CN117641824A - Heat abstractor, circuit board, communication equipment, electronic equipment and communication base station - Google Patents
Heat abstractor, circuit board, communication equipment, electronic equipment and communication base station Download PDFInfo
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- CN117641824A CN117641824A CN202210981752.5A CN202210981752A CN117641824A CN 117641824 A CN117641824 A CN 117641824A CN 202210981752 A CN202210981752 A CN 202210981752A CN 117641824 A CN117641824 A CN 117641824A
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- 238000004891 communication Methods 0.000 title claims abstract description 51
- 230000017525 heat dissipation Effects 0.000 claims abstract description 287
- 238000012546 transfer Methods 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims description 50
- 230000005855 radiation Effects 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 23
- 238000009833 condensation Methods 0.000 abstract description 11
- 230000005494 condensation Effects 0.000 abstract description 11
- 230000002269 spontaneous effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 230000002035 prolonged effect Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a heat abstractor, circuit board, communication equipment, communication base station and electronic equipment, this heat abstractor is through setting up first radiator fin on the base plate, is connected with the second radiator fin on the first radiator fin, and first radiator fin and the inside intercommunication of second radiator fin form the heat dissipation runner, when dispelling the heat, heat transfer medium can spontaneous circulation in the heat dissipation runner. The heat transfer medium condensation area is increased, and then the heat dissipation effect of the heat dissipation device is improved.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation device, a circuit board, communication equipment, electronic equipment and a communication base station.
Background
The heat dissipation effect of the electronic equipment influences the working performance of the equipment. As electronic devices such as communication base stations develop, higher demands are placed on heat dissipation. The communication base station is an important facility in the wireless communication technology, and affects the working quality and efficiency of the whole wireless communication network, so that the heat dissipation effect of the communication base station is particularly important. Meanwhile, with the rapid development of wireless communication technology, the functions of the communication base station are more and more powerful, and the heat dissipation requirement thereof is also increasing.
At present, the heat dissipation of the communication base station mainly adopts flat heat dissipation fins, and heat transfer medium is encapsulated in the heat dissipation fins. However, the heat dissipation device in the related art has a limited heat dissipation area and a low volumetric heat flux density. In order to further enhance the heat dissipation effect, the heat dissipation effect is generally enhanced by increasing the height of the heat dissipation fins or reducing the spacing between the heat dissipation fins. However, it is difficult to meet the increasing heat dissipation demands of rapidly developing electronic devices such as communication base stations, and how to improve the heat dissipation efficiency of the heat dissipation device is a problem to be solved at present.
Disclosure of Invention
The embodiment of the application provides a heat abstractor, a circuit board, communication equipment, electronic equipment and communication base station, and aims to improve the heat dissipation performance of the heat abstractor.
According to a first aspect of the present application, there is provided a heat dissipating device comprising a substrate, at least one heat dissipating structure; wherein each of the heat dissipation structures includes:
the first radiating fin group comprises two first radiating fins, and the two first radiating fins are connected with the substrate;
and the second radiating fins are connected with the two first radiating fins, wherein the second radiating fins are communicated with the interiors of the two first radiating fins to form a radiating runner.
According to the heat dissipation device of the first aspect, the first heat dissipation fins are arranged on the substrate, the second heat dissipation fins are connected to the first heat dissipation fins, the first heat dissipation fins are communicated with the inside of the second heat dissipation fins to form the heat dissipation flow channel, and when heat dissipation is carried out, heat transfer medium can spontaneously circulate in the heat dissipation flow channel. Because the first radiating fins are communicated with the inside of the second radiating fins, the condensing area of the heat transfer medium is increased, and the radiating effect of the radiating device is further improved.
According to a second aspect of the present application, there is provided a circuit board, including the above heat dissipating device, further including a circuit board body, the bottom mounting substrate being connected with the circuit board body.
The circuit board of this application second aspect has adopted above-mentioned heat abstractor, and the circuit board body can be to bottom mounting substrate conduction heat, and then derives heat through heat abstractor, reaches better radiating effect. The heat dissipation device can ensure the light weight of the heat dissipation device, avoid the problem of heat cascade between adjacent heat dissipation fins, and improve the heat dissipation capacity of the heat dissipation device.
According to a third aspect of the present application, there is provided a communication device comprising the above heat sink, or comprising the above circuit board.
The communication equipment of the third aspect of the application adopts the heat dissipation device, so that the service life of the communication equipment can be prolonged, and meanwhile, the working efficiency of the communication equipment can be improved.
According to a fourth aspect of the present application, there is provided a communication base station comprising the above heat dissipation device, or comprising the above circuit board, or comprising the above communication device.
The communication base station of the fourth aspect of the application adopts the heat dissipation device, so that the service life of communication equipment can be prolonged, and meanwhile, the working efficiency of the communication base station can be improved.
According to a fifth aspect of the present application, there is provided an electronic device, including the above-mentioned heat dissipating device.
The electronic equipment of the fifth aspect of the application adopts the heat dissipation device, so that the service life of the equipment can be prolonged.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
FIG. 1 is a schematic diagram of a heat dissipating device according to an embodiment of the present disclosure;
FIG. 2 is a schematic view of a heat dissipating device according to an embodiment of the present disclosure when the heat dissipating device is vertically disposed;
fig. 3 is a schematic structural view of an adjacent second heat sink fin;
fig. 4 is a schematic structural diagram of a first heat sink fin according to an embodiment of the present application:
FIG. 5 is an enlarged view of FIG. 4 at A;
FIG. 6 is a schematic structural view of a side plate according to an embodiment of the present disclosure;
FIG. 7 is a schematic view of a substrate according to an embodiment of the present disclosure;
FIG. 8 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present disclosure;
FIG. 9 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present disclosure;
FIG. 10 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present application.
Reference numerals:
100. a substrate; 200. a first heat sink fin; 300. a second heat sink fin; 210. a first heat dissipation channel; 220. a mounting part; 230. a first heat dissipation pipe; 320. a second heat dissipation pipe; alpha, included angle;
400. a side plate; 110. a bottom mounting substrate; 111. a third heat dissipation pipe; 112. an isolation section; 120. a side mounting base; 130. a fin mounting base; 410. a through hole; 500. a circuit board body.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application. In the case of no conflict, the embodiments and features of the embodiments in this application may be arbitrarily combined with each other.
The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
To facilitate solution understanding, the definitions of some technical terms in this application are as follows:
natural heat dissipation: the passive heat dissipation mode only depends on the temperature difference between the passive heat dissipation mode and the environment to dissipate heat.
Thermal cascading: the temperature of the fluid near the heat dissipation surface is increased and the fluidity is deteriorated due to the influence of the temperature, so that a boundary layer is generated on the heat dissipation surface, and the existence of the boundary layer deteriorates the heat dissipation of the heat source.
Chimney effect: and in the closed space around the upper opening and the lower opening, the low-density air is free to flow upwards due to the temperature difference.
Specific heat dissipation area: heat dissipation area to heat dissipation volume ratio.
Volumetric heat flux density: the heat sink assumes the ratio of the heat dissipation to the volume of the heat sink.
According to the heat dissipation device, the first heat dissipation fins are arranged on the substrate, the second heat dissipation fins are connected to the first heat dissipation fins, the first heat dissipation pipelines and the second heat dissipation pipelines are respectively arranged in the first heat dissipation fins and the second heat dissipation fins, the first heat dissipation pipelines are communicated with the second heat dissipation pipelines to form the heat dissipation flow channels, and when heat dissipation is carried out, heat transfer medium can spontaneously circulate in the heat dissipation flow channels. Because the first heat dissipation pipeline of the first heat dissipation fins is communicated with the second heat dissipation pipeline of the second heat dissipation fins, the condensation area of the heat transfer medium is increased, and the heat dissipation effect of the heat dissipation device is further improved.
A heat dissipating device according to a first embodiment of the present application is described below with reference to fig. 1 to 2.
The heat dissipation device of the embodiment of the application comprises a substrate 100 and at least one heat dissipation structure; each heat dissipation structure comprises a first heat dissipation fin group and a second heat dissipation fin 300, wherein the first heat dissipation fin group comprises two first heat dissipation fins 200, and the two first heat dissipation fins 200 are connected with the substrate 100; the second heat dissipation fins 300 are connected with the two first heat dissipation fins 200, wherein the second heat dissipation fins 300 are communicated with the inside of the two first heat dissipation fins 200 to form a heat dissipation flow channel. The number of the second heat dissipation fins 300 may be plural, and the plurality of second heat dissipation fins 300 form a second heat dissipation fin group.
The first heat dissipation fins 200 include a first heat dissipation pipe 210 inside, the second heat dissipation fins 300 include a second heat dissipation pipe 310 inside, and the first heat dissipation pipe 210 is communicated with the second heat dissipation pipe 310, so as to form a heat dissipation flow channel, a heat transfer medium exists in the heat dissipation flow channel, and the heat transfer medium can flow in the heat dissipation flow channel.
In one embodiment, the heat dissipating device includes a substrate 100, a first set of heat dissipating fins, a second set of heat dissipating fins, and a heat transfer medium; the first heat radiation fin group at least comprises two first heat radiation fins 200; the second fin group includes at least one second fin 300; the first heat sink fin 200 is connected to the substrate 100; the second heat radiation fin 300 is connected with at least two first heat radiation fins 200; the first heat radiation fin 200 includes a first heat radiation pipe group; the second heat dissipation fin 300 includes a second heat dissipation pipe group; the first heat dissipation pipe group includes at least one first heat dissipation pipe 230; the second heat dissipation pipe group includes at least one second heat dissipation pipe 320; the first heat dissipation pipe 230 is communicated with the second heat dissipation pipe 320 to form a heat dissipation flow channel; the heat transfer medium is capable of flowing in the heat dissipation flow channel.
It is understood that the second heat dissipation fin set may include one or more second heat dissipation fins, if the second heat dissipation fin set includes a plurality of second heat dissipation fins, a first heat dissipation channel 210 is formed between adjacent first heat dissipation fins 200, a second heat dissipation channel is formed between adjacent second heat dissipation fins, the first heat dissipation channel 210 is communicated with the second heat dissipation channel, the heat dissipation flow channel includes an evaporation section and a condensation section, and the heat transfer medium flows to the condensation section after being gasified in the evaporation section and flows back to the evaporation section after being condensed in the condensation section. The second heat sink fins 300 and the plane of the first heat sink fins 200 form an included angle α, where the included angle α is greater than 0 ° and less than 90 °, and the first heat sink fins 200 and the second heat sink fins 300 may be thin-walled aluminum alloy.
The heat dissipating device provided by the embodiment of the application comprises the first heat dissipating fins 200 and the second heat dissipating fins 300, wherein the first heat dissipating pipelines 230 of the first heat dissipating fins 200 are communicated with the second heat dissipating pipelines 320 of the second heat dissipating fins 300, so that the condensation area of the heat transferring medium is increased, the heat dissipating effect of the heat dissipating device is further improved, the condensation area of the heat transferring medium is improved, the natural heat dissipating area of the base station is improved compared with the heat dissipating area of the whole machine, and meanwhile, an included angle alpha is formed between the second heat dissipating fins 300 and the plane of the first heat dissipating fins 200, so that the heat transferring medium can flow back to the evaporation section after condensation of the condensation section.
After the first heat radiation fins 200 are connected with the second heat radiation fins 300, an included angle alpha is formed between the second heat radiation fins 300 and the plane where the first heat radiation fins 200 are located, and adjacent first heat radiation fins 200 and adjacent second heat radiation fins jointly form a 'pane structure' capable of meeting the condition that external cold air enters and flows obliquely upwards, wherein the plane where the first heat radiation fins are located is a vertical plane when the heat radiation device is vertically placed, and the plane where the first heat radiation fins are located is a horizontal plane when the heat radiation device is horizontally placed. In the heat dissipation process, the air between the adjacent first heat dissipation fins 200 is heated to flow upwards, and the pane structure can absorb more cold air to enter the heat dissipation channel, so that the cold air and the hot air are replaced, the self-suction effect of the chimney effect is fully utilized, and the heat dissipation effect of the heat dissipation device is further improved. The included angle α is greater than 0 ° and less than 90 °, for example, 30 °, 40 °, 45 °, 50 °, 60 °, 70 °, 80 °. The heat dissipation device fully utilizes the natural heat dissipation of the first heat dissipation fins 200 and the second heat dissipation fins 300, simultaneously utilizes the phase change heat exchange principle of the heat transfer medium, combines the chimney effect of the pane structure, and can effectively improve the specific heat dissipation area and the volume heat flux density, thereby integrally improving the heat dissipation efficiency of the heat dissipation device.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an adjacent second heat dissipating fin, where the included angle α may be adjusted according to actual requirements, for example, the column pitch of the second heat dissipating fin 300 is D, and the vertical pitch is D; the width of the second heat radiation fins 300 is Z, the projection lengths of the second heat radiation fins 300 on the horizontal plane of the first heat radiation fins and the vertical plane of the first heat radiation fins are X and Y respectively, the included angle between the second heat radiation fins 300 and the horizontal plane of the first heat radiation fins is α, and the adjustment of α is equal to the adjustment of D under the condition of ensuring that D is unchanged. The change of alpha can change the flow sectional area of the air absorbed by the chimney effect, and the larger the alpha is, the larger the flow sectional area of the air absorbed by the chimney effect is, the smaller the alpha is, and the smaller the flow sectional area of the air absorbed by the chimney effect is. Of course, Z may be adjusted to change the heat dissipation area of the second heat dissipation fin 300. D may also be adjusted to change the number of second heat fins 300. Therefore, the relevant parameters of the second heat dissipation fins 300 in the embodiment can be flexibly adjusted according to the actual situation, and are suitable for application scenarios with different heat dissipation requirements.
Referring to fig. 4-5, fig. 4 and 5 are schematic diagrams of a first heat sink fin 200 in the heat sink device of the present application; further, a first mounting portion 220 is disposed at an end of the first heat dissipating fin 200 away from the base, and an end of the second heat dissipating fin 300 is mounted on the mounting portion 220, so that when the first heat dissipating fin 200 is mounted on the second heat dissipating fin 300, the first heat dissipating tube 230 of the first heat dissipating fin 200 is communicated with the second heat dissipating tube 320 of the second heat dissipating fin 300 to form a heat dissipating channel.
In an embodiment, a part of the cavity of the first radiator fin forms a first radiator duct 230, a plurality of mounting portions 220 are disposed on each of the first radiator fins 200, the first radiator fins 200 are connected to a plurality of second radiator fins 300, and the second radiator fins 300 are embedded into the mounting portions of the plurality of first radiator fins 200, it is understood that a plurality of first radiator fins 200 are disposed between two side plates 400 of the radiator, a plurality of mounting portions 220 are disposed on each of the first radiator fins 200, and a corresponding mounting portion 220 is disposed on each of the adjacent first radiator fins 200 along the vertical direction of the two side plates 400. The second heat sink fin 300 is a single piece, spans the plurality of first heat sink fins 200, and is embedded in the mounting portion 220 of the plurality of first heat sink fins 200. The second heat dissipation fins 300 are provided with second heat dissipation pipes 320 corresponding to the mounting portions of each mounting portion 220, each mounting portion 220 of the first heat dissipation fins 200 is provided with a first heat dissipation pipe 230, and each second heat dissipation pipe 320 of the second heat dissipation fins 300 is communicated with the corresponding first heat dissipation pipe 230 when the second heat dissipation fins 300 and the first heat dissipation fins 200 are embedded and mounted, so that a plurality of heat dissipation flow channels are formed. In this embodiment, the first heat dissipation fins 200 and the second heat dissipation fins 300 may form a plurality of independent heat dissipation pipes.
In an embodiment, the whole inside of the first heat dissipation fin is a cavity, it can be understood that the whole inside of the second heat dissipation fin 300 is a hollow structure, so as to form a second heat dissipation pipeline 320, each mounting portion 220 of the first heat dissipation fin 200 is provided with a first heat dissipation pipeline 230, the mounting portion of the second heat dissipation fin 300 corresponding to each mounting portion 220 is provided with a second opening communicated with the second heat dissipation pipeline 320, and when the second heat dissipation fin 300 and the first heat dissipation fin 200 are embedded and mounted, each second opening of the second heat dissipation fin 300 is communicated with the corresponding first heat dissipation pipeline 230, so as to form a plurality of heat dissipation runners. In this embodiment, since the entire interior of the second heat dissipation fin 300 is of a hollow structure, and the heat dissipation channels are mutually communicated, the circulation of the heat transfer medium can be accelerated, and the heat dissipation effect of the heat dissipation device is further improved, and the entire interior of the second heat dissipation fin 300 is of a hollow structure, so that the difficulty of the processing technology is small, the entire heat dissipation device is light in weight, and meanwhile, the second heat dissipation fin 300 can conduct heat, and the heat dissipation efficiency is further improved.
In an embodiment, the second radiator fins 300 do not span the plurality of first radiator fins 200, and adjacent first radiator fins 200 are connected by the second radiator fins 300, it is understood that the second radiator fins 300 are disposed at the mounting portions 220 of the adjacent first radiator fins 200, the plurality of first radiator fins 200 are correspondingly disposed along the vertical direction of the two side plates 400, the plurality of first radiator fins 200 are disposed along the extending direction of the second radiator fins 300, and the adjacent first radiator fins 200 and the adjacent second radiator fins 300 together form a "pane structure". The second heat dissipation fins 300 are mounted on at least one end of the mounting portion 220 and have a second opening, and the second opening is in communication with the first heat dissipation duct 230. In this embodiment, the second heat dissipation fins 300 are disposed between the adjacent first heat dissipation fins 200, so that the replacement of the second heat dissipation fins 300 is facilitated, and the maintenance cost is low.
Further, the first heat dissipation fin 200 is provided with a first opening, the first opening is communicated with the first heat dissipation pipeline 230, the second heat dissipation fin 300 is provided with a second opening, the second opening is communicated with the second heat dissipation pipeline 320, and when one end of the second heat dissipation fin 300 is mounted on the mounting portion 220, the first opening is communicated with the second opening, so that the first heat dissipation pipeline 230 is communicated with the second heat dissipation pipeline 320. In the present embodiment, since the first heat dissipating channel 230 of the first heat dissipating fin 200 is communicated with the second heat dissipating channel 320 of the second heat dissipating fin 300, a first opening is required to be provided on the first heat dissipating fin 200, a second opening is provided on the second heat dissipating fin 300, and when the second heat dissipating fin 300 is mounted on the mounting portion 220 of the first heat dissipating fin 200, the first opening corresponds to and communicates with the second opening, so that the first heat dissipating channel 230 communicates with the second heat dissipating channel 320, thereby forming a heat dissipating channel.
The first heat sink fin 200 is provided with a first opening to form the mounting portion 220 of the first heat sink fin 200, the second heat sink fin 300 is provided with a second opening corresponding to the first opening, and when the second heat sink fin 300 is mounted on the mounting portion 220 of the first heat sink fin 200, the second opening is embedded into the first opening and is connected with the first opening in a matching manner. A caulking seam is formed between the first opening and the second opening, and the caulking seam can be sealed by brazing, a laser welding process and the like so as to prevent leakage of the heat transfer medium in the heat dissipation flow channel.
Further, referring to fig. 6, fig. 6 is a schematic structural view of the side plate 400. The heat dissipating device further includes two side plates 400, wherein the two side plates 400 are respectively mounted on two sides of the substrate 100, the side plates 400 are configured to protect the first heat dissipating fins 200 and the second heat dissipating fins 300, and the side plates 400 can strengthen the heat conduction of the substrate 100 to the first heat dissipating fins 200. The side plate 400 is provided with a plurality of through holes 410, the through holes 410 are communicated with the first heat dissipation channel 210 and the second heat dissipation channel, and the plurality of through holes 410 can be formed. Because the through holes 410 are communicated with the first heat dissipation channel 210 and the second heat dissipation channel, cold air can enter the heat dissipation channels from the through holes 410 of the side plates 400 at both sides, thereby accelerating the convection heat exchange process in the heat dissipation channels and further improving the heat dissipation efficiency as a whole. And, the size of the through hole 410 can be adjusted according to actual requirements.
According to the embodiment of the application, the problem of heat cascade between the fins can be solved, and it can be understood that cold air enters the heat dissipation channels of the adjacent heat dissipation fins from the lower end face of the heat dissipation device, as the temperature of the air is heated by the surfaces of the fins to rise, the viscous effect of the air on the solid surface (the surface of the first heat dissipation fins 200) is enhanced, so that the flowing boundary layer of the solid surface becomes thicker, and the outward heat dissipation capacity of the solid surface is reduced. Generally, the thicker the flow boundary layer is, the more closely and even the heat boundary layers of two adjacent heat dissipation fins are fused, so that the heat dissipation of the surfaces of the heat dissipation fins is seriously affected. In this embodiment, cold air enters the heat dissipation channel from the through hole 410 of the side plate 400, so as to wash the flowing boundary layer, induce the flowing boundary layer to vibrate or be destroyed, accelerate the speed of outward heat dissipation of the surface of the heat dissipation fin, and further improve the total heat dissipation efficiency of the heat dissipation device.
Meanwhile, the side plate 400 is provided with holes, so that the whole mass of the heat radiating device can be reduced, and the effect of weight reduction is achieved. The through holes 410 may be elongated, circular, etc., and the through holes 410 may be uniformly distributed on the side plate 400, and the through holes 410 are elongated and uniformly distributed on the side plate 400 with a certain inclination, so as to increase the amount of cold air entering to a certain extent, thereby improving the heat dissipation effect.
Further, referring to fig. 7, fig. 7 is a schematic structural diagram of the substrate 100. The substrate 100 includes a bottom mounting substrate 110, a side mounting base 120, the side mounting base 120 being connected to the bottom mounting substrate 110, and the side mounting base 120 being located at both sides of the bottom mounting substrate 110. The side mounting base 120 may be integrally formed with the bottom mounting substrate 110, or the side plate 400 may be coupled to the bottom mounting substrate 110 by screwing, or the side mounting base 120 may be obtained by drawing.
In an embodiment, the heat dissipating device further includes a fin mounting base 130, and the first heat dissipating fins 200 are mounted on the fin mounting base 130 by a cog process. The fin mounting bases 130 are located between the two side mounting bases 120, and a plurality of fin mounting bases 130 are uniformly arranged in the vertical direction of the two side plates 400, specifically, mounting grooves are formed in the fin mounting bases 130, and the first heat dissipation fins 200 are mounted in the mounting grooves in a damascene manner. The installation mode is simple in structure.
In an embodiment, the heat dissipating device further includes a fin mounting base 130, and the first heat dissipating fins 200 are welded to the fin mounting base 130 by welding. Because the heat radiation fins are mounted in the mounting groove in an inlaid manner, the mounting groove can generate certain thermal resistance to influence the heat conduction of the substrate 100 to the heat radiation fins, so that the overall heat radiation effect can be reduced to a certain extent. Therefore, in the present embodiment, the heat dissipation fins are welded to the fin mounting base 130 by welding, so that the thermal resistance can be effectively reduced, the heat conduction from the substrate 100 to the heat dissipation fins is facilitated, and the heat dissipation efficiency of the heat dissipation device is improved.
In an embodiment, the first heat dissipation fins 200 may be directly fixed on the bottom mounting substrate 110 through a welding process, and the welding manner may be soldering, laser welding, or the like. Compared with the two embodiments, the heat resistance is further reduced, and the heat of the bottom mounting substrate 110 can be more rapidly transferred to the first heat dissipation fins 200, so that the heat dissipation effect of the heat dissipation device is further improved.
Further, referring to fig. 8, only the first heat dissipation channel 230 of the first heat dissipation fin 200 and the second heat dissipation channel 320 of the second heat dissipation fin 300 form a heat dissipation channel, the first heat dissipation channel 230 of the heat dissipation channel is perpendicular to the bottom mounting substrate 110, and the arrow direction in the figure is the flow direction of the heat transfer medium in the heat dissipation channel.
In an embodiment, referring to fig. 9, only the first heat dissipation channel 230 of the first heat dissipation fin 200 and the second heat dissipation channel 320 of the second heat dissipation fin 300 form a heat dissipation channel, and the first heat dissipation channel 230 of the heat dissipation channel is disposed at a predetermined angle with respect to the bottom mounting substrate 110.
In an embodiment, the bottom mounting substrate 110 is provided with at least one third heat dissipation channel 111, the third heat dissipation channel 111 is communicated with the first heat dissipation channel 230, and the first heat dissipation channel 230, the second heat dissipation channel 320 and the third heat dissipation channel 111 together form a heat dissipation flow channel.
In one embodiment, the third heat dissipation channel 111 is one, it is understood that the entire interior of the bottom mounting substrate 110 is hollow, and one surface of the substrate 100 adjacent to the first heat dissipation fins 200 has an opening, and the opening is in communication with the first heat dissipation channel 230 of the first heat dissipation fins 200, so that the third heat dissipation channel 111 of the bottom mounting substrate 110 is in communication with the first heat dissipation channel 230 of the first heat dissipation fins 200, thereby forming a heat dissipation flow channel. The heat transfer medium is heated and evaporated in the third heat dissipation pipeline 111 of the bottom mounting substrate 110 to flow to the condensation section with low resistance, and flows back to the third heat dissipation pipeline 111 of the bottom mounting substrate 110 in time after being condensed and liquefied in the condensation section.
In an embodiment, referring to fig. 10, a heat dissipation channel is formed by a first heat dissipation channel 230 of the first heat dissipation fins 200, a second heat dissipation channel 320 of the second heat dissipation fins 300, and a third heat dissipation channel 111 of the bottom mounting substrate 110, wherein the first heat dissipation channel 230 of the heat dissipation channel is perpendicular to the bottom mounting substrate 110, and the third heat dissipation channels 111 are plural. Specifically, the third heat dissipation pipes 111 are distributed inside the bottom mounting substrate 110 in a sectional manner, it is understood that the cavity inside the bottom mounting substrate 110 may be divided into a plurality of third heat dissipation pipes 111, an isolation section 112 is disposed between adjacent third heat dissipation pipes 111, and each third heat dissipation pipe 111 is provided with an opening, which is communicated with the corresponding first heat dissipation pipe 230, so as to form a heat dissipation flow channel. In this embodiment, the third heat dissipation pipes 111 are distributed inside the bottom mounting substrate 110 in a sectional manner, so that the probability of dry burning caused by partial no refrigerant in the heat dissipation pipes of the bottom mounting substrate 110 can be reduced, and the bottom mounting substrate 110 is prevented from being burnt out. The number of the third heat dissipation pipes 111 can be flexibly adjusted according to practical situations.
In an embodiment, referring to fig. 11, a heat dissipation channel is formed by a first heat dissipation channel 230 of the first heat dissipation fins 200, a second heat dissipation channel 320 of the second heat dissipation fins 300, and a third heat dissipation channel 111 of the bottom mounting substrate 110, the third heat dissipation channels 111 are plural, and the first heat dissipation channel 230 of the heat dissipation channel is disposed at a predetermined angle with respect to the bottom mounting substrate 110. The preset angle may be greater than 0 ° and less than 90 °, for example 30 °, 40 °, 45 °, 50 °, 60 °, 70 °, 80 °. The first heat dissipation pipe 230 of the heat dissipation flow channel is arranged at a preset angle relative to the bottom mounting substrate 110, so that the liquefied heat transfer medium can flow back to the evaporation section in time, the gas-liquid circulation in the heat dissipation flow channel is accelerated, and the heat dissipation efficiency of the heat dissipation device is improved.
The application also provides a circuit board, and this circuit board includes foretell heat abstractor, still includes circuit board body 500, and heat abstractor's bottom mounting substrate 110 is connected with circuit board body 500, and circuit board body 500 is the heat source, and circuit board body 500 can be to bottom mounting substrate 110 conduction heat, and then derives heat through heat abstractor, reaches better radiating effect.
The application also provides a communication device, which comprises the heat dissipation device or the circuit board, and the heat dissipation device can be used for dissipating heat and reducing temperature for the communication device, so that the service life of the communication device is prolonged, and the working efficiency of the communication device is improved. The communication device includes an outdoor communication device, such as a large-scale active communication device (Active Antenna System, AAU) and a remote radio unit (Radio Remote Unit, RRU), an indoor baseband processing unit (Building Base band Unite, BBU), and the like.
The application also provides a communication base station, which comprises the heat dissipation device, the circuit board or the communication equipment. The heat dissipation device is utilized to dissipate heat for the communication base station, so that the service life of the communication base station can be prolonged, and meanwhile, the working efficiency of the communication base station is improved.
The application also provides electronic equipment, which comprises the heat radiating device, wherein the heat radiating device can radiate heat for the electronic equipment, so that the service life of the electronic equipment is prolonged, and the electronic equipment can be communication equipment or electrical equipment and the like.
Some embodiments of the present application are described above with reference to the accompanying drawings, and thus do not limit the scope of the claims of the present application. Any modifications, equivalent substitutions and improvements made by those skilled in the art without departing from the scope and spirit of the present application shall fall within the scope of the claims of the present application.
Claims (18)
1. The heat dissipating device is characterized by comprising a substrate and at least one heat dissipating structure; wherein each of the heat dissipation structures includes:
the first radiating fin group comprises two first radiating fins, and the two first radiating fins are connected with the substrate;
and the second radiating fins are connected with the two first radiating fins, wherein the second radiating fins are communicated with the interiors of the two first radiating fins to form a radiating runner.
2. The heat dissipating device of claim 1, wherein the first heat dissipating fin comprises a first heat dissipating channel inside and the second heat dissipating fin comprises a second heat dissipating channel inside; the first radiating pipelines of the first radiating fins are communicated with the second radiating pipelines of the second radiating fins to form radiating runners; the heat dissipation runner is used for flowing the internal heat transfer medium.
3. The heat dissipating device of claim 2, wherein a first heat dissipating channel is formed between adjacent ones of said first heat dissipating fins, and a second heat dissipating channel is formed between adjacent ones of said second heat dissipating fins;
the first heat dissipation channel is communicated with the second heat dissipation channel.
4. The heat dissipating device of claim 3, wherein an end of said first heat dissipating fin remote from said base plate is provided with a mounting portion;
one end of the second heat radiation fin is arranged on the mounting part so that the first heat radiation pipeline is communicated with the second heat radiation pipeline.
5. The heat dissipating device of claim 4, wherein said second heat dissipating fin is connected to a plurality of said first heat dissipating fins, and said second heat dissipating fins are embedded in the mounting portions of a plurality of said first heat dissipating fins.
6. The heat dissipating device of claim 5, wherein said first heat dissipating fin comprises a cavity, at least a portion of said cavity forming said first heat dissipating channel.
7. The heat dissipating device of claim 4, wherein said first heat dissipating fin is provided with a first opening, said first opening being in communication with said first heat dissipating conduit;
the second radiating fins are provided with second openings, and the second openings are communicated with the second radiating pipelines;
when one end of the second heat radiation fin is installed on the installation part, the first opening is communicated with the second opening, so that the first heat radiation pipeline is communicated with the second heat radiation pipeline.
8. The heat dissipating device of claim 6, further comprising side plates mounted to both sides of said base plate, said side plates configured to protect said first heat dissipating fins and said second heat dissipating fins.
9. The heat dissipating device of claim 8, wherein said side plate is provided with a through hole, said through hole being in communication with said first heat dissipating channel and said second heat dissipating channel.
10. The heat sink of claim 8, wherein the base plate comprises a bottom mounting base plate, a side mounting base;
the side mounting base is connected with the bottom mounting base plate, the side mounting base is located on two sides of the bottom mounting base plate, and the side plates are mounted on the side mounting base plate.
11. The heat dissipating device of claim 10, wherein said base plate further comprises a fin mounting base, said fin mounting base being located between two of said side mounting bases, said first heat dissipating fin being secured to said fin mounting base by a cog process.
12. The heat dissipating device of any of claims 10-11, wherein the bottom mounting substrate is provided with at least one third heat dissipating channel in communication with the first heat dissipating channel, the second heat dissipating channel, and the third heat dissipating channel collectively forming the heat dissipating flow channel.
13. The heat dissipating device of claim 12, wherein said first heat dissipating conduit is disposed at a predetermined angle to said bottom mounting substrate.
14. The heat dissipating device of claim 2, wherein said second heat dissipating fin forms an angle with said plane of said first heat dissipating fin, said angle being greater than 0 ° and less than 90 °.
15. A circuit board comprising the heat dissipation device of any one of claims 1-14, further comprising a circuit board body, the heat dissipation device being coupled to the circuit board body.
16. A communication device comprising a heat sink according to any one of claims 1-14 or comprising a circuit board according to claim 15.
17. A communication base station comprising a heat sink according to any of claims 1-14, or comprising a circuit board according to claim 15, or comprising a communication device according to claim 15.
18. An electronic device comprising a heat sink as claimed in any one of claims 1-14.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210981752.5A CN117641824A (en) | 2022-08-15 | 2022-08-15 | Heat abstractor, circuit board, communication equipment, electronic equipment and communication base station |
| PCT/CN2023/108591 WO2024037278A1 (en) | 2022-08-15 | 2023-07-21 | Heat dissipation apparatus, circuit board, communication device, electronic device, and communication base station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210981752.5A CN117641824A (en) | 2022-08-15 | 2022-08-15 | Heat abstractor, circuit board, communication equipment, electronic equipment and communication base station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117641824A true CN117641824A (en) | 2024-03-01 |
Family
ID=89940647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210981752.5A Pending CN117641824A (en) | 2022-08-15 | 2022-08-15 | Heat abstractor, circuit board, communication equipment, electronic equipment and communication base station |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117641824A (en) |
| WO (1) | WO2024037278A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2624402Y (en) * | 2003-05-13 | 2004-07-07 | 曾贤菊 | Heat radiating fin |
| CN1909771A (en) * | 2005-08-02 | 2007-02-07 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| EP3236727B1 (en) * | 2016-04-20 | 2019-09-18 | CGG Services SAS | Methods and system for oil immersion cooling |
| CN110505791A (en) * | 2019-07-31 | 2019-11-26 | 联想(北京)有限公司 | A kind of radiator and electronic equipment |
| CN114760803A (en) * | 2021-01-08 | 2022-07-15 | 华为技术有限公司 | Radiator and communication equipment |
-
2022
- 2022-08-15 CN CN202210981752.5A patent/CN117641824A/en active Pending
-
2023
- 2023-07-21 WO PCT/CN2023/108591 patent/WO2024037278A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024037278A1 (en) | 2024-02-22 |
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