CN117747511A - Semiconductor material handling system - Google Patents

Abstract

The present application provides a semiconductor materials handling system, the system comprising: the first main track, the second main track, the third main track and the fourth main track which are sequentially connected to form a loop; the two ends of the annular support rail are respectively connected with the first main rail and the third main rail through connecting rails; the first machine stations and the second machine stations are respectively arranged at two sides of the annular support rail; the special-shaped support rail comprises a main body part and extension parts which extend from two ends of the main body part to the direction perpendicular to the main body part; and the positions of the access ports of the third machines correspond to the positions of the main body part of the special-shaped support rail. The application provides a semiconductor material handling system for near the production facility of main track increases special-shaped stock rail alone, makes near the production facility of main track not be connected rather than with the main track with special-shaped stock rail connection, can alleviate the transportation burden of main track, improves whole conveying efficiency.

Description

Semiconductor material handling system

Technical Field

The present application relates to the field of semiconductor technology, and more particularly, to a semiconductor materials handling system.

Background

With the rapid development of the semiconductor industry, the utilization rate of crown block automation systems (Automated material handling system, AMHS) in wafer factories is gradually increasing. New plants built in recent years all adopt overhead travelling crane automation systems to replace the workshop internal logistics solutions of manual transportation. In factory building, the design of overhead traveling crane track has high correlation with the equipment layout in the factory, and the layout of equipment is influenced by various factors such as product type, factory shape, equipment technology generation and the like, and meanwhile, the demand of equipment for testing new technology generation products on overhead traveling crane transport capacity is gradually increased, so that the overhead traveling crane track with reasonable design plays a vital role in the equipment layout of a wafer factory.

In some current crown block track designs, production equipment adjacent to a main track can occupy the transportation capacity of the main track, so that the transportation efficiency is reduced. Therefore, it is necessary to provide a more effective and reliable technical solution to improve the rail transport efficiency of the crown block.

Disclosure of Invention

The application provides a semiconductor material handling system, can alleviate the transportation burden of main track, improves whole conveying efficiency.

The present application provides a semiconductor materials handling system, comprising: the first main track, the second main track, the third main track and the fourth main track which are sequentially connected to form a loop; the annular support rail is positioned in the loop, and two ends of the annular support rail are respectively connected with the first main rail and the third main rail through connecting rails; the first machine stations and the second machine stations are respectively arranged at two sides of the annular support rail; the special-shaped support rail comprises a main body part and extension parts, wherein the extension parts extend from two ends of the main body part to the direction perpendicular to the main body part, the main body part is close to the second main rail, and the extension parts are respectively connected to the first main rail and the third main rail; and the positions of the access ports of the third machines correspond to the positions of the main body part of the special-shaped support rail.

In some embodiments of the present application, the access ports of the third machine stations are located at one end of the third machine stations near the second main rail.

In some embodiments of the present application, the access ports of the third machine stations are located at an end of the third machine stations away from the second main rail.

In some embodiments of the present application, the direction in which the extension portion of the shaped track extends is a direction approaching the second main track.

In some embodiments of the present application, the direction in which the extension portion of the shaped track extends is a direction away from the second main track.

In some embodiments of the present application, the body portion of the shaped track has a length of 28000 to 30000 millimeters.

In some embodiments of the present application, the length of the extension of the shaped rail is 1000 to 1200 millimeters.

In some embodiments of the present application, a minimum distance between the plurality of third machine stations and the first main rail and the third main rail is 0.6 meters to 1 meter.

In some embodiments of the present application, the positions of the access ports of the third machines and the positions of the main body portion of the shaped support rail correspond to each other and include: the access ports of the third machine stations are located right below the main body portion of the special-shaped support rail.

In some embodiments of the present application, the plurality of first machine stations and the plurality of second machine stations are provided with access ports, and the access ports are respectively located right below the annular support rail.

The application provides a semiconductor material handling system for near the production facility of main track increases special-shaped stock rail alone, makes near the production facility of main track not be connected rather than with the main track with special-shaped stock rail connection, can alleviate the transportation burden of main track, improves whole conveying efficiency.

Drawings

The following figures describe in detail exemplary embodiments disclosed in the present application. Wherein like reference numerals refer to like structure throughout the several views of the drawings. Those of ordinary skill in the art will understand that these embodiments are non-limiting, exemplary embodiments, and that the drawings are for illustration and description purposes only and are not intended to limit the scope of the present application, other embodiments may equally well accomplish the intent of the invention in this application. It should be understood that the drawings are not to scale. Wherein:

FIG. 1 is a schematic diagram of a semiconductor material handling system;

fig. 2 is a schematic diagram of a semiconductor material handling system according to an embodiment of the present application.

Detailed Description

The following description provides specific applications and requirements to enable any person skilled in the art to make and use the teachings of the present application. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the application. Thus, the present application is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.

The technical scheme of the invention is described in detail below with reference to the examples and the accompanying drawings.

FIG. 1 is a schematic diagram of a semiconductor material handling system 100.

Referring to fig. 1, the semiconductor material handling system 100 includes: the first main rail 110, the second main rail 120, the third main rail 130, and the fourth main rail 140, which are sequentially connected to form a loop; the annular support rail 150 is located in the loop, and two ends of the annular support rail 150 are respectively connected with the first main rail 110 and the third main rail 130 through a connecting rail 151; the first machine 160 and the second machine 170 are respectively disposed at two sides of the annular support rail 150; the positions of the access ports 181 of the third machines 180 correspond to the positions of the second main rail 120.

The clean room layout requires placing the machine in a given building structure, and because of the various external dimensions of the machine, a single row of machines may occur at a position close to the main rail (or the ring rail, and the same). For example, referring to fig. 1, in the semiconductor material handling system 100, the position of the access port 181 on the third platform 180 closest to the second main rail 120 corresponds to the position of the second main rail 120, and the wafer handling process directly occurs between the third platform 180 and the second main rail 120. However, it is well known that in AMHS systems, the main track bears a greater transport pressure, and the third station 180 greatly reduces the transport capacity of the second main track 120 during wafer interaction with the second main track 120, thereby reducing the overall wafer transport efficiency. In the running process of the main track, the crown block should be kept running at high speed as much as possible, so as to avoid traffic jam, waiting and other conditions caused by frequent loading and unloading in the interaction process with the machine; the crown block running has three stages of acceleration, uniform speed and deceleration, and frequent traffic jam and waiting can greatly influence the crown block carrying capacity on the track.

To above-mentioned problem, this application provides a semiconductor material handling system, for the production facility that approaches the main track increases special-shaped stock rail alone, makes the production facility that approaches the main track not be connected with the main track but with special-shaped stock rail connection, can alleviate the transportation burden of main track, improves whole conveying efficiency.

Fig. 2 is a schematic diagram of a semiconductor material handling system 200 according to an embodiment of the present disclosure. The following describes in detail a semiconductor material handling system 200 according to an embodiment of the present application with reference to the accompanying drawings.

Embodiments of the present application provide a semiconductor material handling system, as shown with reference to fig. 2, comprising: a first main rail 210, a second main rail 220, a third main rail 230, and a fourth main rail 240, which are sequentially connected to form a loop; the annular support rail 250 is located in the loop, and two ends of the annular support rail 250 are respectively connected with the first main rail 210 and the third main rail 230 through a connecting rail 251; a plurality of first machine tables 260 and second machine tables 270 respectively disposed on two sides of the annular support rail 250; a shaped track 280, wherein the shaped track 280 comprises a main body portion and extension portions extending from two ends of the main body portion to a direction perpendicular to the main body portion, the main body portion is close to the second main track 220, and the extension portions are respectively connected to the first main track 210 and the third main track 230; and the positions of the access ports 291 of the third machines 290 correspond to the positions of the main body of the special-shaped support rail 280.

In the technical scheme of the application, the special-shaped support rail 280 is separately added for the third machine 290 adjacent to the second main rail 220, so that the third machine 290 adjacent to the second main rail 220 is not connected with the second main rail 220 but is connected with the special-shaped support rail 280, the transportation burden of the main rail can be reduced, and the overall transportation efficiency is improved.

Referring to fig. 2, the first main track 210, the second main track 220, the third main track 230 and the fourth main track 240 are used for transporting wafers, and belong to main tracks for carrying out trunk transportation. Among the loops formed by the first main rail 210, the second main rail 220, the third main rail 230 and the fourth main rail 240, the first machine 260, the second machine 270 and the third machine 280 are used for setting production equipment. It should be noted that, for the sake of brevity, only three sets of production machines are shown in this application, and in practice, more sets of production machines may be provided.

With continued reference to fig. 2, the annular support rail 250 and the shaped support rail 280 are used for transporting wafers, and belong to support rails (directly interacting with a machine) for transportation in a production interval (Bay). It should be noted that, for the sake of brevity, only one set of annular support rails 250 is shown in this application, and in fact, a greater number of annular support rails may be provided.

The two sides of the circular support rail 250 (the two sides refer to the side near the second main rail 220 and the side near the fourth main rail 240) are used to interact with the first machine 260 and the second machine 270, respectively.

Both ends of the ring-shaped support rail 250 (the both ends refer to an end near the first main rail 210 and an end near the third main rail 230) are connected to the first main rail 210 and the third main rail 230, respectively, through a connection rail 251.

In some embodiments of the present application, referring to fig. 2, the plurality of first machine tables 260 and the plurality of second machine tables 270 are respectively provided with an access port 261 and an access port 271, and the access port 261 and the access port 271 are respectively located directly below the annular support rail 250. The first and second stations 260 and 270 interact with the annular support rail 250 through the access ports 261 and 271 to perform wafer operation.

With continued reference to fig. 2, the shaped track 280 includes a main body portion adjacent to the second main rail 220 and extension portions extending from both ends of the main body portion in a direction perpendicular to the main body portion, and the extension portions are respectively connected to the first main rail 210 and the third main rail 230.

It should be noted that, referring to fig. 2, the main portion of the shaped support rail 280 refers to a portion of the track parallel to the second main track 220, that is, a portion of the track directly interacting with the third machine 290. The extended portion of the shaped track 280 refers to the portion of the track connecting the main body portion with the first main track 210 and the third main track 230, respectively, that is, the portion of the track parallel to the first main track 210. It should be noted that the location where the extension portion is connected to the first main rail 210 and the third main rail 230 is a ramp. The portion of the track parallel to the first main track 210 is omitted from the portion of the ramp.

In some embodiments of the present application, the main body portion of the shaped rail 280 has a length of 28000 to 30000 millimeters.

In some embodiments of the present application, the length of the extension of the shaped rail 280 is 1000 to 1200 millimeters. The length of the extension refers to the length of a single extension, rather than the sum of the lengths of the two extensions.

With continued reference to fig. 2, in some embodiments of the present application, the positions of the access ports 291 of the third machines 290 correspond to the positions of the main body portion of the shaped support rail 280, including: the access ports 291 of the third machines 290 are located directly below the main body of the shaped support rail 280. The third machines 290 interact with the main body of the special-shaped support rail 280 through the access ports 291 to perform wafer operation.

In some embodiments of the present application, the access ports 291 of the third plurality of machine stations 290 are located on the third plurality of machine stations 290 near one end of the second main rail 220 (i.e., the right end of the third machine station 290 in fig. 2), and the extending portion of the shaped support rail 280 extends in a direction away from the second main rail, i.e., in a direction to the left in fig. 2 (as shown in fig. 2). In this aspect, the connection point of the shaped track 280 and the first main track 210 is located between the connection point of the first main track 210 and the second main track 220 and the connection point of the first main track 210 and the annular track 250, and is further away from the connection point of the first main track 210 and the second main track 220 and the connection point of the first main track 210 and the annular track 250, so as not to interfere with the traveling of the crown block at the connection point of the first main track 210 and the second main track 220 and the connection point of the first main track 210 and the annular track 250.

In other embodiments of the present application, the access ports 291 of the third machines 290 are located at an end of the third machines 290 away from the second main rail 220 (i.e., the left end of the third machines 290 in fig. 2), and the extending portion of the shaped support rail 280 may extend in a direction approaching the second main rail 220 (a rightward direction in fig. 2) or in a direction away from the second main rail 220 (a leftward direction in fig. 2). In this embodiment, since the access ports 291 of the third machines 290 are located at one end of the third machines 290 away from the second main rail 220 (i.e., the left end of the third machine 290 in fig. 2), the distance between the third machines 290 and the second main rail 220 can be shortened, and the space utilization of the semiconductor material handling system described herein can be increased.

In some embodiments of the present application, the minimum distance between the third machine tables 290 and the first main rail 210 and the third main rail 230 is 0.6 m to 1 m, for example, 0.7 m, 0.8 m, or 0.9 m. This distance accommodates just the extension of the shaped track 280 without reducing the number of third stations 290 between the first main rail 210 and the third main rail 230 due to the increased extension of the shaped track 280. This distance cannot be too great, otherwise the number of third stations 290 between the first main rail 210 and the third main rail 230 is reduced; this distance must not be too small to accommodate the extension of the shaped track 280.

The application provides a semiconductor material handling system for near the production facility of main track increases special-shaped stock rail alone, makes near the production facility of main track not be connected rather than with the main track with special-shaped stock rail connection, can alleviate the transportation burden of main track, improves whole conveying efficiency.

In view of the foregoing, it will be evident to those skilled in the art after reading this application that the foregoing application may be presented by way of example only and may not be limiting. Although not explicitly described herein, those skilled in the art will appreciate that the present application is intended to embrace a variety of reasonable alterations, improvements and modifications to the embodiments. Such alterations, improvements, and modifications are intended to be within the spirit and scope of the exemplary embodiments of the present application.

It should be understood that the term "and/or" as used in this embodiment includes any or all combinations of one or more of the associated listed items. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present.

It will be further understood that the terms "comprises," "comprising," "includes" or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It will be further understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Thus, a first element in some embodiments could be termed a second element in other embodiments without departing from the teachings of the present application. Like reference numerals or like reference numerals designate like elements throughout the specification.

Furthermore, the present specification describes example embodiments by reference to idealized example cross-sectional and/or plan and/or perspective views. Thus, differences from the illustrated shapes, due to, for example, manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

Claims (10)

1. A semiconductor material handling system, comprising:

the first main track, the second main track, the third main track and the fourth main track which are sequentially connected to form a loop;

the annular support rail is positioned in the loop, and two ends of the annular support rail are respectively connected with the first main rail and the third main rail through connecting rails;

the first machine stations and the second machine stations are respectively arranged at two sides of the annular support rail;

the special-shaped support rail comprises a main body part and extension parts, wherein the extension parts extend from two ends of the main body part to the direction perpendicular to the main body part, the main body part is close to the second main rail, and the extension parts are respectively connected to the first main rail and the third main rail;

and the positions of the access ports of the third machines correspond to the positions of the main body part of the special-shaped support rail.

2. The semiconductor material handling system of claim 1, wherein the access ports of the third plurality of stations are located at an end of the third plurality of stations proximate the second main rail.

3. The semiconductor material handling system of claim 1, wherein the access ports of the third plurality of stations are located at an end of the third plurality of stations remote from the second main rail.

4. The semiconductor material handling system of claim 1, wherein the extension of the shaped support rail extends in a direction proximate the second main rail.

5. The semiconductor material handling system of claim 1, wherein the extension of the shaped support rail extends in a direction away from the second main rail.

6. The semiconductor material handling system of claim 1, wherein the body portion of the shaped rail has a length of 28000 to 30000 millimeters.

7. The semiconductor material handling system of claim 1, wherein the length of the extension of the shaped rail is between 1000 and 1200 millimeters.

8. The semiconductor material handling system of claim 1, wherein the minimum distance between the third stations and the first and third main rails is between 0.6 meters and 1 meter.

9. The semiconductor material handling system of claim 1, wherein the locations of the access ports of the third plurality of stations correspond to the locations of the body portions of the shaped support rails comprising: the access ports of the third machine stations are located right below the main body portion of the special-shaped support rail.

10. The semiconductor material handling system as recited in claim 1, wherein the plurality of first and second stations are provided with access ports, the access ports being located directly below the annular support rail, respectively.