CN117637370A - Preparation method of silver-based electrical contact material with solder layer - Google Patents
Preparation method of silver-based electrical contact material with solder layer Download PDFInfo
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- CN117637370A CN117637370A CN202311545119.2A CN202311545119A CN117637370A CN 117637370 A CN117637370 A CN 117637370A CN 202311545119 A CN202311545119 A CN 202311545119A CN 117637370 A CN117637370 A CN 117637370A
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- solder layer
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 125
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 57
- 239000004332 silver Substances 0.000 title claims abstract description 57
- 239000000463 material Substances 0.000 title claims abstract description 48
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 75
- 239000000956 alloy Substances 0.000 claims abstract description 37
- 239000002131 composite material Substances 0.000 claims abstract description 34
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 33
- 238000003466 welding Methods 0.000 claims abstract description 30
- 238000005253 cladding Methods 0.000 claims abstract description 27
- 238000004372 laser cladding Methods 0.000 claims abstract description 25
- 238000004140 cleaning Methods 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000005097 cold rolling Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 35
- 230000004907 flux Effects 0.000 claims description 13
- 238000005096 rolling process Methods 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 7
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 6
- 229910044991 metal oxide Inorganic materials 0.000 claims description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 229910017727 AgNi Inorganic materials 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000012298 atmosphere Substances 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 43
- 238000010438 heat treatment Methods 0.000 description 6
- 238000000889 atomisation Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 4
- 239000012300 argon atmosphere Substances 0.000 description 3
- 229910017750 AgSn Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
The invention belongs to the field of electric contact materials, and particularly relates to a preparation method of a silver-based electric contact material with a solder layer, which comprises the following steps: (1) preparing a silver-based contact strip; (2) strip cleaning: the silver-based contact strip prepared in the step (1) passes through a strip cleaning line and is dried; (3) Preparing solder powder, wherein the solder powder is solder alloy powder; (4) preparing a silver-based composite solder strip: cladding the solder powder prepared in the step (3) on the welding surface of the silver-based contact strip processed in the step (2) by using ultra-high-speed laser cladding equipment to obtain a silver-based composite solder strip with a solder layer with a certain thickness cladding on the surface of the welding surface; (5) cold rolling; (6) processing. The composite solder strip has the advantages of more uniform solder layer thickness, high bonding strength, good composite interface quality, improved yield, reduced manufacturing cost, improved consistency and stability of contact performance, and high composite solder contact yield.
Description
Technical Field
The invention belongs to the field of electric contact materials, and particularly relates to a preparation method of a silver-based electric contact material with a solder layer.
Background
In the silver substrate-shaped contact point welding process for the piezoelectric device, a large amount of soldering technology is adopted for welding, soldering paste or sheet-shaped solder is required to be added on the contact, and the problems of complex operation and unstable solder addition exist in the manual welding or automatic welding process during the solder addition process, so that the welding production efficiency is reduced, and the welding quality also fluctuates to a large extent. Silver-based sheet-like contact materials, in which a solder layer is added partly directly during the contact production, are therefore also known in the industry.
The conventional contact composite solder process in the industry mainly comprises a single-piece composite solder and a strip composite solder, wherein the single-piece composite solder is basically carried out in a furnace brazing mode, the strip composite solder can be divided into a resistance furnace heating composite solder process, an intermediate frequency/high frequency induction heating composite solder process and a strip hot rolling composite solder process, wherein the single-piece composite solder in the furnace needs to be sequentially discharged into a graphite material boat, typesetting operation is complicated and low in efficiency, and the composite solder product also has the phenomena of uneven solder spreading, holes in a solder layer and the like. The resistance furnace heating compound solder and the medium/high frequency induction heating compound solder have the problems that the solder flows unevenly after melting because the contact material strip cannot be completely kept horizontal in the advancing process, so that the thickness of a finished contact material layer is uneven, even part of strip areas have the condition of no solder, and the whole strip yield is low. The hot-rolled composite solder needs to be rolled by a large deformation amount to enable the solder layer and the contact material strip to be compounded together, so that the hot-rolled composite solder is not suitable for materials with low silver content and poor processability, otherwise, the problems of serious cracking of the strip edge after compounding or low bonding strength of the composite solder layer can occur. In addition, in the above-mentioned several solder compound processes, the solder strips or solder sheets with different thicknesses are required to be purchased or processed according to the different requirements of different contacts, the solder raw materials are difficult to be commonly used, and the cost of the solder strips processed into thin strips is generally high.
Therefore, the method improves the uniformity of the solder thickness of the composite solder contact and the bonding strength between the solder layer and the contact material, and has important practical application values for improving the reliability of the performance of the composite solder contact, improving the yield of the contact material and the like.
Disclosure of Invention
The invention aims to overcome the defects and the shortcomings of the prior art and provides a preparation method of a silver-based electrical contact material with a solder layer.
The technical scheme adopted by the invention is as follows: the preparation method of the silver-based electrical contact material with the solder layer comprises the following steps:
(1) Preparing a silver-based contact strip, wherein the silver-based contact strip is a pure silver (Ag) strip, a silver alloy (AgMe) material strip or a silver metal oxide compound silver (AgMeO/Ag) material strip;
(2) Cleaning the strip: the silver-based contact strip prepared in the step (1) passes through a strip cleaning line to remove oil stains and impurities on the surface, and is subjected to drying treatment;
(3) Preparing solder powder, wherein the solder powder is solder alloy powder;
(4) Preparing a silver-based composite solder strip: cladding the solder powder prepared in the step (3) on the welding surface of the silver-based contact strip processed in the step (2) by using ultra-high-speed laser cladding equipment to obtain a silver-based composite solder strip with a solder layer with a certain thickness cladding on the surface of the welding surface, wherein metallurgical bonding is formed between the cladding solder layer and a pure silver strip or between the cladding solder layer and a silver alloy material strip or between the cladding solder layer and a silver layer of a silver metal oxide composite silver material strip;
(5) Cold rolling: rolling the silver-based composite solder strip prepared in the step (4) by a certain deformation;
(6) Processing: punching or punching-re-pressing or longitudinal shearing-rolling-slicing the silver-based re-welding flux strip subjected to the rolling treatment in the step (5) to manufacture a sheet-shaped contact.
Preferably, the silver alloy (AgMe) is FAg or AgNi.
Preferably, the silver metal oxide (AgMeO) is AgSnO 2 One of AgCdO, agCuO, agZnO.
Preferably, the solder alloy powder is any one of BAg15CuP alloy powder, BAg25CuZn alloy powder, BAg45CuZn alloy powder, BAg65CuZn alloy powder and BAg56CuZnSn alloy powder, and the powder granularity is 5-50 μm.
Preferably, in the step (4), in the ultra-high speed laser cladding equipment, the powder feeding mode is coaxial powder feeding, the solder alloy powder is uniformly paved on the surface of the silver-based contact material strip for laser cladding, and the powder feeding speed is 50-100 g/min.
Preferably, in the step (4), in the ultra-high speed laser cladding apparatus, the laser type is CO 2 The laser has the laser power of 3000-5000W, the spot diameter of 3-5 mm and the scanning speed of 20-100 m/min.
Preferably, in the step (4), in the ultra-high speed laser cladding equipment, the cladding process is performed under the protection atmosphere of nitrogen or argon, and the thickness of the cladding solder layer obtained after the ultra-high speed laser cladding is 0.05-0.3 mm.
Preferably, in the step (5), the cold rolling deformation amount is 0.05-0.2 mm.
The silver substrate-shaped contact material prepared by the method is characterized in that a thin solder layer is clad on the surface of a silver substrate contact material strip in an ultra-high-speed laser cladding mode, solder alloy powder is converged with laser above the strip and is melted, then the solder alloy powder is uniformly clad on the surface of the strip, the cooling speed of the solder alloy powder is high, the thickness of the clad solder layer is uniform, the thickness of the solder layer can be precisely controlled through parameters such as the powder feeding speed, the laser scanning speed and the like, and the solder layer has high compactness and few holes. The ultra-high-speed laser cladding is adopted to form metallurgical bonding between the solder layer and the matrix material, the heat affected area of the matrix material is shallow, and the structure and performance of the silver-based contact material can not be damaged in the process of cladding the solder.
In addition, the welding flux raw material adopted by the ultra-high speed laser cladding equipment for cladding welding flux is welding flux alloy powder, compared with the traditional single-chip composite welding flux and strip composite welding flux process, the welding flux alloy powder used by the preparation method has more universality, and for the same welding flux material, the welding flux layers with different thicknesses can be obtained by adjusting the process parameters, so that the problems that a large number of welding fluxes with different specifications need to be purchased in advance, continuous production cannot be realized due to insufficient preparation of welding flux strips possibly occurring in the production process, or excessive materials of the welding flux strips are accumulated and wasted are avoided. Compared with the solder strip, the manufacturing process of the solder alloy powder is simple, the processing period is short, the processing cost is low, the processing yield is high, and the manufacturing cost of the solder raw material can be obviously reduced.
Compared with the prior art, the invention has the advantages and positive effects that:
1. the composite solder strip obtained by the laser cladding process has more uniform solder layer thickness, high bonding strength between the solder layer and the contact material and good composite interface quality, can effectively improve the welding performance of the contact material, namely improve the yield, reduce the manufacturing cost, and simultaneously improve the consistency and stability of the contact performance, and has high yield of the composite solder contact;
2. the raw material solder alloy powder required by laser cladding has high universality and simple processing technology, and compared with solder strips with different thicknesses, the manufacturing cost of the solder alloy powder is obviously reduced.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are required in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that it is within the scope of the invention to one skilled in the art to obtain other drawings from these drawings without inventive faculty.
Fig. 1 is a flow chart of a process for preparing a silver-based electrical contact material with a solder layer according to the present invention.
FIG. 2 is a schematic diagram of AgSnO prepared by a conventional solder-reflow process 2 Metallographic structure of the BAg15CuP contact.
FIG. 3 shows AgSnO prepared by the technical scheme of the present invention 2 BAg15CuP strip section metallographic structure.
FIG. 4 shows AgSnO prepared by the technical scheme of the present invention 2 Metallographic structure of the BAg15CuP contact.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings, for the purpose of making the objects, technical solutions and advantages of the present invention more apparent.
Embodiment one:
(1) Preparing a contact material strip: preparing FAg strips with the thickness of 2mm by adopting a smelting process (smelting-extrusion-rolling);
(2) Cleaning the strip: passing the FAg strip through a strip cleaning line to remove oil stains and impurities on the surface, and drying;
(3) Preparing solder powder: preparing BAg25CuZn alloy powder by adopting an atomization process, wherein the granularity of the powder is 5-20 mu m;
(4) And (3) laser cladding: cladding BAg25CuZn alloy powder on the FAg strip by using ultra-high-speed laser cladding equipment, wherein the powder feeding mode is coaxial powder feeding, the powder feeding speed is 80g/min, and the laser type is CO 2 The laser device has the laser power of 4000W, the spot diameter of phi 3mm, the scanning speed of 80m/min and the protection of nitrogen atmosphere, a FAg/BAg25CuZn strip with the thickness of a solder layer of 0.1mm is obtained, and metallurgical bonding is formed between the cladding solder layer and the FAg layer;
(5) Cold rolling: the FAg/BAg25CuZn strip is subjected to secondary rolling to 2.0mm, so that the surface flatness of the BAg25CuZn solder layer is improved;
(6) And (5) subsequent processing: the FAg/BAg25CuZn strip is punched to manufacture a sheet-shaped contact.
Embodiment two:
(1) Preparing a contact material strip: preparing an AgNi10 strip with the thickness of 0.6mm by adopting a powder metallurgy process (powder mixing-isostatic pressing-sintering-extrusion-rolling);
(2) Cleaning the strip: passing the AgNi10 strip through a strip cleaning line, removing oil stains and impurities on the surface, and drying;
(3) Preparing solder powder: preparing BAg45CuZn alloy powder by adopting an atomization process, wherein the granularity of the powder is 10-30 mu m;
(4) And (3) laser cladding: cladding BAg45CuZn alloy powder on the AgNi10 strip by using ultra-high-speed laser cladding equipment, wherein the powder feeding mode is coaxial powder feeding, the powder feeding speed is 50g/min, and the laser type is CO 2 The laser device comprises a laser, wherein the laser power is 3000W, the spot diameter is phi 4mm, the scanning speed is 100m/min, and the AgNi10/BAg45CuZn strip with the thickness of a welding material layer of 0.05mm is obtained through argon atmosphere protection, and metallurgical bonding is formed between the cladding welding material layer and the AgNi layer;
(5) Cold rolling: the AgNi10/BAg45CuZn strip is subjected to sub-rolling to 0.6mm, so that the surface flatness of the BAg45CuZn solder layer is improved;
(6) And (5) subsequent processing: and carrying out slitting-rolling-slicing on the AgNi10/BAg45CuZn strip to manufacture the sheet-shaped contact.
Embodiment III:
(1) Preparing a contact material strip: preparing AgSnO with the thickness of 2.5mm by adopting a preoxidation process (atomizing AgSn powder-powder oxidation-isostatic pressing-sintering-extrusion silver-rolling) 2 (12) Ag tape;
(2) Cleaning the strip: the AgSnO is processed 2 (12) The Ag strip passes through a strip cleaning line to remove oil stains and impurities on the surface, and is dried;
(3) Preparing solder powder: preparing BAg15CuP alloy powder by adopting an atomization process, wherein the granularity of the powder is 15-40 mu m;
(4) And (3) laser cladding: cladding BAg15CuP alloy powder on the AgSnO by using ultra-high-speed laser cladding equipment 2 (12) The powder feeding mode of the welding surface of the Ag strip is coaxial powder feeding, the powder feeding speed is 60g/min, and the laser type is CO 2 The laser has 5000W laser power, 5mm diameter spot diameter, 20m/min scanning speed and nitrogen atmosphere protection, and the AgSnO with 0.3mm solder layer thickness is obtained 2 (12) BAg15CuP strip, cladding solder layer and AgSnO 2 Forming metallurgical bonding between the silver-coated layers of the material;
(5) Cold rolling: the AgSnO is treated with 2 (12) The BAg15CuP strip is rolled again to 2.6mm, so that the surface flatness of the BAg15CuP solder layer is improved;
(6) And (5) subsequent processing: the AgSnO is processed 2 (12) The BAg15CuP strip is punched and re-pressed to manufacture a sheet-shaped contact.
Embodiment four:
(1) Preparing a contact material strip: preparing AgCdO (15)/Ag strips with the thickness of 1.5mm by adopting a preoxidation process (atomization AgCd powder-powder oxidation-isostatic pressing-sintering-extrusion-hot rolling silver recovery-rolling);
(2) Cleaning the strip: the AgCdO (15)/Ag strip is passed through a strip cleaning line to remove oil stains and impurities on the surface, and is dried;
(3) Preparing solder powder: preparing BAg56CuZnSn alloy powder by adopting an atomization process, wherein the granularity of the powder is 20-50 mu m;
(4) And (3) laser cladding: cladding BAg56CuZnSn alloy powder on the AgCdO (15)/Ag strip welding surface by using ultra-high-speed laser cladding equipment, wherein the powder feeding mode is coaxial powder feeding, the powder feeding speed is 100g/min, and the laser type is CO 2 The laser device comprises a laser, wherein the laser power is 4500W, the spot diameter is phi 3.5mm, the scanning speed is 50m/min, the AgCdO (15)/BAg 56CuZnSn strip with the thickness of a solder layer being 0.20mm is obtained through argon atmosphere protection, and metallurgical bonding is formed between the cladding solder layer and a silver coating layer of AgCdO material;
(5) Cold rolling: the AgCdO (15)/BAg 56CuZnSn strip is subjected to sub-cooling to 1.55mm, so that the surface flatness of the BAg56CuZnSn solder layer is improved;
(6) And (5) subsequent processing: the AgCdO (15)/BAg 56CuZnSn strip was punched-re-pressed to make a sheet-like contact.
Comparative example one:
(1) Preparing a contact material strip: preparing AgSnO with the thickness of 2.35mm by adopting a preoxidation process (atomizing AgSn powder-powder oxidation-isostatic pressing-sintering-extrusion silver-rolling) 2 (12) Ag tape;
(2) Cleaning the strip: the AgSnO is processed 2 (12) The Ag strip passes through a strip cleaning line to remove oil stains and impurities on the surface, and is dried;
(3) Preparing a solder strip: preparing a BAg15CuP strip 40mm wide and 0.25mm thick;
(4) Strip compound solder: strip compound solder, agSnO, is carried out by adopting a resistance furnace heating mode 2 (12) The Ag strip and the BAg15CuP strip enter a resistance furnace through a winding and unwinding device, the heating temperature in a furnace chamber is 750 ℃, the furnace is protected by argon atmosphere, the tape feeding speed is 1.2m/min, and AgSnO with the thickness of a solder layer of 0.25mm is obtained 2 (12) BAg15CuP strip;
(5) And (5) subsequent processing: the AgSnO is processed 2 (12) The BAg15CuP strip is punched and re-pressed to manufacture a sheet-shaped contact.
Comparative example one AgSnO prepared 2 (12) The metallographic structure of the BAg15CuP contact is shown in FIG. 2; agSnO prepared in example III 2 The metallographic structure of the cross section of the BAg15CuP strip is shown in figure 3, the metallographic structure of the contact is shown in figure 4, and comparison shows that the thickness of the solder layer prepared by the process is more uniform, metallurgical bonding is formed between the solder layer and the contact material, the bonding strength is high, and the quality of the composite interface is good.
The foregoing disclosure is illustrative of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.
Claims (8)
1. The preparation method of the silver-based electrical contact material with the solder layer is characterized by comprising the following steps of:
(1) Preparing a silver-based contact strip, wherein the silver-based contact strip is a pure silver strip, a silver alloy material strip or a silver metal oxide compound silver material strip;
(2) Cleaning the strip: the silver-based contact strip prepared in the step (1) passes through a strip cleaning line to remove oil stains and impurities on the surface, and is subjected to drying treatment;
(3) Preparing solder powder, wherein the solder powder is solder alloy powder;
(4) Preparing a silver-based composite solder strip: cladding the solder powder prepared in the step (3) on the welding surface of the silver-based contact strip processed in the step (2) by using ultra-high-speed laser cladding equipment to obtain a silver-based composite solder strip with a solder layer with a certain thickness cladding on the surface of the welding surface, wherein metallurgical bonding is formed between the cladding solder layer and a pure silver strip or between the cladding solder layer and a silver alloy material strip or between the cladding solder layer and a silver layer of a silver metal oxide composite silver material strip;
(5) Cold rolling: rolling the silver-based composite solder strip prepared in the step (4) by a certain deformation;
(6) Processing: punching or punching-re-pressing or longitudinal shearing-rolling-slicing the silver-based re-welding flux strip subjected to the rolling treatment in the step (5) to manufacture a sheet-shaped contact.
2. The method for preparing the silver-based electrical contact material with the solder layer according to claim 1, wherein: the silver alloy material is FAg or AgNi.
3. The method for preparing the silver-based electrical contact material with the solder layer according to claim 1, wherein: the silver metal oxide is AgSnO 2 One of AgCdO, agCuO, agZnO.
4. The method for preparing the silver-based electrical contact material with the solder layer according to claim 1, wherein: the solder alloy powder is any one of BAg15CuP alloy powder, BAg25CuZn alloy powder, BAg45CuZn alloy powder, BAg65CuZn alloy powder and BAg56CuZnSn alloy powder, and the powder granularity is 5-50 mu m.
5. The method for preparing the silver-based electrical contact material with the solder layer according to claim 1, wherein: in the step (4), in the ultra-high speed laser cladding equipment, the powder feeding mode is coaxial powder feeding, the solder alloy powder is uniformly paved on the surface of the silver-based contact material strip for laser cladding, and the powder feeding speed is 50-100 g/min.
6. The method for preparing a silver-based electrical contact material with a solder layer according to claim 1, which comprisesIs characterized in that: in the step (4), in the ultra-high speed laser cladding equipment, the laser type is CO 2 The laser has the laser power of 3000-5000W, the spot diameter of 3-5 mm and the scanning speed of 20-100 m/min.
7. The method for preparing the silver-based electrical contact material with the solder layer according to claim 1, wherein: in the step (4), in the ultra-high speed laser cladding equipment, the cladding process is carried out under the protection atmosphere of nitrogen or argon, and the thickness of the cladding solder layer obtained after cladding is 0.05-0.3 mm.
8. The method for preparing the silver-based electrical contact material with the solder layer according to claim 1, wherein: in the step (5), the cold rolling deformation is 0.05-0.2 mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311545119.2A CN117637370A (en) | 2023-11-20 | 2023-11-20 | Preparation method of silver-based electrical contact material with solder layer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311545119.2A CN117637370A (en) | 2023-11-20 | 2023-11-20 | Preparation method of silver-based electrical contact material with solder layer |
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