JP3374604B2 - Wireless communication device - Google Patents
Wireless communication deviceInfo
- Publication number
- JP3374604B2 JP3374604B2 JP17600095A JP17600095A JP3374604B2 JP 3374604 B2 JP3374604 B2 JP 3374604B2 JP 17600095 A JP17600095 A JP 17600095A JP 17600095 A JP17600095 A JP 17600095A JP 3374604 B2 JP3374604 B2 JP 3374604B2
- Authority
- JP
- Japan
- Prior art keywords
- antenna element
- short
- land
- ground plane
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば、移動通信用携
帯機器に使用される無線通信装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wireless communication device used for a mobile communication mobile device, for example.
【０００２】移動通信は高周波回路技術や小型回路技術
等の発展を背景に自動車・船舶・列車・人を対象に、順
次、サービスが拡大され、社会活動に大きく貢献してい
る。近年では、小型の携帯電話やコードレス電話等が実
用化されているが、これらの携帯機器は人が何時でも持
ち運びながら使用できる様に小型・軽量化が進められ、
部品が内蔵アンテナの近くまで実装される様になった。[0002] Mobile communication has been gradually expanding its service to automobiles, ships, trains, and people against the backdrop of the development of high-frequency circuit technology and small-circuit technology, and has greatly contributed to social activities. In recent years, small mobile phones and cordless phones have been put to practical use, but these mobile devices have been made smaller and lighter so that people can carry them around at any time.
Parts are now mounted near the built-in antenna.
【０００３】この為、部品の大きさや実装状態の変化に
対応して内蔵型アンテナに対する影響の程度が変化し、
アンテナの電気特性が変化する可能性が高くなった。そ
こで、部品が内蔵アンテナの近くまで実装されても、内
蔵型アンテナの電気特性の変化を抑圧できる様にするこ
とが必要である。For this reason, the degree of influence on the built-in antenna changes in accordance with changes in the size of components and mounting conditions.
The electric characteristics of the antenna are more likely to change. Therefore, it is necessary to suppress changes in the electrical characteristics of the built-in antenna even if the components are mounted near the built-in antenna.
【０００４】[0004]
【従来の技術】図８は従来例の説明図、図９は別の従来
例の説明図で、(a) は装置筐体斜視図、(b) は(a) の X
-X´断面図、図10は更に別の従来例の説明図で、(a) は
装置筐体斜視図、(b) は(a) の X-X´断面図、(c) は給
電線、短絡線の断面図である。2. Description of the Related Art FIG. 8 is an explanatory view of a conventional example, FIG. 9 is an explanatory view of another conventional example, (a) is a perspective view of an apparatus casing, and (b) is an X of (a).
-X 'cross-sectional view, FIG. 10 is an explanatory view of still another conventional example, (a) is a perspective view of the apparatus housing, (b) is a cross-sectional view of XX' in (a), (c) is a power supply line, and a short circuit. It is sectional drawing of a line.
【０００５】なお、図９(b),図10(b) は図９(a),図10
(a) を一点鎖線の様に切断したものを矢印の方向から見
た図である。以下、図８〜図10を説明する。9 (b) and 10 (b) are shown in FIG. 9 (a) and FIG.
FIG. 6 is a view of (a) cut along a chain line as seen from the direction of the arrow. Hereinafter, FIGS. 8 to 10 will be described.
【０００６】図８において、逆 Fアンテナのアンテナ・
エレメント12が、多層プリント基板で構成された装置基
板内の接地面11に対して間隔d だけ上方に配置されてい
るが、このエレメントの端部には一体成形された長さd
の、例えば、短冊形の給電線13と短絡線14が設けられて
いる。In FIG. 8, the antenna of the inverted F antenna
The element 12 is arranged above the ground plane 11 in the device board constituted by the multilayer printed circuit board by a distance d, but at the end of the element, an integrally formed length d
, For example, a strip-shaped power supply line 13 and a short-circuit line 14 are provided.
【０００７】そして、アンテナ・エレメント12に対して
ほぼ直角に曲げられた直線状給電線13の端部は、装置基
板に設けられた給電用ランド15を介して、図示しない無
線回路に接続された同軸ケーブル16の芯線と接続されて
おり、直線状短絡線14の端部は、短絡用ランドにハンダ
付けされている。なお、短絡用ランドは接地面と接続さ
れている。Then, the end of the linear feed line 13 bent substantially at a right angle to the antenna element 12 is connected to a radio circuit (not shown) via a feed land 15 provided on the device substrate. It is connected to the core wire of the coaxial cable 16, and the end of the linear short-circuit wire 14 is soldered to the short-circuit land. The short-circuit land is connected to the ground plane.
【０００８】なお、直線状短絡線14はアンテナ・エレメ
ントと無線回路の間の整合を取る為の整合素子であり、
整合を取る為には
直線状給電線13と直線状短絡線14の間隔
項の間隔は変えず、アンテナとの接続位置
直線状短絡線や直線状給電線の太さ( 円形の場合)
や幅（短冊形の場合)
のうち、少なくとも１つを変化させなければならない。The linear short-circuit wire 14 is a matching element for matching between the antenna element and the radio circuit,
In order to achieve matching, the distance between the linear feed line 13 and the linear short-circuit line 14 is not changed, and the connection position with the antenna is straight.
At least one of the width and width (for strips) must be changed.
【０００９】ここで、アンテナ・エレメント12は金属板
( 例えば銅板) を加工して製作され、上記の様に、表面
に部品が実装されない装置基板内の接地面11より上方に
間隔ｄだけ浮かせて対応するランドにハンダ付けして固
定する。Here, the antenna element 12 is a metal plate.
It is manufactured by processing (for example, a copper plate), and as described above, it is fixed by soldering it to the corresponding land by floating it by a distance d above the ground plane 11 in the device substrate in which no component is mounted on the surface.
【００１０】しかし、人間が固定するので、間隔にバラ
ツキが生じてアンテナの共振周波数がバラツク等の欠点
があった。この欠点を補う様にしたものが、図９に示す
様な装置筐体張り付け型の逆 Fアンテナである。However, since it is fixed by a person, there is a defect that the resonance frequency of the antenna varies due to variation in the interval. To compensate for this drawback, an inverted F antenna with a device housing attached as shown in Fig. 9 is used.
【００１１】図９において、逆 F型アンテナのアンテナ
・エレメント12を、例えば、プラスチック製の装置筐体
１に接着剤で張り付けておき、装置を組み立てる時に直
線状給電線13と直線状短絡線14を、上記と同様に装置基
板上のランドにハンダ付けする。In FIG. 9, an antenna element 12 of an inverted F-type antenna is attached to, for example, a plastic device housing 1 with an adhesive, and when the device is assembled, a linear feed line 13 and a linear short-circuit line 14 are provided. Are soldered to the lands on the device substrate in the same manner as above.
【００１２】これにより、アンテナ・エレメントと接地
面との間隔は一定になるが、直線状給電線13と直線状短
絡線14を接地面11にハンダ付けする為の工数が必要であ
る。図10は、給電線21と短絡線22を接地面11に接触させ
て接続することにより、ハンダ付け工数を削減する様に
したもので、上記と同様にアンテナ・エレメント12、給
電線21、短絡線22は一体成形してあるが、給電線21と短
絡線22は図10(c) に示す様に変形「逆くの字形」に曲げ
たもので、高さd1は接地面11とアンテナ・エレメントの
間隔d よりも大きくしてある。As a result, the distance between the antenna element and the ground plane becomes constant, but man-hours are required for soldering the linear feed line 13 and the linear short-circuit line 14 to the ground plane 11. In FIG. 10, the feeder line 21 and the short-circuit line 22 are brought into contact with the ground plane 11 to be connected to reduce the man-hour for soldering. The wire 22 is integrally molded, but the power supply wire 21 and the short-circuit wire 22 are bent into a modified "inverted shape" as shown in Fig. 10 (c), and the height d 1 is the ground plane 11 and the antenna.・ It is larger than the element spacing d.
【００１３】そこで、装置筐体にアンテナ・エレメント
を接着剤などで張り付けると、給電線21や短絡線22は下
方に押し付けられて上記の様に図示しない給電用ラン
ド、短絡用ランドを介して、接地面11と機械的に接触し
て接続される。Therefore, when the antenna element is attached to the device housing with an adhesive or the like, the power supply line 21 and the short-circuit line 22 are pressed downward, and the power-supply land and the short-circuit land, not shown, are used as described above. , Is in mechanical contact with the ground plane 11 for connection.
【００１４】ここで、図10(b) に示す構成にすると、給
電線21、短絡線22をハンダ付けする工数は削減される
が、装置の小型化に伴ってアンテナ・エレメント12の真
下にも、例えば、金属ケース17a 〜17d に格納された部
品を実装しなければならない場合が生ずる。Here, with the configuration shown in FIG. 10 (b), the man-hours for soldering the power supply line 21 and the short-circuit line 22 are reduced, but with the miniaturization of the device, it is possible to place the antenna element 12 directly below. In some cases, for example, the components housed in the metal cases 17a to 17d must be mounted.
【００１５】この様な場合、金属ケースとアンテナ・エ
レメント間の容量により、内蔵型アンテナの電気特性が
変化する。In such a case, the electrical characteristics of the built-in antenna change due to the capacitance between the metal case and the antenna element.
【００１６】[0016]
【発明が解決しようとする課題】上記の様に、装置の小
型化に伴ってアンテナ・エレメントの真下に部品を多
数、実装しなければならない場合、アンテナの電気特性
( 例えば、共振周波数) を左右する接地面積が減少す
る。As described above, when a large number of components must be mounted directly below the antenna element as the device becomes smaller, the electrical characteristics of the antenna are reduced.
The ground contact area that affects (for example, resonance frequency) decreases.
【００１７】また、金属ケース内に収納された部品をア
ンテナ・エレメント付近まで実装すると、金属ケースと
アンテナ・エレメントの間に生ずる容量の影響により、
内蔵型アンテナの電気特性が変化する可能性があると云
う課題がある。When the components housed in the metal case are mounted up to the vicinity of the antenna element, due to the influence of the capacitance generated between the metal case and the antenna element,
There is a problem that the electric characteristics of the built-in antenna may change.
【００１８】本発明は、装置の高密度部品実装を実施し
ても内蔵型アンテナの電気特性の変化を抑圧できる様に
することを目的とする。An object of the present invention is to make it possible to suppress changes in the electrical characteristics of a built-in antenna even when high-density component mounting of the device is carried out.
【００１９】[0019]
【課題を解決するための手段】第１本発明は、アンテナ
・エレメントと装置基板の間に、複数の貫通孔を有し、
接地面に接続したシールド板を設け、給電線と短絡線を
該貫通孔を介して対応するランドに接触して接続する構
成にした。According to a first aspect of the present invention, a plurality of through holes are provided between an antenna element and a device substrate.
A shield plate connected to the ground plane is provided, and the power supply line and the short-circuit line are connected to the corresponding land by contacting them through the through hole.
【００２０】第２の本発明は、上記アンテナ・エレメン
トとシールド板との間に、誘電体材料を挿入する構成に
した。第３の本発明は、上記シールド板に設けた貫通孔
は給電線のみを通し、短絡線はシールド板に接触させる
ことでアンテナ・エレメントをシールド板を介して接地
面に接続する構成にした。In the second aspect of the present invention, a dielectric material is inserted between the antenna element and the shield plate. According to a third aspect of the present invention, the through hole provided in the shield plate allows only the power supply line to pass through, and the short-circuit line is in contact with the shield plate .
By doing so, the antenna element is grounded via the shield plate.
It is configured to connect to the surface .
【００２１】第４の本発明は、アンテナ・エレメントと
装置基板との間に、複数の貫通孔を有し、該接地面に接
続したシールド板を設け、給電線は貫通孔を介して給電
用ランドに接続し、短絡線は給電線が貫通する貫通孔以
外の貫通孔の内の何れか一つを選んで貫通させて、アン
テナ・エレメントと接地面とを接続するようにし、アン
テナ・エレメントへの短絡線の接触位置を選んだ貫通孔
の位置に応じて変化できるような構成にした。According to a fourth aspect of the present invention, a shield plate having a plurality of through holes, which is connected to the ground plane, is provided between the antenna element and the device substrate, and the power feed line is for feeding power through the through holes. Connect to the land, and the short-circuit line is a through hole through which
Select any one of the outer through holes and let
Make sure to connect the tena element to the ground plane and
Through hole that selects the contact position of the short-circuit wire to the tenor element
The configuration is such that it can be changed according to the position of .
【００２２】第５の本発明は、上記シールド板を切り起
こして、上記アンテナ・エレメントと接触させ、短絡線
として使用する構成にした。In a fifth aspect of the present invention, the shield plate is cut and raised to be in contact with the antenna element and used as a short-circuit wire.
【００２３】[0023]
【作用】本発明はアンテナ・エレメントと装置基板との
間に、例えば、銅板などで構成され、貫通孔が設けられ
たシールド板をアンテナ・エレメントからｄだけ離して
設け、このシールド板を装置基板内の接地面と接続して
固定する。According to the present invention, a shield plate, which is made of, for example, a copper plate and has a through hole, is provided between the antenna element and the device substrate and is separated from the antenna element by d, and the shield plate is provided on the device substrate. Connect and fix to the ground plane inside.
【００２４】そして、アンテナ・エレメントと一体成形
した給電線、短絡線を上記の貫通孔を通して、装置基板
上に形成した給電用ランド、短絡用ランドと接触させて
接続する。Then, the power feed line and the short-circuit line integrally formed with the antenna element are connected to the power-feed land and the short-circuit land, which are formed on the device substrate, through the through holes.
【００２５】これにより、装置の高密度部品実装を実施
しても、高密度実装した部品とアンテナ・エレメントの
間にシールド板が設けられているので、内蔵型アンテナ
の電気特性の変化を抑圧できる。As a result, even if the device is mounted with high density components, the shield plate is provided between the components mounted with high density and the antenna element, so that the change in the electrical characteristics of the built-in antenna can be suppressed. .
【００２６】[0026]
【実施例】図１は第１の本発明の実施例の要部構成図
（一部破断した状態の斜視図）、図２は第２の本発明の
実施例の要部構成図（一部破断した状態の斜視図）、図
３は第３の本発明の実施例の要部構成図（一部破断した
状態の斜視図）、図４は第４の本発明の実施例の要部構
成図（一部破断した状態の斜視図）である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic view of the essential parts of a first embodiment of the present invention (a perspective view in a partially broken state), and FIG. 2 is a schematic view of the essential parts of a second embodiment of the present invention (partly). 3 is a perspective view of a third embodiment of the present invention (a perspective view in a partially broken state), and FIG. 4 is a main configuration of a fourth embodiment of the present invention. It is a figure (a perspective view in a state where a part is broken).
【００２７】また、図５は第５の本発明の実施例の要部
構成図（一部破断した状態の斜視図）、図６は第６の本
発明の実施例の要部構成図（一部破断した状態の斜視
図）、図７は第６の本発明の別の実施例の要部構成図
（一部破断した状態の斜視図）である。FIG. 5 is a schematic view of the essential parts of a fifth embodiment of the present invention (a perspective view in a partially broken state), and FIG. 6 is a schematic view of the essential parts of a sixth embodiment of the present invention (one FIG. 7 is a perspective view of a main part of another embodiment of the sixth aspect of the present invention (a perspective view in a partially broken state).
【００２８】なお、全図を通じて同一符号は同一対象物
である。以下、図の動作を説明するが、上記で詳細説明
した部分については概略説明し、本発明の部分について
詳細に説明する。The same reference numerals denote the same objects throughout the drawings. The operation of the drawings will be described below, but the portions described in detail above will be briefly described, and the portions of the present invention will be described in detail.
【００２９】図１において、アンテナ・エレメント12と
図示しない装置基板（例えば、接地面11を含む多層プリ
ント板）との間に、例えば、銅板などで構成され、貫通
孔31, 32が設けられた台形のシールド板３を、アンテナ
・エレメントからｄだけ離して設ける。そして、このシ
ールド板を装置基板内の接地面11に、例えば、ハンダ付
けで固定することにより、シールド板と接地面11とを電
気的に接続する。 In FIG. 1, between the antenna element 12 and a device substrate (not shown) (for example, a multilayer printed board including the ground plane 11), which is made of, for example, a copper plate, and through holes 31, 32 are provided. A trapezoidal shield plate 3 is provided at a distance d from the antenna element. Then, by fixing this shield plate to the ground plane 11 in the device substrate by, for example, soldering , the shield plate and the ground plane 11 are electrically connected.
Connect physically.
【００３０】更に、アンテナ・エレメントと一体成形し
た給電線21、短絡線22を、上記の貫通孔31, 32を通して
装置基板上に形成した図示しない給電用ランド、短絡用
ランドと接触させて接続する。Further, the power feed line 21 and the short-circuit line 22 integrally formed with the antenna element are connected by contacting with the power-feed land and the short-circuit land (not shown) formed on the device substrate through the through holes 31 and 32. .
【００３１】これにより、アンテナ・エレメント12に対
する接地面を確保すると共に、アンテナからの不要な電
波が回路側に回り込むことを防止することができる。図
２において、アンテナ・エレメントの小型化を図る場
合、アンテナ・エレメント12とシールド板３との間に比
誘電率εr の誘電体材料４を挿入することにより、電気
特性を保持したまま、アンテナの小型化を実現する実装
方法である。This makes it possible to secure a ground plane for the antenna element 12 and prevent unnecessary radio waves from the antenna from wrapping around to the circuit side. In FIG. 2, in order to reduce the size of the antenna element, by inserting a dielectric material 4 having a relative permittivity ε r between the antenna element 12 and the shield plate 3, the antenna is maintained while maintaining its electrical characteristics. It is a mounting method that realizes miniaturization of.
【００３２】逆Ｆアンテナの共振周波数はアンテナ・エ
レメントの外周長で決まる為、誘電体材料をアンテナ・
エレメントと組み合わせることにより、外周の電気長さ
は長く見え、同じ共振周波数を得るには空気中の時より
も外周長を短くすることができ、アンテナの小型化を図
ることができる。Since the resonance frequency of the inverted F antenna is determined by the outer peripheral length of the antenna element, the dielectric material is used as the antenna.
By combining with the element, the electric length of the outer circumference looks long, and in order to obtain the same resonance frequency, the outer length can be made shorter than that in the air, and the antenna can be miniaturized.
【００３３】図３において、装置基板側で、給電線21、
短絡線22が接触する給電用ランド、短絡用ランドの２種
類のランドを形成するスペースを確保することが困難な
場合、図示しない給電用ランドを装置基板上に形成して
給電線21を接触させる。しかし、短絡用ランドは形成せ
ず、短絡線22a は給電線21よりも短くしてシールド板３
に接触して接続する様にした。In FIG. 3, a feeder line 21,
When it is difficult to secure a space for forming two types of lands, that is, a power supply land with which the short-circuit line 22 contacts and a short-circuit land, a power supply land (not shown) is formed on the device substrate to contact the power supply line 21. . However, the short-circuit land is not formed, and the short-circuit line 22a is made shorter than the power supply line 21 and the shield plate 3 is formed.
I made contact with and connected.
【００３４】なお、従来例で説明した様に、短絡線22の
高さは、アンテナ・エレメントとシールド板との間隔よ
りも大きくして、アンテナ・エレメントが短絡線をシー
ルド板に押しつける様にする。As described in the conventional example, the height of the short-circuit wire 22 is made larger than the distance between the antenna element and the shield plate so that the antenna element presses the short-circuit wire against the shield plate. .
【００３５】これにより、装置基板の使用スペースを削
減することが可能となる。図４において、アンテナ・エ
レメント12と装置基板( 図示せず) との間に、複数の貫
通孔31〜34を有し、装置基板内の接地面11に接続したシ
ールド板３を設ける。This makes it possible to reduce the space used for the device substrate. In FIG. 4, a shield plate 3 having a plurality of through holes 31 to 34 between the antenna element 12 and a device substrate (not shown) and connected to the ground plane 11 in the device substrate is provided.
【００３６】そして、アンテナ・エレメントと一体成形
した給電線21は、貫通孔31を介して図示しない給電用ラ
ンドに接続するが、アンテナ・エレメントと別に設けた
短絡線22b は接地面11での接続位置を変えて、アンテナ
・エレメント12との接触位置を可変する様にした。The feed line 21 integrally formed with the antenna element is connected to the feed land (not shown) through the through hole 31, but the short-circuit line 22b provided separately from the antenna element is connected to the ground plane 11. By changing the position, the contact position with the antenna element 12 can be changed.
【００３７】これにより、アンテナ・エレメントに対す
る短絡線22b のインダクタンス成分の影響が変化し、ア
ンテナ・エレメント12の共振周波数を変えることができ
る。図５において、一端が接地面11に接続され、他端を
アンテナ・エレメント12に接触して接続する短絡線22c
の太さを変えることにより、短絡線のインダクタンスが
変化し、アンテナ・エレメントの共振周波数を変えるこ
とができる。As a result, the influence of the inductance component of the short-circuit wire 22b on the antenna element changes, and the resonance frequency of the antenna element 12 can be changed. In FIG. 5, one end is connected to the ground plane 11 and the other end is in contact with the antenna element 12 and is connected to the short-circuit wire 22c.
By changing the thickness of the antenna, the inductance of the short-circuit wire changes, and the resonance frequency of the antenna element can be changed.
【００３８】ここで、短絡線はシールド板に接触させて
も整合を取ることができるので、図6 示す様にシールド
板３の一部を切り起こしてアンテナ・エレメント12と接
触させて短絡線22d とする。これにより、装置基板に短
絡用ランドを設ける必要がなくなり、スペースを削減す
ることができる。Since the short-circuit wire can be matched even by contacting it with the shield plate, a part of the shield plate 3 is cut and raised to make contact with the antenna element 12 as shown in FIG. And As a result, it is not necessary to provide the short circuit land on the device substrate, and the space can be reduced.
【００３９】図７において、シールド板３の一部を切り
起こして生成した短絡線22e, 22fを複数個設けておき、
アンテナ・エレメント12と接触させる短絡線の位置及び
数を変えることにより、アンテナ・エレメントの共振周
波数を変えることができる。In FIG. 7, a plurality of short-circuit lines 22e and 22f are formed by cutting and raising a part of the shield plate 3,
By changing the position and the number of short-circuit lines that come into contact with the antenna element 12, the resonance frequency of the antenna element can be changed.
【００４０】[0040]
【発明の効果】以上詳細に説明した様に本発明によれ
ば、装置の高密度部品実装を実施しても内蔵型アンテナ
の電気特性の変化を抑圧できると云う効果がある。As described above in detail, according to the present invention, it is possible to suppress the change in the electric characteristics of the built-in type antenna even when the high density component mounting of the device is carried out.
【図１】第１の本発明の実施例の要部構成図（一部破断
した状態の斜視図）である。FIG. 1 is a configuration diagram of a main part of a first embodiment of the present invention (a perspective view in a partially broken state).
【図２】第２の本発明の実施例の要部構成図（一部破断
した状態の斜視図）である。FIG. 2 is a main part configuration diagram of a second embodiment of the present invention (a perspective view in a partially broken state).
【図３】第３の本発明の実施例の要部構成図（一部破断
した状態の斜視図）である。FIG. 3 is a main part configuration diagram of a third embodiment of the present invention (a perspective view in a partially broken state).
【図４】第４の本発明の実施例の要部構成図（一部破断
した状態の斜視図）である。FIG. 4 is a main part configuration diagram of a fourth embodiment of the present invention (a perspective view in a partially broken state).
【図５】第５の本発明の実施例の要部構成図（一部破断
した状態の斜視図）である。FIG. 5 is a main part configuration diagram of a fifth embodiment of the present invention (a perspective view in a partially broken state).
【図６】第６の本発明の実施例の要部構成図（一部破断
した状態の斜視図）である。FIG. 6 is a main part configuration diagram of a sixth embodiment of the present invention (a perspective view in a partially broken state).
【図７】第６の本発明の別の実施例の要部構成図（一部
破断した状態の斜視図）である。FIG. 7 is a configuration diagram (a perspective view in a partially broken state) of a main part of another embodiment of the sixth invention.
【図８】従来例の説明図である。FIG. 8 is an explanatory diagram of a conventional example.
【図９】別の従来例の説明図で、(a) は装置筐体斜視
図、(b) は(a) の X-X´断面図、である。9A and 9B are explanatory views of another conventional example, in which FIG. 9A is a perspective view of an apparatus housing, and FIG. 9B is a sectional view taken along line XX ′ of FIG.
【図１０】更に別の従来例の説明図で、(a) は装置筐体
斜視図、(b) は(a) の X-X´断面図、(c) は給電線、短
絡線の断面図である。FIG. 10 is an explanatory view of still another conventional example, (a) is a device housing perspective view, (b) is a sectional view taken along line XX ′ of (a), and (c) is a sectional view of a power supply line and a short-circuit line. is there.
１ 装置筐体 ３ シールド
板
４ 誘電体材料 11 接地面
12 アンテナ・エレメント 13 直線状給
電線
14 直線状短絡線 21 給電線
22 短絡線 31, 32 貫通
孔1 Equipment housing 3 Shield plate 4 Dielectric material 11 Ground plane 12 Antenna element 13 Linear feed line 14 Linear short-circuit line 21 Feed line 22 Short-circuit line 31, 32 Through hole
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平９−27715（ＪＰ，Ａ) 特開 昭63−62402（ＪＰ，Ａ) 特開 昭62−277801（ＪＰ，Ａ) 特開 昭58−104504（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01Q 13/08 H01Q 1/24 H01Q 23/00 ─────────────────────────────────────────────────── --Continued from the front page (56) References JP-A-9-27715 (JP, A) JP-A 63-62402 (JP, A) JP-A 62-277801 (JP, A) JP-A 58- 104504 (JP, A) (58) Fields surveyed (Int.Cl. 7 , DB name) H01Q 13/08 H01Q 1/24 H01Q 23/00
Claims (5)
を有する装置基板を内蔵すると共に、給電線と短絡線と
が一体成形された平板状のアンテナ・エレメントが接着
された装置筐体を有する無線通信装置において、 該アンテナ・エレメントと該装置基板との間に、複数の
貫通孔を有し、該接地面に接続したシールド板を設け、 該給電線と該短絡線とを該貫通孔を介して該給電用ラン
ドと該短絡用ランドとにそれぞれ接触させて電気的に接
続する構成にしたことを特徴とする無線通信装置。1. A power feed land, with a built-in device substrate having a shorting land and the ground plane, device flat antenna element <br/> the short-circuit line and the feed line are integrally molded it is adhered in the radio communication apparatus having a housing, between said antenna element and said device substrate has a plurality of through-holes, provided with a shield plate connected to said ground plane, and a fed-wire and the short-circuit line The power supply run through the through hole
A wireless communication device, wherein the wireless communication device and the shorting land are in contact with each other and electrically connected to each other .
ド板との間に、誘電体材料を挿入する構成にしたことを
特徴とする請求項１の無線通信装置。Wherein between the sealing <br/> de plate and the antenna element, the radio communication apparatus according to claim 1, characterized in that a configuration of inserting a dielectric material.
板を内蔵すると共に、給電線と短絡線が一体成形された
平面状のアンテナ・エレメントが接着された装置筐体を
有する無線装置において、 該アンテナ・エレメントと装置基板との間に、貫通孔を
有し、該接地面に接続したシールド板を設け、 該給電線を該貫通孔を介して前記給電用ランドに接触す
る構成とし、前記短絡線は前記シールド板に接触する構
成、 としたことを特徴とする無線装置。 3. A device base having a power feeding land and a ground plane.
With a built-in plate, the power supply line and the short-circuit line were integrally molded
Install the device housing with the planar antenna element
A wireless device having a through hole between the antenna element and the device substrate.
A shield plate connected to the ground plane is provided, and the power supply line is brought into contact with the power supply land through the through hole
The structure in which the short-circuit line contacts the shield plate
Growth, and the possible radio apparatus according to claim.
を有する装置基板を内蔵すると共に、給電線が一体成形
された平板状のアンテナ・エレメントが接着された装置
筐体と、短絡線とを有する無線通信装置において、 該アンテナ・エレメントと該装置基板との間に、複数の
貫通孔を有し、該接地面に接続したシールド板を設け、
該給電線は該貫通孔の一つを介して該給電用ランドに接
続し、 該短絡線は該給電線が貫通している貫通孔の一つ以外の
貫通孔の何れか一つを介して該アンテナ・エレメントと
接地面とを電気的に接続するように設けられていること
を特徴とする無線通信装置。4. A power supply land, with a built-in device substrate having a shorting land and the ground plane, the device housing the flat-plate-like antenna element feed lines are integrally molded is bonded, and a short circuit wire in the radio communication apparatus having, between said antenna element and said device substrate has a plurality of through holes, a shield plate connected to said ground plane is provided,
Fed-wire is connected to the power feed land through one of said through holes, said short-circuit line is other than one one through hole fed-wire is passed through
With the antenna element through any one of the through holes
A wireless communication device provided so as to be electrically connected to a ground plane .
を有する装置基板を内蔵すると共に、給電線が一体成形
された平板状のアンテナ・エレメントが接着された装置
筐体とを有する無線通信装置において、 該アンテナ・エレメントと該装置基板との間に、貫通孔
と、該アンテナ・エレメントと接続するように切り起こ
された部分とを有し、該接地面に接続したシー ルド板を
設け、該給電線は該貫通孔を介して該給電用ランドに接
続し、該切り起こされた部分をアンテナ・エレメントと
該シールド板とを接続する短絡線として用い、該アンテ
ナ・エレメントを該シールド板を介して接地面に接続す
る構成にしたことを特徴とする無線通信装置。 5. A power supply land, a short-circuit land and a ground plane
Incorporates a device board with a power supply line and is integrally molded
Device with bonded flat antenna element
In a wireless communication device having a housing , a through hole is provided between the antenna element and the device board.
And cut and raised to connect with the antenna element.
And a portion, a shield plate connected to the ground plane
The feed line is connected to the feed land through the through hole.
Then, the cut-and-raised part is referred to as an antenna element.
It is used as a short-circuit wire to connect with the shield plate,
Connect the antenna element to the ground plane through the shield plate.
A wireless communication device having the following configuration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17600095A JP3374604B2 (en) | 1995-07-12 | 1995-07-12 | Wireless communication device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17600095A JP3374604B2 (en) | 1995-07-12 | 1995-07-12 | Wireless communication device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0927711A JPH0927711A (en) | 1997-01-28 |
| JP3374604B2 true JP3374604B2 (en) | 2003-02-10 |
Family
ID=16005964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17600095A Expired - Fee Related JP3374604B2 (en) | 1995-07-12 | 1995-07-12 | Wireless communication device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3374604B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005114778A1 (en) * | 2004-05-21 | 2005-12-01 | Murata Manufacturing Co., Ltd. | Portable telephone device |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2001244976A1 (en) * | 2000-03-30 | 2001-10-15 | Avantego Ab | Antenna arrangement |
| JP2002064316A (en) * | 2000-08-17 | 2002-02-28 | Sony Corp | Antenna device and portable radio equipment |
| JP3908448B2 (en) | 2000-08-17 | 2007-04-25 | 日本電気株式会社 | Mobile telephone device and its built-in antenna |
| CN1310376C (en) * | 2001-03-02 | 2007-04-11 | 皇家菲利浦电子有限公司 | Module and electronic device |
| GB0122226D0 (en) * | 2001-09-13 | 2001-11-07 | Koninl Philips Electronics Nv | Wireless terminal |
| JP4651411B2 (en) * | 2005-03-02 | 2011-03-16 | ソニー・エリクソン・モバイルコミュニケーションズ株式会社 | ANTENNA DEVICE AND RADIO DEVICE |
| JP4749795B2 (en) * | 2005-08-05 | 2011-08-17 | 新光電気工業株式会社 | Semiconductor device |
| JP4705527B2 (en) * | 2006-06-27 | 2011-06-22 | 富士通株式会社 | Mobile terminal device |
| JP4696049B2 (en) * | 2006-10-26 | 2011-06-08 | 京セラ株式会社 | Mobile phone |
| US8138977B2 (en) * | 2007-08-07 | 2012-03-20 | Apple Inc. | Antennas for handheld electronic devices |
-
1995
- 1995-07-12 JP JP17600095A patent/JP3374604B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005114778A1 (en) * | 2004-05-21 | 2005-12-01 | Murata Manufacturing Co., Ltd. | Portable telephone device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0927711A (en) | 1997-01-28 |
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