TW202410788A - Mass transfer method and device of magnetic electronic components - Google Patents

Abstract

A mass transfer method of magnetic electronic components for processing multiple magnetic electronic components on a surface of a blue film. The method includes: driving a magnetic carrier close to the surface of the blue film and driving an ejection member A plurality of protruding structures press the other surface of the blue film, so that a plurality of the magnetic electronic components are separated from the blue film and fall into a plurality of grooves of the magnetic carrier, wherein the inside of each groove is opposite to One of the magnetic electronic components exerts a first magnetic attraction and a first negative pressure attraction; and drives a magnetic transfer member close to the magnetic carrier to perform a transfer operation, which includes: making a plurality of protrusions of the magnetic transfer member Correspondingly, the magnetic electronic components on the grooves of the magnetic carrier are applied with a second magnetic attraction and a second negative pressure attraction to each magnetic electronic component, and the magnetic carrier is stopped. The first negative pressure suction force of each groove is generated.

Description

Mass transfer method and device for magnetic electronic components

The present invention relates to a method and a device for transferring electronic components, and in particular to a method and a device for transferring magnetic electronic components in bulk.

As the functionality of electronic products continues to improve, many circuit board or display panel component bonding involves transferring a large number of electronic components on a wafer to the circuit board or display panel.

General electronic component transfer methods mainly include: grinding the back of a wafer; affixing a blue film on the back; laser cutting multiple electronic components on the front of the wafer; and using a separation expander to The blue film undergoes a film expansion operation to expand the spacing of the electronic components; and a robot arm or manual clamping of the electronic components one by one to corresponding connection pads of a circuit carrier board or a display panel is used.

However, as the number of electronic components on a wafer increases significantly with the advancement of chip manufacturing processes, the transfer efficiency of existing electronic component transfer methods becomes significantly insufficient.

To solve the above problems, a novel mass transfer solution of electronic components is urgently needed in the art.

One purpose of the present invention is to provide a method for mass transfer of magnetic electronic components, which can directly use an ejector to eject multiple magnetic electronic components on a blue film without the need for a wafer expander, and use a combination of a magnetic suction force and a negative pressure suction force to first adsorb the magnetic electronic components into a magnetic transfer component, and then transfer them to a substrate of an electronic product, thereby greatly shortening the mass transfer time of electronic components and improving the yield of the electronic product.

Another object of the present invention is to provide a mass transfer device for magnetic electronic components, which can significantly shorten the mass transfer time of electronic components and improve the yield of an electronic product through the above method.

To achieve the above-mentioned purpose, a mass transfer method of magnetic electronic components is proposed, which is used to process multiple magnetic electronic components on a surface of a blue film. The method is implemented by a control circuit executing a program, and includes the following steps: Driving an active side of a magnetic carrier close to the surface of the blue film and driving multiple protruding structures of an ejection member to press the other surface of the blue film, so that the multiple magnetic electronic components are separated from the blue film and fall into multiple grooves on the active side of the magnetic carrier, wherein the interior of each groove applies a first magnetic attraction and a first negative pressure attraction to a magnetic electronic component; and Driving an active side of a magnetic transfer member close to the active side of the magnetic carrier to perform a transfer operation, which includes: making the multiple protrusions of the active side of the magnetic transfer member correspondingly face the magnetic electronic components on the grooves of the magnetic carrier to apply a second magnetic attraction and a second negative pressure attraction to each of the magnetic electronic components, and making the magnetic carrier stop generating the first negative pressure attraction of each of the grooves, wherein the sum of the second magnetic attraction and the second negative pressure attraction is greater than the first magnetic attraction.

In one embodiment, the mass transfer method of magnetic electronic components further includes: driving the magnetic transfer member to move above a substrate to place the magnetic electronic components on the substrate.

In one embodiment, each of the grooves has a first air hole inside thereof to communicate with a first air suction device, thereby providing the first negative pressure suction force.

In one embodiment, the top surface of each protrusion has a second air hole communicating with a second air extraction device, thereby providing the second negative pressure suction.

In a possible embodiment, the magnetic electronic component may be an electronic component made of an iron-cobalt-nickel alloy as a substrate or an electronic component attached with an iron-cobalt-nickel alloy layer.

In a possible embodiment, the magnetic electronic component may be a copper pillar, an LED die, or include a copper pillar and an LED die.

In one embodiment, each of the grooves of the magnetic carrier has a funnel structure to facilitate the entry of a magnetic electronic component therein.

In one embodiment, the mass transfer method of magnetic electronic components further includes using a vibration device to actuate the magnetic carrier to urge the plurality of magnetic electronic components separated from the blue film to fall into the magnetic carrier. in these grooves.

In order to achieve the above object, the present invention further discloses a mass transfer device of magnetic electronic components, which has a control circuit, an ejection component, a magnetic bearing component and a magnetic transfer component to perform a mass transfer process of magnetic electronic components. To process multiple magnetic electronic components on one surface of a blue film, the process includes: The control circuit drives an active side of the magnetic carrier to be close to the surface of the blue film and drives a plurality of protruding structures of the ejection member to press the other surface of the blue film, so that the plurality of magnetic electronic components are separated from the surface. The blue film falls into a plurality of grooves on the active side of the magnetic carrier, wherein the inside of each groove exerts a first magnetic attraction force and a first negative pressure attraction force on one of the magnetic electronic components; as well as The control circuit drives an active side of the magnetic transfer member to be close to the active side of the magnetic bearing member to perform a transfer operation, which includes: causing a plurality of protrusions on the active side of the magnetic transfer member to face the magnetic The magnetic electronic components on the grooves of the carrier exert a second magnetic attraction and a second negative pressure attraction on each magnetic electronic component, and stop the magnetic carrier from generating the grooves. As for the first negative pressure suction force, the sum of the second magnetic suction force and the second negative pressure suction force is greater than the first magnetic suction force.

In one embodiment, the mass transfer process of magnetic electronic components further includes driving the magnetic transfer member to move above a substrate to place the magnetic electronic components on the substrate.

In one embodiment, each groove has a first air hole inside to communicate with a first air extraction device, thereby providing the first negative pressure suction force.

In one embodiment, the top surface of each protrusion has a second air hole communicating with a second air extraction device, thereby providing the second negative pressure suction.

In a possible embodiment, the magnetic electronic component may be an electronic component made of an iron-cobalt-nickel alloy as a substrate or an electronic component attached with an iron-cobalt-nickel alloy layer.

In a possible embodiment, the magnetic electronic component may be a copper pillar, an LED die, or include a copper pillar and an LED die.

In one embodiment, each of the grooves of the magnetic carrier has a funnel structure to facilitate the entry of a magnetic electronic component therein.

In one embodiment, the mass transfer device of magnetic electronic components further has a vibration device, which is used to actuate the magnetic carrier to promote the plurality of magnetic electronic components separated from the blue film to fall into in the grooves of the magnetic bearing member.

In order to enable the review committee to further understand the structure, characteristics and purpose of the present invention, drawings and detailed descriptions of preferred embodiments are attached as follows.

Please refer to FIG1, which shows a block diagram of an embodiment of the mass transfer device of magnetic electronic components of the present invention. As shown in FIG1, a mass transfer device 100 of magnetic electronic components is used to process a magnetic electronic component module 10, and has a control circuit 110, an ejection member 120, a magnetic carrier 130 and a magnetic transfer member 140, wherein the control circuit 110 is used to execute a program to control the operation of the ejection member 120, the magnetic carrier 130 and the magnetic transfer member 140 to implement a mass transfer process.

Please refer to FIG. 2 , which is a schematic cross-sectional view of the magnetic electronic component module 10 . As shown in Figure 2, the magnetic electronic component module 10 has a blue film 11 and a plurality of magnetic electronic components 12 adhered to an adhesive surface of the blue film 11, wherein the magnetic electronic components 12 were originally connected to each other. On the wafer, the blue film 11 is used to adhere the magnetic electronic components 12 before laser cutting, so that the magnetic electronic components 12 can be neatly arranged after being cut. Adhered to the blue film 11.

Please refer to Fig. 3, which is a cross-sectional schematic diagram of the ejector 120. As shown in Fig. 3, the active side of the ejector 120 has a plurality of protruding structures 121.

Please refer to FIG. 4 , which is a schematic cross-sectional view of the magnetic bearing member 130 . As shown in FIG. 4 , the active side of the magnetic bearing member 130 has a plurality of grooves 131 , wherein each groove 131 is provided with a through hole 131 a communicating with one of the first air holes 132 of the magnetic bearing member 130 ; each groove 131 can Applying a first magnetic attraction force to a magnetic electronic component 12 through its magnetism; and the first air hole 132 can be connected to a first air extraction device to exert an air extraction function on each groove 131 through the first air extraction device A first negative pressure suction.

Please refer to FIG. 5 , which is a schematic cross-sectional view of the magnetic transfer member 140 . As shown in FIG. 5 , the active side of the magnetic transfer member 140 has a plurality of protrusions 141 , wherein each protrusion 141 is provided with a through hole 141 a communicating with a second air hole 142 of the magnetic transfer member 140 ; each protrusion 141 can Applying a second magnetic attraction force to a magnetic electronic component 12 through its magnetism; and the second air hole 142 can be connected to a second air extraction device to exert an air extraction function on each protruding portion 141 through the air extraction function of the second air extraction device One second negative pressure suction.

In detail, the massive transfer process includes:

(i) the control circuit 110 drives the active side of the magnetic carrier 130 to be close to the sticking surface of the blue film 11 and drives the multiple protruding structures 121 of the ejection member 120 to press the back side of the blue film 11, so that the magnetic electronic components 12 are separated from the blue film 11 and fall into the multiple grooves 131 on the active side of the magnetic carrier 130, wherein the interior of each groove 131 applies a first magnetic attraction and a first negative pressure attraction to a magnetic electronic component 12. Please refer to FIG6 for the operation schematic diagram; and

(ii) the control circuit 110 drives the active side of the magnetic transfer member 140 to approach the active side of the magnetic carrier 130 to perform a transfer operation. Please refer to FIG. 7 for the operation schematic diagram. The transfer operation includes: making the plurality of protrusions 141 of the active side of the magnetic transfer member 140 correspondingly face the magnetic electronic components 12 on the grooves 131 of the magnetic carrier 130, so as to apply a second magnetic attraction force and a second negative pressure attraction force to each magnetic electronic component 12, and making the magnetic carrier 130 stop generating the first negative pressure attraction force of each groove 131, wherein the sum of the second magnetic attraction force and the second negative pressure attraction force is greater than the first magnetic attraction force, so as to transfer the magnetic electronic components 12 to the protrusions 141; and

(3) The control circuit 110 drives the magnetic transfer member 140 to move above a substrate to place the magnetic electronic components 12 on the substrate.

In addition, the magnetic electronic components 12 may be electronic components made of an iron-nickel alloy as a substrate or electronic components attached with an iron-nickel alloy layer; in addition, the magnetic electronic components 12 may be copper columns, LED crystals, or include copper columns and LED crystals.

As can be seen from the above description, the present invention discloses a method for mass transfer of magnetic electronic components. Please refer to FIG8, which shows a flow chart of an embodiment of the method for mass transfer of magnetic electronic components of the present invention, which is used to process a plurality of magnetic electronic components on a surface of a blue film, and the method is implemented by a control circuit executing a program. As shown in FIG8 , the method includes the following steps: driving an active side of a magnetic carrier to be close to the surface of the blue film and driving a plurality of protruding structures of an ejection member to press the other surface of the blue film, so that the magnetic electronic components are separated from the blue film and fall into a plurality of grooves on the active side of the magnetic carrier, wherein the interior of each of the grooves applies a first magnetic attraction and a first negative pressure attraction to the magnetic electronic component (step a); and driving an active side of a magnetic transfer member to be close to the surface of the blue film and driving a plurality of protruding structures of an ejection member to press the other surface of the blue film, so that the magnetic electronic components are separated from the blue film and fall into a plurality of grooves on the active side of the magnetic carrier, wherein the interior of each of the grooves applies a first magnetic attraction and a first negative pressure attraction to the magnetic electronic component (step a); The active side of the magnetic carrier is brought into close proximity to perform a transfer operation, which includes: making the multiple protrusions of the active side of the magnetic transfer member correspond to the surfaces of the magnetic electronic components on the grooves of the magnetic carrier to apply a second magnetic attraction force and a second negative pressure attraction force to each of the magnetic electronic components, and making the magnetic carrier stop generating the first negative pressure attraction force of each of the grooves, wherein the sum of the second magnetic attraction force and the second negative pressure attraction force is greater than the first magnetic attraction force (step b).

In the above steps, each groove may have a first air hole inside to communicate with a first exhaust device, thereby providing the first negative pressure suction force; each protrusion may have a second air hole on the top surface to communicate with a second exhaust device, thereby providing the second negative pressure suction force; the magnetic electronic component may be an electronic component made of an iron-nickel alloy as a substrate or an electronic component attached with an iron-nickel alloy layer; and the magnetic electronic component may be a copper column, an LED chip, or a copper column and an LED chip.

In addition, the mass transfer method of magnetic electronic components may further include driving the magnetic transfer member to move above a substrate to place the magnetic electronic components on the substrate.

As can be seen from the above description, the present invention can provide the following advantages: (1) The mass transfer method of magnetic electronic components of the present invention can directly use an ejection piece to eject multiple magnetic electronic components on a blue film without the need for an expander, and use a magnetic attraction force The combination of the magnetic electronic components and a negative pressure suction force causes the magnetic electronic components to be first attracted to a magnetic transfer member, and then transferred to a substrate of an electronic product, thus greatly shortening the mass transfer time of electronic components and improving the efficiency of the electronic components. Product yield; and (2) The mass transfer device for magnetic electronic components of the present invention can greatly shorten the mass transfer time of electronic components and improve the yield of an electronic product through the above method.

What is disclosed in this case is a preferred embodiment. Any partial changes or modifications derived from the technical ideas of this case and easily inferred by those familiar with the art will not deviate from the scope of the patent rights of this case.

In summary, this case shows that its purpose, means and effects are all different from the known technology, and it is the first invention that is practical and indeed meets the patent requirements for invention. We sincerely request the review committee to examine this carefully and grant a patent as soon as possible to benefit the society. This is our utmost prayer.

10: Magnetic electronic component module 11: Blue film 12: Magnetic electronic component 100: Mass transfer device for magnetic electronic components 110: Control circuit 120: Ejector 121: Protruding structure 130: Magnetic carrier 131: Groove 131a: Through hole 132: First air hole 140: Magnetic transfer component 141: Protrusion 141a: Through hole 142: Second air hole Step a: driving an active side of a magnetic carrier close to the surface of the blue film and driving multiple protruding structures of an ejection member to press the other surface of the blue film, so that the magnetic electronic components are separated from the blue film and fall into multiple grooves on the active side of the magnetic carrier, wherein the interior of each groove applies a first magnetic attraction and a first negative pressure attraction to the magnetic electronic component. Step b: driving an active side of a magnetic transfer member close to the active side of the magnetic carrier to perform a transfer operation, which includes: making the multiple protrusions of the active side of the magnetic transfer member correspondingly face the magnetic electronic components on the grooves of the magnetic carrier to apply a second magnetic attraction force and a second negative pressure attraction force to each of the magnetic electronic components, and making the magnetic carrier stop generating the first negative pressure attraction force of each of the grooves, wherein the sum of the second magnetic attraction force and the second negative pressure attraction force is greater than the first magnetic attraction force

FIG. 1 is a block diagram of an embodiment of the mass transfer device of magnetic electronic components of the present invention. FIG. 2 is a cross-sectional schematic diagram of a magnetic electronic component module to be processed by the mass transfer device of magnetic electronic components of FIG. 1. FIG. 3 is a cross-sectional schematic diagram of an ejector of the mass transfer device of magnetic electronic components of FIG. 1. FIG. 4 is a cross-sectional schematic diagram of a magnetic carrier of the mass transfer device of magnetic electronic components of FIG. 1. FIG. 5 is a cross-sectional schematic diagram of a magnetic transfer member of the mass transfer device of magnetic electronic components of FIG. 1. FIG. 6 is an operation schematic diagram of the mass transfer device of magnetic electronic components of FIG. 1 transferring multiple magnetic electronic components in a magnetic electronic component module to multiple grooves of the magnetic carrier using its magnetic carrier and ejector. FIG. 7 is a schematic diagram of the operation of the mass transfer device of magnetic electronic components in FIG. 1 using its magnetic transfer member to transfer magnetic electronic components in multiple grooves of a magnetic carrier to multiple protrusions of the magnetic transfer member. FIG. 8 is a flow chart of an embodiment of the mass transfer method of magnetic electronic components of the present invention.

Step a: Driving an active side of a magnetic bearing member close to the surface of the blue film and driving a plurality of protruding structures of an ejection member to press the other surface of the blue film, so as to separate the plurality of magnetic electronic components from the blue film. The blue film falls into a plurality of grooves on the active side of the magnetic carrier, wherein the inside of each groove exerts a first magnetic attraction force and a first negative pressure attraction force on one of the magnetic electronic components.

Step b: driving an active side of a magnetic transfer member close to the active side of the magnetic carrier to perform a transfer operation, which includes: making the multiple protrusions of the active side of the magnetic transfer member correspondingly face the magnetic electronic components on the grooves of the magnetic carrier, so as to apply a second magnetic attraction and a second negative pressure attraction to each of the magnetic electronic components, and making the magnetic carrier stop generating the first negative pressure attraction of each of the grooves, wherein the sum of the second magnetic attraction and the second negative pressure attraction is greater than the first magnetic attraction.

Claims (16)

A method for mass transfer of magnetic electronic components is used to process multiple magnetic electronic components on a surface of a blue film. The method is implemented by a control circuit executing a program and includes the following steps: Driving an active side of a magnetic carrier close to the surface of the blue film and driving multiple protruding structures of an ejector to press the other surface of the blue film, so that the multiple magnetic electronic components are separated from the blue film and fall into multiple grooves on the active side of the magnetic carrier, wherein the interior of each groove applies a first magnetic attraction and a first negative pressure attraction to a magnetic electronic component; and Driving an active side of a magnetic transfer member close to the active side of the magnetic carrier to perform a transfer operation, which includes: making the multiple protrusions of the active side of the magnetic transfer member correspondingly face the magnetic electronic components on the grooves of the magnetic carrier to apply a second magnetic attraction force and a second negative pressure attraction force to each of the magnetic electronic components, and making the magnetic carrier stop generating the first negative pressure attraction force of each of the grooves, wherein the sum of the second magnetic attraction force and the second negative pressure attraction force is greater than the first magnetic attraction force. The mass transfer method of magnetic electronic components as claimed in claim 1 , further comprising: driving the magnetic transfer member to move above a substrate to place the magnetic electronic components on the substrate. The mass transfer method of magnetic electronic components as claimed in claim 1 , wherein each groove has a first air hole inside to communicate with a first air extraction device, thereby providing the first negative pressure suction force. A method for mass transfer of magnetic electronic components as described in claim 3 , wherein the top surface of each protrusion has a second air hole connected to a second vacuum device, thereby providing the second negative pressure suction force. The mass transfer method of magnetic electronic components as described in claim 1 , wherein the magnetic electronic components are electronic components manufactured with an iron-cobalt-nickel alloy as a base material or electronic components with an iron-cobalt-nickel alloy layer attached . A method for mass transfer of magnetic electronic components as described in claim 5 , wherein the magnetic electronic components include at least one component selected from a group consisting of copper pillars and LED chips. The mass transfer method of magnetic electronic components as claimed in claim 1 , wherein each of the grooves of the magnetic carrier has a funnel structure to facilitate one of the magnetic electronic components to enter therein. The mass transfer method of magnetic electronic components as claimed in claim 1 , further comprising using a vibration device to actuate the magnetic carrier to urge the plurality of magnetic electronic components separated from the blue film to fall into the magnetic carrier. in these grooves. A mass transfer device for magnetic electronic components, which has a control circuit, an ejection component, a magnetic bearing component and a magnetic transfer component to perform a mass transfer process of magnetic electronic components to process a surface of a blue film For multiple magnetic electronic components, the program includes: The control circuit drives an active side of the magnetic carrier to be close to the surface of the blue film and drives a plurality of protruding structures of the ejection member to press the other surface of the blue film, so that the plurality of magnetic electronic components are separated from the surface. The blue film falls into a plurality of grooves on the active side of the magnetic carrier, wherein the inside of each groove exerts a first magnetic attraction force and a first negative pressure attraction force on one of the magnetic electronic components; as well as The control circuit drives an active side of the magnetic transfer member to be close to the active side of the magnetic bearing member to perform a transfer operation, which includes: causing a plurality of protrusions on the active side of the magnetic transfer member to face the magnetic The magnetic electronic components on the grooves of the carrier exert a second magnetic attraction and a second negative pressure attraction on each magnetic electronic component, and stop the magnetic carrier from generating the grooves. As for the first negative pressure suction force, the sum of the second magnetic suction force and the second negative pressure suction force is greater than the first magnetic suction force. The mass transfer device of magnetic electronic components as described in claim 9, wherein the mass transfer process of the magnetic electronic components further includes: Driving the magnetic transfer member to move above a substrate to place the magnetic electronic components on the substrate. A mass transfer device for magnetic electronic components as described in claim 9, wherein each of the grooves has a first air hole inside to communicate with a first vacuum device, thereby providing the first negative pressure suction force. A mass transfer device for magnetic electronic components as described in claim 11, wherein the top surface of each protrusion has a second air hole connected to a second vacuum device, thereby providing the second negative pressure suction force. The mass transfer device for magnetic electronic components as claimed in claim 9, wherein the magnetic electronic components are electronic components manufactured using an iron-cobalt-nickel alloy as a base material or electronic components attached with an iron-cobalt-nickel alloy layer. . A mass transfer device for magnetic electronic components as described in claim 13 , wherein the magnetic electronic components include at least one component selected from a group consisting of copper pillars and LED chips. The mass transfer device for magnetic electronic components as claimed in claim 9, wherein each of the grooves of the magnetic carrier has a funnel structure to facilitate entry of a magnetic electronic component into it. The mass transfer device of magnetic electronic elements as described in claim 9 further comprises a vibration device, which is used to actuate the magnetic carrier to cause the plurality of magnetic electronic elements separated from the blue film to fall into the grooves of the magnetic carrier.

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