CN114715588A - Storage library - Google Patents
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- CN114715588A CN114715588A CN202210618022.9A CN202210618022A CN114715588A CN 114715588 A CN114715588 A CN 114715588A CN 202210618022 A CN202210618022 A CN 202210618022A CN 114715588 A CN114715588 A CN 114715588A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0485—Check-in, check-out devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0492—Storage devices mechanical with cars adapted to travel in storage aisles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a storage library, which is applied to the technical field of semiconductor manufacturing equipment and comprises the following components: the vertical warehouse comprises a warehouse body, a ground butt joint, a clean gas control box, an air butt joint and a transfer mechanism, wherein the transfer mechanism is arranged in the warehouse body, and the transfer mechanism is used for carrying out wafer box taking and placing operation on a storage shelf in the warehouse body. Through with ground interface, aerial interface, clean gas control box and move the mechanism of carrying and dispose on the storehouse body of founding storehouse formula, be convenient for very much dispose and should the repository to and directly carry out the wafer box through moving the mechanism of carrying and get the operation of putting in the storehouse body is inside to storing the pavilion, form neotype repository, make things convenient for the wafer box to exchange the wafer box between repository and ground interface, aerial interface very much.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing equipment, in particular to a storage library.
Background
In the chip production and manufacturing process of a semiconductor manufacturing enterprise, a wafer is a core raw material for chip manufacturing, and needs to be sequentially produced and processed in batch in each process of chip manufacturing.
In order to meet the requirement of batch-type wafer transfer, an Automatic Material Handling System (AMHS) has come into operation and has been widely used in the semiconductor manufacturing industry, in which a storage library (STK) is used as a core facility in the AMHS, and a large number of wafer storage bays are arranged in the storage library, and the storage bays are mainly used for storing wafer cassettes (also called wafer storage cassettes, Front Open Unified Pod, or Foup) containing wafers, that is, each bay can store one Foup. In addition, in view of the complicated processes of chip production and manufacturing, many processes are required, each process requires an STK having a specific tool or temporary storage space, and the STK is also required to be able to exchange a wafer cassette to facilities such as an aerial shuttle (also called an overhead transport vehicle, OHT, overhead hook transfer) or an MR (Mobile Robot), an AMR (Autonomous Mobile Robot), etc. during the process transfer.
The existing storage library is designed and deployed based on the original low capacity requirement of a Fab factory, and when the new capacity requirement of the Fab factory is met, many defects of the storage library are gradually revealed, for example, the whole layout is backward, the occupied space is large, the deployment position is inflexible, the automatic exchange efficiency of wafer cassettes is not high, and the defects become the bottleneck of improving the new capacity of the Fab factory.
Therefore, a new library is needed to meet the new energy increasing demand of Fab plants.
Disclosure of Invention
In view of this, the present invention provides a storage library, which temporarily stores a large number of wafer cassettes during the process connection in the Fab plant, so as to improve the exchange efficiency of the wafer cassettes during the process connection and meet the new production requirement of the Fab plant.
The invention provides the following technical scheme:
the present invention provides a storage library comprising:
the vertical storage device comprises a vertical storage body, wherein a plurality of storage loft positions are arranged in the storage body and used for storing wafer boxes;
the storage system comprises a ground interface, a plurality of first exchange channels and a plurality of second exchange channels, wherein the ground interface is provided with at least a first ground temporary storage position, the first ground temporary storage position is a storage cabinet position in the storage body, and the ground interface is used for exchanging wafer boxes between the storage body and a ground transportation device;
the clean gas control box is arranged on the outer side surface of the storage body and is used for providing clean gas for each storage position in the storage body;
the storage rack comprises a plurality of storage body bodies, a plurality of aerial butt joints, a plurality of first exchange channels and a plurality of second exchange channels, wherein the aerial butt joints are provided with the second exchange channels, the second exchange channels are provided with a first aerial temporary storage position and a second aerial temporary storage position, the second aerial temporary storage position is a storage shelf position in the storage body, the first aerial temporary storage position is suspended on the outer side of the storage body, and the aerial butt joints are used for exchanging wafer boxes between the storage body and an aerial transport vehicle;
and the transfer mechanism is arranged in the storage body and is used for carrying out wafer box taking and placing operation on a storage shelf in the storage body.
Compared with the prior art, the beneficial effects that can be achieved by at least one technical scheme adopted by the invention at least comprise: in order to solve the problem that in the chip production and manufacturing process, the raw material wafers are sequentially processed and produced in batches, the storage warehouse is used for storing and exchanging the wafers, the requirement for the large-batch wafers in the connection of all working procedures can be met, the wafers can be kept clean during storage, the storage warehouse and various transportation robots are used for butting the wafers through different storage areas and corresponding exchange interfaces, and the requirement for new production capacity of a Fab factory can be met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a perspective isometric schematic view of a storage library provided by the present invention;
FIG. 2 is a schematic front view of a storage library provided by the present invention;
FIG. 3 is a schematic structural diagram of two storage bodies of the storage library of the present invention;
FIG. 4 is a schematic diagram of the transfer of wafers between transfer nodes in the storage library provided by the present invention;
FIG. 5 is a schematic diagram of an A-side memory partition in the storage library provided by the present invention;
FIG. 6 is a schematic diagram of a B-side memory partition in the storage library provided by the present invention;
FIG. 7 is a schematic structural diagram of a frame unit in a storage library provided by the present invention;
FIG. 8 is a schematic view of a partially enlarged view of a frame unit in the storage library provided by the present invention;
FIG. 9 is a schematic diagram of the transfer of a wafer cassette by each transfer node in the storage library according to the present invention;
FIG. 10 is a schematic diagram illustrating a process of controlling the transfer of a wafer cassette by each transfer node in the storage library according to the present invention;
FIG. 11 is a schematic diagram illustrating the calculation of the path length corresponding to the wafer access sequence in the storage library according to the present invention;
FIG. 12 is a schematic diagram of sensory information feedback in a repository provided by the present invention.
Detailed Description
The embodiments of the present application will be described in detail below with reference to the accompanying drawings.
The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The present application is capable of other and different embodiments and its several details are capable of modifications and/or changes in various respects, all without departing from the spirit of the present application. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number and aspects set forth herein. Additionally, such an apparatus may be implemented and/or such a method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should be further noted that the drawings provided in the following embodiments are only schematic illustrations of the basic concepts of the present application, and the drawings only show the components related to the present application rather than the numbers, shapes and dimensions of the components in actual implementation, and the types, the numbers and the proportions of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details. The terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features described as being defined as "first," "second," etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
The technical solutions provided by the embodiments in the present specification are described below with reference to the accompanying drawings.
As shown in fig. 1 to 4, a storage library according to an embodiment of the present disclosure includes: the vertical storage type storage body 1 is provided with a plurality of storage bays, and the storage bays are used for storing wafer boxes; the storage system comprises a ground interface 2, wherein the ground interface 2 is provided with a plurality of first exchange channels, at least a first ground temporary storage position is arranged in each first exchange channel, the first ground temporary storage position is a storage cabinet position in the storage body, and the ground interface 2 is used for exchanging a wafer cassette between the storage body 1 and a ground transportation device (such as manual carrying, Automatic Guided Vehicle (AGV), MR, AMR and the like); the clean gas control box 3 is arranged on the outer side surface of the storage body, wherein the clean gas control box 3 is used for providing clean gas for each storage cabinet in the storage body 1; a plurality of aerial butt-joint interfaces 4, wherein a plurality of second exchange channels are arranged in the aerial butt-joint interfaces 4, a first aerial temporary storage position and a second aerial temporary storage position are arranged in the second exchange channels, the second aerial temporary storage position is a storage cabinet position in the storage body, the first aerial temporary storage position is suspended at the outer side of the storage body, and the aerial butt-joint interfaces 4 are used for exchanging wafer boxes between the storage body 1 and an aerial transport vehicle (also referred to as aerial shuttle trolley, OHT and the like for short); and the transfer mechanism is arranged in the storage body and is used for carrying out wafer box taking and placing operation on a storage shelf in the storage body.
In implementation, a vertical storage mode is adopted, corresponding wafer box exchange devices are arranged aiming at different storage areas, such as an aerial butt joint port, a ground butt joint port and the like, the aerial butt joint port for butting an aerial transport vehicle can be arranged in the air according to different transport equipment, the ground butt joint port can also be arranged aiming at the ground transport equipment, various transmission modes of inputting and outputting the wafer boxes in a storage library are realized, the problem of mass storage of the wafer boxes is solved, and the turnover operation of temporary storage, accurate transfer and the like of the wafer boxes is also solved. In addition, through clean gas control box through gas circuit control in the storage process, constantly to the inside ultrapure gas that specifically provides to every loft of repository, guarantee the quality of wafer during the storage, ensured the repository cleanliness factor.
In implementation, the transfer mechanism can be a mechanism for carrying wafers to move in four degrees of freedom of an X axis, a Y axis, a Z axis and an R axis, and can be a mechanism for taking and placing a wafer cassette on a storage cabinet, so that the wafer access on the storage cabinet can be completed, and the wafers can be transported to an aerial docking port or a ground docking port according to preset transmission requirements, so that the wafer cassette can be exchanged between the storage cabinet and the docking port. The X axis may be set in the width direction of the storage bank, the Y axis may be set in the length direction of the storage bank, the Z axis may be set in the height direction of the storage bank, and the R axis may be set in the rotation axis direction rotating around the Z axis.
It should be noted that the ground interface may be implemented by modifying a storage shelf close to the ground in the storage library, and the air interface may be implemented by modifying a storage shelf higher than the ground in the storage library, so that the interface may be deployed by modifying the storage shelf, the number of the ground interface and the air interface may be determined according to actual deployment requirements, and this specification schematically illustrates one ground interface and two air interfaces.
As shown in fig. 4, the schematic of the wafer (or wafer cassette, Foup) entering and exiting the storage library is as follows: in the process of rolling wafers among various processing technologies for manufacturing chips, a storage library is used as a core among various nodes transferred by the wafers, the input and output divergence directions of the storage library are used as correlation directions, a transfer mechanism is used for transferring wafer boxes among different nodes, and the sources of the wafers input into the storage library mainly comprise: the system comprises a first aerial interface, a second aerial interface and a ground interface, wherein the aerial interface mainly receives wafers transported by an aerial transport trolley (also can be an aerial shuttle trolley, an aerial transport vehicle, an OHT and the like) from the previous process equipment, and further temporarily stores the wafers into a storage library through the aerial interface to wait for the ex-warehouse operation of the next process. The wafers stored in the warehouse need to be transported to the next process equipment through the aerial shuttle trolley, and the wafers are transferred to the aerial shuttle trolley through the aerial butt joint; in addition, the ground interface mainly refers to a process of transferring a wafer needing manual intervention to a manual or ground robot through the ground interface so as to further intervene and adjust the wafer, or transferring the wafer after manual intervention to a storage warehouse through the ground interface by the manual or ground robot so as to wait for entering the next process step. Wherein all wafer transfers between the stocker and the overhead and ground interfaces require an internal transfer mechanism for the stocker.
By adopting the vertical warehouse type structure, the storage warehouse can store wafer boxes with large full load of wafers, a ground interface for exchanging the wafer boxes with ground transportation equipment is arranged on the vertical warehouse, the storage warehouse can realize temporary storage and accurate transmission of the wafer boxes (Foup) through different interfaces, for example, the storage warehouse can be butted with a shuttle transportation robot in the air through the interface in the air (such as the first interface) from the upper end of the storage warehouse, and can be butted with the shuttle transportation robot in the ground or a ground moving worker from the bottom end of the storage warehouse.
In some embodiments, the storage cabinet may be provided with an identification device for identifying the identity of the wafer cassette, so as to uniquely identify the wafer cassette and ensure that the wafer cassette moves and transfers along a predetermined trajectory.
In some embodiments, the storage body may be formed by two opposite side bodies, a tunnel is formed between the two side bodies, and the transfer mechanism is disposed in the tunnel for taking and placing the wafer cassette on the storage bay.
Specifically, the storage body includes a first side body (side a as shown in fig. 3) and a second side body (side B as shown in fig. 3) which are oppositely disposed, a tunnel (an intermediate tunnel formed between side a and side B as shown in fig. 3) is disposed between the first side body and the second side body, and the transfer mechanism is disposed in the tunnel; and the first side body is provided with the ground butt joint port and at least one aerial butt joint port, the second side body is provided with at least one aerial butt joint port, and the aerial butt joint port of the first side body and the aerial butt joint port of the second side body are oppositely arranged.
Each storage library is divided into two body parts which face each other according to the position, a ground butt joint port and an air butt joint port (such as marked as a first air butt joint port) are arranged in a storage area in a body (such as the side A) on one side, an air butt joint port (such as marked as a first air butt joint port) is arranged in a storage area in a body (such as the side B) on the other side, a roadway is arranged between the side A and the side B, a transfer mechanism can move linearly, and wafers stored on the side A and the side B can be taken and placed at will.
Through setting up both sides body, move and carry the mechanism and set up among the tunnel to and set up the butt joint mouth of exchanging the wafer box on the body of both sides respectively, can reduce repository occupation space, also make things convenient for the repository to deploy and apply according to the actual demand of Fab factory.
In some embodiments, for different turnaround time periods of the wafers in the respective process steps, the storage areas in the storage library may be divided into different storage areas according to the turnaround time periods, for example, the storage areas are set as long-time storage areas, short-time storage areas, ground docking storage areas, aerial docking storage areas, and the like, where the long-time storage areas are set far away from each pair of interfaces because the input/output interval time of the stored wafers is long, the short-time storage areas are set near the input/output interfaces because the input/output interval time of the stored wafers is short, the aerial docking storage areas mainly store the wafers input/output to the aerial shuttle car and are set near the aerial docking interfaces, and the ground docking storage areas mainly store the wafers input/output to the ground robot or the manual work and are set around the ground docking interfaces.
As shown in fig. 5, the ground interface and the ground interface storage area are disposed in the middle of the first side body (such as the aforementioned a side body), at least one aerial interface is disposed in one side storage area of the first side body, a first aerial interface storage area is disposed in a storage area above the aerial interface in the first side body, and a first long-term storage area is disposed in the other side storage area of the first side body.
Specifically, the storage area on the side a is further specifically divided into designated areas for storing wafers in different states, such as wafers which are queued for manual intervention in the storage area near the ground interface, or wafers which are transported by using a ground robot; the wafers queued for being conveyed by the aerial transport trolley are distributed and stored in the storage area near the aerial butt joint interface, the wafers needing to be placed for a long time are stored in the area far away from the ground butt joint interface and the aerial butt joint interface, frequent input and output of the wafers are not needed, the idle running time of the transfer mechanism is shortened, and the input and output efficiency of the whole storage space is improved.
As shown in fig. 6, a short-term storage area is disposed in a storage area of the second side body (such as the aforementioned B-side body) opposite to the ground docking storage area, a storage area of the second side body located at the aerial docking port is set as a second aerial docking storage area, a storage area of the second side body located above the aerial docking port is set as a second aerial docking storage area, and a storage area of the second side body opposite to the first long-term storage area is set as a second long-term storage area.
Specifically, the storage area on the side B is further divided into an air docking storage area, a short-time storage area and a long-time storage area, wherein the air docking storage area is located in the upper area and the lower area of the air docking interface, the short-time storage area is located opposite to the ground docking storage area on the side a, and wafers can be input and output in a short transmission distance through the ground docking interface or the cooperation of the air docking interface and the transfer mechanism.
By dividing the storage library into storage areas with different requirements according to storage types, for example, dividing the storage library into 4 areas: the wafer state stored in the storage library can correspond to a wafer stored in any process, before and after the process, such as a reserved wafer before an original processing state, a wafer which needs a specific time after a certain processing process and can be subjected to the next process, or a wafer which is queued before a certain processing process and waits to enter an air interface or a ground interface to be transported to a specific processing machine. After different areas are divided, the utilization rate of the storage warehouse can be maximized, the related warehousing and ex-warehousing order can be conveniently appointed, the operation of wafer warehousing and ex-warehousing is planned, and the warehousing and ex-warehousing efficiency is improved.
In some embodiments, the transfer mechanism may include a stacker, which may be a stacker that carries wafers in four degrees of freedom in X, Y, Z and R axes.
In some embodiments, the clean gas control box may be disposed below the aerial docking port on one side (such as in the drawings), which not only makes full use of the lower space of the external side of the storage warehouse located at the aerial docking port, but also facilitates the deployment of the pipeline from the bottom of the storage warehouse to the inside of the storage warehouse, reduces the occupied space of the pipeline, and facilitates the subsequent maintenance of the pipeline.
It should be noted that the clean gas control box may include a control valve, a metering valve, etc. for flow control, and is not limited herein.
In some embodiments, in view of the need for new Fab capacity, the storage library needs to have the capability of storing a large number of wafer cassettes, and also needs to have flexible deployment features, a new structure of the storage library body is proposed below.
In implementation, the storage body comprises a plurality of frame units, wherein each frame unit is a frame consisting of a plurality of right-angle extrusion angle seats, a plurality of aluminum profiles and a plurality of built-in connecting pieces, each aluminum profile is provided with a first mounting position and a second mounting position, the right-angle extrusion angle seats are detachably mounted at the first mounting positions, and the built-in connecting pieces are detachably embedded at the second mounting positions; and a plurality of the frame units form one side frame of the storage body in the following expansion mode: adjacent two frame element passes through connecting portion fixed connection, wherein connecting portion include a plurality of right angle type extrusion angle seats, a plurality of built-in connecting piece and a plurality of aluminium alloy of parallel arrangement, a plurality of aluminium alloy of parallel arrangement pass through right angle type extrusion angle seat and built-in connecting piece and constitute the main body frame of connecting portion, the main body frame of connecting portion pass through right angle type extrusion angle seat and built-in connecting piece with frame element's extension connector fixed connection.
In implementation, the aluminium alloy in the extension connector of frame element still can be provided with first mounted position and second mounted position, and correspondingly, the position that is used for being connected with frame element on the connecting portion also is provided with first mounted position and second mounted position, carries out corresponding fixed connection through right angle type extrusion angle seat and built-in connecting piece between frame element and the connecting portion of being convenient for.
As shown in fig. 7, to expand the storage capacity of the repository, the repository is a framework main body formed by expanding a plurality of library standing frame units, and the expanded connection between the library standing frame units can be realized by a connecting portion (i.e., a connecting portion shown in the figure), that is, the first frame unit is extendedly and fixedly connected with the second frame unit by the connecting portion. Wherein, the whole rectangle structure that is of connecting portion if adopt many parallel arrangement's aluminium alloy as connecting portion main body frame to fix the main body frame of connecting portion through right angle type extrusion angle seat and built-in connecting piece.
As shown in fig. 8, in the partially enlarged illustration of the fixed connection, in the frame unit 5 (such as the aforementioned hangar frame unit, the main frame of the connecting part, etc.), each corner at the intersection between the aluminum profiles is fixedly connected by using a right-angle type extrusion corner seat 51, each part of the aluminum profiles for extending connection with other aluminum profiles is provided with a unique pattern structure 52, and then the pattern structure 52 is fixedly connected by using a plurality of built-in connecting pieces 53.
Use the aluminium alloy as braced frame through the vertical storehouse frame cell, the aluminium alloy has better intensity and rigidity with its unique flower type structure when lightening self weight, stability is better when bearing multilayer wafer, adopt built-in connecting piece and right angle type extrusion angle seat to connect between the aluminium alloy, not only restricted the degree of freedom of connecting point department aluminium alloy, make it fix in specific position, right angle structure extrusion angle seat can strengthen overall connection structure's stability moreover, messenger's storage frame has better compressive capacity. In addition, after the plurality of frame units are connected in an expanding mode, the storage library is provided with the plurality of vertical library frame units, so that the storage space can be enlarged, the number of layers of the vertical library is increased, and the storage library body can be designed and deployed conveniently according to the actual deployment requirement of the Fab factory due to the expanding connection mode.
In some embodiments, a corresponding transmission mechanism may be provided in the pod exchange docking interface, which may be used to simply transfer the exchanged pods.
In an implementation example, a first transportation mechanism is disposed in the ground interface, the first transportation mechanism is a two-degree-of-freedom transportation mechanism, the first ground temporary storage location is disposed on the first transportation mechanism, and the first transportation mechanism is configured to move linearly in a height direction and a length direction of the storage body.
Specifically, the ground interface may transmit the wafer in the storage warehouse (or the wafer cassette on the first ground temporary storage location in the ground interface) to the manual or ground robot through its own transmission mechanism (i.e. the aforementioned first transportation mechanism), so that the transmission mechanism of the ground interface may have two degrees of freedom to allow the portable wafer to perform linear displacement motion in the Y-axis and the Z-axis.
In one embodiment, a second transportation mechanism is disposed in the aerial docking interface, the second transportation mechanism is a two-degree-of-freedom transportation mechanism, the second aerial temporary storage location is disposed on the second transportation mechanism, and the second transportation mechanism is configured to move linearly in a width direction of the storage body.
Specifically, the overhead interface may transfer the wafer in the storage library (or the wafer cassette at the second overhead temporary storage location in the overhead interface) to the overhead transport vehicle through its own transmission mechanism (i.e. the aforementioned second transport mechanism), so that the transmission mechanism of the overhead interface may have two degrees of freedom for carrying the wafer to perform a displacement motion in the X axis or a rotation motion in the R axis.
As shown in fig. 9, the ground interface performs a Y-axis and Z-axis linear displacement motion through the corresponding transmission mechanism, so as to store or remove the Foup into or from the storage library; the air butt joint makes X-axis linear displacement motion, R-axis 360-degree rotation and the like through a corresponding transmission mechanism, and the Foup can be stored in a storage library or taken out of the storage library; accordingly, the transfer mechanism can transfer the ground interface and the aerial interface into and out of the Foup of the storage warehouse.
In some embodiments, the operations of loading and unloading the wafer cassette into and out of the storage library, and loading and unloading the wafer cassette on the storage shelf, etc. may be managed based on the controller of the storage library itself.
In implementation, as shown in fig. 10, the storage library further includes: the controller (such as a PLC controller) may be electrically connected to the transfer mechanism and the AMHS system, and is configured to collect wafer cassette storage information of each storage bay in the stocker body and receive motion information sent by the AMHS system, where the motion information includes information of exchanging wafer cassettes between the ground interface, the air interface, and the stocker body, and control the transfer mechanism to pick and place a wafer cassette according to the wafer cassette storage information and the motion information.
It should be noted that the AMHS system may include main parts such as manual transportation, MR, AMR, AGV, overhead shuttle, storage library, etc., and the controller is electrically connected to the AMHS system for the purpose of acquiring motion information of each part of the AMHS system in real time, feeding back control information of the controller to the AMHS system, etc., so as to facilitate the overall scheduling control of the AMHS system. In the actual production process, it is usually performed by an MES (manufacturing Execution system) manufacturing Execution system communicating with an mcs (Material Control system) Material Control system, and further acting on a storage device and a transportation device of an amhs (automatic Material Handling system), in this specification example, collecting and sending motion signals of devices such as various storage libraries, a transportation robot, a transportation cart, etc., and MR, air transportation cart exchanging wafers with the storage libraries and wafer storage behaviors related to manual work, which are respectively controlled by a storage library controller, a mobile robot controller, an interactive operation controller, and an air transportation cart controller, except for the storage library controller, controllers on other devices receive and execute commands such as wafer cassette exchange, temporary storage, transportation, etc., and feed back the current state to the storage library controller, so as to facilitate the MES system to lay out all commands and feedback information, coordinate normal commands of each part, normal data, and the like, And (4) running rapidly.
Specifically, the flow of wafer flow control with the storage library as the core is shown as follows: the controller of the storage library can receive information of wafers transmitted by an air shuttle car or a manual or MR (magnetic resonance) device simultaneously through an air interface and a ground interface in the storage library, so that operation control such as exchange, temporary storage, transfer and the like of wafer cassettes can be performed according to transmission requirements Control, etc.
In addition, when the storage warehouse inputs or outputs the wafers from the outside, the controller can also make the priority of manual intervention higher than the priority of equipment intervention of MR and the like, namely when the wafer operation of the ground interface is interfered, the manual intervention priority is higher, so as to prevent the problem of personnel injury caused by the collision of manual and MR simultaneous access to the wafers.
In some embodiments, the controller may further control the transfer mechanism to perform the transfer operation using shortest path planning.
In implementation, when the motion information includes that the wafer cassette of the aerial butt joint interface and the wafer cassette of the ground butt joint interface are simultaneously input to the storage body, the controller is further configured to determine a current position of the transfer mechanism, and determine, according to the current position, a taking-away sequence of the wafer cassettes performed by the transfer mechanism according to shortest path planning.
As shown in fig. 11, when the stocker receives wafers from the overhead interface and wafers from the ground interface at the same time, a transfer mechanism (such as a stacker) inside the stocker needs to determine the order of taking away the wafers according to the travel distance. It is known thatThe current position of the transfer mechanism is set as an original point O, and the position of each wafer to be taken away is set as A1、B1、C1The positions of the storage cabinets corresponding to the wafers are respectively set as A2、B2、C2The distance from the origin O to each wafer to be taken away is O11、O12、O13The distance from each wafer position to the corresponding storage bin is a1、b1、c1Therefore, the corresponding path lengths can be respectively calculated according to the assumed access sequence, and the shortest path is selected for access.
For example, assume that the transfer mechanism first reaches a from the current position1Taking the wafer box away from the position, and placing the wafer box in the position A2In position, then from A2Position is moved to B1Position (assume A)2To B1Has a movement path of O21) And further to B1Taking away the wafer on the position and placing the wafer on the position B2Position, followed by from B2Position arrival C1Position (suppose B2To C1Has a movement path of O24) And further combine C with C1Taking away the wafer on the position and placing the wafer on the C2Position, finally back to the origin O position (assume C)2The movement distance to O is O33). By analogy, the path lengths corresponding to different taking sequences can be obtained, and the description is not repeated.
In some embodiments, various sensors may be disposed in the storage library, and the sensors may be used to detect and collect information of the wafer.
As shown in fig. 12, the storage library may further include one or more of the following sensors: a zero point/limit sensor, a button type photoelectric sensor, a linear detection photoelectric sensor and a bar code detection photoelectric sensor.
In one example, the repository further comprises: the robot moving device comprises a zero limit sensor, a first limit position sensor and a second limit position sensor, wherein the zero limit sensor, the first limit position sensor and the second limit position sensor are respectively located on a linear track where the moving mechanism travels, a linear track where the grabbing robot travels in the moving mechanism and a circular limit angle line where the grabbing robot rotates, the zero limit sensor is used for providing an original reference position, and the first limit position sensor and the second limit position sensor are used for limiting the effective stroke of the grabbing robot.
Specifically, the zero limit sensor and the limit position sensor (i.e. the first limit position sensor and the second limit position sensor) are respectively located on a linear track at the bottom of the storage warehouse for the stacker to travel, a linear track for the stacker to travel and a circular limit angle line of the grabbing robot, and mainly provide an original reference position and limit the movement of each movement mechanism in an effective stroke, so as to ensure the safety of the movement.
In one example, the repository further comprises: and the button type photoelectric sensor is arranged on the wafer box carrying disc in the storage cabinet and used for judging whether the wafer box on the wafer box carrying disc is stably placed or not.
Specifically, the button-type photoelectric sensor is mainly located on each carrying disc for carrying the wafer, and is mainly used for judging whether the wafer is stably placed on the carrying disc or not and ensuring the stability of wafer transmission.
In one example, the repository further comprises: and the linear detection photoelectric sensor is arranged in the air interface or the ground interface and is used for detecting whether the wafer box exists in the air interface or the ground interface.
Specifically, the linear detection photoelectric sensor is mainly located on a track of the aerial docking interface or the ground docking interface, on which a wafer can move, and is mainly used for detecting whether the wafer exists at the current position so as to judge whether to execute a next command.
In one example, the repository further comprises: the bar code detects photoelectric sensor, the bar code detect photoelectric sensor set up in move the track both sides that the mechanism marchd, be used for real-time detection move the current operating position who moves the mechanism.
Specifically, the barcode detection photoelectric switches are mainly located on two sides of a track where the stacker travels, can detect the current running position of the stacker at any time, and feed back the current running position to the controller to check the position accuracy or compensate the position error.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments can be referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments described later, since they correspond to the previous embodiments, the description is simple, and the relevant points can be referred to the partial description of the previous embodiments.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A storage library, comprising:
the vertical storage device comprises a vertical storage body, wherein a plurality of storage loft positions are arranged in the storage body and used for storing wafer boxes;
the storage system comprises a ground interface, a plurality of first exchange channels and a plurality of second exchange channels, wherein the ground interface is provided with at least a first ground temporary storage position, the first ground temporary storage position is a storage cabinet position in the storage body, and the ground interface is used for exchanging wafer boxes between the storage body and a ground transportation device;
the clean gas control box is arranged on the outer side surface of the storage body and is used for providing clean gas for each storage position in the storage body;
the storage rack comprises a plurality of storage body bodies, a plurality of aerial butt joints, a plurality of first exchange channels and a plurality of second exchange channels, wherein the aerial butt joints are provided with the second exchange channels, the second exchange channels are provided with a first aerial temporary storage position and a second aerial temporary storage position, the second aerial temporary storage position is a storage shelf position in the storage body, the first aerial temporary storage position is suspended on the outer side of the storage body, and the aerial butt joints are used for exchanging wafer boxes between the storage body and an aerial transport vehicle;
and the transfer mechanism is arranged in the storage body and is used for carrying out wafer box taking and placing operation on a storage shelf in the storage body.
2. The storage library of claim 1, wherein the library body comprises a first side body and a second side body which are oppositely arranged, a roadway is arranged between the first side body and the second side body, and the transfer mechanism is arranged in the roadway;
the first side body is provided with the ground butt joint port and at least one aerial butt joint port, the second side body is provided with at least one aerial butt joint port, and the aerial butt joint port of the first side body and the aerial butt joint port of the second side body are oppositely arranged.
3. The storage library of claim 2, wherein the ground docking interface and the ground docking storage area are disposed at a central position of the first side body, the one side storage area of the first side body is disposed with at least one of the aerial docking interfaces, the storage area of the first side body above the aerial docking interface is disposed with a first aerial docking storage area, and the other side storage area of the first side body is disposed with a first long-term storage area;
the storage area, opposite to the ground butt joint storage area, in the second side body is provided with a short-time storage area, the storage area, located above the aerial butt joint interface, in the second side body is provided with a second aerial butt joint storage area, the storage area, located above the aerial butt joint interface, in the second side body is provided with a second long-time storage area, and the storage area, opposite to the first long-time storage area, in the second side body is provided with a second long-time storage area.
4. The storage library of claim 1, wherein the transfer mechanism comprises a stacker.
5. The storage library of claim 1, wherein the clean gas control box is located below the aerial docking interface.
6. Storage library according to claim 1, wherein the library body comprises a number of frame units, wherein the frame units are frames consisting of a number of right angle extrusion corner seats, a number of aluminium profiles provided with a first mounting position and a second mounting position, and a number of built-in connectors, wherein the right angle extrusion corner seats are detachably mounted at the first mounting position and the built-in connectors are detachably mounted at the second mounting position;
a plurality of the frame units form one side frame of the storage body in the following expansion mode: two adjacent frame element passes through connecting portion fixed connection, wherein connecting portion include a plurality of right angle type extrusion angle seats, a plurality of built-in connecting piece and two aluminium alloy of parallel arrangement, two aluminium alloys pass through right angle type extrusion angle seat and built-in connecting piece constitution connecting portion's main part, the main part of connecting portion pass through right angle type extrusion angle seat and built-in connecting piece with frame element's extension connector fixed connection.
7. The storage library of claim 1, wherein the ground interface is provided with a first transportation mechanism, the first transportation mechanism is a two-degree-of-freedom transportation mechanism, the first ground temporary storage location is provided on the first transportation mechanism, and the first transportation mechanism is used for moving linearly along the height direction and the length direction of the library body;
and/or a second transportation mechanism is arranged in the air butt joint, the second transportation mechanism is a two-degree-of-freedom transportation mechanism, the second air temporary storage position is arranged on the second transportation mechanism, and the second transportation mechanism is used for making linear movement along the width direction of the storage body.
8. The storage library of claim 1, further comprising: the controller is electrically connected with the transfer mechanism and the AMHS respectively, and is used for collecting wafer box storage information of each storage shelf in the storage body and receiving motion information sent by the AMHS, wherein the motion information comprises information of exchanging wafer boxes among the ground butt joint interface, the air butt joint interface and the storage body, and controlling the transfer mechanism to take and place the wafer boxes according to the wafer box storage information and the motion information.
9. The storage library of claim 8, wherein when the motion information includes simultaneous input of an aerial interface pod and a ground interface pod to the storage library body, the controller is further configured to determine a current position of the transfer mechanism and determine an order of taking away of the pods by the transfer mechanism according to the shortest path plan based on the current position.
10. The storage library of claim 1, further comprising: the system comprises a zero limit sensor, a first limit position sensor and a second limit position sensor, wherein the zero limit sensor, the first limit position sensor and the second limit position sensor are respectively positioned on a linear track where the transfer mechanism travels, a linear track where the grabbing robot travels in the transfer mechanism and a circular limit angle line where the grabbing robot rotates;
and/or, the repository further comprises: the button-type photoelectric sensor is arranged on the wafer box carrying disc in the storage cabinet and used for judging whether a wafer box on the wafer box carrying disc is stably placed or not;
and/or, the repository further comprises: the linear detection photoelectric sensor is arranged in the air interface or the ground interface and is used for detecting whether a wafer box exists in the air interface or the ground interface or not;
and/or, the repository further comprises: the bar code detects photoelectric sensor, the bar code detect photoelectric sensor set up in move the track both sides that the mechanism marchd, be used for real-time detection move the current operating position who moves the mechanism.
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