CN117835582A - Flexible circuit board forming process and flexible circuit board - Google Patents
Flexible circuit board forming process and flexible circuit board Download PDFInfo
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- CN117835582A CN117835582A CN202410121055.1A CN202410121055A CN117835582A CN 117835582 A CN117835582 A CN 117835582A CN 202410121055 A CN202410121055 A CN 202410121055A CN 117835582 A CN117835582 A CN 117835582A
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- conductive layer
- protective film
- circuit board
- flexible circuit
- bonding
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 230000008569 process Effects 0.000 title claims abstract description 41
- 230000001681 protective effect Effects 0.000 claims abstract description 151
- 238000003825 pressing Methods 0.000 claims description 52
- 238000001125 extrusion Methods 0.000 claims description 19
- 238000000465 moulding Methods 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000007493 shaping process Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 127
- 239000012790 adhesive layer Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000004080 punching Methods 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The invention belongs to the technical field of circuit board processing and manufacturing, and discloses a flexible circuit board forming process and a flexible circuit board. The flexible circuit board forming process comprises the steps of obtaining a conductive layer and combining a protective film on a first side of the conductive layer to cover the first side; carrying out circuit forming on the conducting layer combined with the protective film; bonding a protective film to the second side of the conductive layer on which the circuit formation is completed to cover the second side; the protective films on the first side and the second side of the conductive layer are respectively opened to expose the conductive layer so as to form soldering legs. With this flexible circuit board technology in the application process, not only need not the accurate counterpoint of protection film to the circuit board, effectively reduced the processing degree of difficulty, but also can make the opening process according to the size of actual leg, no longer need design extra compensation for the leg, still make the circuit in the arbitrary region on the circuit board all have the support that the protection film provided simultaneously when shaping, effectively reduced the broken possibility of circuit emergence, be favorable to improving the processingquality of flexible circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board processing and manufacturing, in particular to a flexible circuit board forming process and a flexible circuit board.
Background
As an important constituent structure of electronic products, circuit boards are gradually developed in the directions of light, thin and flexible. Among them, flexible printed circuit boards (FPCs) are increasingly used in electronic products with their advantages of being bendable, foldable, three-dimensional wiring, three-dimensional space interconnection, etc., and have replaced conventional rigid Printed Circuit Boards (PCBs) in many places. Particularly, an ultra-thin flexible printed wiring board is widely used in electronic products due to its superior flexibility.
In the prior art, the manufacturing process of the flexible circuit board comprises the steps of drilling a copper foil, punching a protective film, aligning and laminating the copper foil and the protective film, pressing, forming a circuit and the like. Because drilling is carried out in advance, the protective film needs to be ensured to be aligned with the copper foil when being attached, the processing difficulty is increased, glue overflow is easy to generate in the attaching process, the formed welding leg is small, the size of the welding leg needs to be additionally designed and compensated, meanwhile, as the protective film is punched, when an area etched by the copper foil is corresponding to the punching position of the protective film during line forming, the etching process in the area is not effectively supported, the circuit in the area is easy to break, and the processing quality of the flexible circuit board is poor.
Therefore, there is a need to invent a flexible circuit board molding process and a flexible circuit board to solve the above problems.
Disclosure of Invention
The invention aims to provide a flexible circuit board forming process and a flexible circuit board, which solve the problem that in the prior art, the flexible circuit board needs to be accurately positioned during manufacturing to cause the increase of processing difficulty, and also solve the problem that in the attaching process, the solder fillets are easy to generate to be smaller and extra design and compensation are required, and meanwhile, the problem that in the circuit forming process, the circuit is easy to break due to the fact that effective support is insufficient in part of the area, so that the processing quality of the flexible circuit board is poor.
To achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a flexible circuit board molding process, including:
acquiring a conductive layer and bonding a protective film on a first side of the conductive layer to cover the first side;
performing circuit forming on the conductive layer combined with the protective film;
bonding a protective film to the second side of the conductive layer on which the circuit forming is completed to cover the second side;
and opening the protective films on the first side and the second side of the conductive layer respectively to expose the conductive layer so as to form welding pins.
Optionally, the bonding protection film includes:
cutting the protective film according to the size of the conductive layer;
tiling the cut protective film on the first side or the second side of the conductive layer;
and applying pressure to the conductive layer tiled with the protective film to bond the protective film to the surface of the conductive layer.
Optionally, the applying pressure to the conductive layer tiled with the protective film to bond the protective film to the conductive layer surface includes:
sending the conducting layer flatly paved with the protective film into a pressing space, and applying pressing force to the protective film and the conducting layer to press the protective film and the conducting layer together;
and after the protective film and the conductive layer are laminated, sending the protective film and the conductive layer into a laminating space, and applying extrusion force to the protective film and the conductive layer to bond the protective film and the conductive layer together.
Optionally, the applying pressure to the conductive layer tiled with the protective film to bond the protective film to the conductive layer surface further includes:
and heating the pressing space while applying pressure to the protective film and the conductive layer so that the temperature value of the pressing space is within a preset pressing temperature range.
Optionally, the applying pressure to the conductive layer tiled with the protective film to bond the protective film to the conductive layer surface further includes:
and heating the bonding space while applying extrusion force to the protective film and the conductive layer so that the temperature value of the bonding space is within a bonding temperature preset range.
Optionally, the applying pressure to the conductive layer tiled with the protective film to bond the protective film to the conductive layer surface further includes:
and acquiring a time value of the extrusion force application, and stopping the application of the extrusion force when the time value is greater than or equal to a time threshold value.
Optionally, the conductive layer is a copper foil.
Optionally, the performing circuit forming on the conductive layer combined with the protective film includes:
attaching a photosensitive dry film to the conductive layer;
exposing the whole surface of the conductive layer;
and developing, etching and stripping the exposed conductive layer to form a circuit.
Optionally, the opening of the protective film includes:
and cutting the corresponding position of the protective film by using laser to form an opening exposing the conductive layer.
In a second aspect, the present invention provides a flexible circuit board produced using the flexible circuit board molding process of any one of the first aspects, comprising:
and the first side and the second side of the conductive layer are combined with a protective film, and the protective film is provided with an opening to expose the conductive layer to form a welding leg.
The invention has the beneficial effects that:
in the first aspect, when the flexible circuit board is manufactured, the conductive layer does not need to be drilled in advance, the protective film does not need to be punched in advance, the whole surface of the protective film is combined on the first side of the conductive layer, then a circuit is formed on the circuit board, then the protective film is combined on the whole surface of the second side of the conductive layer, and finally the solder fillets are formed by opening the protective film independently. With this flexible circuit board technology in the application process, not only need not the accurate counterpoint of protection film to the circuit board, effectively reduced the processing degree of difficulty, but also can make the opening process according to the size of actual leg, no longer need design extra compensation for the leg, still make the circuit in the arbitrary region on the circuit board all have the support that the protection film provided simultaneously when shaping, effectively reduced the broken possibility of circuit emergence, be favorable to improving the processingquality of flexible circuit board.
In the second aspect, the flexible circuit board produced by the flexible circuit board forming process does not need to be accurately positioned in the production process, so that the production difficulty can be greatly reduced, the solder leg is not required to be designed and compensated in advance, the fracture probability in the process of circuit forming can be effectively reduced, and the quality of the flexible circuit board is improved.
Drawings
FIG. 1 is a schematic flow chart of a flexible circuit board forming process according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a flexible circuit board molding process according to an embodiment of the present invention;
FIG. 3 is a schematic flow chart of the combination of protective films in the flexible circuit board forming process according to the embodiment of the invention;
fig. 4 is a schematic diagram of a process for laminating and attaching a protective film in a flexible circuit board forming process according to an embodiment of the invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
The embodiment of the invention discloses a flexible circuit board forming process and a flexible circuit board. The flexible circuit board in this embodiment is a simple dual-contact flexible circuit board, i.e. soldering legs are provided on both the upper and lower sides of the conductive layer.
Referring to fig. 1 and 2, the flexible circuit board molding process includes:
step S1: the conductive layer is obtained and a protective film is bonded on the first side of the conductive layer to cover the first side.
Specifically, the conductive layer may be copper foil or other conductive material that meets the requirements. The conducting layer is cut into specific size according to the manufacturing requirement of the flexible circuit board, the protective film is directly combined on the first side of the conducting layer, no circuit is formed on the conducting layer at the moment, and the size and the shape of the protective film are consistent with those of the conducting layer so as to cover the whole surface of the first side of the conducting layer, namely the protective film is combined on the whole surface of the first side of the conducting layer. The protective film is made of a polyester imide material, one side of the protective film, which is close to the conductive layer, is provided with a glue layer, and the glue layer can be made of an epoxy resin material.
Step S2: and (3) performing circuit forming on the conductive layer combined with the protective film.
After the first side of the conductive layer is combined with the protective film, a circuit is formed on the conductive layer in a developing and etching mode, and the protective film covers the first side of the whole conductive layer at the moment, so that the circuit in each area of the conductive layer can be supported by the protective film during forming.
Step S3: and combining a protective film on the second side of the conducting layer with the circuit forming to cover the second side.
After the circuit is formed, a protective film is bonded on the second side of the conductive layer, and the bonding mode is exactly the same as that of the step S1. At the time of bonding, since the first side of the conductive layer is already bonded with the protective film, the second side of the conductive layer can be easily recognized, and the protective film can be quickly bonded on the second side of the conductive layer.
Step S4: the protective films on the first side and the second side of the conductive layer are respectively opened to expose the conductive layer so as to form soldering legs.
After the protective film is combined on the conductive layer, the adhesive layer between the protective film and the conductive layer flows uniformly, an opening is formed in the protective film in a mechanical mode or a laser mode, the opening is processed according to the size of the welding leg, extra design compensation is not needed, and the size of the welding leg is ensured to meet the requirement.
Through the steps S1 to S4, when the flexible circuit board is manufactured, the conductive layer does not need to be drilled in advance, the protective film does not need to be punched in advance, the whole surface of the protective film is combined on the first side of the conductive layer, then the circuit forming is performed on the circuit board, then the protective film is combined on the whole surface of the second side of the conductive layer, and finally the solder fillets are formed by singly opening the protective film, so that the single-layer double-contact flexible circuit board is formed. With this flexible circuit board shaping technology in the application process, not only need not the accurate counterpoint of protection film and circuit board, effectively reduced the processing degree of difficulty, but also can make the opening process according to the size of actual leg, no longer need design extra compensation for the leg, still have the support that the protection film provided when making the circuit shaping in arbitrary region on the circuit board simultaneously, effectively reduced the likelihood that the circuit takes place to break, be favorable to improving the processingquality of flexible circuit board.
Referring to fig. 3, optionally, the bonding protective film includes:
step S5: the protective film is cut according to the size of the conductive layer.
The size of the conductive layer depends on the processing size which needs to be met by the flexible circuit board, the flexible circuit board is cut in advance according to the requirement, and then the protective film is cut according to the size of the conductive layer, so that the size and the shape of the protective film can be matched with the conductive layer, and the protective film can be covered to the whole surface of the conductive layer when the flexible circuit board is attached.
Step S6: and (3) flatly paving the cut protective film on the first side or the second side of the conductive layer.
Tiling the protective film can align the protective film with the conductive layer, that is, ensure that the edge of the protective film corresponds to the edge of the conductive layer, and simultaneously can reduce the air amount contained between the protective film and the conductive layer, so that the protective film and the conductive layer can be combined together later.
Step S7: and applying pressure to the conductive layer paved with the protective film to bond the protective film to the surface of the conductive layer.
After the protective film is flatly paved on the surface of the conductive layer, the protective film and the conductive layer are sent into a special combination platform, and the protective film can be combined on the first side or the second side of the conductive layer by applying pressure and raising the temperature, so that the bonding of the protective film can be completed.
Through the steps S5 to S7, the protective film is cut according to the size of the conductive layer, then the protective film is tiled on the conductive layer, so that the edge of the protective film corresponds to the edge of the conductive layer, and the protective film is smoothly combined on the first side and the second side of the conductive layer by applying pressure, so that the protective film can cover the whole surface of the conductive layer after being combined.
Referring to fig. 4, optionally, the step S7 includes:
step S71: and sending the conducting layer paved with the protective film into the pressing space, and applying pressing force to the protective film and the conducting layer to press the protective film and the conducting layer together.
Before the protective film is combined, the conductive layer is sent into a pressing space of the pressing device, a special pressing structure is arranged in the pressing space, and the pressing structure can apply two opposite forces to the upper side and the lower side of the conductive layer simultaneously as pressing force so as to press the protective film and the conductive layer together, so that the protective film and the conductive layer are prevented from being separated. The specific pressing structure can refer to the prior art, and the magnitude of the pressing force generated by the specific pressing structure can be controlled according to the temperature of the actual pressing space and the combination condition of the protective film and the conductive layer, which is not limited by the invention.
Step S72: after the lamination of the protective film and the conductive layer is completed, the protective film and the conductive layer are sent into the lamination space, and extrusion force is applied to the protective film and the conductive layer so as to combine the protective film and the conductive layer together.
After the protection film pressfitting is on the conducting layer, the protection film is fixed with the conducting layer together, but the combination degree of the protection film and the conducting layer is lower, so that the conducting layer is sent into the laminating space of the laminating device, a laminating structure is arranged in the laminating space, the laminating structure can generate extrusion force with the same direction and the same laminating force, and the extrusion force is greater than the laminating force. The specific bonding structure can also refer to the prior art, the generated extrusion force is adjusted according to the temperature of the actual bonding space and the bonding condition of the protective film and the conductive layer, and the invention is not limited to the above. It should be understood that the bonding space and the pressing space may be the same space, that is, the bonding device and the pressing device are the same device, so as to save the cost of implementing the flexible circuit board forming process, and of course, different bonding devices and pressing devices may be set according to different requirements, so as to ensure that the bonding effect of the protective film and the conductive layer is better.
Through the above steps S71 and S72, when the protective film is bonded, the protective film and the conductive layer are first pre-pressed by using the pressing force to press them together, so as to ensure that they are not easily separated. And then the two are extruded by utilizing extrusion force, so that the two can be completely combined together to smoothly combine the protective film on the surface of the conductive layer.
Optionally, the step S7 further includes:
and heating the pressing space while applying pressure to the protective film and the conductive layer so that the temperature value of the pressing space is within a preset pressing temperature range.
Because there is the glue film between protection film and the conducting layer, make pressfitting space temperature rise through heating, can make the glue film melt gradually, cooperate the pressure force just can firmly adhere the protection film on the surface of conducting layer again. The specific temperature preset range can be designed according to the actual pressing requirement, and in this embodiment, the temperature preset range can be 70 ℃ to 90 ℃, preferably 80 ℃, that is, the temperature value of the pressing space is kept at about 80 ℃.
Optionally, the step S7 further includes:
and when the extrusion force is applied to the protective film and the conductive layer, the bonding space is heated so that the temperature value of the bonding space is within the bonding temperature preset range.
In order to enable the protective film to be better combined with the conductive layer, the protective film needs to be effectively melted through heating to enable the adhesive layer to be effectively melted, the adhesive layer can be heated when extrusion force is applied, the adhesive layer can be effectively melted when the temperature of the adhesive layer is heated to be within a preset range of the adhesive temperature, and then the adhesive layer is matched with the applied extrusion force, so that the protective film can be combined on the surface of the conductive layer. In this embodiment, the temperature preset range may be between 170 ℃ and 190 ℃, preferably 180 ℃, i.e. the temperature value of the bonding space is kept around 180 ℃.
Optionally, the step S7 further includes:
and acquiring a time value of the extrusion force application, and stopping the extrusion force application when the time value is greater than or equal to a time threshold value.
In order to ensure effective bonding of the protective film and the conductive layer, the application of the pressing force needs to be maintained for a period of time, and the time threshold may be set according to the magnitude of the pressing force, the temperature of the bonding space, and the dimensions of the conductive layer and the protective film, and in this embodiment, the time threshold is set to 180 seconds, that is, when the time value of the application of the pressing force is greater than or equal to 180 seconds, the application of the pressing force is stopped. In other embodiments, when the factors such as the magnitude of the extrusion force are changed, the time threshold may be correspondingly adjusted, so as to ensure that the protective film and the conductive layer are effectively combined.
Optionally, the step S2 includes: attaching a photosensitive dry film to the conductive layer; exposing the whole surface of the conductive layer; and developing, etching and stripping the exposed conductive layer to form a circuit. The specific photosensitive dry film can be attached, exposed and developed, etched and removed by referring to the prior art, and the film is different from the prior art in that the film is not required to correspond to the punching position of the protective film during exposure, the whole surface of the conductive layer is directly exposed, dislocation can not occur during exposure, and the efficiency of exposure operation is improved.
Optionally, the opening of the protective film includes: and cutting the corresponding position of the protective film by using laser to form an opening exposing the conductive layer.
After the second surface of the conductive layer is combined with the protective film, the protective film is removed at a corresponding position by using a picosecond laser device to form an opening exposing the conductive layer so as to form a welding leg, and the situation of glue overflow can be further reduced by laser cutting, so that the opening size of the protective film is ensured to be in accordance with the size of the welding leg, and the design compensation in advance is not needed.
The flexible circuit board is produced by the flexible circuit board forming process in the embodiment, and the flexible circuit board comprises a conductive layer. The first side and the second side of the conductive layer are both combined with a protective film, and the protective film is provided with an opening to expose the conductive layer to form a welding leg.
The flexible circuit board produced by the flexible circuit board forming process does not need to be accurately positioned in the production process, so that the production difficulty can be greatly reduced, the solder leg design compensation is not needed in advance, the fracture probability during circuit forming can be effectively reduced, and the quality of the flexible circuit board is improved.
It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the invention. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (10)
1. The flexible circuit board forming process is characterized by comprising the following steps:
acquiring a conductive layer and bonding a protective film on a first side of the conductive layer to cover the first side;
performing circuit forming on the conductive layer combined with the protective film;
bonding a protective film to the second side of the conductive layer on which the circuit forming is completed to cover the second side;
and opening the protective films on the first side and the second side of the conductive layer respectively to expose the conductive layer so as to form welding pins.
2. The flexible circuit board molding process of claim 1, wherein the bonding protection film comprises:
cutting the protective film according to the size of the conductive layer;
tiling the cut protective film on the first side or the second side of the conductive layer;
and applying pressure to the conductive layer tiled with the protective film to bond the protective film to the surface of the conductive layer.
3. The flexible circuit board molding process of claim 2, wherein said applying pressure to said conductive layer tiled with said protective film to bond the protective film to said conductive layer surface comprises:
sending the conducting layer flatly paved with the protective film into a pressing space, and applying pressing force to the protective film and the conducting layer to press the protective film and the conducting layer together;
and after the protective film and the conductive layer are laminated, sending the protective film and the conductive layer into a laminating space, and applying extrusion force to the protective film and the conductive layer to bond the protective film and the conductive layer together.
4. The flexible circuit board molding process of claim 3, wherein said applying pressure to said conductive layer tiled with said protective film to bond the protective film to said conductive layer surface further comprises:
and heating the pressing space while applying pressure to the protective film and the conductive layer so that the temperature value of the pressing space is within a preset pressing temperature range.
5. The flexible circuit board molding process of claim 3, wherein said applying pressure to said conductive layer tiled with said protective film to bond the protective film to said conductive layer surface further comprises:
and heating the bonding space while applying extrusion force to the protective film and the conductive layer so that the temperature value of the bonding space is within a bonding temperature preset range.
6. The flexible circuit board molding process of claim 3, wherein said applying pressure to said conductive layer tiled with said protective film to bond the protective film to said conductive layer surface further comprises:
and acquiring a time value of the extrusion force application, and stopping the application of the extrusion force when the time value is greater than or equal to a time threshold value.
7. The flexible circuit board molding process according to any one of claims 1 to 6, wherein the conductive layer is a copper foil.
8. The flexible circuit board molding process according to any one of claims 1 to 6, wherein the line molding of the conductive layer to which the protective film is bonded includes:
attaching a photosensitive dry film to the conductive layer;
exposing the whole surface of the conductive layer;
and developing, etching and stripping the exposed conductive layer to form a circuit.
9. The flexible circuit board molding process according to any one of claims 1 to 6, wherein the opening of the protective film includes:
and cutting the corresponding position of the protective film by using laser to form an opening exposing the conductive layer.
10. Flexible circuit board, characterized in that it is produced by applying the flexible circuit board molding process according to any one of claims 1 to 9, comprising:
and the first side and the second side of the conductive layer are combined with a protective film, and the protective film is provided with an opening to expose the conductive layer to form a welding leg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410121055.1A CN117835582A (en) | 2024-01-29 | 2024-01-29 | Flexible circuit board forming process and flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410121055.1A CN117835582A (en) | 2024-01-29 | 2024-01-29 | Flexible circuit board forming process and flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117835582A true CN117835582A (en) | 2024-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410121055.1A Pending CN117835582A (en) | 2024-01-29 | 2024-01-29 | Flexible circuit board forming process and flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117835582A (en) |
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2024
- 2024-01-29 CN CN202410121055.1A patent/CN117835582A/en active Pending
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