CN217035613U

CN217035613U - Wafer detection system

Info

Publication number: CN217035613U
Application number: CN202220360370.6U
Authority: CN
Inventors: 陈阳阳; 殷骐
Original assignee: Hangzhou Zhonggui Electronic Technology Co ltd
Current assignee: Hangzhou Zhonggui Electronic Technology Co ltd
Priority date: 2022-02-22
Filing date: 2022-02-22
Publication date: 2022-07-22
Anticipated expiration: 2032-02-22

Abstract

The utility model discloses a wafer detection system, which comprises a horizontal transmission shaft; the wafer cleaning module is arranged on one side of the horizontal transmission shaft; the wafer transmission hand is movably arranged on the horizontal transmission shaft and is used for taking and placing the wafer and driving the wafer to move in the wafer transmission channel so as to realize the transmission of the wafer; the head end and the tail end of the wafer transmission channel are provided with at least one group of emission units and feedback units, the emission units are used for emitting light beams to the feedback units, and the light beams are located in the wafer transmission channel and used for detecting whether wafers are clamped on the wafer transmission hands or not. The wafer transmission device can detect whether a wafer is in the wafer transmission channel in real time, and then judges whether the wafer is clamped on the wafer transmission hand, the structure is simple, and the detection timeliness is high; the structure of wafer transmission hand is various, and it is more nimble to press from both sides getting of wafer, can adapt to different use scenes.

Description

Wafer detection system

Technical Field

The utility model belongs to the technical field of semiconductor integrated circuit chip manufacturing equipment, and particularly relates to a wafer detection system.

Background

A Chemical Mechanical Planarization (CMP) apparatus generally includes a semiconductor Equipment Front End Module (EFEM), a polishing unit, and a cleaning unit. In the working process of the existing cleaning unit, wafers are taken and placed by a wafer conveying hand to move among the cleaning modules, so that the wafers are guaranteed to complete corresponding cleaning processes in the cleaning modules. In order to ensure the effective performance of each process, it is necessary to determine whether a wafer is clamped on the wafer transfer hand.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides the wafer detection system which is simple in structure and can detect whether the wafer is clamped on the wafer transmission hand in real time.

The technical scheme adopted by the utility model for solving the technical problems is as follows: a wafer inspection system comprising:

a horizontal transmission shaft;

the wafer cleaning module is arranged on one side of the horizontal transmission shaft;

the wafer transmission hand is movably arranged on the horizontal transmission shaft and is used for taking and placing the wafer and driving the wafer to move in the wafer transmission channel so as to realize the transmission of the wafer;

the head end and the tail end of the wafer transmission channel are provided with at least one group of emission units and feedback units, the emission units are used for emitting light beams to the feedback units, and the light beams are positioned in the wafer transmission channel and used for detecting whether wafers are clamped on the wafer transmission hand or not.

The utility model can detect whether a wafer is in the wafer transmission channel in real time by matching the emission units at the head end and the tail end of the wafer transmission channel with the feedback units, namely, whether the wafer is clamped on the wafer transmission hand is detected, the structure is simple, and the detection timeliness is high; the emitting unit and the feedback unit are arranged at the head end and the tail end, so that the whole transmission process of the wafer cannot be interfered, the transmission is not influenced by a transmission humid environment, the sensor and the like are effectively protected from being influenced by cleaning liquid, and the detection or corrosion of the sensor and the like caused by liquid is avoided; the transmitting unit and the feedback unit are arranged from head to tail, the used sensors are few, the whole cleaning area can be detected, the calibration process of the sensors is easier, the replacement is convenient, and the normal work of the cleaning area is not influenced in the replacement process.

Further, the light beam is parallel to the horizontal transmission axis. The light beam is parallel, so that the light beam is vertical to the wafer, and the detection is more accurate.

Furthermore, the wafer transmission hands are one or more than two, and the bottoms of the wafer transmission hands can be movably arranged on the horizontal transmission shaft.

Furthermore, the wafer transmission hand comprises a longitudinal shaft, a vertical lifting shaft and a clamping jaw, wherein the longitudinal shaft is movably connected with the horizontal transmission shaft, one or two or more vertical lifting shafts are arranged on the longitudinal shaft, and the clamping jaw is connected with the vertical lifting shaft. The structure of the wafer transmission hand is convenient to upgrade and rotate, so that the wafer can be clamped conveniently; the vertical shaft is provided with one or two or more vertical lifting shafts, namely, two or more clamping jaws are arranged on one vertical shaft, the two clamping jaws cannot simultaneously take and place wafers, the head and tail ends of the emission unit and the feedback unit are arranged very favorably, the wafer carrying condition of two wafer transmission hands can be detected, the arrangement is simple, and different use scenes can be adapted.

Furthermore, the number of the wafer cleaning modules is at least two, and the wafer cleaning modules are wafer megasonic cleaning modules, wafer brushing modules, wafer drying modules, wafer transition modules or a combination thereof.

Furthermore, a plurality of groups of transmitting units and feedback units are arranged in the wafer transmission channel, the number of the transmitting units and the feedback units corresponds to the number of the wafer cleaning modules, and the single group of transmitting units and the feedback units are respectively arranged on two opposite sides of the wafer cleaning modules. Every wafer washs the module and all disposes transmitting element and feedback unit, and sensor quantity is many, detects more comprehensively, more accurate, and when using a plurality of manipulators, the wafer detects more sensitively.

Further, the feedback unit is a reflector; the emitting unit is a reflective optical sensor and is used for emitting light beams and receiving the light beams reflected back by the reflecting plate. The cost of the reflector is relatively low, and the overall use cost is reduced.

Further, the transmitting unit and the feedback unit are a transmitting end and a receiving end of the correlation optical sensor.

Furthermore, a wafer drying unit is arranged at the downstream of the wafer cleaning module, the wafer drying unit is used for vertically drying the wafer, and the wafer transmission channel extends towards the wafer drying unit.

Furthermore, a wafer drying unit is arranged at the downstream of the wafer cleaning module, the wafer is rotated to be horizontal after being clamped by a wafer transmission hand, the wafer drying unit is used for horizontally drying the wafer and comprises a support used for horizontally supporting the wafer and a first sensor assembly, the first sensor assembly comprises a first sensor transmitting unit and a first sensor receiving unit, and the first sensor transmitting unit transmits a horizontal beam to the first sensor receiving unit so as to detect whether the wafer is placed in parallel or not.

Further, the number of the first sensor assemblies is two, and the emitted light beams thereof intersect. The two groups of first sensor assemblies can detect whether the wafers are placed in parallel more accurately.

Further, the wafer drying unit further comprises a second sensor assembly including a second sensor transmitting unit and a second sensor receiving unit which are located at different heights, and the second sensor transmitting unit transmits the oblique beam to the second sensor receiving unit to detect whether the wafer is placed on the support.

Furthermore, the wafer drying unit further comprises a distance measuring sensor which is higher than or lower than the position of the horizontal plane where the wafer is located and used for monitoring the distance between the barrier and the wafer to judge whether the wafer is placed on the support. The ranging sensor can be arranged at any position and can adapt to various use scenes.

Further, the first sensor assembly and/or the second sensor assembly and/or the distance measuring sensor are arranged on the support.

The utility model has the beneficial effects that: 1) the emission units at the head end and the tail end of the wafer transmission channel are matched with the feedback unit, so that whether a wafer exists in the wafer transmission channel can be detected in real time, and whether the wafer is clamped on a wafer transmission hand is judged, the structure is simple, and the detection timeliness is high; 2) the wafer transmission hand has various structures, is more flexible to clamp wafers and can adapt to different use scenes; 3) the wafer drying unit has various structural forms and can adapt to different drying requirements; 4) the wafer drying unit is provided with a second sensor assembly for detecting whether the wafer is placed or not and a detection structure for detecting whether the wafer is placed in parallel or not, so that the wafer can be monitored more comprehensively and accurately; 5) the setting of support provides the space for first sensor subassembly, second sensor subassembly and distance measuring sensor's installation, the installation of being convenient for.

Drawings

Fig. 1 is a first perspective view of a first structural form of the first embodiment of the present invention.

Fig. 2 is a second perspective view of the first embodiment of the utility model, in which the wafer blocks the light beam.

Fig. 3 is a perspective view of a third embodiment of the present invention.

Fig. 4 is a perspective view of a second embodiment of the present invention.

Fig. 5 is a perspective view of a third embodiment of the present invention.

Fig. 6 is a first side view of a wafer drying unit according to a fourth embodiment of the present invention.

Fig. 7 is a second side view of the wafer drying unit according to the fourth embodiment of the utility model, wherein the wafer is horizontal.

Fig. 8 is a second side view of the wafer drying unit according to the fourth embodiment of the present invention, wherein the wafer is tilted.

Fig. 9 is a second side view of the wafer drying unit according to the fourth embodiment of the present invention, in which the number of the first sensor assemblies is two.

Fig. 10 is a first side view of a wafer drying unit according to a fifth embodiment of the present invention.

Fig. 11 is a second side view of the wafer drying unit according to the fifth embodiment of the present invention.

Detailed Description

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, shall fall within the protection scope of the present invention.

Example one

As shown in fig. 1, a wafer inspection system includes a horizontal transmission shaft 1, a wafer cleaning module 2 disposed at one side of the horizontal transmission shaft 1, and a wafer transmission hand 3 movably disposed on the horizontal transmission shaft 1, wherein the wafer transmission hand 3 is used for picking and placing a wafer 4 and driving the wafer 4 to move in a wafer transmission channel 5, thereby realizing the transmission of the wafer 4.

The wafer transfer hand 3 is one or two or more, and the bottom of the wafer transfer hand is movably disposed on the horizontal transfer shaft 1, but in other embodiments, the wafer transfer hand 3 may be movably connected to the horizontal transfer shaft 1 at other positions, not necessarily at the bottom end thereof. The wafer transfer hand 3 comprises a vertical shaft 31 perpendicular to and movably connected with the horizontal transfer shaft 1, a vertical lifting shaft 32 capable of lifting up and down along the vertical shaft 31, and a clamping jaw 33 connected to the vertical lifting shaft 32. As shown in fig. 1, a single vertical shaft 31 may be connected to a single vertical shaft 32, as shown in fig. 2, two vertical shafts 32 may be connected to the single vertical shaft 31, and a plurality of vertical shafts may be connected to the single vertical shaft 31.

The number of the wafer cleaning modules 2 may be one or at least two, where the wafer cleaning module 2 refers to a wafer megasonic cleaning module, or refers to a wafer brushing module, or refers to a wafer drying module, or refers to a wafer transition module, or refers to a combination of a wafer megasonic cleaning module, a wafer brushing module, a wafer transition module, and a wafer drying module.

For example, the wafer cleaning module 2 in fig. 1 is sequentially a wafer transition module, a wafer megasonic cleaning module, a wafer brushing module and a wafer drying module from right to left. For another example, the wafer cleaning module 2 in fig. 1 is a wafer megasonic cleaning module, a wafer brushing module i, a wafer brushing module ii and a wafer drying module from right to left.

The wafer transfer passage 5 is a space above the wafer cleaning module 2, and more specifically, a space above the wafer cleaning module 2 and below the corresponding clamping jaw 33, and has a length direction extending parallel to the horizontal transfer shaft 1, a width direction extending along the width direction of the wafer cleaning module 2, and a height greater than the outer diameter of the wafer 4.

At least one group of emission units 61 and feedback units 62 are disposed at the head end and the tail end of the wafer transmission channel 5, the emission units 61 are configured to emit light beams 71 to the feedback units 62, and the light beams 71 are located in the wafer transmission channel 5 and configured to monitor whether the wafer 4 is clamped on the wafer transmission hand 3. The beam 71 may be parallel to the horizontal transport axis 1, or may be slightly inclined, as long as it can pass through the wafer 4 when being incident in the wafer transport passage 5. At least one group here means that one transmitting unit 61 is provided at the head end and one feedback unit 62 is provided at the tail end, or that one feedback unit 62 is provided at the head end and one transmitting unit 61 is provided at the tail end. Alternatively, two or more transmitting units 61 are provided at the head end and two or more feedback units 62 are provided at the tail end, or two or more feedback units 62 are provided at the head end and two or more transmitting units 61 are provided at the tail end.

As shown in fig. 2, when there is a wafer 4 in the wafer transmission channel 5, the light beam emitted from the emitting unit 61 is blocked by the wafer 4 and cannot be transmitted to the feedback unit 62, and the wafer 4 may be a wafer on any wafer transmission hand 3.

As shown in fig. 3, when the wafer transfer passage 5 is not provided with the wafer 4, the light beam emitted from the emitting unit 61 is not blocked by the wafer 4 and can be transferred to the feedback unit 62.

In this embodiment, the feedback unit 62 is a reflector, the emitting unit 61 is a reflective optical sensor, and the emitting unit 61 is configured to emit a light beam 71 and receive the light beam reflected back by the reflector. When the wafer 4 is held by the wafer transfer hand 3, the light beam 71 is blocked by the wafer 4, the light beam 71 cannot return to the emitting unit 61, and the emitting unit 61 outputs a signal of the wafer. When the wafer 4 is not clamped on the wafer transferring hand 3, the light beam 71 emitted by the emitting unit 61 irradiates the reflector, the light beam 71 can return to the emitting unit 61, and the emitting unit 61 outputs a signal that no wafer exists.

Certainly, the emitting unit 61 and the feedback unit 62 may also be an emitting end and a receiving end of a correlation optical sensor, in this case, when the wafer 4 is clamped on the wafer transferring hand 3, the light beam emitted by the emitting end is blocked by the wafer 4, and the receiving end outputs a signal of the wafer; when the wafer 4 is not clamped on the wafer transmission hand 3, the light beam emitted by the emitting end irradiates the receiving end, and the receiving end outputs a signal that the wafer is not clamped.

Example two

The difference between the first embodiment and the second embodiment is that the number of the wafer cleaning modules 2 is at least two, and a plurality of sets of the transmitting units 61 and the feedback units 62 are disposed in the wafer transmission channel 5, and the number of the transmitting units and the number of the feedback units correspond to that of the wafer cleaning modules 2, that is, the two are equal.

As shown in fig. 4, a set of transmitting units 61 and feedback units 62 are disposed on two opposite sides of each wafer cleaning module 2, so that whether a wafer is clamped on each wafer transferring hand 3 can be monitored in real time. In order to avoid the influence on the transportation of the wafer 4, it is sufficient to detect that the light is blocked by the wafer 4 between the emission unit 61 and the feedback unit 62 at a predetermined height during the upward or downward movement of the wafer 4 held by the chuck 33.

EXAMPLE III

As shown in fig. 5, a wafer drying unit 8 is disposed downstream of the wafer cleaning module 2, and is used for vertically drying the wafer 4, that is, the wafer 4 is in a vertical state during the drying process. The box body of the wafer drying unit 8 and the box body of the wafer cleaning module 2 are arranged side by side and at intervals. The wafer transfer passage 5 in the first embodiment extends toward the wafer drying unit 8. In other words, the head end or the tail end of the wafer transfer passage 5 is located at the side of the wafer drying unit 8 away from the wafer cleaning module 2.

The rest is the same as the first embodiment and is not repeated.

Example four

As shown in fig. 6 to 9, a wafer drying unit 8 is disposed downstream of the wafer cleaning module 2, and is configured to horizontally dry the wafer 4, that is, the wafer 4 is rotated to be horizontal after being held by the wafer 4 transferring hand 3, so that the wafer 4 is in a horizontal state during the drying process.

In this embodiment, the wafer drying unit 8 includes a support 81 for horizontally supporting the wafer 4, and a first sensor assembly including a first sensor transmitting unit 821 and a first sensor receiving unit 822, wherein the first sensor transmitting unit 821 transmits a horizontal beam 72 to the first sensor receiving unit 822 for detecting whether the wafer 4 is placed in parallel.

As shown in fig. 7, the first sensor assembly is located in a plane as close to the wafer 4 as possible, and the first sensor emitting unit 821 and the first sensor receiving unit 822 may be a reflector and a reflective optical sensor, or may be an emitting end and a receiving end of a correlation optical sensor. When the wafer 4 is horizontally placed on the support 81, the light beam emitted from the first sensor transmitting unit 821 is received by the first sensor receiving unit 822; as shown in fig. 8, when the wafer 4 is placed on the support 81 with a tilt, the light beam emitted from the first sensor transmitting unit 821 is blocked by the wafer 4 and cannot be received by the first sensor receiving unit 822. The specific judgment and signal output principle is the same as that of the first embodiment, and is not described again.

The first sensor assembly is arranged on the support, the support comprises a first support body 851 and a second support body 852, the planes of the first support body 851 and the second support body 852 are perpendicular to the horizontal transmission shaft 1, namely the first support body 851 and the second support body 852 are respectively positioned on two sides of the support 81 in the longitudinal width direction; or, the plane of the two is parallel to the horizontal transmission shaft 1, that is, the first support body 851 and the second support body 852 are respectively located at two sides of the support 81 in the transverse length direction. Of course, in other embodiments, the support may include a plurality of support bodies, and the positional relationship may be set arbitrarily as long as the wafer transfer hand 3 does not affect the transfer of the wafer 4.

As shown in fig. 9, the number of the first sensor assemblies may be not only one set, but also two sets, and the light beams emitted by the first sensor emitting units of the two sets intersect at the point a, specifically, a cross.

The wafer drying unit 8 further includes a second sensor assembly including a second sensor transmitting unit 831 and a second sensor receiving unit 832 which are located at different heights, the second sensor transmitting unit 831 transmitting the oblique beam 73 to the second sensor receiving unit 832 for detecting whether the wafer 4 is placed on the support 81. As shown in fig. 6, when the wafer 4 is not placed on the support 81, the oblique beam 73 is not blocked by the wafer 4.

The second sensor assembly is also disposed on the bracket, and one of the second sensor transmitting unit 831 and the second sensor receiving unit 832 is higher than the first sensor transmitting unit 821 or the first sensor receiving unit 822, and the other is lower than the first sensor receiving unit 822 or the first sensor transmitting unit 821, thereby ensuring oblique emission of the oblique light beam 73.

EXAMPLE five

As shown in fig. 10, the wafer drying unit 8 further includes a distance measuring sensor 84, which is capable of emitting a light beam 74 obliquely downward at a position higher than the horizontal plane of the wafer 4, and when the distance between the obstacle and the obstacle is detected to be within a set range, it is determined that the wafer 4 is placed on the support 81, and when the distance is detected to be beyond the set range, it is determined that the wafer 4 is not placed on the support 81.

As shown in fig. 11, the ranging sensor 84 may also be positioned below the level of the wafer 4, where the ranging sensor 84 emits the beam 74 obliquely upward.

The range sensor 84 may be provided on the first support body 851 or the second support body 852.

The foregoing detailed description is intended to illustrate and not limit the utility model, which is intended to be within the spirit and scope of the appended claims, and any changes and modifications that fall within the true spirit and scope of the utility model are intended to be covered by the following claims.

Claims

1. A wafer inspection system, comprising:

a horizontal transmission shaft (1);

the wafer cleaning module (2) is arranged on one side of the horizontal transmission shaft (1);

the wafer transmission hand (3) is movably arranged on the horizontal transmission shaft (1) and is used for taking and placing the wafer (4) and driving the wafer (4) to move in the wafer transmission channel (5) so as to realize the transmission of the wafer (4);

the wafer transmission channel is characterized in that the head end and the tail end of the wafer transmission channel (5) are provided with at least one group of emission units (61) and a feedback unit (62), the emission units (61) are used for emitting light beams (71) to the feedback unit (62), and the light beams (71) are located in the wafer transmission channel (5) and used for detecting whether wafers (4) are clamped on the wafer transmission hand (3) or not.

2. The wafer inspection system of claim 1, wherein: the light beam (71) is parallel to the horizontal transmission shaft (1).

3. The wafer inspection system of claim 1, wherein: the wafer transmission hands (3) are one or more than two, and the bottoms of the wafer transmission hands are movably arranged on the horizontal transmission shaft (1).

4. The wafer inspection system of claim 3, wherein: wafer transmission hand (3) are including axis of ordinates (31), vertical lift axle (32), and clamping jaw (33), axis of ordinates (31) and horizontal transmission axle (1) swing joint, be equipped with one or two and more vertical lift axle (32) on axis of ordinates (31), clamping jaw (33) are connected in vertical lift axle (32).

5. The wafer inspection system of claim 1, wherein: the number of the wafer cleaning modules (2) is at least two, and the wafer cleaning modules are wafer megasonic cleaning modules, wafer brushing modules, wafer drying modules, wafer transition modules or the combination thereof.

6. The wafer inspection system of claim 5, wherein: the wafer transmission channel (5) is internally provided with a plurality of groups of transmitting units (61) and feedback units (62), the number of the transmitting units and the number of the feedback units correspond to the number of the wafer cleaning modules (2), and the single group of transmitting units (61) and the feedback units (62) are respectively arranged on two opposite sides of the wafer cleaning modules (2).

7. The wafer inspection system of claim 1, wherein: the feedback unit (62) is a reflector; the emission unit (61) is a reflective optical sensor for emitting a light beam and for receiving the light beam reflected back by the reflector.

8. The wafer inspection system of claim 1, wherein: the transmitting unit (61) and the feedback unit (62) are the transmitting end and the receiving end of the correlation type optical sensor.

9. The wafer inspection system of claim 1, wherein: the wafer drying unit (8) is arranged at the downstream of the wafer cleaning module (2), the wafer drying unit (8) is used for vertically drying the wafer (4), and the wafer transmission channel (5) extends towards the wafer drying unit (8).

10. The wafer inspection system of claim 1, wherein: the wafer drying unit (8) is arranged at the downstream of the wafer cleaning module (2), the wafer transmission hand (3) is used for clamping the wafer (4) and then rotating the wafer (4) to be horizontal, the wafer drying unit (8) is used for horizontally drying the wafer (4), the wafer transmission hand comprises a support (81) used for horizontally supporting the wafer (4), and a first sensor assembly, the first sensor assembly comprises a first sensor transmitting unit (821) and a first sensor receiving unit (822), and the first sensor transmitting unit (821) transmits a horizontal light beam (72) to the first sensor receiving unit (822) so as to detect whether the wafer (4) is placed in parallel or not.

11. The wafer inspection system of claim 10, wherein: the number of the first sensor assemblies is two groups, and the emitted light beams of the first sensor assemblies are intersected.

12. The wafer inspection system of claim 10, wherein: the wafer drying unit (8) further comprises a second sensor assembly which comprises a second sensor transmitting unit (831) and a second sensor receiving unit (832) which are located at different heights, and the second sensor transmitting unit (831) transmits an inclined light beam (73) to the second sensor receiving unit (832) so as to detect whether the wafer (4) is placed on the support (81).

13. The wafer inspection system of claim 10, wherein: the wafer drying unit (8) further comprises a distance measuring sensor (84) which is higher or lower than the level of the wafer (4) and is used for monitoring the distance between the obstacle and the wafer to judge whether the wafer (4) is placed on the support (81).

14. The wafer inspection system of claim 12 or 13, wherein: the first sensor assembly and/or the second sensor assembly and/or the distance measuring sensor (84) are arranged on the support.