CN117683187A - 一种高击穿强度vpi树脂及其制备方法 - Google Patents
一种高击穿强度vpi树脂及其制备方法 Download PDFInfo
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- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical group FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 claims description 4
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- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 claims description 4
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- MNYLCGIJDZPKLE-UHFFFAOYSA-N 2-methylbutan-2-yloxy butaneperoxoate Chemical compound CCCC(=O)OOOC(C)(C)CC MNYLCGIJDZPKLE-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
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- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- YGANSGVIUGARFR-UHFFFAOYSA-N dipotassium dioxosilane oxo(oxoalumanyloxy)alumane oxygen(2-) Chemical compound [O--].[K+].[K+].O=[Si]=O.O=[Al]O[Al]=O YGANSGVIUGARFR-UHFFFAOYSA-N 0.000 description 1
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- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/01—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- H01B3/421—Polyesters
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- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
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Abstract
本发明涉及一种高击穿强度VPI树脂及其制备方法。按质量百分比计,VPI树脂原料包括以下组分:分子蒸馏环氧树脂20%~40%;不饱和聚酯15%~30%;固化剂1.5%~10%;交联单体25%~50%;云母粉10%~25%;气相白炭黑0.2%~1%;引发剂0.2%~1%;助剂0.05%~1.5%,其中不饱和聚酯由亚胺醇、二元醇与二元酸酐反应合成。本发明的VPI树脂的击穿电压强度>35kV/mm(约1mm厚测试样品),相比现有VPI树脂提升1.5倍以上,能够提升绝缘系统的长期电老化寿命。本发明的VPI树脂无云母粉的沉降,黏度合适,满足真空压力浸渍工艺使用要求,同时VOC含量少,低气味,绿色环保。
Description
技术领域
本发明属于绝缘材料领域,具体涉及一种高击穿强度VPI树脂及其制备方法。
背景技术
近年来随着发电机及特种电机等产品的不断更新换代,额定电压有所提升加上功率密度不断提高,运行条件较为苛刻,会加速所用绝缘材料及系统的老化,导致过早地被电击穿、失效。为了延长发电机及特种电机等的使用寿命,需要使用高击穿强度的主绝缘材料,如高击穿强度云母带、高击穿强度VPI树脂等产品。
现有VPI树脂,主要有环氧酸酐VPI树脂、聚酯亚胺VPI树脂、环氧改性不饱和聚酯VPI树脂等,已在发电机、特种电机领域广泛应用。但随着发电机、特种电机的技术发展,如绝缘减薄、变频控制(产生更高的尖峰脉冲电压)等对主绝缘材料的击穿强度提出了更高的要求,现有VPI树脂的击穿强度基本在25kV/mm左右,较高领域的应用受到限制,所以急需研发具有更高高击穿强度的VPI树脂。
发明内容
本发明的目的是提供一种具有高击穿电压强度(>35kV/mm,约1mm厚测试样品)的VPI树脂及其制备方法。
为达到上述目的,本发明采用的技术方案是:
一种VPI树脂,其特征在于,按质量百分比计,所述VPI树脂包括以下组分:
分子蒸馏环氧树脂20%~40%;
不饱和聚酯15%~30%;
固化剂1.5%~10%;
交联单体25%~50%;
云母粉10%~25%;
气相白炭黑0.2%~1%;
引发剂0.2%~1%;
助剂0.05%~1.5%,
其中,所述不饱和聚酯由亚胺醇、二元醇与二元酸酐反应合成,所述亚胺醇、二元醇与二元酸酐的投料摩尔比为1:(4~6):(4~5)。
优选地,按质量百分比计,所述VPI树脂包括以下组分:
分子蒸馏环氧树脂20%~30%;
不饱和聚酯15%~20%;
固化剂1.5%~10%;
交联单体30%~45%;
云母粉10%~15%;
气相白炭黑0.2%~1%;
引发剂0.2%~1%;
助剂0.05%~1.5%。
优选地,所述亚胺醇由四氢苯酐和一乙醇胺反应合成,所述四氢苯酐和一乙醇胺的投料摩尔比为(0.8~1.2):1。
进一步优选地,所述亚胺醇的制备方法为:将一定量的四氢苯酐与一乙醇胺,分批交替逐步加料到反应釜内,此时为放热反应,缓慢开动搅拌,通冷却水,控制物料温度低于100℃。待所有物料添加完毕后,缓慢升温,到120-240min内加热至200-210℃,此时有反应水蒸出,气相温度不超过105℃。在200-210℃保温反应,直到气相温度低于80℃。开始抽真空反应0.5-1.5h,降温至140℃以下解除真空,继续降温到100℃以下,放出物料,降温至常温,即为所述亚胺醇。
优选地,所述二元醇包括甲基丙二醇和/或新戊二醇。
优选地,所述二元酸酐为顺丁烯二酸酐与四氢苯酐和/或甲基四氢苯酐的组合。
优选地,所述亚胺醇由以下制备方法制备得到:将亚胺醇、二元醇与二元酸酐混合,边搅拌边升温至160±2℃,然后以8~15℃/h的速度逐步升温到200±2℃,200±2℃下保温反应至酸酯小于20KOHmg/g,抽真空到-0.1MPa以下并保持15~20min,自然冷却至170±2℃,加入少量对苯二酚搅拌溶解,继续自然冷却至室温得到所述亚胺醇。
优选地,所述VPI树脂原料不含有机溶剂。
优选地,所述分子蒸馏环氧树脂的黏度为25℃下1000~5000mPa·s。
优选地,所述不饱和聚酯的黏度为25℃下3000~20000mPa·s。
优选地,所述云母粉的粒径为1~10μm。
优选地,所述云母粉为经硅烷偶联剂处理的云母粉。
优选地,所述分子蒸馏环氧树脂为经过分子蒸馏提纯处理后的双酚A型环氧树脂和/或经过分子蒸馏提纯处理后的双酚F型环氧树脂。
优选地,所述固化剂为乙酰丙酮铝、594、甲基四氢苯酐、桐油酸酐、异辛酸锌、环烷酸锌或氰酸酯中的一种或多种。
优选地,所述引发剂为过氧化二异丙苯(DCP)、3,3-双(叔丁基过氧)丁酸乙酯、或3,3-双(叔戊基过氧)丁酸乙酯中的一种或多种。
优选地,所述助剂为分散剂、阻聚剂、消泡剂、防沉剂、流平剂中的一种或多种。
进一步优选地,所述分散剂包括BYK110、Disponer 983或BYK163中的一种或多种。
进一步优选地,所述阻聚剂包括对叔丁基邻本二酚(TBC)、对苯醌、甲基氢锟或对苯二酚中的一种或多种。
进一步优选地,所述消泡剂包括DEFOM 2700、BYK052或BYK-1796中的一种或多种。
进一步优选地,所述防沉剂包括BYK410、BYK420或DeuRheo201P中的一种或多种。
进一步优选地,所述流平剂包括BYK371、BYK354或BYK359中的一种或多种。
优选地,所述交联单体为多官能甲基丙烯酸酯单体和/或多官能缩水甘油醚。
进一步优选地,所述多官能甲基丙烯酸酯单体为1,4丁二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、二丙二醇二甲基丙烯酸酯中的一种或多种。
进一步优选地,所述多官能缩水甘油醚为间苯二酚二缩水甘油醚和/或新戊二醇二缩水甘油醚。
本发明还提供VPI树脂的制备方法,将所述分子蒸馏环氧树、所述不饱和聚酯、所述交联单体、所述云母粉、所述气相白炭黑和所述助剂在≤45℃的条件下搅拌均匀得到基体浆料,将所述基体浆料在<45℃的条件下研磨分散后与所述固化剂和所述引发剂在<40℃的条件下反应得到所述VPI树脂。
根据一些具体实施方式,所述制备方法具体包括以下步骤:
(1)将所述分子蒸馏环氧树和所述不饱和聚酯预热至40~45℃并混合,加入所述交联单体,搅拌至所述交联单体溶解,加入所述云母粉、所述气相白炭黑和所述助剂,在3000r/min-5000r/min条件下搅拌2-3h得到基体浆料,搅拌过程中控制物料温度<45℃;
(2)将步骤(1)的基体浆料研磨分散4~5h,研磨过程中控制物料温度<50℃,降温至<40℃后加入所述固化剂和所述引发剂,在<40℃的条件下搅拌反应30~60min,经过300目滤网过滤得到所述VPI树脂。
本发明第三方面还提供上述VPI树脂在线圈绕组中的应用。
本发明的VPI树脂适用于发电机及特种电机,如风力发电机、煤矿电机、牵引电机等线圈绕组的VPI绝缘处理。
由于上述技术方案运用,本发明与现有技术相比具有下列优点:
本发明的VPI树脂的击穿电压强度达到35kV/mm(约1mm厚测试样品),相比现有VPI树脂提升1.5倍以上,能够提升绝缘系统的长期电老化寿命。本发明的VPI树脂挥发性有机化合物(VOC)含量少,低气味,绿色环保。本发明的VPI树脂无云母粉的沉降,黏度合适,满足真空压力浸渍工艺使用要求。
具体实施方式
下面结合具体的实施案例对本发明的技术方案进一步描述,但本发明不只限于下面的实施例。实施例中采用的实施条件可以根据具体要求做进一步调整,未注明的实施条件通常为常规实验中的条件。
如无特殊说明,本发明中使用的原料均为市售产品。
以下实施例和对比例中,超细云母粉为经硅烷偶联剂处理的超细云母粉,购自云水云母科技有限公司,型号为3000目白云母粉。
JF-158分子蒸馏高纯度环氧树脂由苏州巨峰电气绝缘系统股份有限公司提供,粘度约为:25℃下3500mPa.s。
双酚F分子蒸馏高纯度环氧树脂购自山东艾蒙特新材料有限公司,粘度约为:25℃下1250mPa.s。
亚胺醇由苏州巨峰电气绝缘系统股份有限公司提供,制备方法为:将1400g四氢苯酐与600g一乙醇胺,等量分成6批交替逐步加料到反应釜内,此时为放热反应,缓慢开动搅拌,通冷却水,控制物料温度低于100℃。待所有物料添加完毕后,缓慢升温,到190min内加热至205℃,此时有反应水蒸出,气相温度不超过105℃。在205℃保温反应,直到气相温度低于80℃。开始抽真空到-0.095Mpa,继续反应1h,降温至140℃以下解除真空,继续降温到100℃以下,放出物料,降温至常温,即为所述亚胺醇。
实施例1
本实施例提供一种高击穿强度VPI树脂,通过以下步骤制备得到:
低粘度不饱和聚酯的合成:将538g甲基丙二醇、158.2g四氢苯酐、441.3g顺丁烯二酸酐、247g亚胺醇加入到反应瓶内,边搅拌边升温至160±2℃。以约10℃/h的速度逐步升温到200±2℃。在200℃保温反应1h后,取样测试酸值,要求20KOHmg/g以下为终点,如果一次取样不合格,每隔30min取样测试一次。酸值合格后,抽真空到约-0.090MPa,保真空15-20min,开始降温。自然冷却至170±2℃加入0.5g对苯二酚,搅拌溶解均匀后,降温至常温得低粘度不饱和聚酯,粘度约为:25℃下12600mPa·s。
(1)将600g JF-158分子蒸馏高纯度环氧树脂与400g低黏度不饱和聚酯分别预热到43℃,添加到物料桶内,边搅拌边加入800g 1,4丁二醇二甲基丙烯酸酯和100g间苯二酚二缩水甘油醚,搅拌溶解均匀后,加入260g超细云母粉、10g A200气相白炭黑、12g BYK110、5g DEFOM 2700、0.7g TBC,添加完毕后,调整搅拌速度在4000r/min,搅拌2h(搅拌过程中,控制物料温度<45℃,如温度过高,采用冷却水冷却),得基体浆料。
(2)在上述基体浆料转移到研磨机上,研磨分散4.5h(研磨过程中需要夹套通冷却水冷却,控制物料温度<50℃)。降温至40℃以下,将物料放料到洁净搅拌瓶内,加入45g环烷酸锌、12gDCP,搅拌50min,经过300目滤网过滤到包装桶内,得高击穿强度VPI树脂。
实施例2
本实施例提供一种高击穿强度VPI树脂,通过以下步骤制备:
低粘度不饱和聚酯的合成:将357.78g甲基丙二醇、208.3g新戊二醇、173g甲基四氢苯酐、450g顺丁烯二酸酐、255g亚胺醇加入到反应瓶内,边搅拌边升温至160±2℃。以约10℃/h的速度逐步升温到200±2℃。在200℃保温反应1h后,取样测试酸值,要求20KOHmg/g以下为终点,如果一次取样不合格,每隔30min取样测试一次。酸值合格后,抽真空到约-0.090MPa,保真空15-20min,开始降温。冷却至170±2℃加入0.55g对苯二酚,搅拌溶解均匀后,降温至常温得低粘度不饱和聚酯,粘度约为:25℃下13520mPa·s。
(1)将580g JF-158分子蒸馏高纯度环氧树脂与360g低黏度不饱和聚酯分别预热到44℃,添加到物料桶内,边搅拌边加入780g三乙二醇二甲基丙烯酸酯和110g新戊二醇二缩水甘油醚,搅拌溶解均匀后,加入280g超细云母粉、12g A200气相白炭黑、13g Disponer983、6gBYK052、0.8g TBC,添加完毕后,调整搅拌速度在4000r/min,搅拌3h(搅拌过程中,控制物料温度<45℃,如温度过高,采用冷却水冷却),得基体浆料。
(2)在上述基体浆料转移到研磨机上,研磨分散5h(研磨过程中需要夹套通冷却水冷却,控制物料温度<50℃)。降温至40℃以下,将物料放料到洁净搅拌瓶内,加入150g甲基四氢苯酐、50g 594、10g DCP,搅拌60min,经过300目滤网过滤到包装桶内,得高击穿强度VPI树脂。
实施例3
本实施例提供一种高击穿强度VPI树脂,通过以下步骤制备:
低粘度不饱和聚酯为实施例1合成制备的低粘度不饱和聚酯。
(1)将520g双酚F分子蒸馏高纯度环氧树脂与330g低黏度不饱和聚酯分别预热到45℃,添加到物料桶内,边搅拌边加入230g1,4丁二醇二甲基丙烯酸酯、500g二丙二醇二甲基丙烯酸酯和120g间苯二酚二缩水甘油醚,搅拌溶解均匀后,加入260g超细云母粉、8.5gA200气相白炭黑、11g BYK110、6g BYK052、0.5g TBC,添加完毕后,调整搅拌速度在4000r/min,搅拌3h(搅拌过程中,控制物料温度<45℃,如温度过高,采用冷却水冷却),得基体浆料。
(2)在上述基体浆料转移到研磨机上,研磨分散5h(研磨过程中需要夹套通冷却水冷却,控制物料温度<50℃)。降温至40℃以下,将物料放料到洁净搅拌瓶内,加入43g环烷酸锌、11g DCP,搅拌50min,经过300目滤网过滤到包装桶内,得高击穿强度VPI树脂。
对比例1
本对比例提供一种环氧酸酐VPI树脂,通过以下步骤制备:
将300g JF-158分子蒸馏环氧树脂加入到反应瓶内,加入300g甲基六氢苯酐,1.5gN,N-二甲基苄胺搅拌溶解均匀后得环氧酸酐VPI树脂。
对比例2
本对比例提供一种聚酯亚胺VPI树脂,通过以下步骤制备:
将500g聚酯亚胺树脂(JF-956-3,由苏州巨峰电气绝缘系统股份有限公司提供)加热到80℃,开动搅拌,缓慢加入460g三乙二醇二甲基丙烯酸酯,搅拌溶解均匀后,加入12gDCP,0.6g TBC,继续搅拌溶解约60min,待物料完全透明均匀,过滤得聚酯亚胺VPI树脂。
对比例3
本实施例提供一种环氧改性不饱和聚酯VPI树脂,通过以下步骤制备:
将800g市售3302不饱和聚酯,75g市售6101环氧树脂,75g市售308桐油酸酐,349g苯乙烯,10g DCP,0.7g TBC添加到物料桶里,持续搅拌溶解约80min,待物料完全透明均匀,过滤得环氧改性不饱和聚酯VPI树脂。
对实施例1~3及对比例1~3VPI树脂的各项性能进行测试,结果参见表1:
表1
测试方法参考标准:GB/T 15022.2-2017电气绝缘用树脂基活性复合物第2部分试验方法。
表1显示,相比对比例1~3,实施例1~3的高击穿强度VPI树脂性能显著提高。实施例1~3的高击穿强度VPI树脂均匀液体,无沉降、无机械杂质,可使用VPI工艺,实施例1~3的高击穿强度VPI树脂的击穿电压强度>35kV/mm,明显优于对比例1~3,实施例1~3的高击穿强度VPI树脂的固化挥发份低,绿色环保。
上述实施例只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施,并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰,都应涵盖在本发明的保护范围之内。
Claims (10)
1.一种VPI树脂,其特征在于,按质量百分比计,所述VPI树脂原料包括以下组分:
分子蒸馏环氧树脂20%~40%;
不饱和聚酯15%~30%;
固化剂1.5%~10%;
交联单体25%~50%;
云母粉10%~25%;
气相白炭黑0.2%~1%;
引发剂0.2%~1%;
助剂0.05%~1.5%,
其中,所述不饱和聚酯由亚胺醇、二元醇与二元酸酐反应合成,所述亚胺醇、二元醇与二元酸酐的投料摩尔比为1:(4~6):(4~5)。
2.根据权利要求1所述的VPI树脂,其特征在于,按质量百分比计,所述VPI树脂原料包括以下组分:
分子蒸馏环氧树脂20%~30%;
不饱和聚酯15%~20%;
固化剂1.5%~10%;
交联单体30%~45%;
云母粉10%~15%;
气相白炭黑0.2%~1%;
引发剂0.2%~1%;
助剂0.05%~1.5%。
3.根据权利要求1所述的VPI树脂,其特征在于,所述亚胺醇由四氢苯酐和一乙醇胺反应合成,所述四氢苯酐和一乙醇胺的投料摩尔比为(0.8~1.2):1;
所述二元醇包括甲基丙二醇和/或新戊二醇;
所述二元酸酐为顺丁烯二酸酐与四氢苯酐和/或甲基四氢苯酐的组合。
4.根据权利要求1所述的VPI树脂,其特征在于,所述不饱和聚酯由以下制备方法制备得到:将亚胺醇、二元醇与二元酸酐混合,边搅拌边升温至160±2℃,然后以8~15℃/h的速度逐步升温到200±2℃,200±2℃下保温反应至酸酯小于20KOHmg/g,抽真空到-0.1MPa以下并保持15~20min,自然冷却至170±2℃,加入少量对苯二酚搅拌溶解,继续自然冷却至室温得到所述不饱和聚酯。
5.根据权利要求1所述的VPI树脂,其特征在于,所述VPI树脂原料不含有机溶剂;
和/或,所述分子蒸馏环氧树脂的黏度为25℃下1000~5000mPa·s;
和/或,所述不饱和聚酯的黏度为25℃下3000~20000mPa·s;
和/或,所述云母粉的粒径为1~10μm;
和/或,所述云母粉为经硅烷偶联剂处理的云母粉。
6.根据权利要求1所述的VPI树脂,其特征在于,所述分子蒸馏环氧树脂为经过分子蒸馏提纯处理后的双酚A型环氧树脂和/或经过分子蒸馏提纯处理后的双酚F型环氧树脂。
和/或,所述交联单体为多官能甲基丙烯酸酯单体和/或多官能缩水甘油醚;
和/或,所述固化剂为乙酰丙酮铝、594、甲基四氢苯酐、桐油酸酐、异辛酸锌、环烷酸锌或氰酸酯中的一种或多种;
和/或,所述引发剂为过氧化二异丙苯、3,3-双(叔丁基过氧)丁酸乙酯、或3,3-双(叔戊基过氧)丁酸乙酯中的一种或多种;
和/或,所述助剂为分散剂、阻聚剂、消泡剂、防沉剂、流平剂中的一种或多种。
7.根据权利要求6所述的VPI树脂,其特征在于,所述多官能甲基丙烯酸酯单体为1,4丁二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、二丙二醇二甲基丙烯酸酯中的一种或多种;
所述多官能缩水甘油醚为间苯二酚二缩水甘油醚和/或新戊二醇二缩水甘油醚。
8.如权利要求1至7中任一项所述的VPI树脂的制备方法,其特征在于,将所述分子蒸馏环氧树、所述不饱和聚酯、所述交联单体、所述云母粉、所述气相白炭黑和所述助剂在≤45℃的条件下搅拌均匀得到基体浆料,将所述基体浆料在<45℃的条件下研磨分散后与所述固化剂和所述引发剂在<40℃的条件下反应得到所述VPI树脂。
9.根据权利要求8所述的制备方法,其特征在于,所述制备方法具体包括以下步骤:
(1)将所述分子蒸馏环氧树和所述不饱和聚酯预热至40~45℃并混合,加入所述交联单体,搅拌至所述交联单体溶解,加入所述云母粉、所述气相白炭黑和所述助剂,在3000r/min-5000r/min条件下搅拌2-3h得到基体浆料,搅拌过程中控制物料温度<45℃;
(2)将步骤(1)的基体浆料研磨分散4~5h,研磨过程中控制物料温度<50℃,降温至<40℃后加入所述固化剂和所述引发剂,在<40℃的条件下搅拌反应30~60min,经过300目滤网过滤得到所述VPI树脂。
10.如权利要求1至7中任一项所述的VPI树脂在线圈绕组中的应用。
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