CN117606641B - Optical fiber interference type sensor based on germanium wafer and manufacturing method thereof - Google Patents
Optical fiber interference type sensor based on germanium wafer and manufacturing method thereof Download PDFInfo
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- CN117606641B CN117606641B CN202311620539.2A CN202311620539A CN117606641B CN 117606641 B CN117606641 B CN 117606641B CN 202311620539 A CN202311620539 A CN 202311620539A CN 117606641 B CN117606641 B CN 117606641B
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 96
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title claims abstract description 87
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000000835 fiber Substances 0.000 claims abstract description 41
- 239000011521 glass Substances 0.000 claims abstract description 30
- 238000003848 UV Light-Curing Methods 0.000 claims abstract description 24
- 238000005253 cladding Methods 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 claims description 4
- 230000035945 sensitivity Effects 0.000 abstract description 9
- 238000005259 measurement Methods 0.000 abstract description 5
- 230000008859 change Effects 0.000 abstract description 4
- 238000009529 body temperature measurement Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/32—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/353—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells influencing the transmission properties of an optical fibre
- G01D5/35306—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells influencing the transmission properties of an optical fibre using an interferometer arrangement
- G01D5/35309—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells influencing the transmission properties of an optical fibre using an interferometer arrangement using multiple waves interferometer
- G01D5/35312—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells influencing the transmission properties of an optical fibre using an interferometer arrangement using multiple waves interferometer using a Fabry Perot
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses an optical fiber interference type sensor based on germanium wafer and a manufacturing method thereof, wherein the sensor comprises a single-mode fiber, a glass sleeve and the germanium wafer; the single-mode optical fiber comprises an optical fiber core positioned inside and an optical fiber cladding wrapped outside the optical fiber core; the end face of the single-mode fiber is connected with the end face of the germanium wafer, and UV curing glue is coated between the connecting end faces of the single-mode fiber and the germanium wafer; the glass sleeve is fixedly sleeved on the outer side of the connecting position of the single-mode fiber and the germanium wafer. The optical fiber interference type sensor based on the germanium wafer and the manufacturing method thereof can dynamically monitor the change of the external temperature in real time, has high sensitivity and high resolution, is suitable for high-precision measurement of the temperature in a small area space, can replace an interference cavity rapidly and nondestructively, and meets the sensing application requirements of different resolutions and temperature ranges.
Description
Technical Field
The invention relates to the technical field of temperature sensors, in particular to an optical fiber interference type sensor based on a germanium wafer and a manufacturing method thereof.
Background
In recent decades, optical fiber sensing technology has made remarkable progress in the fields of engineering technology, aerospace, ocean development and detection, and the like, and optical fiber temperature measurement sensors have been attracting attention as one of the key technologies. Currently, the mainstream temperature sensor mainly adopts an electrical sensor, wherein a thermistor and a platinum resistor are common temperature sensitive elements. Although these conventional sensors are stable in low temperature environments, they have problems of poor corrosion resistance, large volume, difficulty in arrangement, electromagnetic interference, and the like. In contrast, the optical fiber sensor has a brand-new angle in recent years, overcomes the defects of the traditional electrical sensor, and shows remarkable advantages. Firstly, the sensing probe of the optical fiber sensor has the characteristics of low cost, light weight, small volume, low loss, corrosion resistance, electromagnetic interference resistance and the like. These advantages make the optical fiber sensor more flexible in application, especially in the occasion that the space and weight requirement are higher for laying, the optical fiber sensor possesses obvious superiority. And secondly, the optical fiber sensor is easy to form an array, has high integration and can monitor the temperature in a large range with high efficiency. This is especially important for the engineering project that needs to cover extensive area, and fiber sensor provides more convenient and accurate means for monitoring and control through the characteristic of integrating. In addition, the optical fiber sensor also has the characteristics of high sensitivity and convenient long-distance transmission of signals, so that the optical fiber sensor plays a unique role in application scenes needing real-time monitoring and timely response.
The optical fiber FP interference type sensor has the advantages of small size in the aspect of temperature sensing, suitability for special narrow spaces and the like. However, the optical fiber temperature sensor based on the air interference cavity or the optical fiber interference cavity is affected by the material characteristics in the cavity, has lower sensitivity, has lower resolution under the condition of the same free spectrum range, and cannot meet the requirement of high-precision measurement. In addition, the interference cavity length of the FP interference type sensor does not influence the sensitivity of the sensor, but the temperature measurement range and the temperature resolution of the sensor can be changed, the interference cavity cannot be replaced after the manufacturing of the FP interference type optical fiber sensor is finished, only the optical fiber of the sensor head part can be cut off for remanufacturing, and when the signal light guide optical fiber is a relatively expensive multi-core optical fiber or a relatively expensive sapphire optical fiber, the cost of the sensor can be greatly increased.
Disclosure of Invention
The invention aims to provide an optical fiber interference type sensor based on a germanium wafer and a manufacturing method thereof, wherein the sensor can dynamically monitor the change of the external temperature in real time, has high sensitivity and high resolution, is suitable for high-precision measurement of the temperature in a small area space, can replace an interference cavity rapidly and nondestructively, and meets the sensing application requirements of different resolutions and temperature ranges.
In order to achieve the above object, the present invention provides an optical fiber interference type sensor based on germanium wafer, comprising a single mode fiber, a glass sleeve and a germanium wafer; the single-mode optical fiber comprises an optical fiber core positioned inside and an optical fiber cladding wrapped outside the optical fiber core;
The end face of the single-mode fiber is connected with the end face of the germanium wafer, and UV curing glue is coated between the connecting end faces of the single-mode fiber and the germanium wafer;
the glass sleeve is fixedly sleeved on the outer side of the connecting position of the single-mode fiber and the germanium wafer.
Preferably, the inner diameter of the glass sleeve is the same as the outer diameter of the single mode fiber, and the diameter of the germanium wafer is not larger than the inner diameter of the glass sleeve.
Preferably, the end face of the single-mode fiber is parallel to the end face of the germanium wafer, and the end face of the germanium wafer completely covers the end face of the fiber core.
Preferably, the cut surfaces of the optical fiber core and the optical fiber cladding at the end surface of the single-mode optical fiber are smooth and flush, and the inner side end surface and the outer side end surface of the germanium wafer are polished and polished to be smooth and flush.
Preferably, the length of the glass sleeve on the side close to the germanium wafer is not greater than the thickness of the germanium wafer.
A manufacturing method of an optical fiber interference type sensor based on a germanium wafer comprises the following steps:
s1, manufacturing a double-sided polished germanium wafer;
s2, performing coating removal operation on the single-mode fiber by using a wire stripper, and cutting by using an optical fiber cutting knife to keep the end face of the single-mode fiber smooth;
S3, a section of glass sleeve is sleeved into the end face of the single-mode fiber, wherein the length of the exposed part of the outer glass sleeve is not more than the thickness of the germanium wafer;
S4, vertically fixing the single-mode optical fiber by using an optical fiber holder, wherein the end face part of the single-mode optical fiber with the glass sleeve is vertically downward;
S5, placing the germanium wafer right below the single-mode fiber, and keeping the end face of the single-mode fiber parallel to the upper surface of the germanium wafer;
S6, coating a layer of UV curing adhesive on the upper surface of the germanium wafer, wherein the thickness of the UV curing adhesive is not more than 10 microns;
s7, slowly adjusting the height of the optical fiber holder to enable the germanium wafer to be inserted into the glass sleeve and contact with the end face of the single-mode optical fiber;
s8, fixing the UV curing adhesive by using an ultraviolet lamp, and finishing manufacturing the temperature sensor.
Preferably, the method for carrying out nondestructive replacement on the sensor interference cavity is further included, and the specific method is as follows: connecting the manufactured temperature sensor with a 980nm optical fiber laser, gradually increasing the power of the 980nm optical fiber laser, enabling the germanium wafer to absorb laser and heat up to be above the melting point of the UV curing adhesive, enabling the UV curing adhesive of the sensor head to be heated, melted and evaporated, separating the germanium wafer from the single-mode optical fiber by using a clamping tool, repeating the manufacturing steps of the sensor, and replacing the germanium wafers with different cavity lengths.
Therefore, the optical fiber interference type sensor based on the germanium wafer and the manufacturing method thereof have the beneficial effects that:
(1) The sensor probe has low manufacturing cost and simple manufacturing process.
(2) The sensor has light weight and small volume, and is more convenient for integration and array manufacture.
(3) The thermal-optical coefficient of the germanium wafer is high and is about 4 multiplied by 10 -4/K, the high thermal-optical coefficient enables the germanium wafer to have higher sensitivity, and compared with an intrinsic optical fiber temperature sensor, the sensor sensitivity can be improved by more than 150 times, so that the sensor has higher resolution and is more suitable for high-precision temperature data monitoring.
(4) The sensor uses the germanium wafer as the interference cavity, different interference cavity lengths have the same sensitivity, but have different temperature measurement ranges and resolutions, so that the nondestructive interference cavity replacement of the sensor light guide optical fiber can be realized, and the replacement cost of the sensor is reduced.
The technical scheme of the invention is further described in detail through the drawings and the embodiments.
Drawings
FIG. 1 is a schematic diagram of a germanium wafer based optical fiber interferometric sensor in accordance with the present invention.
Reference numerals
1. An optical fiber core; 2. an optical fiber cladding; 3. a glass sleeve; 4. a germanium wafer; 5. UV curing glue.
Detailed Description
The technical scheme of the invention is further described below through the attached drawings and the embodiments.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs.
As used herein, the word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements. The terms "inner," "outer," "upper," "lower," and the like are used for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not denote or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention, but the relative positional relationship may be changed when the absolute position of the object to be described is changed accordingly. In the present invention, unless explicitly specified and limited otherwise, the term "attached" and the like should be construed broadly, and may be, for example, fixedly attached, detachably attached, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Example 1
As shown in fig. 1, the present invention provides an optical fiber interference type sensor based on a germanium wafer, which comprises a single-mode fiber, a glass sleeve 3 and a germanium wafer 4, wherein the single-mode fiber comprises an optical fiber core 1 positioned inside and an optical fiber cladding 2 wrapped outside the optical fiber core 1.
The end face of the single-mode fiber is connected with the end face of the germanium wafer 4, and a UV curing glue 5 is coated between the end face of the single-mode fiber and the end face of the germanium wafer 4, wherein the coating thickness of the UV curing glue 5 is controlled within 10 micrometers, and in the embodiment, the coating thickness of the UV curing glue 5 is 5 micrometers.
The glass sleeve 3 is fixedly sleeved on the outer side of the connecting position of the single-mode fiber and the germanium wafer 4 and is used for further fixing the positions of the single-mode fiber and the germanium wafer 4. Wherein the inner diameter of the glass sleeve 3 is the same as the outer diameter of the single mode fiber, and the diameter of the germanium wafer 4 is not larger than the inner diameter of the glass sleeve 3. The length of the glass sleeve 3 on the side close to the germanium wafer 4 is not greater than the thickness of the germanium wafer 4.
The end face of the single-mode optical fiber is parallel to the end face of the germanium wafer 4, and the end face of the germanium wafer 4 completely covers the end face of the optical fiber core 1. The sections of the optical fiber core 1 and the optical fiber cladding 2 at the end face of the single-mode optical fiber are smooth and flush, and the inner side end face and the outer side end face of the germanium wafer 4 are polished and are smooth and flush so as to ensure that the sensor has higher measurement accuracy.
The invention discloses a manufacturing method of an optical fiber interference type sensor based on a germanium wafer, which comprises the following steps:
s1, manufacturing a double-sided polished germanium wafer;
s2, performing coating removal operation on the single-mode fiber by using a wire stripper, and cutting by using an optical fiber cutting knife to keep the end face of the single-mode fiber smooth;
S3, a section of glass sleeve is sleeved into the end face of the single-mode fiber, wherein the length of the exposed part of the outer glass sleeve is not more than the thickness of the germanium wafer;
S4, vertically fixing the single-mode optical fiber by using an optical fiber holder, wherein the end face part of the single-mode optical fiber with the glass sleeve is vertically downward;
S5, placing the germanium wafer right below the single-mode fiber, and keeping the end face of the single-mode fiber parallel to the upper surface of the germanium wafer;
S6, coating a layer of UV curing adhesive on the upper surface of the germanium wafer, wherein the thickness of the UV curing adhesive is not more than 10 microns;
s7, slowly adjusting the height of the optical fiber holder to enable the germanium wafer to be inserted into the glass sleeve and contact with the end face of the single-mode optical fiber;
s8, fixing the UV curing adhesive by using an ultraviolet lamp, and finishing manufacturing the temperature sensor.
When different temperature measurement ranges need to be selected, nondestructive replacement can be performed on the sensor interference cavity, and the specific method is as follows: connecting the manufactured temperature sensor with a 980nm optical fiber laser, gradually increasing the power of the 980nm optical fiber laser, enabling the germanium wafer to absorb laser and heat up to be above the melting point of the UV curing adhesive, enabling the UV curing adhesive of the sensor head to be heated, melted and evaporated, separating the germanium wafer from the single-mode optical fiber by using a clamping tool, repeating the manufacturing steps of the sensor, and replacing the germanium wafers with different cavity lengths.
The working principle of the invention is as follows:
The sensor utilizes an infrared light source as a sensing light source, including but not limited to broadband light sources and lasers. The light source emits light signals to transmit the sensing light source to the sensor through the optical fiber coupler or the optical fiber circulator, when the light enters the sensor, a part of the light is reflected at the junction of the germanium wafer and the end face of the optical fiber, and a part of the light enters the germanium wafer and is reflected at the second end face of the germanium wafer. In the reflection process, two parts of light interfere, and the interfered light signals enter the optical fiber spectrometer or the photoelectric detector again through the optical fiber coupler or the circulator for signal demodulation. The sensor is connected with a light source and a spectrometer (photoelectric detector) through an optical fiber jumper, the light source provides sensing light signals for the integral sensor, and the spectrometer (photoelectric detector) can output the reflection spectrum of the sensor.
When the external temperature changes, the refractive index of the Fabry-Perot interference cavity formed by the germanium wafer in the sensing probe can be changed, so that the optical path difference of the Fabry-Perot interference cavity is influenced, and finally, the interference characteristic peak position in the spectrometer is moved. Therefore, by monitoring the position of the characteristic peak in the spectrometer, the change of the measured temperature can be obtained, and further the temperature sensing is realized.
When the temperature reaches the melting point of the UV curing adhesive, the germanium wafer and the end face of the optical fiber can be peeled off, and the UV curing adhesive can be further evaporated through high temperature. And then, the steps of manufacturing the sensor can be repeated to replace germanium wafers with different interference cavity lengths, so that the manufacturing of the sensor with different temperature test ranges and resolutions is realized.
Therefore, the optical fiber interference type sensor based on the germanium wafer and the manufacturing method thereof can dynamically monitor the change of the external temperature in real time, have high sensitivity and high resolution, are suitable for high-precision measurement of the temperature in a small area space, can replace an interference cavity rapidly and nondestructively, and meet the sensing application requirements of different resolutions and temperature ranges.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention and not for limiting it, and although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that: the technical scheme of the invention can be modified or replaced by the same, and the modified technical scheme cannot deviate from the spirit and scope of the technical scheme of the invention.
Claims (2)
1. A manufacturing method of an optical fiber interference type sensor based on a germanium wafer is characterized by comprising the following steps:
The sensor comprises a single mode fiber, a glass sleeve and a germanium wafer; the single-mode optical fiber comprises an optical fiber core positioned inside and an optical fiber cladding wrapped outside the optical fiber core;
The end face of the single-mode fiber is connected with the end face of the germanium wafer, and UV curing glue is coated between the connecting end faces of the single-mode fiber and the germanium wafer;
The glass sleeve is fixedly sleeved on the outer side of the connecting position of the single-mode fiber and the germanium wafer;
the inner diameter of the glass sleeve is the same as the outer diameter of the single-mode optical fiber, and the diameter of the germanium wafer is not larger than the inner diameter of the glass sleeve;
the end face of the single-mode optical fiber is correspondingly parallel to the end face of the germanium wafer, and the end face of the germanium wafer completely covers the end face of the optical fiber core;
The sections of the fiber core and the fiber cladding at the end face of the single-mode fiber are smooth and flush, and the inner side end face and the outer side end face of the germanium wafer are polished and polished to be smooth and flush;
the length of one side of the glass sleeve close to the germanium wafer is not more than the thickness of the germanium wafer;
The manufacturing method comprises the following steps:
s1, manufacturing a double-sided polished germanium wafer;
s2, performing coating removal operation on the single-mode fiber by using a wire stripper, and cutting by using an optical fiber cutting knife to keep the end face of the single-mode fiber smooth;
S3, a section of glass sleeve is sleeved into the end face of the single-mode fiber, wherein the length of the exposed part of the outer glass sleeve is not more than the thickness of the germanium wafer;
S4, vertically fixing the single-mode optical fiber by using an optical fiber holder, wherein the end face part of the single-mode optical fiber with the glass sleeve is vertically downward;
S5, placing the germanium wafer right below the single-mode fiber, and keeping the end face of the single-mode fiber parallel to the upper surface of the germanium wafer;
S6, coating a layer of UV curing adhesive on the upper surface of the germanium wafer, wherein the thickness of the UV curing adhesive is not more than 10 microns;
s7, slowly adjusting the height of the optical fiber holder to enable the germanium wafer to be inserted into the glass sleeve and contact with the end face of the single-mode optical fiber;
s8, fixing the UV curing adhesive by using an ultraviolet lamp, and finishing manufacturing the temperature sensor.
2. The method for manufacturing the optical fiber interference sensor based on the germanium wafer according to claim 1, wherein the method comprises the following steps: the method for carrying out nondestructive replacement on the sensor interference cavity is further included, and the specific method is as follows: connecting the manufactured temperature sensor with a 980nm optical fiber laser, gradually increasing the power of the 980nm optical fiber laser, enabling the germanium wafer to absorb laser and heat up to be above the melting point of the UV curing adhesive, enabling the UV curing adhesive of the sensor head to be heated, melted and evaporated, separating the germanium wafer from the single-mode optical fiber by using a clamping tool, repeating the manufacturing steps of the sensor, and replacing the germanium wafers with different cavity lengths.
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| CN202311620539.2A CN117606641B (en) | 2023-11-30 | 2023-11-30 | Optical fiber interference type sensor based on germanium wafer and manufacturing method thereof |
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| CN202311620539.2A CN117606641B (en) | 2023-11-30 | 2023-11-30 | Optical fiber interference type sensor based on germanium wafer and manufacturing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101034007A (en) * | 2007-01-24 | 2007-09-12 | 冉曾令 | Optical fiber Fabry-Perot sensor and manufacture method therefore |
| US7762720B1 (en) * | 2006-08-08 | 2010-07-27 | Virginia Tech Intellectual Properties, Inc. | Fabrication of miniature fiber-optic temperature sensors |
| CN109798977A (en) * | 2018-12-27 | 2019-05-24 | 北京信息科技大学 | Temperature and strain measurement method based on fiber bragg grating and thin-core fibers |
| CN111208088A (en) * | 2020-03-17 | 2020-05-29 | 广东海洋大学 | Optical fiber heavy ion sensor based on Fabry-Perot interference |
| CN113624361A (en) * | 2021-08-16 | 2021-11-09 | 哈尔滨工程大学 | Optical fiber probe, temperature sensor and preparation method of optical fiber probe |
-
2023
- 2023-11-30 CN CN202311620539.2A patent/CN117606641B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7762720B1 (en) * | 2006-08-08 | 2010-07-27 | Virginia Tech Intellectual Properties, Inc. | Fabrication of miniature fiber-optic temperature sensors |
| CN101034007A (en) * | 2007-01-24 | 2007-09-12 | 冉曾令 | Optical fiber Fabry-Perot sensor and manufacture method therefore |
| CN109798977A (en) * | 2018-12-27 | 2019-05-24 | 北京信息科技大学 | Temperature and strain measurement method based on fiber bragg grating and thin-core fibers |
| CN111208088A (en) * | 2020-03-17 | 2020-05-29 | 广东海洋大学 | Optical fiber heavy ion sensor based on Fabry-Perot interference |
| CN113624361A (en) * | 2021-08-16 | 2021-11-09 | 哈尔滨工程大学 | Optical fiber probe, temperature sensor and preparation method of optical fiber probe |
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