CN117693115A - Circuit board and electronic equipment - Google Patents

Circuit board and electronic equipment Download PDF

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Publication number
CN117693115A
CN117693115A CN202310831749.XA CN202310831749A CN117693115A CN 117693115 A CN117693115 A CN 117693115A CN 202310831749 A CN202310831749 A CN 202310831749A CN 117693115 A CN117693115 A CN 117693115A
Authority
CN
China
Prior art keywords
layer
sub
frame
board
ply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310831749.XA
Other languages
Chinese (zh)
Inventor
唐兴国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to CN202310831749.XA priority Critical patent/CN117693115A/en
Publication of CN117693115A publication Critical patent/CN117693115A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0071—Active shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The application discloses circuit board and electronic equipment, this circuit board include mainboard layer, first frame plate layer, first sub-plate layer, first device and second device, first frame plate range upon range of in the mainboard layer, first sub-plate range upon range of in first frame plate layer dorsad one side of mainboard layer, first device set up in the mainboard layer, the second device set up in first sub-plate layer. This application has first sub-sheet layer through the superpose on the mainboard layer to can change bigger overall arrangement area to Z to the space with the mode of piling up, namely, increased the overall arrangement area of circuit board, at this moment, can set up first device in the mainboard layer, set up the second device in first sub-sheet layer, and then can satisfy the overall arrangement wiring requirement of device and circuit.

Description

Circuit board and electronic equipment
Technical Field
The application relates to the technical field of electronic equipment, in particular to a circuit board and electronic equipment comprising the circuit board.
Background
Since the area and thickness of electronic devices (e.g., mobile phones, tablet) are generally of a certain size, the space for mounting the motherboard in the electronic device is limited, and the motherboard cannot be made too large. However, as the functions of the electronic devices become stronger, the main boards on the electronic devices become more and more complex, such as devices and circuits on the main boards, which results in that the current main board area cannot meet the layout of the devices and circuits.
Disclosure of Invention
In order to overcome the problems of the prior art, a main object of the present application is to provide a circuit board capable of satisfying the layout of devices and circuits.
In order to achieve the above purpose, the present application specifically adopts the following technical scheme:
the application provides a circuit board, is applied to electronic equipment, the circuit board includes:
a main board layer;
a first frame plate layer laminated to the main plate layer;
the first sub board layer is stacked on one side of the first frame board layer, which is opposite to the main board layer;
the first device is arranged on the main board layer; and
and the second device is arranged on the first sub-board layer.
According to the embodiment, the first sub-board layer is overlapped on the main board layer, so that a larger layout area can be replaced to the Z-direction space in a stacking mode, namely, the layout area of the circuit board is increased, at the moment, the first device can be arranged on the main board layer, the second device can be arranged on the first sub-board layer, and the layout and wiring requirements of the devices and circuits can be met.
In some embodiments, the main board layer is provided with a hollowed-out area, a first layout area and a second layout area, wherein the first layout area and the second layout area are respectively positioned at two opposite sides of the hollowed-out area; the circuit board further comprises a wiring layer and a second frame plate layer, wherein the first frame plate layer, the second frame plate layer and the wiring layer are stacked in the first layout area in a spaced mode, the wiring layer is located between the first frame plate layer and the second frame plate layer, and the wiring layer extends from the first layout area to the second layout area. In this embodiment, since the wiring layer extending from the first layout area to the second layout area is provided, signals between the first layout area and the second layout area can be connected through the wiring layer, so that signal connection requirements of left and right side areas of the main board layer are satisfied.
In some embodiments, the first daughter board layer stack is disposed on a side of the first frame board layer remote from the motherboard layer and extends to the second frame board layer. In the embodiment, the first sub-board layer is stacked on one side of the first frame board layer, which is opposite to the main board layer, and extends to the second frame board layer, so that each second device on the first sub-board layer can be electrically connected through the signal wires in the first sub-board layer, and the signal wires electrically connected with each second device on the first sub-board layer do not need to pass through the first frame board layer and the second frame board layer, so that the connecting wires between each second device are shorter, the connecting wire perforation is less, and the signal insertion loss is reduced.
In some embodiments, the first and second frame plate layers have the same thickness, and the wiring layer has a thickness less than the thickness of the first and second frame plate layers. According to the embodiment, the thicknesses of the first frame plate layer and the second frame plate layer are the same, so that the first sub-plate layer can be arranged parallel to the main plate layer, and the supporting stability of the first sub-plate layer by the first frame plate layer and the second frame plate layer is enhanced; by making the thickness of the wiring layer smaller than the thicknesses of the first and second frame plate layers, the mutual influence of the wiring layer and the first sub-plate layer due to contact is avoided, and at the same time, the device can be laid out by making full use of the space between the wiring layer and the first sub-plate layer.
In some embodiments, the first frame plate layer is in a ring-shaped structure. According to the first frame plate layer, the first frame plate layer is of the annular structure, so that the first sub-plate layer can be supported more firmly through the first frame plate layer of the annular structure, the size of the first frame plate layer can be reduced, and the cost is reduced.
In some embodiments, the circuit board further comprises a third frame ply and a second sub-ply, the third frame ply being laminated to a side of the first sub-ply facing away from the first frame ply, the second sub-ply being laminated to a side of the third frame ply facing away from the first sub-ply, the second sub-ply being provided with at least one of the second devices. In the embodiment, the second sub-board layer is arranged, so that a larger layout area is further exchanged for the Z-direction space in a stacking mode, and the layout area of the circuit board is increased.
In some embodiments, the third frame plate layer is in a ring-shaped structure. In the embodiment, the third frame plate layer is of the annular structure, so that the second sub-plate layer can be supported more firmly through the third frame plate layer of the annular structure, the volume of the third frame plate layer can be reduced, and the cost is reduced.
In some embodiments, the first sub-board layer includes a first portion and a second portion, the first portion is stacked on a side of the first frame board layer facing away from the main board layer, the second portion is stacked on a side of the second frame board layer facing away from the main board layer, and at least one second device is disposed on each of the first portion and the second portion.
In some embodiments, the circuit board further includes a third frame plate layer and a second sub-plate layer, the third frame plate layer being disposed on a side of the first portion facing away from the first frame plate layer, the second sub-plate layer being disposed on a side of the third frame plate layer facing away from the first portion, the second sub-plate layer further providing at least one of the second devices.
In some embodiments, the first device comprises at least one of a system on chip, a general purpose flash memory storage chip, a power management unit, a fast charge chip, an audio codec chip, an audio amplifier, a screen drive chip, a board-to-board connector, a resistor, a capacitor, and an inductor; the second device comprises at least one of a radio frequency transceiver, a power amplifier, a low noise amplifier, a combiner switch, a filter, a duplexer, an open switch and an open spring.
Accordingly, the present application also provides an electronic device, including:
a housing enclosing a receiving cavity;
the circuit board, the circuit board set up in hold the intracavity, just the circuit board includes mainboard layer, first frame layer, first sub-layer, first device and second device, first frame plate range upon range of in the mainboard layer, first sub-board range upon range of in first frame layer dorsad one side of mainboard layer, first device set up in the mainboard layer, the second device set up in first sub-board layer.
According to the embodiment, the first sub-board layer is overlapped on the main board layer, so that a larger layout area can be exchanged for the Z-direction space inside the electronic equipment in a stacking mode, the layout wiring requirements of devices and circuits can be met by fully utilizing the internal space of the electronic equipment, meanwhile, more space can be saved in the X direction and the Y direction, a larger volume of batteries can be laid out, and further the battery endurance requirements of users on the electronic equipment can be met.
In some embodiments, the camera module further comprises a light hole, the main board layer is provided with a hollowed-out area, a first layout area and a second layout area, the first layout area and the second layout area are respectively located on two opposite sides of the hollowed-out area, the first frame plate is stacked in the first layout area, and the camera module is assembled in the hollowed-out area and is opposite to the light hole. According to the embodiment, the hollowed-out area is formed in the main board layer, and the camera assembly is assembled in the hollowed-out area, so that the camera assembly can be assembled by fully utilizing the Z-direction space inside the electronic equipment, and the thickness of the electronic equipment is prevented from being influenced due to the fact that the height of the camera assembly is in the Z-direction.
In some embodiments, the circuit board further includes a routing layer and a second frame plate layer, the first frame plate layer, the second frame plate layer, and the routing layer are stacked with the first layout area apart, and the routing layer is located between the first frame plate layer and the second frame plate layer, the routing layer extending from the first layout area to the second layout area. In this embodiment, since the wiring layer extending from the first layout area to the second layout area is provided, signals between the first layout area and the second layout area can be connected through the wiring layer, so that signal connection requirements of left and right side areas of the main board layer are satisfied.
In some embodiments, the first sub-board stack is disposed on the first frame board layer and extends to the second frame board layer. In the embodiment, the first sub-board layer is stacked on one side of the first frame board layer, which is opposite to the main board layer, and extends to the second frame board layer, so that each second device on the first sub-board layer can be electrically connected through the signal wires in the first sub-board layer, and the signal wires electrically connected with each second device on the first sub-board layer do not need to pass through the first frame board layer and the second frame board layer, so that the connecting wires between each second device are shorter, the connecting wire perforation is less, and the signal insertion loss is reduced.
In some embodiments, the first sub-board layer includes a first portion and a second portion, the first portion is stacked on a side of the first frame board layer facing away from the main board layer, the second portion is stacked on a side of the second frame board layer facing away from the main board layer, and at least one second device is disposed on each of the first portion and the second portion.
In some embodiments, the circuit board further comprises a third frame ply and a second sub-ply, the third frame ply being laminated to a side of the first sub-ply facing away from the first frame ply, the second sub-ply being laminated to a side of the third frame ply facing away from the first sub-ply, the second sub-ply being provided with at least one of the second devices.
In some embodiments, the camera assembly includes a camera ornament and a camera module, the camera ornament is assembled in the light hole, the camera module is assembled in the hollowed-out area, and the position of the camera module corresponds to the position of the camera ornament, and at least part of the third frame board layer, the second sub board layer and the second device arranged on the second sub board layer is located in the internal space of the camera ornament. According to the embodiment, the third frame plate layer, the second sub-plate layer and the second device arranged on the second sub-plate layer of the circuit board are at least partially positioned in the inner space of the shooting decoration piece, so that the inner space of the electronic equipment can be fully utilized, and the waste of empty space of the electronic equipment is avoided.
Compared with the prior art, the circuit board comprises a main board layer, a first frame board layer, a first sub board layer, a first device and a second device, wherein the first frame board layer is stacked on the main board layer, the first sub board layer is stacked on the first frame board layer back to one side of the main board layer, the first device is arranged on the main board layer, and the second device is arranged on the first sub board layer. This application has first sub-sheet layer through the superpose on the mainboard layer to can change bigger overall arrangement area to Z to the space with the mode of piling up, namely, increased the overall arrangement area of circuit board, at this moment, can set up first device in the mainboard layer, set up the second device in first sub-sheet layer, and then can satisfy the overall arrangement wiring requirement of device and circuit.
Drawings
Fig. 1 is a top view of a circuit board according to an embodiment of the present disclosure.
Fig. 2 is a perspective view of a circuit board according to an embodiment of the present application.
Fig. 3 is a sectional view at E-E in fig. 1.
Fig. 4 is a top view of a circuit board according to a second embodiment of the present disclosure.
Fig. 5 is a perspective view of a circuit board according to a second embodiment of the present application.
Fig. 6 is a sectional view at E-E in fig. 4.
Fig. 7 is a top view of a circuit board according to a third embodiment of the present application.
Fig. 8 is a perspective view of a circuit board according to a third embodiment of the present application.
Fig. 9 is a sectional view at E-E in fig. 7.
Fig. 10 is a top view of a circuit board according to a fourth embodiment of the present application.
Fig. 11 is a perspective view of a circuit board according to a fourth embodiment of the present application.
Fig. 12 is a sectional view at E-E in fig. 10.
Fig. 13 is a top view of a circuit board provided in a fifth embodiment of the present application.
Fig. 14 is a perspective view of a circuit board provided in a fifth embodiment of the present application.
Fig. 15 is a sectional view at E-E in fig. 13.
Fig. 16 is a top view of a circuit board provided in a sixth embodiment of the present application.
Fig. 17 is a perspective view of a circuit board according to a sixth embodiment of the present application.
Fig. 18 is a sectional view at E-E in fig. 16.
Fig. 19 is a signal hole structure diagram of a circuit board.
Fig. 20 is a top view of an electronic device provided in an embodiment of the present application.
Fig. 21 is a cross-sectional view at F-F in fig. 20.
The attached drawings are identified:
1. a main board layer; 11. digging out the area; 12. a first layout area; 13. a second layout area; 2. a first frame plate layer; 3. a second frame plate layer; 4. a third frame plate layer; 5. a wiring layer; 6. a first sub-sheet layer; 61. a first portion; 62. a second portion; 7. a second sub-sheet layer; 8. a first device; 9. a second device; 10. a shield; 100. a circuit board; 101. a signal hole; 102. a ground hole; 200. a housing; 201. a light hole; 300. a camera assembly; 301. shooting decoration pieces; 302. a camera module; 400. and a screen module.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
In the description of the present application, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance unless explicitly specified or limited otherwise; the term "plurality" means two or more, unless specified or indicated otherwise; the terms "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In the description of the present specification, it should be understood that the terms "upper" and "lower" and the like in the embodiments of the present application are described in terms of positions relative to a screen, and when the circuit board is mounted in a housing of an electronic device, a side of each board layer close to the screen is an upper surface, and a side far from the screen is a lower surface, and in this context, it should also be understood that when it is referred to that one element is connected to another element "upper" or "lower", it can be directly connected to another element "upper" or "lower", or can be indirectly connected to another element "upper" or "lower" through an intermediate element.
Electronic devices, such as cell phones, tablets, etc., typically include components such as a housing, a screen, a battery, a circuit board, and a camera assembly, wherein the housing is coupled to the screen to form a receiving cavity in which the battery and the circuit board are mounted to provide power to the entire electronic device via the battery, to control operation of the entire electronic device via the circuit board, and to display related information via the screen. Simultaneously, the shell is provided with the light hole, the camera component is arranged in the shell and is opposite to the light hole, and the electronic equipment can execute a shooting function through the camera component, wherein the camera component comprises a camera shooting module and a camera shooting decoration piece, the camera shooting decoration piece is arranged in the light hole of the shell, and the camera shooting module is arranged on the circuit board and corresponds to the camera shooting decoration piece.
In the prior art, the camera component of the mobile phone is generally centrally designed and has a higher specification, so that the central area of the main board is larger and larger due to the hollowing of the camera component, so that the wiring channels on the left side and the right side of the main board are narrower and narrower, and the modules on the left side and the right side of the main board are required to be interconnected, and the left signal wiring channel and the right signal wiring channel are required to be connected through the main board, so that the problem of the shortage of the left wiring channel and the right wiring channel of the main board is required to be solved through an elevated board or sandwich scheme. Meanwhile, the hardware specification of the smart phone is higher and higher, the battery endurance requirement is larger, and the battery volume is larger, but because the internal space of the mobile phone is limited, the mobile phone main board cannot be increased, and the layout area of the main board is continuously deficient, so that the main board needs to be stacked through a plurality of Printed Circuit Boards (PCB) to be clearly treated to change the larger layout area into Z-direction space layout, and the requirements of the radio frequency module layout sub-board on signal insertion loss are higher, particularly the radio frequency signal public end is connected to an antenna, and the wiring is required to be as short as possible and the number of through holes is small in order to reduce the signal insertion loss.
Referring to fig. 1 to 3, fig. 1 is a top view of a circuit board according to an embodiment of the present application, fig. 2 is a perspective view of the circuit board according to the embodiment, and fig. 3 is a cross-sectional view of fig. 1 at E-E. Embodiments of the present application disclose a circuit board 100, the circuit board 100 comprising a main board layer 1, a first frame board layer 2, a first sub board layer 6, a first device 8 and a second device 9. The main board layer 1 is provided with a hollowed-out area 11, a first layout area 12 and a second layout area 13, wherein the hollowed-out area 11 can be used for installing a camera assembly, and the first layout area 12 and the second layout area 13 are respectively positioned on two opposite sides of the hollowed-out area 11 and can be used for laying out devices and circuits. The first frame plate layer 2 is stacked on the first layout area 12 of the main plate layer 1, and the first sub-plate layer 6 is stacked on the side of the first frame plate layer 2 facing away from the main plate layer 1. The first devices 8 may be plural, the first devices 8 may be disposed on the main board layer 1, the second devices 9 may be plural, the second devices 9 may be disposed on the first sub board layer 6, and at least part of the second devices 9 disposed on the first sub board layer 6 may be electrically connected through the signal line C. The first device 8 may be a baseband device of an electronic device, for example, may be a System on a Chip (SOC), a general flash memory Chip (Universal Flash Storage, UFS), a power management unit (power management unit, PMU), a fast-charging Chip, a Codec Chip, an audio amplifier, an LCD (screen) driver Chip, a Board-to-Board connector (BTB connector), a resistor, a capacitor, an inductor, and the like; the second device 9 may be a radio frequency transceiver (in english: radio Frequency Integrated Circuit, abbreviated as RFIC), a radio frequency PA (power amplifier), a low noise amplifier (in english: low Noise Amplifier, abbreviated as LNA), a combiner switch, a filter, a duplexer, an antenna switch, an antenna spring, etc., and the wiring layer 5 may be configured with baseband devices such as a board-to-board connector with a camera head and peripheral devices.
In this embodiment, since each second device 9 is disposed on the first sub-board layer 6, each second device 9 can be electrically connected through the signal line in the first sub-board layer 6, if a part of the second devices 9 are disposed on the first sub-board layer 6 and a part of the second devices 9 are disposed on the main board layer 1, the signal line between the second devices 9 on the first sub-board layer 6 and the second devices 9 on the main board layer 1 needs to pass through the first frame board layer 2, while the signal line for electrically connecting each second device 9 in this embodiment does not need to pass through the first frame board layer 2, so that the connection line between the second devices 9 is shorter, the signal perforation is less, and the signal insertion loss (the insertion loss is used for describing the attenuation degree of the signal in the transmission process) is reduced; meanwhile, in this embodiment, the first sub-board layer 6 is stacked on the main board layer 1, so that a larger layout area can be exchanged for the Z-direction space in a stacking manner, and the layout area of the circuit board is increased, at this time, the first device 8 can be arranged on the main board layer 1, and the second device 9 can be arranged on the first sub-board layer 6, so that the layout and wiring requirements of devices and circuits are met.
With continued reference to fig. 3, the main board layer 1 and the first sub board layer 6 are connected through the first frame board layer 2, that is, the first sub board layer 6 is elevated above the main board layer 1 through the first frame board layer 2, and the main board layer 1 can perform signal transmission with the first sub board layer 6 through signal wires arranged inside the first frame board layer 2, for example, a via hole can be formed in the first frame board layer 2, and a wire is arranged in the via hole, so that at least part of the first devices 8 on the main board layer 1 can be electrically connected with at least part of the second devices 9 on the first sub board layer 6 through the wire; or a via hole is arranged in the first frame plate layer 2, and a conductive layer is arranged on the inner wall of the via hole, so that at least part of the first devices 8 on the main board layer 1 can be electrically connected with at least part of the second devices 9 on the first sub-board layer 6 through the conductive layer. Therefore, the sandwich-type PCB stacking structure is formed, and under the condition that the area of the circuit board is unchanged, the circuit board extends towards the Z direction (the thickness extending direction of the circuit board), so that the layout area of the circuit board is increased, and the electronic device can be laid out on the main board layer 1 and the first sub board layer 6.
Specifically, the first frame plate layer 2 is at least partially in an annular structure, and the peripheral side of the first sub plate layer 6 is flush with the peripheral side of the first frame plate layer 2, so that the first sub plate layer 6 can be supported more firmly by the first frame plate layer 2 in the annular structure, and meanwhile, the first frame plate layer 2 is set to be in the annular structure, so that the volume of the first frame plate layer 2 can be reduced, and the device layout area can be increased while the weight is reduced.
In some embodiments, referring to fig. 4 to 6, fig. 4 is a top view of a circuit board provided in a second embodiment of the present application, fig. 5 is a perspective view of the circuit board provided in the second embodiment, and fig. 6 is a cross-sectional view of fig. 4 at E-E. In the present embodiment, the circuit board 100 includes a main board layer 1, a first frame board layer 2, a second frame board layer 3, a wiring layer 5, a first sub board layer 6, a first device 8, and a second device 9. Wherein the first sub-sheet layer 6 is divided into two parts, a first part 61 and a second part 62, respectively. The main board layer 1 is provided with a hollowed-out area 11, a first layout area 12 and a second layout area 13, the hollowed-out area 11 being usable for assembling a camera module. The first layout area 12 and the second layout area 13 are respectively located at two opposite sides of the hollowed-out area 11, and are used for layout of devices and circuits. The first frame plate layer 2, the wiring layer 5 and the second frame plate layer 3 are respectively stacked on the first layout area 12 of the main plate layer 1 at intervals, the wiring layer 5 is positioned between the first frame plate layer 2 and the second frame plate layer 3, and the wiring layer 5 extends from the first layout area 12 to the second layout area 13. The first portion 61 is stacked on a side of the first frame plate layer 2 facing away from the main plate layer 1, and the second portion 62 is stacked on a side of the second frame plate layer 3 facing away from the main plate layer 1. The first devices 8 may be provided in plurality, and the plurality of first devices 8 are respectively provided on the main board layer 1; the second device 9 may be provided in plurality, the plurality of second devices 9 are provided in the first portion 61 and the second portion 62, respectively, and at least part of the second devices 9 located in the first portion 61 and at least part of the second devices 9 located in the second portion 62 may be electrically connected through the signal line C.
In the present embodiment, since the wiring layer 5 extending from the first layout area 12 to the second layout area 13 of the main board layer 1 is provided, signals between the first layout area 12 and the second layout area 13 of the main board layer 1 can be connected through the wiring layer 5, satisfying the signal connection requirements in the left and right side areas of the main board layer 1.
In some embodiments, referring to fig. 7 to 9, fig. 7 is a top view of a circuit board provided in the third embodiment of the present application, fig. 8 is a perspective view of the circuit board provided in the third embodiment, and fig. 9 is a cross-sectional view at E-E in fig. 7. In the present embodiment, the circuit board 100 includes a main board layer 1, a first frame board layer 2, a second frame board layer 3, a wiring layer 5, a first sub board layer 6, a first device 8, and a second device 9. The main board layer 1 is provided with a hollowed-out area 11, a first layout area 12 and a second layout area 13, wherein the hollowed-out area 11 can be used for installing a camera assembly, and the first layout area 12 and the second layout area 13 are respectively positioned on two opposite sides of the hollowed-out area 11 and can be used for laying out devices and circuits. The first frame plate layer 2, the second frame plate layer 3 and the wiring layer 5 are stacked at intervals on the first layout area 12 of the main plate layer 1, and the wiring layer 5 is located between the first frame plate layer 2 and the second frame plate layer 3, and the wiring layer 5 extends from the first layout area 12 to the second layout area 13 of the main plate layer 1. The first sub-board layer 6 is stacked on the side of the first frame board layer 2 facing away from the main board layer 1 and extends to the second frame board layer 3. The first devices 8 may be provided in plurality, and the plurality of first devices 8 are respectively provided on the main board layer 1; the second devices 9 may be provided in plurality, the plurality of second devices 9 are respectively provided to the first sub-board layer 6, and at least part of the second devices 9 may be electrically connected through the signal lines C provided in the first sub-board layer 6.
In the present embodiment, since the wiring layer 5 extending from the first layout area 12 to the second layout area 13 of the main board layer 1 is provided, signals between the first layout area 12 and the second layout area 13 of the main board layer 1 can be connected through the wiring layer 5, satisfying the signal connection requirements in the left and right side areas of the main board layer 1. In addition, the first sub-board layer 6 is stacked on one side of the first frame board layer 2, which is opposite to the main board layer 1, and extends to the second frame board layer 3 (the first sub-board layer 6 spans the wiring layer 5), and each second device 9 is respectively arranged on the first sub-board layer 6, so that each second device 9 can be electrically connected through the signal wire in the first sub-board layer 6, the signal wire electrically connected with each second device 9 does not need to pass through the first frame board layer 2 and the second frame board layer 3, and further, the connecting wires between the second devices 9 are shorter, the connecting perforation is less, and the signal insertion loss is reduced.
In some embodiments, the present application further discloses another specific implementation manner, referring to fig. 10 to 12, fig. 10 is a top view of a circuit board provided in the fourth embodiment of the present application, fig. 11 is a perspective view of the circuit board provided in the fourth embodiment, and fig. 12 is a cross-sectional view at E-E in fig. 10. In the present embodiment, the circuit board 100 includes a main board layer 1, a first frame board layer 2, a third frame board layer 4, a first sub board layer 6, a second sub board layer 7, a first device 8, and a second device 9. The main board layer 1 is provided with a hollowed-out area 11, a first layout area 12 and a second layout area 13, wherein the hollowed-out area 11 can be used for assembling a camera assembly, and the first layout area 12 and the second layout area 13 are respectively positioned on two opposite sides of the hollowed-out area 11 and can be used for laying out devices and circuits. The first frame plate layer 2 is stacked on the first layout area 12, and the first sub-plate layer 6 is stacked on a side of the first frame plate layer 2 facing away from the main plate layer 1. The third frame ply 4 is stacked on the side of the first sub-ply 6 facing away from the first frame ply 2, and the second sub-ply 7 is stacked on the side of the third frame ply 4 facing away from the first sub-ply 6. The first devices 8 may be plural, the first devices 8 are disposed on the main board layer 1, the second devices 9 may be plural, the second devices 9 are disposed on the first sub board layer 6 and the second sub board layer 7, and at least part of the second devices 9 disposed on the second sub board layer 7 and at least part of the second devices 9 disposed on the first sub board layer 6 may be electrically connected through the signal line C.
In this embodiment, the second devices 9 are disposed on the first sub-board layer 6 and the second sub-board layer 7, so that the second devices 9 can be electrically connected through the second sub-board layer 7, the second frame layer 4 and the signal lines in the first sub-board layer 6, the signal lines electrically connected with the second devices 9 do not need to pass through the first frame board layer 2, the connection lines between the second devices 9 are shorter, the connection line perforation is less, and the signal insertion loss is reduced, for example, a combining switch can be disposed on the second sub-board layer 7, and an antenna is disposed on the first sub-board layer 6, so that the signal lines from the combining switch to the antenna can be shortened, and the insertion loss of the radio frequency common terminal signal (the signal from the combining switch to the antenna can be called the radio frequency common terminal signal) is reduced.
In some embodiments, referring to fig. 13 to 15, fig. 13 is a top view of a circuit board provided in embodiment five of the present application, fig. 14 is a perspective view of the circuit board provided in embodiment five, and fig. 15 is a cross-sectional view at E-E in fig. 13. In the present embodiment, the circuit board 100 includes a main board layer 1, a first frame board layer 2, a second frame board layer 3, a third frame board layer 4, a wiring layer 5, a first sub board layer 6, a second sub board layer 7, a first device 8, and a second device 9. Wherein the first sub-sheet layer 6 is divided into two parts, a first part 61 and a second part 62, respectively. The main board layer 1 is provided with a hollowed-out area 11, a first layout area 12 and a second layout area 13, wherein the hollowed-out area 11 can be used for installing a camera assembly, and the first layout area 12 and the second layout area 13 are respectively positioned on two opposite sides of the hollowed-out area 11 and can be used for laying out devices and circuits. The first frame plate layer 2, the wiring layer 5 and the second frame plate layer 3 are respectively stacked on the first layout area 12 of the main plate layer 1 at intervals, the wiring layer 5 is positioned between the first frame plate layer 2 and the second frame plate layer 3, and the wiring layer 5 extends from the first layout area 12 to the second layout area 13. The first portion 61 is stacked on a side of the first frame plate layer 2 facing away from the main plate layer 1, and the second portion 62 is stacked on a side of the second frame plate layer 3 facing away from the main plate layer 1. The third frame ply 4 is stacked on the side of the first portion 61 facing away from the first frame ply 2 and the second sub-ply 7 is stacked on the side of the third frame ply 4 facing away from the first sub-ply 6. The number of the first devices 8 may be plural, and the plurality of the first devices 8 are provided on the main board layer 1 and the wiring layer 5, respectively; the second device 9 may be provided in plurality, the plurality of second devices 9 are provided in the second sub-board layer 7, the first portion 61 and the second portion 62, respectively, and at least part of the second devices 9 located in the first portion 61 and at least part of the second devices 9 located in the second portion 62 may be electrically connected through the signal line C.
In the present embodiment, since the wiring layer 5 extending from the first layout area 12 to the second layout area 13 of the main board layer 1 is provided, signals between the first layout area 12 and the second layout area 13 of the main board layer 1 can be connected through the wiring layer 5, satisfying the signal connection requirements in the left and right side areas of the main board layer 1.
In some embodiments, referring to fig. 16 to 18, fig. 16 is a top view of a circuit board provided in the sixth embodiment of the present application, and fig. 17 is a perspective view of the circuit board provided in the sixth embodiment, and fig. 18 is a cross-sectional view at E-E in fig. 16. In the present embodiment, the circuit board 100 includes a main board layer 1, a first frame board layer 2, a second frame board layer 3, a third frame board layer 4, a wiring layer 5, a first sub board layer 6, a second sub board layer 7, a first device 8, and a second device 9. The main board layer 1 is provided with a hollowed-out area 11, a first layout area 12 and a second layout area 13, wherein the hollowed-out area 11 can be used for installing a camera assembly, and the first layout area 12 and the second layout area 13 are respectively positioned on two opposite sides of the hollowed-out area 11 and can be used for laying out devices and circuits. The first frame plate layer 2, the second frame plate layer 3 and the wiring layer 5 are stacked at intervals on the first layout area 12, and the wiring layer 5 is located between the first frame plate layer 2 and the second frame plate layer 3, and the wiring layer 5 extends from the first layout area 12 to the second layout area 13. The first sub-board layer 6 is stacked on the side of the first frame board layer 2 facing away from the main board layer 1 and extends to the second frame board layer 3. The third frame plate layer 4 is arranged on the side of the first sub-plate layer 6 facing away from the first frame plate layer 2, and the second sub-plate layer 7 is stacked on the side of the third frame plate layer 4 facing away from the first sub-plate layer 6. The first devices 8 may be provided in plurality, the first devices 8 are respectively disposed on the upper surface and the lower surface of the main board layer 1 and the wiring layer 5, the second devices 9 may be provided in plurality, the second devices 9 are respectively disposed on the upper surface and the lower surface of the first sub board layer 6 and the lower surface of the second sub board layer 7, and at least part of the second devices 9 located in the second sub board layer 7 and at least part of the second devices 9 located in the first sub board layer 6 may be electrically connected through the signal line C.
In this embodiment, the main board layer 1 and the first sub board layer 6 are connected through the first frame board layer 2 and the second frame board layer 3, that is, the first sub board layer 6 is elevated above the main board layer 1 through the first frame board layer 2 and the second frame board layer 3, and the main board layer 1 can perform signal transmission with the first sub board layer 6 through the first frame board layer 2, for example, a via hole can be formed in the first frame board layer 2, and a wire is disposed in the via hole, so that at least part of the first device 8 on the main board layer 1 can be electrically connected with at least part of the second device 9 on the first sub board layer 6 through the wire; or a via hole is arranged in the first frame layer 2, and a conductive layer is arranged on the inner wall of the via hole, so that at least part of the first devices 8 on the main board layer 1 can be electrically connected with at least part of the second devices 9 on the first sub board layer 6 through the conductive layer. The first sub-board layer 6 and the second sub-board layer 7 are connected through the third frame board layer 4, that is, the second sub-board layer 7 is elevated above the first sub-board layer 6 through the third frame board layer 4, and the second sub-board layer 7 can perform signal transmission with the first sub-board layer 6 through the third frame board layer 4, for example, a through hole can be formed in the third frame board layer 4, and a wire is arranged in the through hole, so that at least part of the second devices 9 on the first sub-board layer 6 can be electrically connected with at least part of the second devices 9 on the second sub-board layer 7 through the wire; or be equipped with the via hole in third frame sheet layer 4, the via hole inboard is equipped with the conducting layer, makes the at least partial second device 9 on the first sub-sheet layer 6 can be through conducting layer and the at least partial second device 9 electricity on the second sub-sheet layer 7 to form five clear PCB board stacked structure, under the unchangeable circumstances of circuit board area, through making the circuit board extend to Z direction (the thickness extending direction of circuit board), increased the layout area of circuit board, because electronic device not only can be laid out in mainboard layer 1 this moment, can also be laid out on first sub-sheet layer 6 and second sub-sheet layer 7. In addition, the area of the second sub-board layer 7 is made smaller than the area of the first sub-board layer 6, so that the space in the electronic device can be fully utilized.
Specifically, the thicknesses of the first frame plate layer 2 and the second frame plate layer 3 are the same, i.e., the first frame plate layer 2 and the second frame plate layer 3 are set at equal heights. The first board layer 2 is welded on the motherboard layer 1, and signal wires can be routed inside the first board layer 2, so that the first sub board layer 6 can be electrically connected with the motherboard layer 1 through the first board layer 2. The second frame board layer 3 can play a supporting role, and welding spots between the second frame board layer 3 and the main board layer 1 and the first sub board layer 6 are set to be ground network welding spots or empty network welding spots (non-functional welding spots), and no signal wires are arranged inside, wherein the ground network welding spots are welding spots with GND network properties, are connected with the GND of the single board, and the empty network welding spots are welding spots with dummy network properties, are not connected with any network of the single board, and can also be called as dummy network welding spots. The thickness of the wiring layer 5 is smaller than that of the first frame plate layer 2 and the second frame plate layer 3, the wiring layer 5 is welded on the main board layer 1, penetrates through the space between the first frame plate layer 2 and the second frame plate layer 3 and is positioned below the first sub-plate layer 6, extends from the first layout area 12 to the second layout area 13, can be internally provided with signal wires, and is convenient for signal transmission between the first layout area 12 and the second layout area 13 of the main board layer 1.
Further, the first frame ply 2 and the third frame ply 4 are both of an annular structure, the first sub-ply 6 is stacked on the peripheral side of the portion of the first frame ply 2 and the peripheral side of the first frame ply 2, and the peripheral side of the second sub-ply 7 and the peripheral side of the third frame ply 4 are flush, so that the first sub-ply 6 can be supported more firmly by the first frame ply 2 of the annular structure, and the second sub-ply 7 can be supported more firmly by the third frame ply 4 of the annular structure. Meanwhile, the first frame plate layer 2 and the third frame plate layer 4 are both in annular structures, so that the volumes of the first frame plate layer 2 and the third frame plate layer 4 can be reduced, and the layout area of the device can be increased while the weight is reduced.
In the present embodiment, since the wiring layer 5 extending from the first layout area 12 to the second layout area 13 is provided, signals between the first layout area 12 and the second layout area 13 can be connected through the wiring layer 5, satisfying the signal connection requirements of the left and right side areas of the main board layer 1. In addition, the first sub-board layer 6 is stacked on the side of the first frame board layer 2 facing away from the main board layer 1 and extends to the second frame board layer 3 (the first sub-board layer 6 is arranged across the wiring layer 5), and the second devices 9 are arranged on the first sub-board layer 6 and the second sub-board layer 7, so that the connecting lines between the second devices 9 are shorter, and the connecting line perforation is less, thereby reducing the signal insertion loss. For example, the combining switch may be disposed on the second sub-board layer 7, and the antenna may be disposed on the first sub-board layer 6, so that the signal line from the combining switch to the antenna may be shortened, and the insertion loss of the signal at the radio frequency public terminal may be reduced. The insertion loss is used for describing the attenuation degree of the signal in the transmission process.
For example, if the signal line between the combiner switch on the second sub-board layer 7 and the antenna on the first sub-board layer 6 needs to be penetrated through the second frame board layer 3 of the first frame board layer 2, then the first frame board layer 2 and the second frame board layer 3 need to be provided with a via hole so as to facilitate signal transmission; in order to achieve the impedance continuity at the frame plate via hole, a plurality of ground holes 102 are generally provided around the signal hole 101, and in this embodiment, six ground holes 102 are uniformly distributed around the signal hole 101. Reference is made to fig. 19. Assuming that the thickness of the first frame plate layer 2 and the second frame plate layer 3 is 1.3mm, the welding spot distance W1 (the distance from the center point of the ground hole to the center point of the signal hole) of the first frame plate layer 2 and the second frame plate layer 3 is 0.6mm, the size of the welding disc W2 (the diameter of the ground hole or the signal hole) is 0.4mm, and the insertion loss of a single via hole is-0.0328 dB@2.2GHz and-0.0611@5 GHz, wherein the insertion loss of the single via hole refers to the insertion loss of a signal passing through one frame plate layer. If the design is performed according to the parameters of the first frame plate layer 2 and the second frame plate layer 3, the scheme of making the electric connection switch and the signal wire of the antenna penetrate through the first frame plate layer 2 and the second frame plate layer 3 is larger than the insertion loss of the scheme of the embodiment by 0.0656dB@2.2GHz and 0.1222@5GHz.
Correspondingly, the embodiment of the application also discloses an electronic device, and referring to fig. 20 and 21, fig. 20 is a top view of the electronic device provided by the embodiment of the application, and fig. 21 is a cross-sectional view at F-F in fig. 20. The electronic device includes a housing 200, a camera assembly 300, a screen module 400, and the circuit board 100 described in the fourth to sixth embodiments. The housing 200 is connected with the screen module 400 to form a receiving chamber, and the housing 200 is provided with a light hole 201. The circuit board 100 is disposed in a receiving cavity defined by the housing 200 and the screen module 400. The camera assembly 300 includes a camera decoration 301 and a camera module 302, the camera decoration 301 is in an annular structure to form an inner space, and the camera decoration 301 is assembled in the light hole 201 of the housing 200, the camera module 302 is assembled in the hollowed-out area 11 of the circuit board 100, and the position of the camera module 302 corresponds to the position of the camera decoration 301, and at least part of the third frame board layer 4, the second sub board layer 7 and the second device 9 arranged on the second sub board layer 7 of the circuit board 100 are located in the inner space of the camera decoration 301.
In order to prevent electromagnetic interference, the electronic apparatus further includes a shielding case 10, the shielding case 10 covering the electronic device of the circuit board so that the influence of external electromagnetic waves on the internal circuit and the external radiation of internally generated electromagnetic waves can be shielded by the shielding case 10, i.e., the shielding effect on the device on the circuit board is performed.
In some embodiments, the electronic device may also include a housing, a camera assembly, and the circuit board 100 described in the first to third embodiments, where the housing 200 and the screen module 400 are connected to form a receiving cavity. The circuit board 100 is disposed in a receiving cavity formed by the housing 200 and the screen module 400. The camera assembly 300 includes a camera ornament 301 and a camera module 302, the camera ornament 301 is assembled in the light hole 201 of the housing 200, the camera module 302 is assembled in the hollowed-out area 11 of the circuit board 100, and the position of the camera module 302 corresponds to the position of the camera ornament 301.
In this embodiment, by providing the circuit board 100 with the third frame board layer 4 and the second sub board layer 7, the layout area of the circuit board 100 is increased, and at the same time, at least part of the third frame board layer 4, the second sub board layer 7 and the second device 9 provided on the second sub board layer 7 of the circuit board 100 are located in the internal space of the camera ornament 301, so that the internal space of the electronic device can be fully utilized, and the waste of the internal space of the electronic device is avoided.
The foregoing is merely a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the technical scope of the present application should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (17)

1. A circuit board for use in an electronic device, comprising:
a main board layer;
a first frame plate layer laminated to the main plate layer;
the first sub board layer is stacked on one side of the first frame board layer, which is opposite to the main board layer;
the first device is arranged on the main board layer; and
and the second device is arranged on the first sub-board layer.
2. The circuit board of claim 1, wherein the motherboard layer is provided with a hollowed-out area, a first layout area and a second layout area, the first layout area and the second layout area being respectively located on opposite sides of the hollowed-out area;
the circuit board further comprises a wiring layer and a second frame plate layer, wherein the first frame plate layer, the second frame plate layer and the wiring layer are stacked in the first layout area in a spaced mode, the wiring layer is located between the first frame plate layer and the second frame plate layer, and the wiring layer extends from the first layout area to the second layout area.
3. The circuit board of claim 2, wherein the first daughter board stack is disposed on a side of the first frame board layer remote from the motherboard layer and extends to the second frame board layer.
4. The circuit board of claim 2, wherein the first and second frame layers have the same thickness, and the wiring layer has a thickness less than the first and second frame layers.
5. The circuit board of claim 2, wherein the first frame plate layer has a ring-shaped structure.
6. The circuit board of any one of claims 1-5, further comprising a third frame ply and a second sub-ply, wherein the third frame ply is laminated to a side of the first sub-ply facing away from the first frame ply, wherein the second sub-ply is laminated to a side of the third frame ply facing away from the first sub-ply, and wherein the second sub-ply is provided with at least one of the second devices.
7. The circuit board of claim 6, wherein the third frame plate layer has a ring-shaped structure.
8. The circuit board of claim 2, wherein the first sub-board layer comprises a first portion and a second portion, the first portion is stacked on a side of the first frame board layer facing away from the main board layer, the second portion is stacked on a side of the second frame board layer facing away from the main board layer, and at least one of the second devices is disposed on each of the first portion and the second portion.
9. The circuit board of claim 8, further comprising a third frame ply and a second sub-ply, the third frame ply being laminated to a side of the first portion facing away from the first frame ply, the second sub-ply being laminated to a side of the third frame ply facing away from the first portion, the second sub-ply further providing at least one of the second devices.
10. The circuit board of claim 1, wherein the first device comprises at least one of a system on chip, a general purpose flash memory chip, a power management unit, a fast charge chip, an audio codec chip, an audio amplifier, a screen driver chip, a board-to-board connector, a resistor, a capacitor, and an inductor; the second device comprises at least one of a radio frequency transceiver, a power amplifier, a low noise amplifier, a combiner switch, a filter, a duplexer, an open switch and an open spring.
11. An electronic device, comprising:
a housing enclosing a receiving cavity;
the circuit board, the circuit board set up in hold the intracavity, just the circuit board includes mainboard layer, first frame layer, first sub-layer, first device and second device, first frame plate range upon range of in the mainboard layer, first sub-board range upon range of in first frame layer dorsad one side of mainboard layer, first device set up in the mainboard layer, the second device set up in first sub-board layer.
12. The electronic device of claim 11, further comprising a camera assembly, wherein the housing is provided with a light hole, the motherboard layer is provided with a hollowed-out area, a first layout area and a second layout area, the first layout area and the second layout area are respectively located at two opposite sides of the hollowed-out area, the first frame plate is stacked in the first layout area, and the camera assembly is assembled in the hollowed-out area and is opposite to the light hole.
13. The electronic device of claim 12, wherein the circuit board further comprises a routing layer and a second frame plate layer, the first frame plate layer, the second frame plate layer, and the routing layer are stacked apart from the first layout area, and the routing layer is located between the first frame plate layer and the second frame plate layer, the routing layer extending from the first layout area to the second layout area.
14. The electronic device of claim 13, wherein the first stack of sub-boards is disposed on the first frame plate layer and extends to the second frame plate layer.
15. The electronic device of claim 13, wherein the first sub-board layer comprises a first portion and a second portion, the first portion is stacked on a side of the first frame board layer facing away from the main board layer, the second portion is stacked on a side of the second frame board layer facing away from the main board layer, and at least one of the second devices is disposed on each of the first portion and the second portion.
16. The electronic device of any of claims 12-15, wherein the circuit board further comprises a third frame ply and a second sub-ply, the third frame ply being laminated to a side of the first sub-ply facing away from the first frame ply, the second sub-ply being laminated to a side of the third frame ply facing away from the first sub-ply, the second sub-ply being provided with at least one of the second devices.
17. The electronic device of claim 16, wherein the camera assembly comprises a camera trim and a camera module, the camera trim is mounted to the light aperture, the camera module is mounted to the hollowed-out area, the camera module corresponds to the camera trim, and at least a portion of the third bezel layer, the second sub-layer, and the second device disposed on the second sub-layer are located in an interior space of the camera trim.
CN202310831749.XA 2023-07-06 2023-07-06 Circuit board and electronic equipment Pending CN117693115A (en)

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WO2023043254A1 (en) * 2021-09-16 2023-03-23 엘지이노텍 주식회사 Camera module and optical device comprising same
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JP2000208947A (en) * 1999-01-08 2000-07-28 Kyocera Corp Wiring board
US20200275553A1 (en) * 2017-03-09 2020-08-27 Huawei Technologies Co., Ltd. Mainboard for consumer electronic product, and terminal
EP3487274A1 (en) * 2017-11-20 2019-05-22 Valeo Comfort and Driving Assistance Electronic device comprising a structral piece with a cage positionned over an electronic component
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