CN218277292U - Mainboard and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a mainboard and electronic equipment, wherein, the mainboard includes: mainboard main part, frame plate, daughter board and protection piece, the mainboard main part the frame plate with the daughter board stacks gradually the setting from bottom to top, the mainboard main part the frame plate with the daughter board encloses to close and forms and holds the chamber, the mounting hole has been seted up on the daughter board, the protection piece set up in mounting hole department shields hold intracavity electronic signal, the upper surface of protection piece has the installation face, the installation face is used for installing electronic components, the height of installation face is less than the height of daughter board upper surface. According to the mainboard and the electronic equipment, the overall thickness of the mainboard can be reduced through the improvement of the mainboard structure, so that the thickness of the whole electronic equipment is reduced, and the trend of thinning of the electronic equipment is facilitated.

Description

Mainboard and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of electronic equipment, in particular to a mainboard and electronic equipment.

Background

With the development of science and technology, electronic devices have been popularized in daily life of people. Electronic equipment generally includes a main board, which is also called a main board, a system board or a motherboard, and is one of the most important components of the electronic equipment. The main function of the main board is to transmit various electronic signals, and part of the chips are also responsible for primarily processing some peripheral data. All parts in the electronic equipment are connected through a mainboard, whether the performance of the electronic equipment can be fully exerted, whether the hardware function is enough, how the hardware is compatible and the like depend on the design of the mainboard, and the quality of the mainboard determines the overall performance, the service life and the function expansion capability of the electronic equipment to some extent.

In some electronic devices, such as mobile phones, tablet computers, etc., in order to save the internal space of the electronic devices, the motherboard adopts a sandwich-type lamination scheme, which includes: the mainboard main part, the frame plate and the daughter board that stack gradually the setting, fretwork in the middle part of the frame plate, mainboard main part, frame plate and daughter board will enclose and close and form an inner space, so, the upper and lower surface of mainboard and the upper surface of daughter board all can set up electronic components.

However, the main board adopting the sandwich type stacking scheme has a disadvantage that since the main board is formed by stacking the main board body, the frame plate and the daughter board, the thickness of the main board is large, and if the electronic components, especially the electronic components with a high height (such as a camera) are mounted on the upper surface of the daughter board, the thickness of the whole main board is further increased. The thickness of the main board will directly affect the thickness of the whole electronic device, which is related to the appearance effect of the whole electronic device, and is not beneficial to the thinning of the electronic device.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a mainboard and electronic equipment, and through the improvement to the mainboard structure, can reduce the holistic thickness of mainboard, and then reduce the thickness of electronic equipment complete machine, be favorable to electronic equipment's trend thinly.

An aspect of an embodiment of the present application provides a motherboard, including: a main board body, a frame board, a sub-board and a guard. Mainboard main part, frame and daughter board range upon range of setting from bottom to top in proper order, and mainboard main part, frame and daughter board enclose to close and form and hold the chamber, have seted up the mounting hole on the daughter board, and the protection part sets up and holds intracavity electronic signal in order to shield in mounting hole department, and the upper surface of protection part has the installation face, and the installation face is used for installing electronic components, and the height that highly is less than the daughter board upper surface of installation face.

The mainboard that this application embodiment provided is through seting up the mounting hole on the daughter board, is provided with the protection piece in mounting hole department, and the protection piece can play the shielding effect to the electronic signal who holds the intracavity, and the upper surface of protection piece has the installation face, can install electronic components on the installation face to the height that highly is less than the daughter board upper surface of installation face. On one hand, the height of the mounting surface is lower than that of the upper surface of the daughter board, and after the electronic component is mounted on the mounting surface, compared with the situation that the electronic component is mounted on the upper surface of the daughter board, the overall thickness of the mainboard and the electronic component can be reduced, the thickness size of the whole electronic equipment and the protruding size of the camera decorating part can be reduced, the appearance effect of the electronic equipment is optimized, and the thinning tendency of the electronic equipment is facilitated. On the other hand, the protection part can play a shielding role to the electronic signal in the accommodation cavity, and prevent the electronic signal in the accommodation cavity (for example, the signal generated by the electronic component on the upper surface of the main board body) from generating signal leakage and signal interference. In addition, due to the existence of the protection piece, the protection piece has stable structure, and can prevent the damage or the failure of the device caused by the collision between the electronic component assembled on the installation surface and the electronic component assembled on the upper surface of the mainboard main body.

In one possible embodiment, the guard comprises: the mounting panel, the upper surface of mounting panel is the installation face, and the periphery of mounting panel has downwardly extending's first hem, and the protection piece covers and establishes on mainboard main part, and first hem links to each other with mainboard main part. Therefore, the protection part can be connected with the main board body through the first folding edge and is arranged on the main board body in a covering mode, the electronic components on the main board body are covered into the containing space formed by the protection part and the main board body, and the shielding effect on electronic signals in the containing cavity is achieved. Moreover, the protective frame under the structure is simple to assemble.

In one possible embodiment, a shield is associated with the daughter board, the shield closing the mounting hole. On one hand, the protection piece seals the mounting hole, and can further prevent the leakage and the interference of electronic signals in the accommodating cavity. On the other hand, the shield is connected to the daughter board, so that the reliability of the motherboard can be improved.

In one possible embodiment, the guard comprises: the upper surface of mounting panel is the installation face, and the periphery of mounting panel has the second hem along the radial extension of mounting panel, and the upper surface of second hem links to each other with the lower surface of daughter board. The stability of the guard may be improved compared to the manner in which the guard side walls are connected to the mounting holes.

In one possible embodiment, the mounting surface is higher than the upper surface of the second flap. Applicable in the higher operating mode of mainboard main part upper surface electronic components height.

In a possible embodiment, the mounting surface is lower in height than the upper surface of the second flange. Applicable in the lower operating mode of mainboard main part upper surface electronic components height.

In one possible embodiment, the guard comprises: the upper surface of mounting panel is the installation face, and the periphery of mounting panel has the third hem along the radial extension of mounting panel, and the lower surface of third hem links to each other with the upper surface of daughter board. In this way, the connection of the shield member to the daughter board can be made from the outside of the daughter board, and the mounting of the shield member can be facilitated.

In a possible embodiment, the protection member has a limiting protrusion at its periphery, and the daughter board has a limiting hole, in which the limiting protrusion is disposed. The protection piece can obtain limiting displacement in the horizontal direction, prevents that the protection piece from producing the displacement in the horizontal direction, guarantees the steadiness of protection piece.

In a possible embodiment, the upper surface of the main board body, the lower surface of the main board body and the upper surface of the daughter board are provided with electronic components. The tiling size of the mainboard can be reduced, and the transverse space of the electronic equipment is saved.

Another aspect of the embodiments of the present application provides an electronic device, which includes a housing and the above motherboard, where the motherboard is disposed in the housing.

According to the electronic equipment provided by the embodiment of the application, the installation holes are formed in the daughter board of the mainboard, the protection piece is arranged at the installation holes and can shield electronic signals in the accommodating cavity, the upper surface of the protection piece is provided with the installation surface, electronic components can be installed on the installation surface, and the height of the installation surface is lower than that of the upper surface of the daughter board. On one hand, the height of the mounting surface is lower than that of the upper surface of the daughter board, and after the electronic component is mounted on the mounting surface, compared with the situation that the electronic component is mounted on the upper surface of the daughter board, the overall thickness of the mainboard and the electronic component can be reduced, the thickness size of the whole electronic equipment and the protruding size of the camera decorating part can be reduced, the appearance effect of the electronic equipment is optimized, and the thinning tendency of the electronic equipment is facilitated. On the other hand, the protection piece can play a role in shielding electronic signals in the accommodating cavity, and prevents the electronic signals in the accommodating cavity (such as signals generated by electronic components on the upper surface of the main board body) from generating signal leakage and signal interference. In addition, due to the existence of the protection piece, the protection piece has stable structure, and can prevent the damage or the failure of the device caused by the collision between the electronic component assembled on the installation surface and the electronic component assembled on the upper surface of the mainboard main body.

Drawings

In order to more clearly illustrate the technical solutions in the present application or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for a person skilled in the art to obtain other drawings according to these drawings without creating any inventive idea.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2 is an exploded schematic view of an electronic device according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of a motherboard according to the related art;

fig. 4 is a schematic structural diagram of a motherboard disposed in an electronic device according to a related art;

fig. 5 is a schematic structural diagram of a motherboard disposed in an electronic device according to the related art;

FIG. 6 is a schematic diagram of a motherboard and an electronic device according to the related art;

fig. 7 is a schematic structural diagram of a motherboard according to an embodiment of the present application;

FIG. 8 is a top view of a motherboard according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of a motherboard according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a motherboard according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of a motherboard according to an embodiment of the present application;

fig. 12 is a schematic structural view of a guard provided in an embodiment of the present application;

fig. 13 is a schematic structural diagram of a motherboard according to an embodiment of the present application;

FIG. 14 is a schematic view of a protective element according to an embodiment of the present application;

fig. 15 is a schematic partial structure diagram of a main board according to an embodiment of the present application.

Description of the reference numerals:

100-an electronic device;

10-a display screen; 20-a rear cover;

30-middle frame; 31-middle plate;

32-a frame; 40-a main board;

41-main board main body; 42-a frame plate;

43-daughter board; 431-mounting holes;

432-a limiting hole; 44-a guard;

441-a mounting plate; 4411-a mounting face;

442-first fold; 443-second fold;

444-third folding edge; 445-limit projection;

45-a containment chamber; 46-electronic components;

50-a battery; 60-a camera module;

61-front camera; 62-rear camera;

70-camera decoration piece.

Detailed Description

The terminology used in the description of the embodiments section of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application, which will be described in detail below with reference to the accompanying drawings.

The electronic device provided by the embodiment of the application can include, but is not limited to, a mobile or fixed terminal such as a mobile phone, a tablet Computer, a watch, a notebook Computer, an Ultra-mobile Personal Computer (UMPC), a handheld Computer, an interphone, a netbook, a POS machine, a Personal Digital Assistant (PDA), a driving recorder, a security device, and the like. The embodiments of the present application take a mobile phone as an example for description.

Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application, and fig. 2 is a schematic exploded structural diagram of the electronic device 100 according to the embodiment of the present application, and referring to fig. 1 and fig. 2, the electronic device 100 according to the embodiment of the present application may include: a housing, which may provide a structural framework for the electronic device 100, such as in fig. 2, the housing may include a center frame 30 and a back cover 20, and may also have a display screen 10 when the electronic device 100 has a display function. A middle frame 30, a main board 40 and a battery 50 are arranged between the display screen 10 and the rear cover 20. The main board 40 and the battery 50 may be disposed on the middle frame 30, for example, the main board 40 and the battery 50 may be disposed on a side of the middle frame 30 facing the rear cover 20, or the main board 40 and the battery 50 may be disposed on a side of the middle frame 30 facing the display screen 10.

It will be readily appreciated that the housing of the electronic device 100 provided herein includes, but is not limited to, the above-described structure, for example, in some other embodiments, the housing may be a one-piece or two-piece housing made of metal or plastic, etc. In the embodiment of the present application, the housing is specifically described by taking as an example a structure formed by the middle frame 30 and the rear cover 20.

The battery 50 may be connected to the main board 40 to supply power to the processor, the internal memory, the external memory, the display screen 10, the camera module 60, the communication module, and the like.

The Display screen 10 may be an Organic Light-Emitting Diode (OLED) Display screen or a Liquid Crystal Display (LCD).

The rear cover 20 may be a metal rear cover, a glass rear cover, a plastic rear cover, or a ceramic rear cover, and in the embodiment of the present application, the material of the rear cover 20 is not limited.

Middle frame 30 may include a middle plate 31 and a bezel 32. The rim 32 is disposed around the outer circumference of the middle plate 31. In general, the frame 32 may include a top frame, a bottom frame, a left frame, and a right frame, which form a frame of a square ring structure. The middle plate 31 may be an aluminum plate, an aluminum alloy, or a magnesium alloy. The frame 32 may be a metal frame or a ceramic frame. The metal middle plate 31 and the frame 32 may be clamped, welded, bonded or integrally formed, or the metal middle plate 31 and the frame 32 are fixedly connected by injection molding.

It should be noted that in some other embodiments, the electronic device 100 may include, but is not limited to, the structure shown in fig. 1 and fig. 2, and the back cover 20 of the mobile phone may be connected to the bezel 32 to form an integrally formed housing, for example, the electronic device 100 may include: display screen 10, metal middle plate 31 and the outer casing, the outer casing can be formed by integrally forming frame 32 and back cover 20. So that the main board 40 and the battery 50 are located in a space surrounded by the metal middle plate 31 and the case.

In the embodiment of the present application, in order to implement the shooting function, the electronic apparatus 100 further includes: at least one camera module 60 and a flash (not shown in the figure), wherein the camera module 60 may be a front camera 61, a rear camera 62, and the like, and the number of the front camera 61 and the rear camera 62 may be one or more, for example, as shown in fig. 2, in the electronic device 100 provided in the present application, the camera module 60 includes: a front camera 61 and a rear camera 62.

The rear cover 20 is provided with an opening 21 for installing the flashlight and a part of the rear camera 62. The front camera 61 may be disposed on a side of the metal middle plate 31 facing the display screen 10. In the embodiment of the present application, the positions where the front camera 61 and the rear camera 62 are disposed include, but are not limited to, the above description. In some embodiments, the sum of the numbers of the front cameras 61 and the rear cameras 62 arranged in the electronic device 100 may be 1 or N, where N is a positive integer greater than 1.

It is to be understood that the illustrated structure of the embodiment of the present application does not specifically limit the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer components than illustrated, or combine certain components, or split certain components, or a different arrangement of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

Wherein, the camera module 60 may include: lens, optical filter, support, photosensitive element, flexible board and connector etc..

It should be noted that the camera module 60 can be a camera module with a fixed focal length, or a camera module with a variable focal length, and when the camera module 60 is the camera module 60 with a variable focal length, the camera module 60 can further include a focusing module (not shown), such as a focusing motor, and the focusing motor can be disposed on the bracket of the camera module 60.

In this application embodiment, the optical Filter can set up according to the function needs, for example, the optical Filter can be infrared cut Filter (IR cut Filter, IRCF), and infrared cut Filter can Filter infrared light, prevents that infrared light from getting into the lens and causing the influence to formation of image.

The photosensitive element may be a Charge Coupled Device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The connector is used for electrically connecting the flexible board and an Image Processing unit (ISP) on the main board 40, and the Image Processing unit (ISP) is electrically connected with a Digital Signal Processing (DSP). Among them, an image processing unit (ISP) and a digital processing unit (DSP) may be separately provided on the main board 40, or the image processing unit (ISP) and the digital processing unit (DSP) may be integrated together to be provided on the main board 40.

When in photographing, a shutter is opened, light passes through a lens and is transmitted to a photosensitive element through a filter, an optical signal is converted into an electric signal, the photosensitive element transmits the electric signal to an image processing unit (ISP) through a flexible plate and a connector for processing, the image processing unit (ISP) converts the electric signal into a digital image signal, the image processing unit (ISP) outputs the digital image signal to a digital processing unit (DSP) for processing, and the digital processing unit (DSP) converts the digital signal into image signals in standard RGB, YUV and other formats.

Fig. 3 is a schematic structural diagram of a motherboard 40 in the related art, fig. 4 is a schematic structural diagram of a motherboard 40 in the related art disposed in an electronic device 100, and referring to fig. 3 and fig. 4, for example, the motherboard 40 is disposed between a middle plate 31 and a rear cover 20, in order to save an internal space of the electronic device 100, the motherboard 40 adopts a sandwich type lamination scheme, which includes: mainboard main part 41, framed board 42 and daughter board 43, hollowed out in framed board 42 middle part, and mainboard main part 41, framed board 42 enclose with daughter board 43 and close and form an accommodation space, so, the upper surface and the lower surface of mainboard main part 41 and the upper surface of daughter board 43 all can set up electronic components 46 to this saves the inside transverse space of electronic equipment 100.

However, the thickness of the main board 40 itself after the sandwich lamination scheme is larger, if the electronic component 46, especially the electronic component 46 with a higher height (for example, the rear camera 62) is mounted on the upper surface of the sub-board 43, the thickness of the whole main board 40 will be further increased, and the thickness of the main board 40 will directly affect the thickness of the whole electronic device 100, which is related to the appearance effect of the whole electronic device. For example, as shown in fig. 5, fig. 5 is a schematic structural diagram of a related art main board 40 installed in an electronic device 100, and if an electronic component 46 with a relatively high height is installed on the upper surface of a sub-board 43, taking a rear camera 62 as an example, the height of the rear camera 62 plus the thickness of the main board 40 itself will directly affect the overall thickness X of the electronic device 100. For example, as shown in fig. 6, fig. 6 is a schematic structural diagram of the motherboard 40 and the electronic device 100 in the related art, and if the electronic component 46 with a high height is disposed on the upper surface of the daughter board 43, taking the rear camera 62 as an example, the height of the rear camera 62 plus the thickness of the motherboard 40 itself will affect the protruding dimension Y of the camera ornament 70. The two dimensions X and Y are directly related to the appearance of the whole electronic device, and if X and Y are larger, the thinning of the electronic device 100 is not facilitated.

In order to solve the above problem, fig. 7 is a schematic structural diagram of a main board 40 provided in an embodiment of the present application, and fig. 8 is a top view of the main board 40 provided in the embodiment of the present application, and referring to fig. 7 and fig. 8, the main board 40 provided in the embodiment of the present application includes: mainboard main part 41, framed panel 42 and daughter board 43, mainboard main part 41, framed panel 42 and daughter board 43 stack gradually from bottom to top and set up, mainboard main part 41, framed panel 42 and daughter board 43 enclose to close and form and hold chamber 45, mainboard main part 41's upper surface, mainboard main part 41's lower surface and daughter board 43's upper surface all can set up electronic components 46, daughter board 43 has seted up mounting hole 431, the higher electronic components 46 of mountable height (this application explains with rear camera 62 as an example) in the mounting hole 431, rear camera 62 accessible support is fixed on mainboard main part 41, framed panel 42 or daughter board 43. It should be understood that, in the main board 40 provided in the embodiment of the present application, by forming the mounting hole 431 on the sub-board 43, the rear camera 62 with a higher height can sink for a certain distance in the mounting hole 431, and the overall thickness of the main board 40 and the rear camera 62 is reduced, so as to reduce the overall thickness of the electronic device 100 and the protruding dimension of the camera ornament 70, further optimize the appearance effect of the electronic device 100, and facilitate the thinning of the electronic device 100.

The main board 40 provided by the above embodiments of the present application is suitable for a solution in which there is no or weak electronic signal inside the accommodating cavity 45. It can be understood that, since the sub-board 43 is provided with the mounting hole 431, the electronic components 46 on the upper surface of the main board body 41 will be exposed, and if these electronic components 46 have electronic signals or the electronic signals are strong, this will cause leakage and interference of the electronic signals.

Thus, fig. 9 is a schematic structural diagram of the main board 40 provided in an embodiment of the present application, and referring to fig. 9, the main board 40 provided in the embodiment of the present application may further include: a shield member 44, the shield member 44 being disposed at the mounting hole 431 to shield the electronic signal in the accommodation chamber 45, an upper surface of the shield member 44 having a mounting surface 4411, the mounting surface 4411 being used for mounting the electronic component 46 (e.g., the rear camera 62), and a height of the mounting surface 4411 being lower than a height of an upper surface of the daughter board 43.

It should be understood that, in the main board 40 provided in the embodiment of the present application, the mounting hole 431 is formed in the sub-board 43, the shielding member 44 is disposed at the mounting hole 431, the shielding member 44 can shield the electronic signal in the receiving cavity 45, the upper surface of the shielding member 44 has the mounting surface 4411, the electronic component 46 can be mounted on the mounting surface 4411, and the height of the mounting surface 4411 is lower than the height of the upper surface of the sub-board 43. On one hand, since the height of the mounting surface 4411 is lower than the height of the upper surface of the daughter board 43, after the electronic component 46 is mounted on the mounting surface 4411, compared with the case where the electronic component 46 is mounted on the upper surface of the daughter board 43, the overall thickness of the main board 40 and the electronic component 46 can be reduced, and the overall thickness of the electronic device 100 and the protruding dimension of the camera decoration 70 can be further reduced, so that the appearance effect of the electronic device 100 is optimized, and the thinning of the electronic device 100 is facilitated. On the other hand, the shielding member 44 can shield the electronic signals in the accommodating cavity 45, and prevent the electronic signals in the accommodating cavity 45 (for example, signals generated by the electronic components 46 on the upper surface of the main board body 41) from signal leakage and signal interference. In addition, the presence of the protector 44 stabilizes the structure of the protector 44 itself, and prevents damage or failure of the device due to collision between the electronic component 46 mounted on the mounting surface 4411 and the electronic component 46 mounted on the upper surface of the main board main body 41.

The shielding member 44 may be made of a shielding material such as hardware, and the common material includes cupronickel, silver, and the like. The shielding member 44 may be connected to the main plate body 41, the frame plate 42 or the sub-plate 43 according to an operating condition to ensure structural stability of the shielding member 44. The connection between the protection member 44 and the main board body 41, the frame plate 42 or the sub-board 43 may be made by conventional connection methods such as bonding, welding, clipping, fastening with fasteners, etc. Here, the material of the guard 44 and the connection method of the guard 44 are not particularly limited.

With continued reference to fig. 9, in some embodiments of the present application, the guard 44 may include: the mounting plate 441 has a mounting surface 4411 on the upper surface of the mounting plate 441, and the periphery of the mounting plate 441 has a first folded edge 442 extending downward, so that the shielding member 44 can be connected to the main board body 41 through the first folded edge 442 and cover the main board body 41, and the electronic component 46 on the main board body 41 is covered in the accommodating space formed by the shielding member 44 and the main board body 41, thereby shielding the electronic signal in the accommodating cavity 45. The guard 44 under this structure is simple to assemble, and for example, may be welded to the main plate body 41 through the first folded edge 442.

Fig. 10 is a schematic structural diagram of the main board 40 according to an embodiment of the present application, and referring to fig. 10, in some embodiments of the present application, the protection member 44 is connected to the sub-board 43, and the protection member 44 closes the mounting hole 431. On one hand, the shielding member 44 closes the mounting hole 431, so that the leakage and interference of the electronic signal in the accommodating cavity 45 can be further prevented. On the other hand, when the electronic component 46 on the lower surface of the main board body 41 is a component that is easily damaged, such as a glass package, compared to the case where the shield member 44 is connected to the main board body 41, if the electronic device 100 is dropped and hit, the electronic component 46 mounted on the mounting surface 4411 impacts the shield member 44, and the force is transmitted to the main board body 41 through the shield member 44, so that the main board body 41 is deformed, and the deformation of the main board body 41 causes the pads of the electronic component 46 on the main board body 41 to be peeled off from the main board body 41, or the device is directly damaged or failed. The shield 44 is connected to the daughter board 43 to prevent such a situation from occurring, and the impact force is buffered by the daughter board 43, so that the influence on the electronic components 46 on the main board body 41 is reduced, and the reliability of the main board 40 is improved.

It should be noted that the structure of the protection member 44 includes, but is not limited to, the case where the area is larger than the installation hole 431 in fig. 10, for example, the shape and the area of the protection member 44 may be the same as those of the installation hole 431. And the fixing of the shielding member 44 is achieved by the side edge of the shielding member 44 being connected to the inner wall of the mounting hole 431.

Continuing to refer to fig. 10, in some embodiments of the present application, the guard 44 may include: the mounting plate 441, the upper surface of the mounting plate 441 is the mounting surface 4411, the periphery of the mounting plate 441 has a second folded edge 443 extending along the radial direction of the mounting plate 441, and the upper surface of the second folded edge 443 is connected with the lower surface of the sub-plate 43. The stability of the prevention piece 44 can be improved compared to the manner in which the side wall of the prevention piece 44 is connected to the mounting hole 431.

In some embodiments of the present application, when the height of the electronic component 46 on the upper surface of the main board body 41 is high, the height of the mounting surface 4411 may be set higher than the height of the upper surface of the second folding edge 443, which may be understood as setting the mounting plate 441 on the second folding edge 443 (for example, as shown in fig. 10).

Fig. 11 is a schematic structural view of a motherboard 40 according to an embodiment of the present invention, fig. 12 is a schematic structural view of a protection component 44 according to an embodiment of the present invention, and referring to fig. 11 and 12, when the height of an electronic component 46 on the upper surface of the motherboard body 41 is lower, the height of the mounting surface 4411 can be set lower than the height of the upper surface of the second flange 443, that is, the mounting plate 441 is disposed below the second flange 443, so that the overall thickness of the motherboard 40 and the electronic component 46 can be further reduced.

Fig. 13 is a schematic structural diagram of a main board 40 according to an embodiment of the present application, and fig. 14 is a schematic structural diagram of a protection component 44 according to an embodiment of the present application, referring to fig. 13 and 14, in some embodiments of the present application, the protection component 44 may include: the mounting plate 441, the upper surface of the mounting plate 441 is the mounting surface 4411, the periphery of the mounting plate 441 has a third folding edge 444 extending in the radial direction of the mounting plate 441, and the lower surface of the third folding edge 444 is connected to the upper surface of the daughter board 43, and the connection of the shielding member 44 to the daughter board 43 can be performed from the outside of the daughter board 43, which can facilitate the assembly of the shielding member 44, compared to the above-mentioned manner in which the upper surface of the second folding edge 443 of the mounting plate 441 is connected to the lower surface of the daughter board 43.

Fig. 15 is a partial structural schematic view of the main board 40 according to an embodiment of the present invention, and as shown in fig. 12 and fig. 15, in some embodiments of the present invention, a limiting protrusion 445 may be disposed on a periphery of the protection component 44, for example, as shown in fig. 12, an upward limiting protrusion 445 may be disposed on an extension of the second flange 443, and accordingly, a limiting hole 432 is formed on the daughter board 43, and the limiting protrusion 445 is assembled in the limiting hole 432 during assembly, so that the protection component 44 can be limited in a horizontal direction, the protection component 44 is prevented from being displaced in the horizontal direction, and the stability of the protection component 44 is ensured. The shape and number of the limiting protrusions 445 and the limiting holes 432 can be set according to specific working conditions.

It will be appreciated that in the working condition of fig. 13 and 14, a downward limiting protrusion 445 may be provided at the periphery of the third folding edge 444, and a corresponding limiting hole 432 is formed in the sub-plate 43, so as to prevent the protection member 44 from being displaced in the horizontal direction, and ensure the stability of the protection member 44.

To sum up, the mainboard 40 that this application embodiment provided can reduce the whole thickness between mainboard 40 and electronic components 46, and then can reduce the thickness size of the whole machine of electronic equipment 100 and the outstanding size of camera decoration, and electronic equipment 100 thickness size and the outstanding size of camera decoration reduce the income and predict about 0.55mm-0.8mm, and then optimize electronic equipment 100's outward appearance effect, are favorable to becoming thin of electronic equipment 100.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

The terms "first," "second," "third," "fourth," and the like in the description and claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and are not limited thereto; although embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A motherboard, comprising: a main board body, a frame board, a sub-board and a protection part;

the main board body, the frame plate and the daughter board are sequentially stacked from bottom to top, and the main board body, the frame plate and the daughter board enclose to form an accommodating cavity;

the daughter board is provided with a mounting hole, and the protection piece is arranged at the mounting hole to shield the electronic signal in the accommodating cavity;

the upper surface of the protection part is provided with a mounting surface, the mounting surface is used for mounting electronic components, and the height of the mounting surface is lower than that of the upper surface of the daughter board.

2. The motherboard of claim 1, wherein the shield comprises: mounting a plate;

the upper surface of the mounting plate is the mounting surface, the periphery of the mounting plate is provided with a first folded edge extending downwards, the protection piece is covered on the main board body, and the first folded edge is connected with the main board body.

3. The motherboard of claim 1, wherein the shield is coupled to the daughter board, the shield closing the mounting hole.

4. The motherboard of claim 3, wherein the shield comprises: mounting a plate;

the upper surface of the mounting plate is the mounting surface, a second folded edge extending along the radial direction of the mounting plate is arranged on the periphery of the mounting plate, and the upper surface of the second folded edge is connected with the lower surface of the daughter board.

5. The main panel as claimed in claim 4, wherein the mounting surface is higher than the upper surface of the second flap.

6. The main panel as claimed in claim 4, wherein the mounting surface is lower in height than an upper surface of the second flap.

7. The motherboard of claim 3, wherein the shield comprises: mounting a plate;

the upper surface of the mounting plate is the mounting surface, a third folded edge extending along the radial direction of the mounting plate is arranged on the periphery of the mounting plate, and the lower surface of the third folded edge is connected with the upper surface of the daughter board.

8. The motherboard according to any one of claims 3 to 7, wherein the protection member has a limiting protrusion at a periphery thereof, and the daughter board has a limiting hole, and the limiting protrusion is disposed in the limiting hole.

9. The motherboard according to any one of claims 1 to 7, wherein electronic components are provided on the upper surface of the motherboard main body, the lower surface of the motherboard main body, and the upper surface of the daughter board.

10. An electronic device comprising a housing and the main board of any one of claims 1-9;

the main board is disposed in the housing.

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