CN117597839A

CN117597839A - Connector for electric connection

Info

Publication number: CN117597839A
Application number: CN202280046711.5A
Authority: CN
Inventors: 郑永倍; 李柄周; 金彦中; 金奎炫; 池周铉
Original assignee: ISC Co Ltd
Current assignee: ISC Co Ltd
Priority date: 2021-07-01
Filing date: 2022-06-22
Publication date: 2024-02-23
Also published as: KR20230005516A; KR102556867B1; WO2023277437A1; TW202404210A

Abstract

The invention provides a connector for electric connection, which is configured between an inspection device and inspected equipment. The connector for electrical connection includes a signal conductive portion, a ground conductive portion, and a metal frame portion. The signal conductive part includes a transmission part and an insulation part. The transmission part is composed of a plurality of first conductive particles. The insulating portion is integrally formed with the transmission portion so as to surround the transmission portion, and has a thickness in the horizontal direction larger than a maximum width of the transmission portion in the horizontal direction. The metal frame part maintains the signal conductive part and the grounding conductive part along the vertical direction and is separated along the horizontal direction, and is electrically connected with the grounding conductive part, and the metal frame part comprises a plurality of metal frame layers which are laminated along the vertical direction.

Description

Connector for electric connection

Technical Field

The present invention relates to a connector for electrically connecting an inspection apparatus and a device under inspection.

Background

For testing the operating characteristics of the test devices, connectors for electrically connecting the test devices to the test apparatus are used in the art. Spring pins, conductive rubber sheets, and the like are known as such connectors. The conductive rubber sheet includes: a plurality of conductive parts each formed by collecting a plurality of metal particles along the up-down direction; and a frame made of silicone rubber for maintaining the plurality of conductive parts.

A semiconductor device for a mobile communication device needs to check Radio Frequency (RF) characteristics. However, since the conductive rubber sheet has more excellent radio frequency characteristics than the pogo pin sheet due to its thinner thickness, the conductive rubber sheet is used for radio frequency inspection of semiconductor devices. As an example, japanese laid-open patent publication No. 2004-335450 discloses a conductive connector that can respond to a high frequency signal.

Disclosure of Invention

Technical problem

The conventional conductive rubber sheet has the limitation that high-frequency radio-frequency related noise cannot be sufficiently restrained and a large amount of signals are lost. Therefore, the conventional conductive rubber sheet is difficult to be effectively used for high-frequency radio frequency inspection of 40GHz or more. Further, the conventional conductive rubber sheet cannot have an impedance matching the impedance of the test equipment and the impedance of the inspection device. If the impedance exhibited by the conductive rubber sheet for inspection does not match the impedance of the device under inspection and the inspection apparatus, a large amount of signal is lost due to signal reflection generated at the conductive rubber sheet. Since the existing conductive rubber sheet exhibits impedance that cannot be matched, it is inevitable to have unacceptable radio frequency characteristics.

Further, since the metal frame as the high-frequency rf-related noise shielding layer is a thick metal layer, there is a problem in that it is difficult to process the through hole for accommodating the signal conductive portion to a precise specification.

To this end, an object of the present disclosure is to provide a connector for electrical connection that prevents generation of signal interference or noise and is suitable for high-frequency radio frequency inspection. An embodiment of the present disclosure provides a connector for electrical connection having an impedance matching with an impedance of a device under test and an impedance of an inspection device, and preventing signal loss due to impedance mismatch.

Technical proposal

The connector for electrical connection according to an embodiment of the present invention includes: at least one signal conductive part including a transmission part composed of a plurality of first conductive particles and an insulating part integrally formed with the transmission part in such a manner as to surround the transmission part in a horizontal direction; at least one ground conductive portion arranged along the horizontal direction so as to be spaced apart from the signal conductive portion; and a metal frame portion for maintaining the signal conductive portion and the ground conductive portion in the vertical direction and for separating them in the horizontal direction, and for electrically connecting the signal conductive portion and the ground conductive portion, wherein the metal frame portion includes a plurality of metal frame layers stacked in the vertical direction.

The plurality of metal frame layers include: a first through hole for accommodating the signal conductive part; and a second through hole for accommodating the ground conductive portion, wherein an uppermost metal frame layer of the plurality of metal frame layers includes a third through hole having a diameter larger than that of the second through hole.

The ground conductive portion includes: second conductive particles; and an elastic material for maintaining the second conductive particles.

The connector for electrical connection according to an embodiment of the present invention further includes a ground terminal protection portion located in the third through hole and surrounding the ground conductive portion.

The grounding terminal protection part is annular and consists of more than two insulating sheets separated by a prescribed interval when seen from a plane.

The second conductive particles and the elastic substance may fill the space between the insulating sheets. The metal frame layer includes: a metal plate; and a highly conductive metal film which is formed by coating or plating the surface of the metal plate. The high-conductivity metal film is made of at least one of gold (Au), silver (Ag), and copper (Cu).

The third through hole of the uppermost metal frame layer has an inverted tapered shape, the inner diameter gradually decreases from the upper end toward the lower end, and the ground terminal protecting portion gradually decreases the outer diameter from the upper end toward the lower end so as to correspond to the third through hole.

The plurality of metal frame layers each include a first through hole for accommodating the signal conductive portion, and a part of the plurality of metal frame layers includes a second through hole for accommodating the ground conductive portion, and a first groove and a second groove are formed so as to be spaced apart in the vertical direction, and the ground conductive portion includes: an upper side grounding conductive part positioned in the first groove; and a lower side grounding conductive part positioned in the second groove.

The other part of the plurality of metal frame layers does not include a second through hole for accommodating the grounding conductive portion, and is in contact with one end of the upper grounding conductive portion and one end of the lower grounding conductive portion.

ADVANTAGEOUS EFFECTS OF INVENTION

According to an embodiment of the present disclosure, the signal conductive part includes: a transmission section; and an insulating portion integrally formed with the transmission portion so as to surround the transmission portion, the signal conductive portion insulating the frame portion from the ground conductive portion for electrical connection. Thus, the signal conductive part can be prevented from being affected by signal interference or noise by significantly reducing the signal interference or noise of the ground conductive part and the metal frame part.

Also, according to an embodiment of the present disclosure, the transmission part and the insulation part are formed at the signal conductive part in a ratio of a specific range so that the impedance matches with the impedance of the device under test and the impedance of the inspection apparatus. Therefore, the connector of an embodiment can not only prevent the generation of signal loss due to impedance mismatch, but also be effectively used for high-frequency radio frequency inspection.

Further, according to an embodiment of the present disclosure, the metal frame portion is formed in a split lamination manner, whereby not only the accuracy of the through holes for positioning the signal conductive portion and the ground conductive portion can be improved, but also the entire thickness of the connector can be freely selected, and therefore, connectors of various structures can be manufactured by changing the design.

Drawings

Fig. 1 is a cross-sectional view schematically showing an example of a connector application of an embodiment.

Fig. 2 is a cross-sectional view showing a part of a connector of a first embodiment of the present invention.

Fig. 3 is a plan view showing a part of a connector of a first embodiment of the present invention.

Fig. 4 is a cross-sectional perspective view showing a part of a connector of a first embodiment of the present invention.

Fig. 5 is a cross-sectional view showing a connector of a second embodiment of the present invention.

Fig. 6 is a sectional view showing a connector of a third embodiment of the present invention.

Fig. 7 is a cross-sectional view showing a connector of a fourth embodiment of the present invention.

Fig. 8 is a sectional view showing a connector of a fifth embodiment of the present invention.

Fig. 9 is a cross-sectional view schematically showing an example of manufacturing a connector according to a third embodiment of the present invention.

Detailed Description

The embodiments of the present disclosure are exemplified for the purpose of illustrating the technical ideas of the present disclosure. The scope of the present disclosure is not limited to the embodiments or the specific description of the embodiments disclosed below.

Unless defined otherwise, all technical and scientific terms used in this disclosure have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. All terms used in the present disclosure are used for further clarifying the present disclosure and are not intended to limit the scope of the present disclosure.

Unless otherwise indicated in a sentence or article including the following expressions, the expressions "including", "setting", "having", etc. as used in this disclosure are to be understood in open-ended terms, with the possibility of including other embodiments.

Unless otherwise defined, singular expressions described in this disclosure may include plural meanings, and the same applies to singular expressions described in the scope of the claims of the invention.

The expressions "first", "second", and the like used in the present disclosure are used to distinguish a plurality of structural elements from one another, and do not limit the order or importance of the respective structural elements.

In the present disclosure, when a certain structural element is "connected" or "combined" with another structural element, it should be understood that the certain structural element may be directly connected or combined with another structural element, or may be connected or combined with a new other structural element as a medium.

The direction indicator "above" as used in this disclosure refers to the direction in which the connector is located relative to the inspection device, and the direction indicator "below" refers to the direction opposite to the above. Also, the direction indicator "up-down direction" used in the present disclosure includes an upper direction and a lower direction, and should not be understood in a specific one of the upper direction and the lower direction.

The embodiments are described below with reference to the drawings.

In the drawings, the same or corresponding constituent elements are given the same reference numerals. In the following description of the embodiments, the description of the same or corresponding components may be omitted. However, even if descriptions of the constituent elements are omitted, it is not meant that such constituent elements do not belong to a certain embodiment.

The embodiments described below and the examples shown in the drawings relate to connectors for electrically connecting two electronic devices. In an application example of the connector of the embodiment, one of the two electronic devices may be an inspection apparatus, and the other of the two electronic devices may be a device under inspection inspected by the inspection apparatus. Thus, the connector of the embodiment can be used for electrical connection between the inspection apparatus and the inspected apparatus when performing electrical inspection of the inspected apparatus. As an example, the connector of the embodiment can be used for final electrical inspection of a semiconductor device in a later process in the manufacturing process of the semiconductor device. However, the example of inspection by which the connector of the embodiment is applied is not limited to the above inspection.

Fig. 1 shows an application example of the connector of the first embodiment, and fig. 1 schematically shows the connector, the inspection apparatus, and the inspected device for the sake of easy understanding of the embodiment.

The connector 100 of the first embodiment is a sheet-shaped structure, and is disposed between the inspection apparatus 10 and the device under inspection 20. As an example, the connector 100 may be provided on the inspection device 10 through the test socket 30. The test socket 30 can be detachably mounted on the inspection device 10. The test socket 30 is for receiving therein the device under test 20 that is carried to the inspection apparatus 10 by manual or carrying means such that the device under test 20 is aligned with the connector 100. When inspecting the inspected apparatus 20, the connector 100 is in contact with the inspection device 10 and the inspected apparatus 20 in the up-down direction VD, so that the inspection device 10 and the inspected apparatus 20 are electrically connected.

The subject apparatus 20 may be a semiconductor apparatus in which a semiconductor Integrated Circuit (IC) chip and a plurality of terminals are packaged in a hexahedral shape with a resin material. As an example, the test device 20 may be a semiconductor device for a mobile communication device, but is not limited thereto. A plurality of terminals of hemispherical shape are formed on the lower side of the subject apparatus 20. The plurality of the above-described terminals of the subject apparatus 20 may include a signal terminal 21 and a ground terminal 22.

The inspection apparatus 10 can inspect various operation characteristics of the inspected device 20. The inspection apparatus 10 may include a board that performs inspection, and the board may include an inspection circuit 11 for inspecting the device under inspection. The inspection circuit 11 has a plurality of terminals electrically connected to the terminals 21 and 22 of the device under test via the connector 100. The above-described terminals of the inspection apparatus 10 may include: a signal terminal 12 for transmitting a test signal and receiving a response signal; and a ground terminal 13 located around the signal terminal 12.

The signal terminal 21 of the test device 20 is electrically connected to the signal terminal 12 of the inspection apparatus 10 via the connector 100, and the ground terminal 22 of the test device 20 is electrically connected to the ground terminal 13 of the inspection apparatus 10 via the connector 100. When inspecting the inspected apparatus, the connector 100 electrically connects the respective terminals 21, 22 of the inspected apparatus and the respective terminals 12, 13 of the inspection device corresponding thereto in the up-down direction VD, whereby the connector 100 performs inspection of the inspected apparatus 20 by the inspection device 10. As an example, the connector 100 may be arranged between the test device 20 and the inspection apparatus 10 so as to inspect the high-frequency radio frequency of the test device 20.

Referring to fig. 1, the connector 100 includes at least one signal conductive portion 110, at least one ground conductive portion 120, and a metal frame portion 130.

The signal conductive portion 110 extends along the vertical direction VD, and can realize the conductivity in the vertical direction VD.

The signal conductive portion 110 is in contact with the signal terminal 21 of the device under test at its upper end and with the signal terminal 12 of the inspection apparatus at its lower end. Thus, a conductive path in the vertical direction is formed between the signal terminal 12 and the signal terminal 21 corresponding to one signal conductive portion 110 with the signal conductive portion 110 as a medium. The test signal of the inspection apparatus may be transmitted from the signal terminal 12 to the signal terminal 21 of the device under test 20 through the signal conductive part 110, and the response signal of the device under test 20 may be transmitted from the signal terminal 21 to the signal terminal 12 of the inspection apparatus 10 through the signal conductive part 110.

The upper end of the signal conductive part 110 protrudes upward from the upper surface of the metal frame part 130, and the lower end of the signal conductive part 110 protrudes downward from the lower surface of the metal frame part 130.

The ground conductive portion 120 is arranged apart from the signal conductive portion 110 along a horizontal direction HD orthogonal to the vertical direction VD.

Referring to fig. 1, the ground conductive portion 120 is disposed in a through hole penetrating in the vertical direction of the metal frame portion 130.

The upper end of the ground conductive part 120 protrudes upward from the upper surface of the metal frame part 130, and the lower end of the ground conductive part 120 protrudes downward from the lower surface of the metal frame part 130.

The frame portion 130 maintains the signal conductive portion 110 and the ground conductive portion 120 along the up-down direction VD and is spaced apart along the horizontal direction HD.

The signal conductive portion 110 is insulated by the metal frame portion 130, and cannot be electrically connected to the ground conductive portion 120 and the metal frame portion 130. The upper end of the ground conductive part 120 protrudes upward from the upper surface of the metal frame part 130, and the lower end of the ground conductive part 120 protrudes downward from the lower surface of the metal frame part 130. The ground conductive portion 120 is electrically connected to the metal frame portion 130.

The connector of the first embodiment is described with reference to the examples shown in fig. 2 to 4. Although fig. 2 to 4 schematically show the shape, configuration, and arrangement of the structural elements of the connector, this is merely an example selected for understanding the embodiments. Fig. 2 is a sectional view showing a part of the connector of the first embodiment, fig. 3 is a plan view showing a part of the connector of the first embodiment, and fig. 4 is a sectional perspective view showing a part of the connector of the first embodiment.

In the connector 100, the signal conductive portion 110 is used to perform signal transmission in the up-down direction VD between the inspection apparatus and the device under inspection. The signal conductive part 110 may have a cylindrical shape extending along the up-down direction VD. The signal conductive part 110 includes: a transmission section 111 for performing signal transmission; and an insulating portion 112 that insulates the transmission portion 111 from the metal frame portion 130 in the horizontal direction HD.

Referring to fig. 2, the signal conductive portions 110 are formed in the metal frame portion 130 in the up-down direction VD with the same diameter.

As yet another embodiment, although not shown, the signal conductive portion 110 may have a diameter gradually increasing toward the center portion of the metal frame portion 130.

The transfer section 111 is composed of a plurality of first conductive particles 113, and the plurality of first conductive particles 113 are disposed in contact in a conductive manner along the vertical direction VD while being gathered along the vertical direction VD. The plurality of first conductive particles 113, which are conductively contacted along the up-down direction VD, may perform signal transmission in the up-down direction VD within the signal conductive section 110.

The first conductive particles 113 may be particles formed of a highly conductive metal material. The high-conductivity metal material may be a metal, for example, but is not limited thereto. Alternatively, the first conductive particles 113 may be formed by coating the high-conductivity metal material on core particles made of a resin material or a metal material having elasticity.

As a specific example, the first conductive particles 113 may be formed by coating magnetic metal particles such as iron (Fe), nickel (Ni), cobalt (Co), or alloy particles thereof or particles containing these metals as core particles with a metal having excellent conductivity such as gold, silver, palladium, rhodium, or the like, or coating non-magnetic metal particles, inorganic particles such as glass beads, or polymer particles as core particles with a conductive magnet such as nickel, cobalt, or the like, or coating both of the core particles with a conductive magnet, a metal having excellent conductivity, or the like.

Although not shown, the transmission unit 111 may be composed of one or more conductive wires or a plurality of carbon nanotubes, and the conductive wires are gathered in the vertical direction VD and are disposed in contact with each other in the vertical direction VD so as to be conductive.

The insulating portion 112 is made of an elastic insulating material, and has a cylindrical shape extending in the up-down direction VD.

The insulating portion 112 may have the same height as the metal frame portion 130. Further, although not shown, unlike fig. 2, the insulating portion 112 has the same height as the transmitting portion 111. Thus, the height of the insulating portion 112 may be less than or equal to the height of the transmitting portion 111.

The elastic insulating substance constituting the insulating portion 112 includes an insulating substance having a relatively low capacitance. As an example, the elastic insulating material constituting the insulating portion 112 may be an insulating material such as silicone rubber or teflon, but is not limited thereto. The insulating portion 112 is formed integrally with the transmitting portion 111, thereby constituting the signal conducting portion 110. The insulating portion 112 may surround the transmitting portion 111 in the horizontal direction HD.

Since the transmission part 111 is formed integrally with the insulation part 112, an elastic insulating substance forming the insulation part 112 may be filled between the first conductive particles 113.

That is, the insulating part 112 maintains the shape of the transfer part 111 by the plurality of first conductive particles 113, and the insulating part 112 may be formed integrally with an elastic insulating substance filled between the plurality of first conductive particles 113. Accordingly, the insulating portion 112 imparts elasticity to the signal conductive portion 110 along the up-down direction VD and the horizontal direction HD. The portion of the signal conductive portion 110 that contacts the metal frame portion 130 is difficult to elastically deform due to the metal frame portion 130.

However, the transmission part 111 of the signal conductive part 110 may include: an upper end portion 114 protruding upward from an upper surface of the metal frame portion 130; and a lower end portion 115 protruding downward from a lower surface of the metal frame portion 130.

The upper end 114 and the lower end 115 are part of the transmission portion 111 of the signal conductive portion 110. Referring to fig. 2, an upper end of the upper end portion 114 includes an upper end of the transfer portion 111, and a lower end of the lower end portion 115 includes a lower end of the transfer portion 111. The upper end 114 and the lower end 115 of the signal conductive portion can be elastically deformed in the up-down direction VD and the horizontal direction HD by an elastic insulating substance between the first conductive particles 113 included in the upper end 114 and the lower end 115. For example, when the signal conductive portion 110 is pressed downward by the signal terminal 21 (refer to fig. 1) of the test device, the upper end portion 114 and the lower end portion 115 may be elastically deformed in the horizontal direction HD.

If the subject device is removed from the connector, the upper end 114 and the lower end 115 may be elastically restored.

Unlike fig. 2, the transmission part 111 and the insulation part 112 of the signal conductive part 110 may protrude downward from the lower surface of the metal frame part 130.

The insulating portion 112 surrounding the transmitting portion 111 has a predetermined thickness, whereby the transmitting portion 111 is effectively insulated from the frame portion 130, and signal transmission without signal loss can be achieved. The maximum distance between both ends of the transfer portion 111 in the horizontal direction HD may be defined as the maximum width W of the transfer portion 111. As an example, the maximum distance between the two ends refers to the distance between the first conductive particles farthest in the horizontal direction HD orthogonal to the central axis C of the transmission unit 111. The insulating portion 112 has a thickness T along a radial direction (i.e., a horizontal direction HD) with respect to a central axis C of the transmission portion 111. The ratio (W/T) of the thickness T of the insulating portion 112 to the maximum width W of the transfer portion 111 is 0.5 to 3.

Thus, the signal conductive portion 110 has a coaxial (coaxial) structure, and the central axis of the insulating portion 112 may be the same as the central axis C of the transmitting portion 111.

The ground conductive portion 120 is located around the signal conductive portion 110 and may be spaced apart from the signal conductive portion 110 in the horizontal direction HD by the metal frame portion 130.

The transmission portion 111 is not short-circuited with the ground conductive portion 120 and the metal frame portion 130 due to the insulating portion 112 of the signal conductive portion 110.

As shown in fig. 2 to 4, the plurality of ground conductive parts 120 may be arranged to be spaced apart from one signal conductive part 110 in the horizontal direction HD. As shown in fig. 3, the plurality of ground conductive parts 120 may be arranged around one signal conductive part 110 in a state of being spaced apart from the one signal conductive part 110 in the horizontal direction HD by the metal frame part 130.

The planar arrangement of the signal conductive portion 110 and the plurality of ground conductive portions 120 shown in fig. 3 is merely an example, and is not limited to the planar arrangement shown in fig. 3. The planar configurations of the signal conductive portion 110 and the ground conductive portion 120 may become different based on the multiple terminal-related planar configurations of the device under test. For example, at least one or more ground conductive parts 120 may be disposed apart from the signal conductive part 110 in the horizontal direction, and the intervals between the plurality of ground conductive parts 120 may be different. Further, a plurality of groups each of the plurality of ground conductive portions 120 may be arranged to be spaced apart from one signal conductive portion 110 or a plurality of signal conductive portions 110 in the horizontal direction. The plurality of signal conductive portions 110 may be formed in a single group, and the plurality of ground conductive portions 120 may be arranged around the group while being spaced apart from the group in the horizontal direction.

The ground conductive portion 120 may be conductive.

The ground conductive portion 120 is electrically connected to the metal frame portion 130. Thus, the ground conductive portion 120 and the metal frame portion 130 are short-circuited to each other, and can serve as one short-circuit member. Thereby, the ground conductive portion 120 and the metal frame portion 130 are electrically connected.

The ground conductive portion 120 includes: a plurality of second conductive particles 123 electrically conductive and electrically conductive, which are gathered and contacted along the vertical direction VD; the elastic material 124 maintains the plurality of second conductive particles 123 along the up-down direction VD.

Between the second conductive particles 123, the elastic substance 124 is cured and maintains the second conductive particles 123. The elastic material 124 may have insulating properties or conductive properties. As an example, the elastic material 124 may include an elastic insulating material for forming the insulating portion 112 of the signal conductive portion 110, but is not limited thereto.

The ground conductive portion 120 includes: an upper end portion 125 protruding upward from an upper surface of the metal frame portion 130; and a lower end portion 126 protruding downward from a lower surface of the metal frame portion 130. The protruding height of the upper end portion 125 may be the same as the protruding height of the upper end portion 114 of the signal conductive portion, and the protruding height of the lower end portion 126 may be the same as the protruding height of the lower end portion 115 of the signal conductive portion.

When inspecting the test apparatus, the ground conductive portion 120 can be elastically deformed and restored by the upper end portion 125 and the lower end portion 126 of the ground conductive portion 120.

The metal frame portion 130 may be a flat body and may be made of a metal material such as stainless steel or aluminum. The metal frame portion 130 separates the signal conductive portion 110 and the ground conductive portion 120 from each other. The metal frame portion 130 may be electrically connected to the ground conductive portion 120, and short-circuited with the ground conductive portion 120.

The metal frame 130 is connected to a test socket guide attached to a board of the inspection apparatus, and can be grounded to the outside. If the metal frame portion 130 is grounded to the outside through the test socket guide, the radio frequency characteristics can be further improved by expanding the grounding range through the test socket guide of the connector 100.

Referring to fig. 2, the metal frame part 130 includes a plurality of metal frame layers 131. The plurality of metal frame layers 131 may be bonded by an adhesive.

For example, the metal frame part 130 includes 2 to 10 metal frame layers 131.

For example, the metal frame layer 131 may be a metal plate made of a metal material such as stainless steel, aluminum, or the like. Further, each metal frame layer 131 may include a high-conductivity metal film deposited or plated with gold, silver, copper, or the like on the surface of the metal plate. The electromagnetic wave shielding property of the metal frame part formed by laminating the metal frame layers coated with the high-conductivity metal film is more excellent than the metal frame layer made of only the stainless steel or aluminum metal plate body.

The metal frame layers 131 have first through holes 132 formed at the same positions in the vertical direction VD to accommodate the first conductive portions 111.

The first through holes 132 of the metal frame layer 131 are arranged with the same diameter and the same center, respectively, and accommodate the signal conductive portions 110.

As a further example, although not shown, the first through hole 132 of the metal frame layer 131 may have a diameter gradually increasing toward the center of the metal frame 130.

The signal conductive portion 110 is not shorted to the ground conductive portion 120 and the metal frame portion 130 by the insulating portion 112 of the signal conductive portion.

Referring to fig. 2, the plurality of metal frame layers 131 each include a second through hole 135 formed to penetrate in the vertical direction VD and arranged at the same diameter and the same center for accommodating the ground conductive portion 120.

Hereinafter, the connector of the second embodiment will be described centering on differences from the connector of the first embodiment while omitting the repetition.

Fig. 5 is a cross-sectional view showing a part of the connector of the second embodiment.

Referring to fig. 5, the ground conductive portion 120 is formed in grooves formed on the upper and lower surfaces of the metal frame portion 130, respectively. Thus, one end of the ground conductive portion 120 is located inside the metal frame portion 130.

The metal frame portion 130 maintains the signal conductive portion 110 and the ground conductive portion 120 along the up-down direction VD and is spaced apart along the horizontal direction HD.

The metal frame layer 130 includes a plurality of metal frame layers stacked. The plurality of metal layers may be bonded by an adhesive.

In the connector 100, the signal conductive portion 110 performs signal transmission in the up-down direction VD between the inspection apparatus and the device under inspection. The signal conductive portion 110 may have a cylindrical shape extending along the up-down direction VD. The signal conductive part 110 includes: a transmission section 111 for performing transmission of a signal; and an insulating portion 112 that insulates the transmission portion 111 from the metal frame portion 130 in the horizontal direction HD.

Referring to fig. 5, the signal conductive portions 110 have the same diameter along the up-down direction VD.

As yet another embodiment, although not shown, the signal conductive portion 110 may have a diameter gradually increasing toward the center portion of the metal frame portion.

The insulating portion 112 may have the same height as the metal frame portion 130. Further, although not shown, unlike fig. 5, the insulating portion 112 has the same height as the transmitting portion 111. Thus, the height of the insulating portion 112 may be less than or equal to the height of the transmitting portion 111.

The insulating portion 112 is formed integrally with the transmitting portion 111, thereby constituting the signal conducting portion 110. The insulating portion 112 may surround the transmitting portion 111 in the horizontal direction HD.

Since the transmission part 111 is formed integrally with the insulation part 112, an elastic insulating substance forming the insulation part 112 may be filled between the plurality of first conductive particles 113.

That is, the insulating part 112 maintains the shape of the transfer part 111 by the plurality of first conductive particles 113, and the insulating part 112 may be formed integrally with an insulating substance filled between the plurality of first conductive particles 113. Accordingly, the insulating portion 112 imparts elasticity to the signal conductive portion 110 along the up-down direction VD and the horizontal direction HD. The portion of the signal conductive portion 110 that contacts the metal frame portion 130 is difficult to elastically deform due to the metal frame portion 130.

As shown in fig. 5, the plurality of ground conductive parts 120 may be arranged to be spaced apart from one signal conductive part 110 in the horizontal direction HD.

The ground conductive portion 120 may be conductive.

The ground conductive portion 120 is electrically connected to the metal frame portion 130. Thus, the ground conductive portion 120 and the metal frame portion 130 are short-circuited to each other, and can serve as one short-circuit member.

According to an embodiment, each of the ground conductive portions 120 includes an upper ground conductive portion 121 and a lower ground conductive portion 122. The upper side ground conductive portion 121 and the lower side ground conductive portion 122 may be arranged along the up-down direction VD and separated by the metal frame portion 130 along the up-down direction VD. The upper and lower ground conductive portions 121 and 122 are electrically connected to the metal frame portion 130.

The upper-side ground conductive portion 121 and the lower-side ground conductive portion 122 include: a plurality of second conductive particles 123 electrically conductively gathered and contacted along the vertical direction VD; the elastic material 124 maintains the plurality of second conductive particles 123 along the up-down direction VD.

The second conductive particles 123 constituting the upper-side ground conductive portion 121 and the lower-side ground conductive portion 122 may be the same as or different from the first conductive particles 113 described above. The assembly formed of the plurality of second conductive particles 123 contacting in the up-down direction VD contacts the metal frame portion 130 at the upper or lower end thereof, so that the upper and lower ground conductive portions 121 and 122 are electrically connected to the metal frame portion 130. Therefore, the upper-side ground conductive portion 121 and the lower-side ground conductive portion 122 are short-circuited by the metal frame portion 130.

The upper-side ground conductive portion 121 includes an upper end portion 125 protruding upward from the upper surface of the metal frame portion 130, and the lower-side ground conductive portion 122 includes a lower end portion 126 protruding downward from the lower surface of the metal frame portion 130. The protruding height of the upper end portion 125 may be the same as the protruding height of the upper end portion 114 of the signal conductive portion, and the protruding height of the lower end portion 126 may be the same as the protruding height of the lower end portion 115 of the signal conductive portion.

When inspecting the test apparatus, the ground conductive portion 120 can be elastically deformed and restored by the upper end portion 125 of the upper ground conductive portion 121 and the lower end portion 126 of the lower ground conductive portion 122.

Referring to fig. 5, the metal frame part 130 includes a plurality of metal frame layers 131. For example, the metal frame part 130 includes 2 to 10 metal frame layers 131.

And, the metal frame part 130 includes: a first groove 133 recessed downward from the upper surface; the second groove 134 is recessed upward from the lower surface. The upper ground conductive portion 121 is located in the first groove 133, and the lower ground conductive portion 122 is located in the second groove 134.

Thus, referring to fig. 5, in order to form the first grooves 133 and the second grooves 134, the second through holes 135 penetrating in the vertical direction VD and arranged at the same diameter and the same center are formed in a part of the plurality of metal frame layers 131, and the second through holes 135 penetrating in the vertical direction VD are not formed in another part of the plurality of metal frame layers 131. Thus, the second through hole 135 for accommodating the ground conductive portion is not formed, so that the other portions of the plurality of metal frame layers 131 are in contact with one ends of the upper and lower ground conductive portions.

The first groove 133 is spaced apart from the second groove 134 along the up-down direction VD. The upper-side ground conductive portion 121 formed in the first groove 133 is electrically connected to the metal frame portion 130 through the first groove 133, and the lower-side ground conductive portion 122 formed in the second groove 134 is electrically connected to the metal frame portion 130 through the second groove 134. Thus, the upper and lower ground conductive portions 121 and 122 may be short-circuited by the frame portion 130.

However, the signal conductive portion 110 is not short-circuited with the upper ground conductive portion 121, the lower ground conductive portion 122, and the metal frame portion 130 by the insulating portion 112 of the signal conductive portion 110.

Hereinafter, the connector of the third embodiment will be described centering on differences from the connector of the second embodiment while omitting the duplicate matters.

Fig. 6 is a cross-sectional view showing a part of a connector of the third embodiment.

Referring to fig. 6, the upper end of the signal conductive part 110 is located on the same plane as the upper surface of the metal frame part 130, and the lower end of the signal conductive part 110 is located on the same plane as the lower surface of the metal frame part 130, or may be formed to protrude from the lower surface of the metal frame part 130.

In fig. 5, the transmission portion 111 is formed to protrude from the lower surface of the metal frame portion 130, but the present invention is not limited thereto, and the transmission portion 111 may be formed to protrude from the lower surface of the metal frame portion 130 together with the insulating portion 112. The ground conductive portion 120 may have a cylindrical shape penetrating the metal frame portion 130 and extending in the up-down direction VD in the same manner as the signal conductive portion 110.

The upper end of the ground conductive part 120 is located on the same plane as the upper surface of the metal frame part 130, and the lower end of the ground conductive part 120 may protrude on the same plane as the lower surface of the metal frame part 130.

The ground conductive portion 120 further includes a ground terminal protection portion 137 formed at the uppermost metal frame layer.

The metal frame part 130 includes a plurality of metal frame layers 131. For example, the metal frame part 130 includes 2 to 10 metal frame layers 131.

The metal frame portion 130 includes a second through hole 135 for receiving the ground conductive portion. In this case, the ground conductive portion is integrally formed, and the upper and lower sides are not distinguished. Accordingly, the metal frame layer 131 includes second through holes 135 formed to penetrate in the vertical direction VD and arranged at the same diameter and the same center, respectively, so as to accommodate the ground conductive portions 120.

The uppermost metal frame layer of the metal frame portion 130 includes a third through hole 136 that is larger than the second through hole 135 formed in the remaining metal frame layer 131. In order to accommodate the ground conductive portion 120 and the ground terminal protection portion 137, the third through hole 136 and the second through hole 135 have the same center, and have a larger diameter than the second through hole 135.

Further, although not shown, instead of the third through hole 136 shown in fig. 6, the uppermost metal frame layer of the metal frame portion 130 may have a through groove larger than the second through hole 135 formed in the remaining metal frame layer. The through groove has the same center as the second through hole 135 and has a diameter larger than that of the second through hole 135 in order to accommodate the ground conductive portion 120 and the ground terminal protection portion 137. In this case, the through groove is formed to a depth smaller than the thickness of the uppermost frame layer by etching or drilling the uppermost frame layer.

Referring to fig. 6, the ground terminal protection portion 137 is located at a position facing the third through hole 136 or the through groove, and surrounds the ground conductive portion 120.

The ground terminal protecting portion 137 may have a circular shape when the connector of the third embodiment is viewed from the plane as shown in fig. 3. However, the shape of the ground terminal protection portion is not limited to this, and may be composed of two or more insulating sheets each of which is formed of one of a C shape, a "shape, and a" "shape as a part of the circular ring is cut. When the insulating sheets of the ground terminal protecting portion 137 are spaced apart by a prescribed interval, the second conductive particles 123 and the elastic substance 124 may fill the space between the insulating sheets.

The ground terminal protecting portion 137 may be made of the same elastic insulating material as the insulating portion 112, but is not limited thereto and may be made of other elastic materials.

Further, the ground terminal protecting portion 137 may be in contact with the upper surface of the metal frame layer 131 located at the lower portion of the uppermost metal frame layer.

The ground terminal protecting portion 137 functions as a guide member of the test socket, whereby the ground terminal 22 can be prevented from being damaged when it comes into contact with the ground terminal 22 of the test apparatus 20.

Referring to fig. 6, the transmission part 111 and the insulation part 112 of the signal conductive part 110 protrude downward from the lower surface of the metal frame part 130. However, the present invention is not limited thereto, and only the transmission portion 111 of the signal conductive portion 110 may protrude downward from the lower surface of the metal frame portion 130.

Hereinafter, the repeated contents with the connectors of the first to third embodiments will be omitted and the connector of the fourth embodiment will be described centering on the differences.

Fig. 7 is a cross-sectional view showing a part of a connector of the fourth embodiment.

Referring to fig. 7, the metal frame part 130 includes a plurality of metal frame layers 131. For example, the metal frame part 130 includes 2 to 10 metal frame layers 131.

The metal frame portion 130 includes a second through hole 135 for receiving the ground conductive portion 120. In this case, the ground conductive portion 120 is integrally formed, and the upper and lower sides are not distinguished. Accordingly, the metal frame layer 131 includes second through holes 135 formed to penetrate in the vertical direction VD and arranged at the same diameter and the same center, respectively, so as to accommodate the ground conductive portions 120.

The uppermost metal frame layer of the metal frame portion 130 includes a third through hole 136 having an inverted cone shape with a diameter gradually decreasing from the upper end toward the lower end. This can allow the ground terminal of the test device 20 to easily contact the ground conductive portion 120.

The third through hole 136 has an upper end larger than the diameter of the second through hole 135 and a lower end identical to the diameter of the second through hole 135.

Further, although not shown, instead of the third through hole 136 shown in fig. 6, the uppermost metal frame layer of the metal frame portion 130 may have a through groove larger than the second through hole 135 formed in the remaining frame layer. The through groove has the same center as the second through hole 135 and has a diameter larger than that of the second through hole 135 in order to accommodate the ground conductive portion 120 and the ground terminal protection portion 137. The through groove has an inverted taper shape in which an inner diameter gradually decreases toward a lower end. In this case, the through groove is formed to a depth smaller than the thickness of the uppermost frame layer by etching or drilling the uppermost frame layer. Referring to fig. 7, the ground terminal protecting portion 137 has an inverted tapered shape in which the outer diameter gradually decreases from the upper end toward the lower end, and surrounds the ground conductive portion 120 and is disposed in the third through hole 136 or the through groove (not shown).

The ground terminal protecting portion 137 may have a circular shape when the connector of the fourth embodiment is viewed from the plane as shown in fig. 3. However, the shape of the ground terminal protection portion is not limited to this, and may be composed of two or more insulating sheets each of which is formed of one of a C shape, a "shape, and a" "shape as a part of the circular ring is cut. When the insulating sheets of the ground terminal protecting portion 137 are spaced apart by a prescribed interval, the second conductive particles 123 may fill the space between the insulating sheets. The ground terminal protecting portion 137 may be made of the same elastic insulating material as the insulating portion 112, but is not limited thereto and may be made of other elastic materials.

Further, the ground terminal protecting portion 137 may be in contact with the upper surface of the metal frame layer located at the lower portion of the uppermost metal frame layer.

Fig. 8 is a sectional view showing a connector of a fifth embodiment of the present invention. In the connector shown in fig. 8, the insulating portion 112 includes a plurality of air holes 116, and the plurality of air holes 116 may be distributed in the overall elastic portion 112. The air holes 116 are formed in the insulating portion 112 by partially eliminating the above-described elastic insulating material constituting the insulating portion 112. Since the insulating portion 112 having the air holes 116 formed therein has a relatively low permittivity as compared with the insulating portion having no air holes formed therein, signal loss of the signal conductive portion 110 can be further reduced.

During the molding of the connector 110, the air holes 116 may be formed in the insulating portion 112. For this purpose, the first liquid material for forming the signal conductive portion 110 may include a liquid elastic insulating material for forming the insulating portion 112, first conductive particles dispersed in the liquid elastic insulating material, and a foaming agent included in the liquid elastic insulating material. The foaming agent reacts with the liquid elastic insulating material to generate gas. The generated gas will compress the liquid elastic insulation. Thus, as the generated gas partially eliminates the liquid elastic insulating material in the insulating portion 112, a plurality of air holes 116 can be formed in the entire insulating portion 112. In contrast, the air holes of the insulating portion 112 may be formed by mixing and solidifying liquid silicon and hollow particles.

When the insulating portion of the signal conductive portion is formed with the air hole, when the upper portion is pressurized, the space in which the conductive portion expands in the horizontal direction is formed, so that the stroke of the connector can be increased and the permittivity of the insulating portion can be reduced, and therefore, impedance matching can be facilitated.

The connector of the embodiment of the invention can represent the impedance matched with the impedance of the inspection circuit of the inspection device and the impedance of the inspected equipment. Since the ground conductive part 120 and the metal frame part 130 may serve as one short circuit member, a distance between the metal frame part 130 and the transmission part 111 of the signal conductive part 110 may have an influence on the impedance of the connector. In order to express an impedance matching the impedance of the inspection apparatus and the impedance of the device under inspection, the size of the transmission portion 111 and the size of the insulation portion 112 may be set within a range of a specific ratio. When the transmission portion 111 and the insulation portion 112 constituting the coaxial structure are formed in the dimensions determined in a specific ratio, not only can signal loss due to impedance mismatch be prevented, but also impedance matching with the impedance of the test equipment and the inspection device can be imparted to the connector 100.

Referring to fig. 2 and 3, the signal conductive portion 110 may have an inner diameter D1 and an outer diameter D2. In association therewith, the inner diameter D1 of the signal conductive portion 110 may correspond to the maximum width W of the transmission portion 111 in the horizontal direction HD, and the outer diameter D2 of the signal conductive portion 110 may correspond to the width between both ends of the insulating portion 112 (or the diameter of the through hole of the metal frame portion 130) in the horizontal direction HD. The impedance of the signal conductive portion may depend on the diameter of the transmission portion (i.e., the inner diameter D1) and the diameter of the insulation portion (i.e., the outer diameter D2).

The ratio of the inner diameter D1 to the outer diameter D2 should be determined in such a manner that the impedance of the connector of an embodiment matches the impedance of the inspection circuit of the inspection device and the impedance of the inspected equipment inspected by the inspection device. The impedance value of the signal conductive portion can be determined by the ratio of the inner diameter D1 to the outer diameter D2.

As an example, a device under test may have an impedance of about 50 ohms, and for inspection of such a device under test, the inspection circuit of the inspection apparatus may have an impedance of about 50 ohms. The impedance of the device under test of about 50 ohms and the impedance of the examination circuit of about 50 ohms may be impedances determined for achieving signal transmission without signal distortion. Based on the scaling of the inner diameter D1 to the outer diameter D2, an embodiment of the connector may exhibit an impedance of about 50 ohms. Thus, if the connector of an embodiment is disposed between the device under test and the inspection apparatus, the impedance of the connector matches the impedance of the device under test and the impedance of the inspection apparatus. Therefore, the connector of an embodiment can not only prevent signal loss such as signal reflection, but also realize high-frequency radio frequency inspection with high reliability for the inspected apparatus.

According to an embodiment, in order to allow the signal conductive part 110 to be applied to various kinds of inspected apparatuses and inspection devices for inspecting the same, the outer diameter D2 may be 1.5 to 5 times the inner diameter D1. That is, the ratio of the inner diameter D1 to the outer diameter D2 may be set at 1:1.5 to 1: 5. As a specific example, when the outer diameter D2 is 4 times the inner diameter D1, that is, when the ratio of the inner diameter D1 to the outer diameter D2 is 1:4, the connector of an embodiment may exhibit an impedance of about 50 ohms.

For example, when the outer diameter D2 is 4 times the inner diameter D1, the impedance can be confirmed by software (for example, coaxial line calculating tool (coaxial line calculator)) capable of calculating the impedance related to the coaxial line structure. The impedance was calculated using the above software under the conditions that the capacitance of the insulating portion 112 was 2.95, the inner diameter D1 was 0.1mm, and the outer diameter D2 was 0.4 mm. From the results of calculation under the above conditions, it was confirmed that the impedance was about 50 ohms. And, the parasitic capacitance (parasitic capacitance) is 118.222pF/m, the inductance is 277.259nH/m, the phase velocity is 174667km/s, and the time delay is 5.719ns/m can be calculated through the above calculation process.

The connector of an embodiment can realize impedance matching and high-frequency radio frequency inspection of 40GHz or more on the premise of preventing signal interference, noise and signal loss. As an example, a connector having an embodiment of a signal conductive portion representing an impedance of about 50 ohms can cover a high frequency band, and semiconductor devices of mobile communication devices operating in the high frequency band can be effectively inspected. According to the connector of the embodiment, under the coaxial structure of the signal conducting part, the sizes of the inner diameter D1 and the outer diameter D2 are adjusted, and the signal conducting part is not in short circuit with the grounding conducting part and the frame part, so that the radio frequency characteristic can be improved.

An example of the manufacture of the connector according to the third embodiment will be described with reference to fig. 9. Fig. 9 is a diagram schematically showing an example of manufacturing the connector of the third embodiment, and the constituent elements shown in fig. 9 are only examples selected for understanding the embodiment.

Referring to fig. 9 (a), 2 to 10 metal frame layers 131 for manufacturing the metal frame part are prepared, and first through holes 132 having the same diameter and the same center are formed at positions where the metal frame layers 131 are to form signal conductive parts, respectively. For example, the first through hole 132 may be formed by drilling or laser.

In the plurality of metal frame layers 131, the second through holes 135 are spaced apart from the first through holes 132 in the horizontal direction HD, and are formed so as to have the same diameter and the same center at the positions where the ground conductive portions 120 are to be formed. For example, the second through hole 135 may be formed by drilling or laser.

A third through hole 136 larger than the second through hole 135 formed in the remaining metal frame layer 131 is formed in the uppermost metal frame layer of the metal frame portion 130. The third through-hole 136 has the same center as the second through-hole 135, and has a larger diameter than the second through-hole 135.

Referring to part (b) of fig. 9, a plurality of metal frame layers 131 are laminated using an adhesive such that centers of the first through-holes 132 to the third through-holes 136 are the same.

The adhesive may be one of conductive adhesive, epoxy and silicon.

Subsequently, referring to fig. 9 (c), the first liquid material 40 is injected into the first through hole 132 of the metal frame portion 130, and the second liquid material 41 is injected into the second through hole 135 and the third through hole 136. The first liquid material 40 includes a liquid elastic insulating material for forming the insulating portion 112 of the signal conductive portion 110, and first conductive particles 113 dispersed in the liquid elastic insulating material. The second liquid material 41 contains a liquid elastic material constituting the elastic material of the ground conductive portion, and second conductive particles 123 dispersed therein. The elastic insulating substance of the first liquid material 40 and the elastic substance of the second liquid material 41 may be the same. The first conductive particles 113 and the second conductive particles 123 may be the same.

Then, referring to fig. 9 (d), a magnetic field is applied to the first liquid material 40 injected into the first through hole 132 and the second liquid material 41 injected into the second through hole 135 and the third through hole 136 along the vertical direction VD. With the application of the magnetic field, the first conductive particles 113 in the first liquid material 40 are compactly collected and brought into conductive contact in the vertical direction VD in the magnetic field, and the second conductive particles 123 in the second liquid material 41 are compactly collected and brought into conductive contact in the vertical direction VD in the magnetic field.

Thereby, the transmission portion of the signal conductive portion is formed by the plurality of first conductive particles 113 which are compactly gathered and contacted along the up-down direction VD.

The plurality of second conductive particles 123 compactly collected and contacted along the up-down direction VD may form a ground conductive portion.

After the magnetic field is applied, the elastic insulating material in a liquid state excluding the first conductive particles 113 from the first liquid material 40 is cured by the curing process, whereby the insulating portion 112 of the signal conductive portion 110 can be formed.

Then, the second conductive particles 123 are maintained in the up-down direction by curing the liquid elastic material disposed between the second conductive particles 123 in the second liquid material 41 by the curing process. In the third through-hole 136 formed in the uppermost metal frame layer, as the liquid elastic material disposed between the second conductive particles 123 in the same manner as the diameter of the second through-hole 135 is cured, the second conductive particles 123 are maintained and the ground terminal protection portion 137 larger than the diameter of the second through-hole 135 is formed.

While the technical idea of the present disclosure has been described above by way of examples and illustrations, it should be understood that various modifications, alterations and changes may be made by those having ordinary skill in the art to which the present disclosure pertains without departing from the technical idea and scope of the present disclosure. And such modifications, variations and changes are intended to be included within the scope of the appended claims.

Claims

1. A connector for electrical connection is characterized in that,

comprising the following steps:

at least one signal conductive part including a transmission part composed of a plurality of first conductive particles and an insulating part integrally formed with the transmission part in such a manner as to surround the transmission part in a horizontal direction;

at least one ground conductive portion arranged along the horizontal direction so as to be spaced apart from the signal conductive portion; and

a metal frame part for maintaining the signal conductive part and the grounding conductive part along the vertical direction and separating along the horizontal direction to realize electric connection with the grounding conductive part,

the metal frame portion includes a plurality of metal frame layers stacked in the up-down direction.

2. The connector for electrical connection according to claim 1, wherein,

the plurality of metal frame layers include:

a first through hole for accommodating the signal conductive part; and

a second through hole for accommodating the grounding conductive portion,

the uppermost metal frame layer of the plurality of metal frame layers includes a third through hole having a diameter larger than that of the second through hole.

3. The connector for electrical connection of claim 2, wherein the ground conductive portion comprises:

Second conductive particles; and

and an elastic material for maintaining the second conductive particles.

4. The connector for electrical connection according to claim 2 or 3, wherein the ground conductive portion further comprises a ground terminal protection portion located in the third through hole.

5. The connector for electrical connection according to claim 4, wherein the ground terminal protecting portion has a circular ring shape.

6. The connector for electrical connection according to claim 4, wherein the ground terminal protecting portion is composed of two or more insulating sheets spaced apart by a predetermined interval when viewed from a plane.

7. The connector for electrical connection according to claim 6, wherein the second conductive particles and the elastic material fill a space between the insulating sheets.

8. The connector for electrical connection according to claim 4, wherein the third through hole of the uppermost metal frame layer has an inverted tapered shape, an inner diameter gradually decreases from an upper end toward a lower end, and the ground terminal protecting portion gradually decreases an outer diameter from the upper end toward the lower end so as to correspond to the third through hole.

9. The connector for electrical connection of claim 1, wherein the metal frame layer comprises:

A metal plate; and

a highly conductive metal film, which is obtained by coating or plating the surface of the metal plate.

10. The connector for electrical connection according to claim 9, wherein the high-conductivity metal film is made of at least one of gold, silver and copper.

11. The connector for electrical connection of claim 1, wherein the insulating portion includes a plurality of air holes.

12. The connector for electrical connection of claim 1, wherein upper surfaces of the signal conductive portion and the ground conductive portion are located on the same plane as an upper surface of the metal frame portion.

13. The connector for electrical connection according to claim 1, wherein lower surfaces of the transmission portion and the ground conductive portion are formed to protrude from a lower surface of the metal frame portion.

14. The connector for electrical connection according to claim 1, wherein,

the metal frame layers each include a first through hole for accommodating the signal conductive portion,

a plurality of metal frame layers, wherein a part of the metal frame layers includes a second through hole for accommodating the grounding conductive portion, a first groove and a second groove are formed along the vertical direction,

The grounding conductive part includes:

an upper side grounding conductive part positioned in the first groove; and

the lower side grounding conductive part is positioned in the second groove.

15. The connector for electrical connection of claim 14, wherein another portion of the plurality of metal frame layers does not include a second through hole for receiving the ground conductive portion, and is in contact with one end of the upper side ground conductive portion and one end of the lower side ground conductive portion.

16. The connector for electrical connection of claim 14, wherein said upper ground conductive portion and said lower ground conductive portion comprise:

a plurality of second conductive particles; and

and an elastic material located between the plurality of second conductive particles.

17. The connector for electrical connection according to claim 14, wherein,

the upper end of the upper ground conductive part is formed protruding from the upper surface of the metal frame part,

the lower end portion of the lower ground conductive portion is formed to protrude from the lower surface of the metal frame portion.

18. The connector for electrical connection according to claim 14, wherein,

the upper end of the transmission part is formed protruding from the upper surface of the metal frame part,

The lower end of the transmission part protrudes from the lower surface of the metal frame part.

19. The connector for electrical connection according to claim 1, wherein,

the inner diameter of the signal conductive part corresponds to the maximum width of the transmission part in the horizontal direction,

the signal conductive part has an outer diameter 1.5 to 5 times the inner diameter and corresponds to a width between both ends of the insulating part in the horizontal direction.

20. The connector for electrical connection according to claim 1, wherein the elastic insulating material of the insulating portion comprises silicone rubber or teflon.

21. The connector for electrical connection according to claim 1, wherein,

the plurality of metal frame layers include:

a first through hole for accommodating the signal conductive part; and

a second through hole for accommodating the grounding conductive portion,

the uppermost metal frame layer of the plurality of metal frame layers includes a through groove having a diameter larger than that of the second through hole.

22. The connector for electrical connection of claim 21, wherein said ground conductive portion further comprises a ground terminal protection portion located in said through slot.