CN221041051U - Tool fixture for stripping chip and substrate - Google Patents
Tool fixture for stripping chip and substrate Download PDFInfo
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- CN221041051U CN221041051U CN202322856965.8U CN202322856965U CN221041051U CN 221041051 U CN221041051 U CN 221041051U CN 202322856965 U CN202322856965 U CN 202322856965U CN 221041051 U CN221041051 U CN 221041051U
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- chip
- substrate
- pressing piece
- die
- push head
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- 239000000758 substrate Substances 0.000 title claims abstract description 69
- 238000003825 pressing Methods 0.000 claims abstract description 76
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 238000010008 shearing Methods 0.000 claims abstract description 16
- 238000012360 testing method Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 8
- 230000000903 blocking effect Effects 0.000 claims description 5
- 230000008901 benefit Effects 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 7
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model provides a chip and base plate strip frock tool, includes the loading board, the loading board is used for bearing the weight of the base plate and the chip of adhesion on the base plate; the chip pressing device comprises a base plate, a pressing piece and a pressing mechanism, wherein the pressing piece is arranged on the base plate, the pressing piece is used for pressing the chip, and the pressing piece is used for pressing the chip; and enabling the substrate and the chip to perform relative shearing movement. The utility model has the advantage of reducing chip breakage during the stripping of the chip and the substrate.
Description
Technical Field
The utility model relates to the technical field of chip peeling test, in particular to a chip and substrate peeling tool jig.
Background
In the semiconductor industry, a packaged chip or device has a chip bonding process, that is, the chip is bonded to the substrate by means of conductive adhesive or solder balls, and a reliability test of the chip bonding, such as a shear force test of the chip and a peeling test of the chip, is performed in the process, so that the chip and the substrate are separated, and a microscope is used to observe the welding condition between the chip and the substrate, thereby improving the performance and quality of the product.
In the prior art, when the substrate and the chip are large in size (relatively speaking), the chip needs to be peeled off from the substrate; the conventional method is that a substrate with a chip is positioned by a clamp, then a testing tool (also called a sensor push head which is directly connected to a tester) is used for contacting the upper surface of the substrate, and then the chip is directly subjected to horizontal shearing motion to realize shearing stripping; the defect of this mode is that the substrate and the chip are larger in size, and the binding force between the substrate and the chip is also larger, so that the deformation of the sensor and the deformation of the substrate are larger and overlapped in the horizontal shearing process, when the thickness of the chip is smaller, the deformation can lead to uneven stress and fragmentation of the chip, and the ideal test effect is that the whole chip is relatively intact, and the whole chip falls off from the substrate. Therefore, how to peel off the chip from the substrate more completely is a problem to be solved by technicians in the same industry when the sizes of the substrate and the chip are large and the bonding force between the substrate and the chip is also large.
Disclosure of utility model
In order to solve the problems, the utility model provides a chip and substrate stripping tool fixture capable of reducing chip breakage during stripping of chips and substrates to society.
The technical scheme of the utility model is as follows: the utility model provides a chip and base plate stripping fixture, which comprises a bearing plate, wherein the bearing plate is used for bearing a base plate and a chip adhered on the base plate; the chip testing device comprises a substrate, a pressing piece and a force application mechanism, wherein the substrate is provided with a substrate stop block, the side surface of the substrate stop block is provided with a sensor push head, the sensor push head is connected with a testing machine, the sensor push head is propped against the side surface of the substrate, or the sensor push head is propped against the side surface of a bearing plate, and when the chip testing device is used, the pressing piece is pressed on the upper surface of the substrate, so that the arch deformation of the substrate and the chip in a stressed state is limited; the chip stop block keeps one side of the chip and keeps the chip motionless, and the sensor push head horizontally acts on one side of the base plate or the bearing plate; and enabling the substrate and the chip to perform relative shearing movement.
As an improvement of the utility model, the chip stop is fixedly connected with the pressing piece.
As an improvement on the utility model, the utility model also comprises a moving block, a guide rail and a jig mounting plate, wherein the bearing plate is fixedly arranged on the moving block, and the moving block is arranged on the jig mounting plate through the guide rail.
As an improvement of the utility model, the force application mechanism comprises a first cylinder and a second cylinder, the pressing piece is in a rod shape, and two ends of the pressing piece are respectively connected with cylinder shafts of the first cylinder and the second cylinder.
As an improvement of the utility model, a step is arranged on one side of the bearing plate, which is close to the sensor push head, and one side of the step is adjacent to one side of the base plate, and the other side of the step is adjacent to one side of the sensor push head.
As an improvement of the utility model, the lower surface of the pressing piece is a plane, and the area of the plane is abutted with the upper surface of the chip.
As an improvement of the utility model, the lower surface of the pressing piece is a curved surface, and a bus of the curved surface presses on the upper surface of the chip.
As an improvement of the utility model, the lower surface of the pressing member is a protrusion protruding from the lower surface, and the protrusion presses against the upper surface of the chip.
The utility model adopts a structure comprising a pressing piece and a force application mechanism for applying force to the pressing piece, wherein one side of the pressing piece is provided with a chip stop block for blocking the side surface of a chip; the substrate and the chip are subjected to relative shearing movement, so that even if the chip is relatively thin and broken, the substrate and the chip can be effectively prevented from being arched and deformed under the action of the pressing force of the pressing piece, the chip can not be damaged basically, and the chip can be stripped from the substrate basically integrally. Therefore, the utility model has the advantage of reducing chip breakage during the peeling of the chip and the substrate.
Drawings
Fig. 1 is a schematic structural view of a first embodiment of the present utility model.
Fig. 2 is a schematic structural view of a second embodiment of the present utility model.
Fig. 3 is a schematic perspective view of a third embodiment of the present utility model.
Fig. 4 is a schematic top view of fig. 3.
Fig. 5 is a schematic view of the cross-sectional A-A configuration of fig. 4.
Fig. 6 is a schematic perspective view of a second embodiment of the compression element of fig. 3.
Fig. 7 is a schematic perspective view of a third embodiment of the compression element of fig. 3.
Detailed Description
Referring to fig. 1, fig. 1 discloses a first embodiment of a tool fixture for stripping chips and substrates, which comprises a carrier plate 1, a pressing member 4 and a force application mechanism 5 for applying force to the pressing member 4, wherein the force application mechanism 5 in this embodiment applies force to the pressing member 4 vertically, and of course, the force application mechanism 5 can also apply force to the pressing member 4 obliquely according to needs, as long as a component force of the applied force is a downward vertical component force; the carrying board 1 is used for carrying a substrate 2 (the substrate 2 is generally a PCB board, the same applies hereinafter) and a chip 3 adhered to the substrate 2; in this embodiment, the pressing member 4 has a pressing surface 41, the area of the pressing surface 41 is substantially equal to the surface area of the chip 3, and the area of the pressing surface 41 is substantially equal to the surface area of the chip 3, which means that the area of the pressing surface 41 is greater than or equal to or slightly smaller than the surface area of the chip 3; a die stop 6 for blocking the side surface of the die 3 is arranged on one side of the pressing member 4, when the die pressing member 4 is used, the pressing member 4 vertically presses the upper surface of the die 3, namely, the pressing member 4 applies downward pressure F1 to the die 3, so as to prevent the substrate 2 and the die 3 from being arched and deformed, keep the die 3 not easy to break, keep one side of the die 3 blocked by the die stop 6, keep the die 3 still, and a sensor push head 7 of a testing machine horizontally acts on one side of the substrate 2 far away from the die stop 6, wherein in the embodiment, the sensor push head 7 is only one component of the testing machine and is not the same as the middle component of the utility model; the substrate 2 and the chip 3 are subjected to relative shearing movement, so that the chip 3 can be completely peeled off from the substrate 2. In this embodiment, the force application mechanism 5 may be a cylinder; as can be seen from fig. 1, the sensor push head 7 provides a horizontal force F2, which horizontal force F2 is directly applied to the side of the substrate 2 remote from the chip stop 6, i.e. the sensor push head 7 is pushing the substrate 2 directly.
The utility model changes the traditional method that the chip is directly pushed by the sensor push head into the method that the chip is blocked by the chip stop block, and the substrate or the bearing plate is pushed by the sensor push head, so that the substrate and the chip do shearing motion, and the chip can be acted on by the chip stop block under the reaction force, the chip stop block is not fixedly connected with the sensor of the tester, the deformation of the sensor can not be led in, in addition, the chip stop block is not arranged by the size of the sensor of the tester because the chip stop block is not fixedly connected with the sensor, and the deformation of the cutter can be largely avoided by enhancing the material hardness of the chip stop block and the size of the chip stop block.
In summary, the utility model separates the stress sensor (the sensor push head) from the shearing tool (the chip stop block), and uses the pressing piece to press down the chip to limit the arch deformation of the chip and the substrate, and meanwhile, the deformation of the sensor (the sensor push head) cannot be conducted to the stress contact point of the chip, so that a very ideal shearing effect can be obtained.
In this embodiment, the die stop 6 is preferably fixedly connected to the pressing element 4.
Referring to fig. 2, fig. 2 discloses a second embodiment of a tool fixture for stripping chips and substrates, which comprises a carrier plate 1, a pressing member 4 and a force application mechanism 5 for applying force to the pressing member 4, wherein the force application mechanism 5 in this embodiment applies force to the pressing member 4 vertically, and of course, the force application mechanism 5 can also apply force to the pressing member 4 obliquely according to needs, as long as a component force of the applied force is a downward vertical component force; the bearing plate 1 is used for bearing a substrate 2 and a chip 3 adhered on the substrate 2; in this embodiment, the pressing member 4 has a pressing surface 41, the area of the pressing surface 41 is substantially equal to the surface area of the chip 3, and the area of the pressing surface 41 is substantially equal to the surface area of the chip 3, which means that the area of the pressing surface 41 is greater than or equal to or slightly smaller than the surface area of the chip 3; a chip stop block 6 for blocking the side surface of the chip 3 is arranged on one side of the pressing piece 4, and when the chip stop block is used, the pressing piece 4 is pressed on the upper surface of the chip 3 to prevent the substrate 2 and the chip 3 from being arched and deformed; the chip stop block 6 keeps one side of the chip 3, keeps the chip 3 motionless, and the sensor push head 7 of the testing machine horizontally acts on one side of the bearing plate 1 far away from the chip stop block 6; the substrate 2 and the chip 3 are subjected to relative shearing movement, so that the chip 3 can be completely peeled off from the substrate 2. In this embodiment, the force application mechanism 5 may be a cylinder; as can be seen from fig. 2, the sensor push head 7 acts horizontally indirectly on the side of the base plate 2 remote from the die stop 6, i.e. the sensor push head 7 pushes the base plate 2 indirectly via the step 11.
In this embodiment, the die stop 6 is preferably fixedly connected to the pressing element 4.
Referring to fig. 3-5, fig. 3-5 disclose a third embodiment of a tool for stripping a chip from a substrate, which includes a carrier plate 1, a pressing member 4, and a force application mechanism 5 for applying force to the pressing member 4, wherein the carrier plate 1 is used for carrying a substrate 2 and a chip 3 adhered to the substrate 2; the pressing member 4 has a pressing surface 41, and the area of the pressing surface 41 is substantially equal to the surface area of the chip 3, in this embodiment, the area of the pressing surface 41 is substantially equal to the surface area of the chip 3, which means that the area of the pressing surface 41 is greater than or equal to or slightly smaller than the surface area of the chip 3; a chip stop block 6 for blocking the side surface of the chip 3 is arranged on one side of the pressing piece 4, when the chip pressing piece 4 is used, the pressing piece 4 is vertically pressed on the upper surface of the chip 3, the chip stop block 6 blocks one side of the chip 3, the chip 3 is kept motionless, and a sensor push head 7 of a testing machine horizontally acts on one side of the substrate 2 far away from the chip stop block 6; the substrate 2 and the chip 3 are subjected to relative shearing movement, so that the chip 3 can be completely peeled off from the substrate 2. In this embodiment, the force application mechanism 5 may be a cylinder; as can be seen from fig. 5, the sensor push head 7 acts horizontally indirectly on the side of the base plate 2 remote from the die stop 6, i.e. the sensor push head 7 pushes the base plate 2 indirectly via the step 11.
In this embodiment, the die stop 6 is preferably fixedly connected to the pressing element 4.
Preferably, the utility model further comprises a moving block 8, a guide rail 9 and a jig mounting plate 10, wherein the bearing plate 1 is fixedly arranged on the moving block 8, and the moving block 8 is arranged on the jig mounting plate 10 through the guide rail 9.
Preferably, the force application mechanism 5 includes a first cylinder 51 and a second cylinder 52, the pressing member 4 is rod-shaped, and two ends of the pressing member 4 are respectively connected with cylinder shafts of the first cylinder 51 and the second cylinder 52.
Preferably, a step 11 is provided on a side of the carrier plate 1 close to the sensor push head 7, one side of the step 11 is adjacent to a side of the base plate 2, and the other side of the step 11 is adjacent to a side of the sensor push head 7.
Referring to fig. 6, fig. 6 is a schematic perspective view of a second embodiment of the compression element of fig. 3. As can be seen from fig. 6, the lower surface of the pressing member 4 is a curved surface 42, and a generatrix of the curved surface 42 presses against the upper surface of the chip 3 (not shown). The curved surface 42 in this embodiment is a plurality of semicircular roller-like structures arranged in succession.
Referring to fig. 7, fig. 7 is a schematic perspective view of a third embodiment of the pressing member of fig. 3. As can be seen from fig. 7, the lower surface of the pressing member 4 is a protrusion 43 protruding from the lower surface, and the protrusion 43 is pressed against the upper surface of the chip 3 (not shown). The projections 43 in the present embodiment are rectangular projections, and of course, the projections 43 in the present embodiment are spherical projections.
As can be seen from fig. 6 and 7, the lower surface of the pressing member 4 of the present utility model may be designed to be planar or non-planar, as long as the pressing member can press the chip 3.
The utility model changes the traditional method that the chip is directly pushed by the sensor push head into the method that the chip is blocked by the chip stop block, and the substrate or the bearing plate is pushed by the sensor push head, so that the substrate and the chip do shearing motion, and the chip can be acted on by the chip stop block under the reaction force, the chip stop block is not fixedly connected with the sensor of the tester, the deformation of the sensor can not be led in, in addition, the chip stop block is not arranged by the size of the sensor of the tester because the chip stop block is not fixedly connected with the sensor, and the deformation of the cutter can be largely avoided by enhancing the material hardness of the chip stop block and the size of the chip stop block.
In summary, the utility model separates the stress sensor (the sensor push head) from the shearing tool (the chip stop block), and uses the pressing piece to press down the chip to limit the arch deformation of the chip and the substrate, and meanwhile, the deformation of the sensor (the sensor push head) cannot be conducted to the stress contact point of the chip, so that a very ideal shearing effect can be obtained.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (8)
1. The utility model provides a chip and base plate stripping tool fixture, includes loading board (1), loading board (1) is used for loading board (2) and chip (3) that adheres to on board (2); the method is characterized in that: the chip testing device further comprises a pressing piece (4) and a force application mechanism (5) for applying force to the pressing piece (4), wherein a chip stop block (6) for blocking the side face of the chip (3) is arranged on one side of the pressing piece (4), a sensor push head (7) connected with a testing machine is arranged on one side away from the chip stop block (6), the sensor push head (7) is abutted against the side face of the base plate (2), or the sensor push head (7) is abutted against the side face of the bearing plate (1), and when the chip testing device is used, the pressing piece (4) is pressed on the upper surface of the chip (3) to limit arch deformation of the chip and the base plate under the stress state; the chip stop block (6) keeps one side of the chip (3) and keeps the chip (3) motionless, and the sensor push head (7) horizontally acts on one side of the base plate (2) or the bearing plate (1); -imparting a relative shearing movement to the substrate (2) and to the chip (3).
2. The die and substrate stripping tool fixture of claim 1, wherein: the chip stop block (6) is fixedly connected with the pressing piece (4).
3. The die and substrate stripping tool according to claim 1 or 2, characterized in that: the jig comprises a jig mounting plate (10), and is characterized by further comprising a moving block (8), a guide rail (9) and the jig mounting plate (10), wherein the bearing plate (1) is fixedly arranged on the moving block (8), and the moving block (8) is arranged on the jig mounting plate (10) through the guide rail (9).
4. The die and substrate stripping tool according to claim 1 or 2, characterized in that: the force application mechanism (5) comprises a first air cylinder (51) and a second air cylinder (52), the pressing piece (4) is in a rod shape, and two ends of the pressing piece (4) are respectively connected with air cylinder shafts of the first air cylinder (51) and the second air cylinder (52).
5. The die and substrate stripping tool according to claim 1 or 2, characterized in that: a step (11) is arranged on one side of the bearing plate (1) close to the sensor push head (7), one side of the step (11) is adjacent to one side of the base plate (2), and the other side of the step (11) is adjacent to one side of the sensor push head (7).
6. The die and substrate stripping tool according to claim 1 or 2, characterized in that: the lower surface of the pressing piece (4) is a plane (41), and the area of the plane (41) is abutted with the upper surface of the chip (3).
7. The die and substrate stripping tool according to claim 1 or 2, characterized in that: the lower surface of the pressing piece (4) is a curved surface (42), and a bus of the curved surface (42) is pressed on the upper surface of the chip (3).
8. The die and substrate stripping tool according to claim 1 or 2, characterized in that: the lower surface of the pressing piece (4) is provided with a bulge (43) protruding from the lower surface, and the bulge (43) presses on the upper surface of the chip (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322856965.8U CN221041051U (en) | 2023-10-24 | 2023-10-24 | Tool fixture for stripping chip and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322856965.8U CN221041051U (en) | 2023-10-24 | 2023-10-24 | Tool fixture for stripping chip and substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221041051U true CN221041051U (en) | 2024-05-28 |
Family
ID=91170393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322856965.8U Active CN221041051U (en) | 2023-10-24 | 2023-10-24 | Tool fixture for stripping chip and substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221041051U (en) |
-
2023
- 2023-10-24 CN CN202322856965.8U patent/CN221041051U/en active Active
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