CN117672898A - Method and apparatus for mass transfer of magnetic electronic components - Google Patents
Method and apparatus for mass transfer of magnetic electronic components Download PDFInfo
- Publication number
- CN117672898A CN117672898A CN202211013143.7A CN202211013143A CN117672898A CN 117672898 A CN117672898 A CN 117672898A CN 202211013143 A CN202211013143 A CN 202211013143A CN 117672898 A CN117672898 A CN 117672898A
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- magnetic
- attraction force
- negative pressure
- electronic
- blue film
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- 238000012546 transfer Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000012545 processing Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 8
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 5
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 4
- 238000005086 pumping Methods 0.000 description 4
- 238000012797 qualification Methods 0.000 description 3
- 230000005389 magnetism Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Abstract
The invention discloses a mass transfer method of a magnetic electronic element, which is used for processing a plurality of magnetic electronic elements on one surface of a blue film, and comprises the following steps: driving a magnetic bearing piece to be close to the surface of the blue film and driving a plurality of protruding structures of an ejection piece to press the other surface of the blue film so that a plurality of magnetic electronic elements are separated from the blue film and fall into a plurality of grooves of the magnetic bearing piece, wherein the inner part of each groove applies a first magnetic attraction force and a first negative pressure attraction force to one magnetic electronic element; and driving a magnetic transfer member proximate to the magnetic carrier for a transfer operation, comprising: the plurality of protruding parts of the magnetic transfer piece correspondingly face the magnetic electronic components on the grooves of the magnetic bearing piece so as to apply a second magnetic attraction force and a second negative pressure attraction force to each magnetic electronic component and enable the magnetic bearing piece to stop generating the first negative pressure attraction force of each groove.
Description
Technical Field
The present invention relates to a method and apparatus for transferring electronic components, and more particularly, to a method and apparatus for transferring magnetic electronic components in large quantities.
Background
As electronic products continue to increase in functionality, component mounting of many circuit carriers or display panels involves transferring a large number of electronic components on a wafer to the circuit carrier or display panel.
The general electronic component transferring method mainly comprises the following steps: grinding the back surface of a wafer; attaching a blue film to the back surface; performing laser cutting on a plurality of electronic elements on the front surface of the wafer, and performing a film expanding operation on the blue film by using a separating film expander so as to enlarge the spacing between the electronic elements; and clamping the electronic elements on a circuit carrier board or a corresponding connection pad of a display panel by using a robot arm or a manual work.
However, when the number of electronic devices on a wafer increases greatly with the progress of the chip process, the transfer efficiency of the conventional electronic device transfer method is significantly insufficient.
Disclosure of Invention
To solve the above-mentioned problems, there is a need in the art for a new mass transfer scheme for electronic devices.
The invention provides a huge amount transfer method of magnetic electronic elements, which can directly eject a plurality of magnetic electronic elements on a blue film by utilizing an ejector under the condition of not needing a film expander, and enable the magnetic electronic elements to be firstly absorbed into a magnetic transfer piece by utilizing a combination of magnetic attraction and negative pressure attraction and then transferred onto a substrate of an electronic product, thereby greatly shortening the huge amount transfer time of the electronic elements and improving the qualification rate of the electronic product.
Another objective of the present invention is to provide a bulk transfer device for magnetic electronic devices, which can greatly shorten the bulk transfer time of the electronic devices and improve the yield of an electronic product.
To achieve the above object, a method for mass transfer of magnetic electronic devices is proposed for processing a plurality of magnetic electronic devices on a surface of a blue film, the method being implemented by a control circuit executing a program, and comprising the steps of:
driving an action side of a magnetic bearing piece to be close to the surface of the blue film, and driving a plurality of protruding structures of an ejection piece to press the other surface of the blue film so that a plurality of magnetic electronic elements are separated from the blue film and fall into a plurality of grooves of the action side of the magnetic bearing piece, wherein the inner part of each groove applies a first magnetic attraction force and a first negative pressure attraction force to one magnetic electronic element; and
driving an active side of a magnetic transfer member proximate to the active side of the magnetic carrier for a transfer operation, comprising: the plurality of protruding parts of the acting side of the magnetic transfer piece correspondingly face the magnetic electronic components on the grooves of the magnetic bearing piece so as to apply a second magnetic attraction force and a second negative pressure attraction force to each magnetic electronic component, and the magnetic bearing piece stops generating the first negative pressure attraction force of each groove, wherein the sum of the second magnetic attraction force and the second negative pressure attraction force is larger than the first magnetic attraction force.
In one embodiment, the method for transferring bulk of the magnetic electronic component further comprises: the magnetic transfer member is driven to move over a substrate to place the magnetic electronic components on the substrate.
In one embodiment, each of the grooves has a first air hole therein for communicating with a first air suction device, thereby providing the first negative pressure suction force.
In one embodiment, the top surface of each protruding portion is provided with a second air hole to be communicated with a second air pumping device, so that the second negative pressure suction force is provided.
In a possible embodiment, the magnetic electronic component may be an electronic component manufactured by using an iron-cobalt-nickel alloy as a base material or an electronic component attached with an iron-cobalt-nickel alloy layer.
In possible embodiments, the magnetic electronic element may be a copper pillar, an LED die, or include a copper pillar and an LED die.
In one embodiment, the grooves of the magnetic carrier each have a funnel structure to facilitate the entry of one of the magnetic electronic components.
In one embodiment, the method further comprises actuating the magnetic carrier with a vibration device to cause the plurality of magnetic electronic components separated from the blue film to fall into the grooves of the magnetic carrier.
In order to achieve the above object, the present invention further discloses a mass transfer device of a magnetic electronic device, which has a control circuit, an ejector, a magnetic carrier and a magnetic transfer member for performing a mass transfer process of a magnetic electronic device to process a plurality of magnetic electronic devices on a surface of a blue film, the process comprising:
the control circuit drives an action side of the magnetic bearing piece to be close to the surface of the blue film and drives a plurality of protruding structures of the ejection piece to press the other surface of the blue film so that a plurality of magnetic electronic elements are separated from the blue film and fall into a plurality of grooves of the action side of the magnetic bearing piece, wherein the inner part of each groove applies a first magnetic attraction force and a first negative pressure attraction force to one magnetic electronic element; and
the control circuit drives an active side of the magnetic transfer member to be close to the active side of the magnetic carrier for transfer operation, and the control circuit comprises: the plurality of protruding parts of the acting side of the magnetic transfer piece correspondingly face the magnetic electronic components on the grooves of the magnetic bearing piece so as to apply a second magnetic attraction force and a second negative pressure attraction force to each magnetic electronic component, and the magnetic bearing piece stops generating the first negative pressure attraction force of each groove, wherein the sum of the second magnetic attraction force and the second negative pressure attraction force is larger than the first magnetic attraction force.
In one embodiment, the bulk transfer process of the magneto-electronic device further comprises: the magnetic transfer member is driven to move over a substrate to place the magnetic electronic components on the substrate.
In one embodiment, each of the grooves has a first air hole therein for communicating with a first air suction device, thereby providing the first negative pressure suction force.
In one embodiment, the top surface of each protruding portion is provided with a second air hole to be communicated with a second air pumping device, so that the second negative pressure suction force is provided.
In a possible embodiment, the magnetic electronic component may be an electronic component manufactured by using an iron-cobalt-nickel alloy as a base material or an electronic component attached with an iron-cobalt-nickel alloy layer.
In possible embodiments, the magnetic electronic element may be a copper pillar, an LED die, or include a copper pillar and an LED die.
In one embodiment, the grooves of the magnetic carrier each have a funnel structure to facilitate the entry of one of the magnetic electronic components.
In one embodiment, the mass transfer device of the magnetic electronic component further comprises a vibration device for actuating the magnetic carrier to cause a plurality of the magnetic electronic components separated from the blue film to fall into the grooves of the magnetic carrier.
Drawings
FIG. 1 is a block diagram of a bulk transfer device for magnetic electronic components according to an embodiment of the invention;
FIG. 2 is a schematic cross-sectional view of a module of a magnetic electronic component to be processed by the mass transfer device of the magnetic electronic component of FIG. 1;
FIG. 3 is a schematic cross-sectional view of an ejector of the bulk transfer device of the magnetic electronic component of FIG. 1;
FIG. 4 is a schematic cross-sectional view of a magnetic carrier of the mass transfer device of the magnetic electronic component of FIG. 1;
FIG. 5 is a schematic cross-sectional view of a magnetic transfer member of the mass transfer device of the magnetic electronic component of FIG. 1;
FIG. 6 is a schematic diagram illustrating an operation of the macro transferring apparatus of the magnetic electronic component of FIG. 1 using the magnetic carrier and the ejector to transfer a plurality of magnetic electronic components of a magnetic electronic component module into a plurality of grooves of the magnetic carrier;
FIG. 7 is a schematic diagram illustrating the operation of the mass transfer device of the magnetic electronic component of FIG. 1 using its magnetic transfer member to transfer the magnetic electronic component in the plurality of grooves of the magnetic carrier onto the plurality of protrusions of the magnetic transfer member;
FIG. 8 is a flow chart of a method for transferring bulk of a magneto-electronic device according to an embodiment of the invention.
Detailed Description
For a further understanding of the structure, features, and objects of the invention, reference should be made to the drawings and to the detailed description of the preferred embodiment.
Referring to fig. 1, a block diagram of an embodiment of a bulk transfer device for a magnetic electronic component according to the present invention is shown. As shown in fig. 1, a bulk transfer device 100 for processing a magnetic electronic device module 10 has a control circuit 110, an ejector 120, a magnetic carrier 130 and a magnetic transfer member 140, wherein the control circuit 110 is used for executing a program to control the operations of the ejector 120, the magnetic carrier 130 and the magnetic transfer member 140 to implement a bulk transfer program.
Referring to fig. 2, a schematic cross-sectional view of the magneto-electronic device module 10 is shown. As shown in fig. 2, the magnetic electronic device module 10 has a blue film 11 and a plurality of magnetic electronic devices 12 adhered to an adhesion surface of the blue film 11, wherein the magnetic electronic devices 12 are originally connected to each other on a wafer, and the blue film 11 is used for adhering the magnetic electronic devices 12 before the magnetic electronic devices 12 are laser-cut, so that the magnetic electronic devices 12 can be adhered to the blue film 11 neatly after being cut.
Referring to fig. 3, a schematic cross-sectional view of the ejector 120 is shown. As shown in fig. 3, the active side of the ejector 120 has a plurality of protruding structural presses 121.
Referring to fig. 4, a schematic cross-sectional view of the magnetic carrier 130 is shown. As shown in fig. 4, the acting side of the magnetic carrier 130 has a plurality of grooves 131, wherein each groove 131 is provided with a through hole 131a in communication with a first air hole 132 of the magnetic carrier 130; each groove 131 can apply a first magnetic attraction force to a magnetic electronic component 12 through magnetism thereof; and the first air hole 132 can be connected with a first air extracting device to apply a first negative pressure suction force to each groove 131 through the air extracting function of the first air extracting device.
Referring to fig. 5, a schematic cross-sectional view of the magnetic transfer member 140 is shown. As shown in fig. 5, the magnetic transfer member 140 has a plurality of protruding portions 141 on the active side, wherein each protruding portion 141 has a through hole 141a communicating with a second air hole 142 of the magnetic transfer member 140; each protrusion 141 can apply a second magnetic attraction force to a magnetic electronic component 12 through its magnetism; and the second air hole 142 may be connected to a second air extracting device to apply a second negative pressure suction to each protruding portion 141 through the air extracting function of the second air extracting device.
In detail, the macro transfer process includes:
the control circuit 110 drives the active side of the magnetic carrier 130 to be close to the adhesive surface of the blue film 11 and drives the protruding structures 121 of the ejector 120 to press the back surface of the blue film 11, so that the magnetic electronic components 12 separate from the blue film 11 and fall into the grooves 131 of the active side of the magnetic carrier 130, wherein the interior of each groove 131 applies a first magnetic attraction force and a first negative pressure attraction force to a magnetic electronic component 12, and the operation schematic diagram is shown in fig. 6; and
(II) the control circuit 110 drives the active side of the magnetic transfer element 140 to be close to the active side of the magnetic carrier 130 for a transfer operation, and the operation is shown in FIG. 7, and the transfer operation includes: the plurality of protruding parts 141 of the acting side of the magnetic transfer element 140 correspondingly face the magnetic electronic elements 12 on the grooves 131 of the magnetic carrier 130 so as to apply a second magnetic attraction force and a second negative pressure attraction force to each magnetic electronic element 12, and the magnetic carrier 130 stops generating the first negative pressure attraction force of each groove 131, wherein the sum of the second magnetic attraction force and the second negative pressure attraction force is larger than the first magnetic attraction force, so that the magnetic electronic elements 12 are transferred to the protruding parts 141; and
(III) the control circuit 110 drives the magnetic transfer element 140 over a substrate to place the magnetic electronic components 12 on the substrate.
In addition, the magnetic electronic components 12 may be electronic components manufactured by using an iron-nickel alloy as a base material or electronic components attached with an iron-nickel alloy layer; in addition, the magnetic electronic components 12 may be copper pillars, LED dies, or include copper pillars and LED dies.
From the above description, the present invention discloses a mass transfer method of a magnetic electronic device. Referring to fig. 8, a flow chart of a method for transferring bulk of a magneto-electronic device according to an embodiment of the invention is shown, which is used for processing a plurality of magneto-electronic devices on a surface of a blue film, and the method is implemented by a control circuit executing a program. As shown in fig. 8, the method includes the steps of: driving an action side of a magnetic bearing piece to be close to the surface of the blue film, and driving a plurality of protruding structures of an ejection piece to press the other surface of the blue film so that the magnetic electronic components are separated from the blue film and fall into a plurality of grooves on the action side of the magnetic bearing piece, wherein a first magnetic attraction force and a first negative pressure attraction force are applied to one magnetic electronic component by the inner part of each groove (step a); and urging an active side of a magnetic transfer member proximate the active side of the magnetic carrier for a transfer operation, comprising: the plurality of protruding parts of the acting side of the magnetic transfer piece correspondingly face the magnetic electronic components on the grooves of the magnetic bearing piece so as to apply a second magnetic attraction force and a second negative pressure attraction force to each magnetic electronic component, and the magnetic bearing piece stops generating the first negative pressure attraction force of each groove, wherein the sum of the second magnetic attraction force and the second negative pressure attraction force is larger than the first magnetic attraction force (step b).
In the above step, a first air hole may be formed in each groove to communicate with a first air pumping device, so as to provide the first negative pressure suction force; the top surface of each protruding part can be provided with a second air hole to be communicated with a second air pumping device so as to provide the second negative pressure suction force; the magnetic electronic component can be an electronic component manufactured by taking an iron-nickel alloy as a base material or an electronic component attached with an iron-nickel alloy layer; and the magnetic electronic element can be a copper pillar, an LED die or comprise a copper pillar and an LED die.
In addition, the mass transfer method of the magnetic electronic element may further include: the magnetic transfer member is driven to move over a substrate to place the magnetic electronic components on the substrate.
From the above description, the present invention can provide the following advantages:
(1) The huge amount transfer method of the magnetic electronic element can directly eject a plurality of magnetic electronic elements on a blue film by utilizing an ejector under the condition of not needing a film expander, and the magnetic electronic elements are firstly adsorbed into a magnetic transfer piece by utilizing the combination of a magnetic attraction force and a negative pressure attraction force and then transferred onto a substrate of an electronic product, so that the huge amount transfer time of the electronic element is greatly shortened and the qualification rate of the electronic product is improved; and
(2) The device for transferring the huge amount of the magnetic electronic element can greatly shorten the time for transferring the huge amount of the electronic element and improve the qualification rate of an electronic product by the method.
The present disclosure is directed to a preferred embodiment, and is directed to a method for manufacturing a semiconductor device, and a semiconductor device manufactured by the method.
Claims (16)
1. A method for mass transfer of magnetic electronic components for processing a plurality of magnetic electronic components on a surface of a blue film, the method being implemented by a control circuit executing a program and comprising the steps of:
driving an action side of a magnetic bearing piece to be close to the surface of the blue film, and driving a plurality of protruding structures of an ejection piece to press the other surface of the blue film so that a plurality of magnetic electronic elements are separated from the blue film and fall into a plurality of grooves of the action side of the magnetic bearing piece, wherein the inner part of each groove applies a first magnetic attraction force and a first negative pressure attraction force to one magnetic electronic element; and
driving an active side of a magnetic transfer member proximate to the active side of the magnetic carrier for a transfer operation, comprising: the plurality of protruding parts of the acting side of the magnetic transfer piece correspondingly face the magnetic electronic components on the grooves of the magnetic bearing piece so as to apply a second magnetic attraction force and a second negative pressure attraction force to each magnetic electronic component, and the magnetic bearing piece stops generating the first negative pressure attraction force of each groove, wherein the sum of the second magnetic attraction force and the second negative pressure attraction force is larger than the first magnetic attraction force.
2. The method of bulk transfer of a magneto-electronic element of claim 1, further comprising:
the magnetic transfer member is driven to move over a substrate to place the magnetic electronic components on the substrate.
3. The method of claim 1, wherein each of the recesses has a first air hole therein for communicating with a first air extractor to provide the first negative pressure suction.
4. The method of claim 3, wherein each of the protrusions has a second air hole on its top surface for communicating with a second air extractor to provide the second negative pressure suction force.
5. The method of claim 1, wherein the magnetic electronic device is an electronic device manufactured by using an iron-cobalt-nickel alloy as a base material or an electronic device attached with an iron-cobalt-nickel alloy layer.
6. The method of claim 5, wherein the magnetic electronic component comprises at least one component selected from the group consisting of copper pillars and LED dies.
7. The method of claim 1, wherein the plurality of grooves of the magnetic carrier each have a funnel structure for facilitating the entry of a magnetic electronic device.
8. The method of claim 1, further comprising actuating the magnetic carrier with a vibration device to cause a plurality of the magnetic electronic components separated from the blue film to fall into the grooves of the magnetic carrier.
9. A mass transfer device for a magnetic electronic device having a control circuit, an ejector, a magnetic carrier and a magnetic transfer member for performing a mass transfer process for a magnetic electronic device to process a plurality of magnetic electronic devices on a surface of a blue film, the process comprising:
the control circuit drives an action side of the magnetic bearing piece to be close to the surface of the blue film and drives a plurality of protruding structures of the ejection piece to press the other surface of the blue film so that a plurality of magnetic electronic elements are separated from the blue film and fall into a plurality of grooves of the action side of the magnetic bearing piece, wherein the inner part of each groove applies a first magnetic attraction force and a first negative pressure attraction force to one magnetic electronic element; and
the control circuit drives an active side of the magnetic transfer member to be close to the active side of the magnetic carrier for transfer operation, and the control circuit comprises: the plurality of protruding parts of the acting side of the magnetic transfer piece correspondingly face the magnetic electronic components on the grooves of the magnetic bearing piece so as to apply a second magnetic attraction force and a second negative pressure attraction force to each magnetic electronic component, and the magnetic bearing piece stops generating the first negative pressure attraction force of each groove, wherein the sum of the second magnetic attraction force and the second negative pressure attraction force is larger than the first magnetic attraction force.
10. The apparatus for mass transfer of magnetic electronic components of claim 9, wherein the process for mass transfer of magnetic electronic components further comprises:
the magnetic transfer member is driven to move over a substrate to place the magnetic electronic components on the substrate.
11. The device of claim 9, wherein each recess has a first air hole therein for communicating with a first air extractor to provide the first negative pressure suction.
12. The device of claim 11, wherein each of the protrusions has a second air hole on its top surface for communicating with a second air extractor to provide the second negative pressure suction force.
13. The bulk transfer device of claim 9, wherein the magnetic electronic component is an electronic component manufactured by using an iron-cobalt-nickel alloy as a base material or an electronic component attached with an iron-cobalt-nickel alloy layer.
14. The mass transfer device of claim 13, wherein the magnetic electronic component comprises at least one component selected from the group consisting of copper pillars and LED dies.
15. The device of claim 9, wherein the plurality of grooves of the magnetic carrier each have a funnel structure for facilitating the entry of a magnetic electronic component therein.
16. The device of claim 9, further comprising a vibration device for actuating the magnetic carrier to cause a plurality of said magnetic electronic components separated from the blue film to fall into the grooves of the magnetic carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211013143.7A CN117672898A (en) | 2022-08-23 | 2022-08-23 | Method and apparatus for mass transfer of magnetic electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211013143.7A CN117672898A (en) | 2022-08-23 | 2022-08-23 | Method and apparatus for mass transfer of magnetic electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117672898A true CN117672898A (en) | 2024-03-08 |
Family
ID=90077375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211013143.7A Pending CN117672898A (en) | 2022-08-23 | 2022-08-23 | Method and apparatus for mass transfer of magnetic electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117672898A (en) |
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2022
- 2022-08-23 CN CN202211013143.7A patent/CN117672898A/en active Pending
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