CN117769143A - Depth control method of non-metallized groove and preparation method of isolator - Google Patents
Depth control method of non-metallized groove and preparation method of isolator Download PDFInfo
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- CN117769143A CN117769143A CN202311834950.XA CN202311834950A CN117769143A CN 117769143 A CN117769143 A CN 117769143A CN 202311834950 A CN202311834950 A CN 202311834950A CN 117769143 A CN117769143 A CN 117769143A
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- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000002360 preparation method Methods 0.000 title abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 148
- 239000011889 copper foil Substances 0.000 claims abstract description 141
- 238000005530 etching Methods 0.000 claims abstract description 48
- 230000004888 barrier function Effects 0.000 claims abstract description 23
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 238000000059 patterning Methods 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000010000 carbonizing Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000003801 milling Methods 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000003754 machining Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 229910001882 dioxygen Inorganic materials 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
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- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The invention provides a depth control method of a non-metallized groove and a preparation method of an isolator, which comprises the following steps: pressing the first core board and the copper foil through the prepreg; patterning the copper foil to form a copper foil pattern which is matched with the shape of the non-metallized groove; laminating the second core plate and one side of the copper foil far away from the first core plate, so that the non-metallized grooves in the second core plate are overlapped with the copper foil patterns; using the copper foil pattern as an etching barrier layer, and performing laser control on the second core plate to form a non-metallized groove; etching to remove the copper foil pattern. According to the depth control method for the non-metallized groove, the copper foil pattern is preset at the bottom of the second core plate, then the copper foil pattern is used as an etching barrier layer for laser control depth, the non-metallized groove can be accurately formed, the depth control precision of the dense non-metallized groove and the distance from the bottom of the non-metallized groove to the circuit layer can be effectively met, products with the thickness of not less than 0.05mm can be processed, and mass production of the products can be achieved.
Description
Technical Field
The invention relates to the technical field of non-metallized groove formation, in particular to a depth control method of a non-metallized groove and a preparation method of an isolator.
Background
Special through holes and bonding pads are designed on the peripheral edges of the dense non-metallized grooves, the non-metallized grooves are designed mainly for meeting the requirement of flat installation of special-shaped devices, and the thickness of a medium between the bottom of each non-metallized groove and a circuit bonding pad of an adjacent layer is less than or equal to 0.10mm because the size of the product is smaller, so that the requirements on the depth control precision and the dimensional processing precision of the non-metallized grooves are extremely high (tolerance + -0.05 mm), and the non-metallized grooves are processed in a mode of depth control milling and manual uncovering after pressing is usually adopted in the industry at present.
Because the thickness of the medium between the bottom of the non-metallized groove and the circuit bonding pad of the adjacent layer is less than or equal to 0.10mm, the depth control milling mode is adopted, and the thickness of the medium is generally more than or equal to 0.20mm, the direct depth control milling cannot meet the requirements of the ultrathin structure, otherwise, the problems of poor connection and insufficient depth of the non-metallized groove are easily caused when the depth control milling is too shallow, and the reliability risks such as short circuit and the like are easily caused when the line at the bottom is damaged when the depth control milling is too deep.
When the nonmetallic step groove is processed, the conventional non-gumming PP+pre-milling groove+uncovering mode after pressing is adopted, the depth control precision of the step groove can be controlled, but because the type of product is a high-density nonmetallic groove product, the width of each PCS groove is 20 x 20mm, 120-150 grooves are formed in one Set, bonding pads and through holes are designed at the peripheral edges of the grooves, the distance between the bonding pads and the through holes and the step edge is less than or equal to 0.10mm, and the non-gumming PP is adopted for pressing after milling the groove, so that the liquid medicine is easy to seep after drilling due to the fact that the through holes are too close, and the connection reliability of the product is affected.
Disclosure of Invention
In order to overcome the problems in the related art, one of the purposes of the invention is to provide a depth control method of a non-metallized groove, wherein a copper foil pattern is preset at the bottom of a second core board, and then the copper foil pattern is used as an etching barrier layer for laser depth control, so that the non-metallized groove can be precisely formed, the depth control precision of the dense non-metallized groove and the distance from the bottom of the non-metallized groove to a circuit layer can be effectively satisfied to be larger than or equal to 0.05mm, and the mass production of the product can be realized.
In order to achieve the above purpose, the present application adopts the following technical scheme: a method for controlling the depth of a non-metallized groove, comprising:
pressing the first core board and the copper foil through the prepreg;
patterning the copper foil to form a copper foil pattern which is matched with the shape of the non-metallized groove;
laminating the second core plate and one side of the copper foil far away from the first core plate, so that the non-metallized grooves in the second core plate are overlapped with the copper foil patterns;
using the copper foil pattern as an etching barrier layer, and performing laser control on the second core plate to form a non-metallized groove;
etching to remove the copper foil pattern.
Further, the cross-sectional area of the copper foil pattern is larger than the cross-sectional area of the non-metallized groove, and the non-metallized groove is completely overlapped with the copper foil pattern in the direction perpendicular to the plane of the copper foil pattern.
Further, the edges of the copper foil patterns are widened by 0.1-0.3mm in each dimension parallel to the direction of the pressing surface based on the edges of the non-metallized grooves.
Further, when the depth of the non-metallized groove is less than or equal to 0.2mm, the second core board is subjected to laser control by taking the copper foil pattern as an etching barrier layer to form the non-metallized groove.
Further, when the depth of the non-metallized groove is greater than 0.2mm, mechanically controlling the depth of the non-metallized groove in the second core plate until the distance from the bottom of the initial groove formed by mechanically controlling the depth to the copper foil pattern is less than or equal to 0.2mm, and using the copper foil pattern as an etching barrier layer, and performing laser control on the initial groove to form the non-metallized groove.
Further, after the first core plate and the copper foil are pressed through the prepreg, the minimum distance between the copper foil and the first core plate is more than or equal to 0.05mm.
Further, the laser depth control further comprises: and cleaning carbide on the surface of the copper foil pattern by using plasma, wherein the carbide refers to sundries remained after carbonizing semi-cured glue in a non-metallized groove in the laser depth control process.
Further, etching to remove the copper foil pattern includes: and etching to remove the copper foil pattern inside the non-metallized groove.
Further, after etching to remove the copper foil pattern, the method further comprises: and fixing the components in the non-metallized grooves, wherein the height of the components is smaller than or equal to the height of the non-metallized grooves.
It is a second object of the present application to provide a method for preparing an isolator, comprising a method for controlling the depth of a non-metallized groove as described above.
The beneficial effects of the invention are as follows:
according to the depth control method of the non-metallized groove, the first core board and the copper foil are pressed through the prepreg; patterning the copper foil to form a copper foil pattern matched with the shape of the non-metallized groove; then pressing the second core plate and one side of the copper foil far away from the first core plate, so that the non-metallized groove in the second core plate is overlapped with the copper foil pattern; using the copper foil pattern as an etching barrier layer, and performing laser control on the second core plate to form a non-metallized groove; finally etching to remove the copper foil pattern; the copper foil pattern is used as an etching barrier layer of the laser control depth, so that the precision of the laser control depth can be ensured, the mechanical control depth can not be influenced by the machining precision as in the prior art, and the bottom position of the non-metallized groove can not be accurately defined within the size range smaller than the machining precision; the method can effectively meet the requirements of depth control precision of the dense non-metallized grooves and the distance from the bottom of the non-metallized grooves to the circuit layer, can be used for processing products with the thickness of not less than 0.05mm, and can realize mass production of the products.
The preparation method of the isolator comprises the depth control method of the non-metallized groove, and the size and the position of the non-metallized groove can be accurately defined by adopting the depth control method, so that the accuracy and the performance of an isolator product are improved.
Drawings
Fig. 1 is a schematic structural diagram of the first core board and the copper foil after lamination;
fig. 2 is a schematic flow chart of the processing method in example 3 of the present application.
Reference numerals:
1. a first core plate; 2. a second core plate; 3. copper foil; 4. a non-metallized groove; 5. and (5) gumming PP.
Detailed Description
Preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
Example 1
The application provides a depth control method of a non-metallized groove, which comprises the following steps:
pressing the first core board and the copper foil through the prepreg;
patterning the copper foil to form a copper foil pattern which is matched with the shape of the non-metallized groove;
laminating the second core plate and one side of the copper foil far away from the first core plate, so that the non-metallized grooves in the second core plate are overlapped with the copper foil patterns;
using the copper foil pattern as an etching barrier layer, and performing laser control on the second core plate to form a non-metallized groove;
etching to remove the copper foil pattern.
The method comprises the steps of firstly laminating a first core board and copper foil through a prepreg; patterning the copper foil to form a copper foil pattern matched with the shape of the non-metallized groove; then pressing the second core plate and one side of the copper foil far away from the first core plate, so that the non-metallized groove in the second core plate is overlapped with the copper foil pattern; using the copper foil pattern as an etching barrier layer, and performing laser control on the second core plate to form a non-metallized groove; finally etching to remove the copper foil pattern; the copper foil pattern is used as an etching barrier layer of the laser control depth, so that the precision of the laser control depth can be ensured, the mechanical control depth can not be influenced by the machining precision as in the prior art, and the bottom position of the non-metallized groove can not be accurately defined within the size range smaller than the machining precision; the method can effectively meet the requirements of depth control precision of the dense non-metallized grooves and the distance from the bottom of the non-metallized grooves to the circuit layer, can be used for processing products with the thickness of not less than 0.05mm, and can realize mass production of the products.
Example 2
The application provides a depth control method of a non-metallized groove 4, which comprises the following steps:
s1: pressing the first core board 1 and the copper foil 3 through the prepreg; the first core board 1 may be understood as an inner core board, and the manufacturing of the first core board 1 is completed according to a conventional processing flow. The first core board 1 comprises a plurality of layers of PCB boards and semi-cured glue between adjacent PCB boards, and an inner layer pattern and a bonding pad structure are formed inside the first core board 1.
This step treats the finally formed first core plate 1 as a whole. When the first core board 1 and the copper foil 3 are pressed, the semi-cured adhesive placed between the first core board 1 and the copper foil 3 is gummed PP5, the gummed PP5 has better fluidity in the pressing process, and the gap between the copper foil 3 and the first core board 1 can be filled, so that better isolation between the copper foil 3 and the bonding pad and the inner layer graph in the first core board 1 is realized.
The thickness of the gumming PP5 in this step may be determined according to the distance between the copper foil 3 and the upper surface of the first core board 1 after lamination, and preferably, the present application may set the thickness of the gumming PP5 such that the minimum distance between the copper foil 3 and the first core board 1 after lamination is greater than or equal to 0.05mm. In the prior art, the machining precision of the mechanical depth control is about 0.05mm, so that when the depth of the non-metallized groove 4 is large and the non-metallized groove 4 is formed by the mechanical depth control, the thickness of a dielectric layer between the first core plate 1 and the second core plate 2 is larger than the depth control precision, and the phenomenon of over etching is avoided.
In the prior art, the non-gumming PP is adopted for lamination, and because the uncovering treatment is needed after the pre-milling of the groove in the prior art, the position of the non-gumming PP is relatively fixed, and the uncovering treatment is convenient. In the application, a laser control deep mode is adopted to form a non-metallized groove with accurate size, and the follow-up uncovering treatment is not performed any more. In the laser control deep method, the gap between the copper foil 3 and the first core board 1 can be fully filled by adopting the gumming PP, so that better isolation between the copper foil 3 and the bonding pad and the inner layer pattern in the first core board 1 is realized.
The minimum distance between the copper foil 3 and the first core plate 1 after lamination is set to be greater than or equal to 0.05mm, the volume of a product formed by the first core plate 1 and the second core plate 2 after lamination is smaller, and the product volume is reduced while the depth control precision is ensured.
S2: the copper foil 3 is patterned to form a copper foil pattern that is adapted to the shape of the non-metallized grooves 4.
The method can be realized by the following operation modes: and generating a copper foil pattern according to the method for forming the circuit pattern, pasting a dry film on the copper foil pattern, and etching to remove other copper foil 3 areas except for dry film protection.
In the present application, the position of the copper foil pattern is required to correspond to the position of the non-metallized groove 4, and the copper foil pattern extends outward by about 0.2mm in each direction at the position of the non-metallized groove 4. That is to say, the position of the copper foil pattern needs to be designed according to the position of the non-metallized groove 4, the cross-sectional area of the copper foil pattern is larger than that of the non-metallized groove 4, and the non-metallized groove 4 and the copper foil pattern are completely overlapped in the direction perpendicular to the plane of the copper foil pattern; the cross-sectional area here refers to the cross-sectional area in the horizontal direction of the non-metallized grooves 4 and the copper foil pattern in the structure shown in fig. 1.
The edges of the finally formed copper foil pattern are widened by 0.1-0.3mm in each dimension parallel to the direction of the bonding surface with reference to the edges of the non-metallized grooves 4. Therefore, in the subsequent laser depth control process, the copper foil pattern is required to be used as an etching barrier layer, so that the size of the copper foil pattern is larger than that of the non-metallized groove 4, the copper foil pattern can be ensured to form the etching barrier layer at each position, and the over etching of the area which is not covered by the copper foil pattern in the laser depth control process is avoided.
S3: and pressing the second core plate 2 and one side of the copper foil 3 away from the first core plate 1, so that the non-metallized grooves 4 in the second core plate 2 are overlapped with the copper foil patterns. The second core board 2 is formed by laminating a plurality of PCB boards.
The second core board 2 may be understood as an outer core board including a plurality of PCB boards and a semi-cured layer between the PCB boards. It should be noted that, when the second core board 2 and the copper foil pattern are pressed together, the edges of the copper foil pattern are wrapped in the adhesive PP5, so that the copper foil pattern in the product is located below the first core board 1 after pressing, and thus a non-metallized groove 4 penetrating the first core board 1 can be formed.
S4: and (3) taking the copper foil pattern as an etching barrier layer, and performing laser control on the second core plate 2 to form a non-metallized groove 4. Specifically, when the depth of the non-metallized groove 4 is less than or equal to 0.2mm, the second core board 2 is excited to a depth by using the copper foil pattern as an etching barrier layer, so as to form the non-metallized groove 4.
When the depth of the non-metallized groove 4 is larger than 0.2mm, mechanically controlling the depth of the non-metallized groove 4 in the second core plate 2 until the distance from the bottom of the initial groove formed by the mechanically controlled depth to the copper foil pattern is smaller than or equal to 0.2mm, and using the copper foil pattern as an etching barrier layer, and performing laser control on the initial groove to form the non-metallized groove 4.
When the depth of the non-metallized groove 4 is large, a mechanical depth control method is needed, namely, a mechanical milling machine is adopted to process the first core plate 1 to form an initial groove, and the distance from the bottom of the initial groove to the copper foil pattern is less than or equal to 0.2mm. The method of mechanical depth control and laser depth control is adopted firstly, the forming speed of the nonmetallic sliding groove can be increased, the speed of forming the nonmetallic sliding groove by mechanical depth control is high, but the machining precision is affected by a machining tool, and a certain error exists. When the distance from the bottom of the initial groove to the copper foil pattern is less than or equal to 0.2mm, the first core plate 1 can be removed by laser at a high speed by switching to laser depth control.
The frequency and the wavelength of laser are controlled, the fact that the laser cannot penetrate through the copper foil 3 is guaranteed, carbonization removal can only be carried out on the first core board 1 above the copper foil 3, copper foil patterns are used as etching barrier layers, and the non-metallized groove 4 with accurate size is formed.
When the depth of the non-metallized groove 4 is smaller, the step of mechanically controlling the depth can be omitted, and the non-metallized groove 4 is directly formed by adopting a laser etching method.
The application uses the special high-efficiency laser control depth parameter to control the depth processing of the non-metallized groove 4, and the PP resin at the step groove position is carbonized completely. The parameters of laser depth control in the present application are shown in table 1.
After the laser depth control is finished, slicing can be carried out on the formed pressed product, and a 100-time mirror is adopted to confirm whether the prepreg remains at the position of the non-metalized groove 4. Specifically, the section of the non-metallized groove 4 may be observed by slicing the non-metallized groove 4 in the depth direction. Different sections of the non-metallized grooves 4 can also be sliced to determine whether there is any residual gumming PP5 on each section.
TABLE 1 efficient laser depth control processing parameters
S5: and cleaning carbide on the surface of the copper foil pattern by using plasma, wherein the carbide refers to sundries remained after carbonizing semi-cured glue in a non-metallized groove in the laser depth control process. That is, after laser depth control, plasma is used for carrying out secondary cleaning on carbonized foreign matters on the bottom copper surface, so that a non-metallized groove is conveniently obtained by subsequent etching.
In this embodiment, specific parameters for cleaning carbide on the surface of the copper foil pattern by plasma include:
the first stage: the power is 3.0-5.0KW, preferably 4.0KW, and the time is 60-80min, preferably 70min; the temperature is 80-100 °, preferably 90 °; oxygen gas 1.0-3.0/min, preferably 2.0/min; the nitrogen gas is 0.2-0.4/min, preferably 0.3/min.
The first stage: the power is 3.0-5.0KW, preferably 4.0KW, and the time is 30-50min, preferably 40min; the temperature is 80-100 °, preferably 90 °; oxygen gas 1.0-3.0/min, preferably 1.85/min; nitrogen gas 0.2-0.4/min, preferably 0.22/min; CF (compact flash) 4 The gas is 0.1-0.3/min, preferably 0.13/min.
The first stage: the power is 3.0-5.0KW, preferably 4.0KW, and the time is 20-40min, preferably 30min; the temperature is 80-100 °, preferably 95 °; oxygen gas 0.2-0.4/min, preferably 0.3/min; the nitrogen gas is 1.0-3.0/min, preferably 2.0/min.
Specifically, specific parameters for cleaning carbide on the surface of the copper foil pattern by plasma include:
the first stage: the power is 4.0KW, and the time is 70min; the temperature is 90 degrees; oxygen gas 2.0/min; nitrogen gas 0.3/min.
The first stage: the power is 4.0KW, and the time is 40min; the temperature is 90 degrees; oxygen gas 1.85/min; nitrogen gas 0.22/min; CF (compact flash) 4 The gas is 0.13/min.
The first stage: the power is 4.0KW, and the time is 30min; the temperature is 95 degrees; oxygen gas 0.3/min; nitrogen gas 2.0/min.
S6: etching to remove the copper foil pattern. The copper foil pattern inside the non-metallized tank 4 is etched away immediately.
And transferring the outer layer circuit pattern of the finished product, wherein the outer layer pattern data is required to be windowed according to the position of the non-metallized groove 4, and the windowed size is manufactured according to the length and width of the non-metallized groove 4, so that the copper foil pattern at the bottom of the non-metallized groove 4 is convenient to etch during etching, and the high-precision non-metallized step groove is obtained. That is, the present application can combine the process of removing the copper foil pattern with the process of forming the outer layer wiring in the first core board 1, and in the process of forming the outer layer wiring, the copper foil pattern is removed, so that the removal efficiency and the outer layer wiring preparation efficiency can be improved.
S7: and fixing the components inside the non-metallized grooves 4, wherein the height of the components is smaller than or equal to the height of the non-metallized grooves 4.
According to the method, when the depth of the non-metallized groove 4 is less than or equal to 0.2mm, a copper foil pattern, laser depth control and acid etching mode are preset at the bottom, and the efficient laser depth control parameters and the plasma photoresist removing method are combined, so that the depth control precision of the dense non-metallized groove 4 and the distance from the bottom of the non-metallized groove 4 to a circuit layer can be effectively met, products with the depth of not less than 0.05mm can be processed, and the mass production of the products can be realized.
When the depth of the non-metallized groove 4 is more than or equal to 0.2mm, a copper foil pattern, mechanical depth control milling, laser control depth and acid etching mode are adopted at the bottom, and then the efficient laser depth control parameters and the plasma photoresist removing method are combined, so that the depth control precision of the dense non-metallized groove 4 and the distance from the bottom of the non-metallized groove 4 to a circuit layer can be effectively met, products with the depth of more than or equal to 0.05mm can be processed, and mass production of the products can be realized.
Example 3
A method of making a separator comprising:
the substrate and the gumming PP are subjected to material cutting, and material cutting operation can be specifically performed according to the laminated structure and the engineering MI size and quantity requirements.
Baking: the parameters of the baking sheet are as follows: baking at 150deg.C for 2-4 hr.
Inner layer pretreatment: and coarsening and cleaning the copper surface by adopting an inner layer coarsening mode.
And (3) inner layer circuit manufacturing: and (3) pasting a dry film on the two sides, performing pattern transfer according to the MI inner layer circuit file by adopting an LDI laser imaging mode, and developing to obtain an inner layer circuit pattern.
And (3) inner layer etching: and (3) selecting matched parameters for etching according to the thickness of the MI inner layer copper, and corroding the copper surface without the protection of the dry film.
Inner layer film stripping: and after the inner layer is etched, removing the surface dry film by a horizontal film removing machine.
And (3) inner layer corrosion detection: and removing the protective frame, and then checking the etched and film-removed inner line by using an AOI machine.
And (3) pressing for the first time: pressing the first core board and the copper foil through the prepreg; the copper foil thickness was 18 μm.
And patterning the copper foil to form a copper foil pattern which is matched with the shape of the non-metallized groove.
And (3) pressing for the second time: and pressing the second core plate and one side of the copper foil far away from the first core plate, so that the non-metallized grooves in the second core plate are overlapped with the copper foil patterns. Specifically, prestack is carried out according to the MI laminated structure, then riveting is carried out, and all encrypted tool holes on the plate edge are riveted during riveting.
Drilling/copper deposition/electroplating: processing and producing according to MI requirements;
an outer layer circuit: a dry film is stuck on the two sides, and pattern transfer is carried out by adopting an LDI laser imaging mode according to the MI external data file;
and (3) taking the copper foil pattern as an etching barrier layer, and performing laser control on the second core plate to form a non-metallized groove. Specifically, when the depth of the non-metallized groove is less than or equal to 0.2mm, the copper foil pattern is used as an etching barrier layer, and the second core plate is subjected to laser control to form the non-metallized groove.
And when the depth of the non-metallized groove is greater than 0.2mm, mechanically controlling the depth of the non-metallized groove in the second core plate until the distance from the bottom of the initial groove formed by the mechanically controlled depth to the copper foil pattern is less than or equal to 0.2mm, and using the copper foil pattern as an etching barrier layer to perform laser control on the initial groove to form the non-metallized groove.
And carbonizing the gumming PP at the position of the non-metallized groove by a laser machine. After the laser depth control is finished, slicing can be carried out on the formed pressed product, and a 100-time mirror is adopted to confirm whether the prepreg remains at the position of the non-metalized groove. Specifically, the section of the non-metallized groove may be observed by slicing the non-metallized groove along the depth direction of the non-metallized groove. Different sections of the non-metallized grooves can also be sliced to determine whether there is any residual flow PP on each section.
Plasma photoresist removal: and cleaning carbide on the surface of the copper foil pattern by using plasma, wherein the carbide refers to sundries remained after carbonizing semi-cured glue in a non-metallized groove in the laser depth control process. That is, after laser depth control, plasma is used for carrying out secondary cleaning on carbonized foreign matters on the bottom copper surface, so that a non-metallized groove is conveniently obtained by subsequent etching.
And (3) outer layer circuit manufacturing: and transferring the outer layer circuit pattern of the finished product, wherein the outer layer pattern data is required to be windowed according to the position of the non-metallized groove, the windowed size is manufactured according to the length, the width and the like of the non-metallized groove, and the copper foil pattern at the bottom of the non-metallized groove is convenient to corrode and etch during etching, so that the high-precision non-metallized step groove is obtained. That is, the present application can combine the process of removing the copper foil pattern with the process of forming the outer layer wiring in the first core board, and in the process of forming the outer layer wiring, the copper foil pattern is removed, so that the removal efficiency and the outer layer wiring preparation efficiency can be improved.
Etching: the copper at the bottom of the non-metallized groove is etched away.
And fixing the components in the non-metallized groove.
And processing into an isolator product, detecting, and removing defective products.
In addition, the terms "first", "second", etc. are used to define the components, and are merely for convenience of distinguishing the corresponding components, and unless otherwise stated, the terms have no special meaning, and thus should not be construed as limiting the scope of the present application.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method for controlling the depth of a non-metallized trench, comprising:
pressing the first core board and the copper foil through the prepreg;
patterning the copper foil to form a copper foil pattern which is matched with the shape of the non-metallized groove;
laminating the second core plate and one side of the copper foil far away from the first core plate, so that the non-metallized grooves in the second core plate are overlapped with the copper foil patterns;
using the copper foil pattern as an etching barrier layer, and performing laser control on the second core plate to form a non-metallized groove;
etching to remove the copper foil pattern.
2. The method of claim 1, wherein the cross-sectional area of the copper foil pattern is greater than the cross-sectional area of the non-metallized groove, and the non-metallized groove is completely coincident with the copper foil pattern in a direction perpendicular to the plane of the copper foil pattern.
3. A method for controlling the depth of a non-metallized groove according to claim 2, wherein the edge of the copper foil pattern is widened by 0.1-0.3mm in each dimension parallel to the direction of the bonding surface based on the edge of the non-metallized groove.
4. The method of claim 1, wherein when the depth of the non-metallized groove is less than or equal to 0.2mm, the second core board is laser controlled to be deep by using the copper foil pattern as an etching barrier layer to form the non-metallized groove.
5. The method for controlling the depth of a non-metallized groove according to claim 1, wherein when the depth of the non-metallized groove is greater than 0.2mm, the non-metallized groove in the second core board is mechanically controlled to be deep until the distance from the bottom of an initial groove formed by the mechanical depth control to the copper foil pattern is less than or equal to 0.2mm, and the copper foil pattern is used as an etching barrier layer, and the initial groove is excited to be deep to form the non-metallized groove.
6. The method according to claim 1, wherein after the first core board and the copper foil are laminated by the prepreg, the minimum distance between the copper foil and the first core board is greater than or equal to 0.05mm.
7. The method for controlling the depth of a non-metallized groove according to claim 1, wherein the laser depth control further comprises: and cleaning carbide on the surface of the copper foil pattern by using plasma, wherein the carbide refers to sundries remained after carbonizing semi-cured glue in a non-metallized groove in the laser depth control process.
8. The method of controlling the depth of a non-metallized trench of claim 1, wherein etching away the copper foil pattern comprises: and etching to remove the copper foil pattern inside the non-metallized groove.
9. The method of controlling the depth of a non-metallized trench of claim 8, further comprising, after etching away the copper foil pattern: and fixing the components in the non-metallized grooves, wherein the height of the components is smaller than or equal to the height of the non-metallized grooves.
10. A method of preparing a separator comprising a method of controlling the depth of a non-metallised trench according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311834950.XA CN117769143A (en) | 2023-12-28 | 2023-12-28 | Depth control method of non-metallized groove and preparation method of isolator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311834950.XA CN117769143A (en) | 2023-12-28 | 2023-12-28 | Depth control method of non-metallized groove and preparation method of isolator |
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| Publication Number | Publication Date |
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| CN117769143A true CN117769143A (en) | 2024-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311834950.XA Pending CN117769143A (en) | 2023-12-28 | 2023-12-28 | Depth control method of non-metallized groove and preparation method of isolator |
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| Country | Link |
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| CN (1) | CN117769143A (en) |
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- 2023-12-28 CN CN202311834950.XA patent/CN117769143A/en active Pending
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