a shielding signal of the reflected light, if the wafer exists, the servo motor controls the lifting platform to move to the end position of the wafer detection, and wafer detection of the next preset position is carried out until all wafers in the wafer box are detected.
In a specific application, 25 wafer slots for placing wafers are generally arranged in the loading chamber, and at each wafer slot position, the controller determines whether a wafer exists in a wafer slot in the loading chamber according to the shielding signal of the reflected light.
Optionally, the wafer inspection method further includes:
a first shielding plate and a second shielding plate which move along a first direction are arranged on two sides of the light through hole, and the widths of the laser and the reflected light are restricted;
and a graduated scale is arranged in the first direction of the light through hole and used for calibrating the positions of the first shielding plate and the second shielding plate in the light through hole.
Optionally, the blocking signal of the reflected light includes a luminous flux of the reflected light, and when the luminous flux of the reflected light is smaller than a preset threshold, it is determined that the wafer is present at the predetermined position.
This embodiment, through set up logical unthreaded hole on the fixed plate, use this logical unthreaded hole transmission laser and receipt reverberation to avoided debugging repeatedly to the angle of the laser of transmission, simultaneously, also can effectively avoid because load the outer door closed position of chamber changes or the outer door takes place the wafer scanning error that deformation and take place, improved transmission system's stability.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
As is readily imaginable to the person skilled in the art: any combination of the above embodiments is possible, and thus any combination between the above embodiments is an embodiment of the present application, but the present disclosure is not necessarily detailed herein for reasons of space.
The above detailed description is made on a wafer inspection apparatus, a wafer transmission system and a wafer inspection method provided by the present application, and a specific example is applied in the detailed description to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A wafer detection device, set up on loading the chamber, includes: a reflector plate, a transceiver, and a fixing plate;
the fixed plate is arranged on the side wall of the loading chamber, and a light through hole is formed in the fixed plate;
the transceiver is arranged on the fixing plate, emits laser into the loading chamber through the light through hole and receives reflected light of the laser through the light through hole;
the reflecting plate is installed on an outer door of the loading chamber, the side wall is arranged opposite to the outer door, the reflecting plate is arranged opposite to the light through hole, and the reflecting plate is used for reflecting laser emitted by the transceiver;
and the controller is used for determining whether a wafer exists at a preset position in the loading chamber according to the reflected light received by the transceiver through the light through hole.
2. The wafer inspection apparatus of claim 1, further comprising:
a first shielding plate and a second shielding plate which move along a first direction are arranged on two sides of the light through hole and are used for restricting the width of the laser and the width of the reflected light;
and a graduated scale is arranged in the first direction of the light through hole and used for calibrating the positions of the first shielding plate and the second shielding plate in the light through hole.
3. The wafer inspection apparatus of claim 2, further comprising:
a first through hole is formed in the first shielding plate;
a second through hole is formed in the second shielding plate;
the light transmission width of the light transmission hole is adjusted by up-down movement of the first through hole and the second through hole along a second direction, wherein the first direction is vertical to the second direction.
4. The wafer inspection device as claimed in claim 1, wherein the reflection plate includes a plurality of corner cubes arranged in a regular pattern so that the reflected light is emitted as parallel light.
5. The wafer detection apparatus as claimed in claim 1, wherein the width of the light passing hole is in a range of 0.05mm to 0.75 mm.
6. The wafer detection apparatus according to claim 1, wherein the controller is configured to obtain a light flux of reflected light according to the reflected light received by the transceiver through the light passing hole, and determine that the wafer is present at the predetermined position in the loading chamber when the light flux of the reflected light is smaller than a preset threshold.
7. The wafer inspection apparatus of claim 1, wherein the transceiver is a retro-reflective laser sensor.
8. A wafer transport system comprising the wafer inspection apparatus of any one of claims 1-7;
the loading chamber is also internally provided with a lifting platform and a servo motor;
the lifting platform is used for placing a wafer box;
and the servo motor is used for controlling the lifting platform to move according to the position of the wafer box.
9. A wafer inspection method applied to the wafer transfer system of claim 8, the method comprising:
loading the wafer into a loading chamber;
the servo motor controls the wafer box of the lifting platform to be at the initial position of wafer detection;
the transceiver transmits laser to the loading cavity through the light through hole, and receives reflected light reflected by the reflecting plate through the light through hole;
and the controller determines whether a wafer exists in a preset position in the wafer box according to the shielding signal of the reflected light, and if so, the servo motor controls the lifting table to move to detect the wafer at the next preset position.
10. The wafer inspection method according to claim 9, wherein the blocking signal of the reflected light includes a luminous flux of the reflected light, and when the luminous flux of the reflected light is smaller than a preset threshold value, it is determined that the wafer is present at the predetermined position.
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| CN201910906361.5A CN110752168B (en) | 2019-09-24 | 2019-09-24 | Wafer detection device, wafer transmission system and wafer detection method |
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| CN201910906361.5A CN110752168B (en) | 2019-09-24 | 2019-09-24 | Wafer detection device, wafer transmission system and wafer detection method |
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Cited By (1)
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| CN112490149A (en) * | 2020-11-13 | 2021-03-12 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and method for detecting existence of wafer in process chamber |
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| JPH11260893A (en) * | 1998-03-13 | 1999-09-24 | Sumitomo Heavy Ind Ltd | Apparatus for detecting work housed in cassette |
| KR20070009276A (en) * | 2005-07-15 | 2007-01-18 | 삼성전자주식회사 | Apparatus for manufacturing semiconductors and method for monitering particles |
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| CN112490149A (en) * | 2020-11-13 | 2021-03-12 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and method for detecting existence of wafer in process chamber |
| CN112490149B (en) * | 2020-11-13 | 2024-04-12 | 北京北方华创微电子装备有限公司 | Semiconductor processing apparatus, method for detecting the presence of a wafer in a process chamber |
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| CN110752168B (en) | 2022-08-16 |
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