CN117577593A - IC packaging structure and process for encapsulating with liquid glue - Google Patents
IC packaging structure and process for encapsulating with liquid glue Download PDFInfo
- Publication number
- CN117577593A CN117577593A CN202311771400.8A CN202311771400A CN117577593A CN 117577593 A CN117577593 A CN 117577593A CN 202311771400 A CN202311771400 A CN 202311771400A CN 117577593 A CN117577593 A CN 117577593A
- Authority
- CN
- China
- Prior art keywords
- glue
- liquid glue
- base island
- encapsulated
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 95
- 239000007788 liquid Substances 0.000 title claims abstract description 68
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 238000001746 injection moulding Methods 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 9
- 238000003860 storage Methods 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 229940125898 compound 5 Drugs 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052705 radium Inorganic materials 0.000 description 2
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention provides an IC packaging structure and a process for encapsulating with liquid glue, wherein the IC packaging structure for encapsulating with liquid glue comprises a frame, a base island, pins, a wafer, a wire and plastic packaging glue which are integrally formed on the frame, wherein the base island and the pins are fixedly connected with each other through plastic packaging glue in an injection molding mode, the wafer is adhered to the surface of the base island through heat-conducting glue, the wire is connected with the wafer and the pins in a bonding mode, and the liquid glue for sealing the wafer and the surface of the base island is encapsulated and solidified in plastic packaging glue ports which are formed around the base island in an injection molding mode. According to the IC packaging structure and the process for encapsulating the liquid glue, the liquid glue is used for sealing the surfaces of the wafer and the base island, so that a liquid seal layer is formed, the requirement on storage conditions can be effectively reduced, the plastic packaging period is shortened, and the material cost is reduced.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to an IC packaging structure and process for liquid glue encapsulation.
Background
Along with development and progress of technology, life electronization and intellectualization of people are continuously improved, and operation of electronic products and intelligent products is not separated from an IC chip, so that the IC chip is developed and used in a large quantity.
The IC packaging structure is used for packaging the semiconductor chip, preventing the semiconductor chip from being damaged by the outside, and stabilizing the use of the semiconductor chip, but the conventional IC packaging structure has a plurality of problems and defects.
In the traditional IC packaging structure, EMC materials are adopted for plastic packaging during packaging, and the EMC materials are thermosetting materials, so that the storage conditions are harsh, the plastic packaging forming period is long, and the materials are expensive.
Therefore, it is desirable to provide a liquid glue encapsulated IC package structure and process for solving the above technical problems.
Disclosure of Invention
The invention mainly solves the technical problems of harsh storage conditions, long molding cycle and high price in the background art by providing a liquid glue encapsulated IC packaging structure and a liquid glue encapsulated IC packaging process.
In order to solve the technical problems, a first technical scheme adopted by the invention is to provide an IC packaging structure encapsulated by liquid glue, which comprises a frame 7, a base island 1, pins 2, a wafer 3, a wire 4 and plastic packaging glue 5 which are integrally formed on the frame 7, wherein the plastic packaging glue 5 is used for fixedly connecting the base island 1 and the pins 2 through injection molding, the wafer 3 is bonded on the surface of the base island 1 through heat-conducting glue, the wire 4 is used for bonding the wafer 3 and the pins 2, and the liquid glue 6 for sealing the surfaces of the wafer 3 and the base island 1 is encapsulated and solidified in openings of the plastic packaging glue 5 which is used for injection molding around the base island 1.
In one embodiment, the wire 4 is a copper wire.
In one embodiment, the wire 4 is a gold wire.
In one embodiment, the conductive wire 4 is a silver wire.
In one embodiment, each liquid glue encapsulated IC package structure includes at least one island 1.
In an embodiment, the outer surface of the liquid glue 6 is an upper top surface of the IC package structure encapsulated by the liquid glue.
In an embodiment, the outer surface of the liquid glue 6 is a lower bottom surface of the IC package structure encapsulated by the liquid glue.
In order to solve the technical problems, a second technical scheme adopted by the invention is to provide a manufacturing process of the liquid glue encapsulated IC packaging structure, which comprises the following steps:
s1, forming a needed base island 1 and a needed pin 2 by a stamping frame 7;
s2, fixing the pins 2 and the base island 1 by using plastic packaging glue 5 through an injection molding process;
s3, partially separating the frame 7, the pins 2 and the base island 1 through die stamping;
s4, coating heat-conducting glue on the base island 1, and fixing the wafer 3 on the base island 1;
s5, connecting the wafer 3 with each pin 2 through a bonding process by using a lead 4;
s6, dripping liquid glue 6 into a plastic package glue 5 port injection-molded around the base island 1 through a glue dispenser, and sealing the base island 1 and the wafer 3 after the liquid glue 5 is solidified.
The beneficial effects of the invention are as follows:
(1) The liquid glue is used for encapsulating the surfaces of the wafer and the island, so that a liquid seal layer is formed, the requirement on storage conditions can be effectively reduced, the plastic package period is shortened, and the material cost is reduced;
(2) Furthermore, the surface of the wafer, the plastic packaging adhesive and the island is encapsulated by filling liquid adhesive, so that the problems of wire punching and the like of the traditional product surface EMC packaging structure can be solved.
Drawings
FIG. 1 is a schematic diagram of a liquid glue encapsulated IC package structure of the present invention after a stamping frame forms the desired islands and pins;
FIG. 2 is an enlarged schematic view of the circled portion A in FIG. 1;
FIG. 3 includes an IC package structure encapsulated by a liquid glue to be front side glue filled and back side glue filled;
FIG. 4 is an enlarged schematic view of the circled portion B in FIG. 3;
FIG. 5 is a schematic structural diagram of an IC package structure encapsulated by a liquid glue obtained by front side glue filling in accordance with the present invention;
FIG. 6 is a schematic diagram of a finished liquid glue encapsulated IC package structure of FIG. 5;
fig. 7 is a block diagram of a process for manufacturing a liquid glue encapsulated IC package structure according to the present invention.
The component names corresponding to the numerical identifiers in the drawings of the specification are respectively as follows:
1-islands;
2-pins;
3-wafer;
4-conducting wires;
5-plastic packaging glue;
6-liquid glue;
7-frame.
Detailed Description
The technical scheme of the invention is described in detail below with reference to the drawings.
Referring to fig. 1 and 2, the IC package structure encapsulated by liquid glue in this embodiment includes a frame 7, a base island 1 integrally formed on the frame 7, a lead 2, a wafer 3, a lead 4, and a molding compound 5, wherein the molding compound 5 is injection-molded to fixedly connect the base island 1 and the lead 2, the wafer 3 is adhered to the surface of the base island 1 by a heat-conducting compound, the lead 2 is bonded to connect the wafer 3 and the lead 2, and the liquid glue 6 sealing the surfaces of the wafer 3 and the base island 1 is encapsulated and solidified in the openings of the molding compound 5 injection-molded around the base island 1.
In the invention, the injected liquid glue 6 is used for solidifying and sealing the surfaces of the wafer 3 and the base island 1 by using the plastic sealing glue 5 around the base island 1, and the traditional EMC plastic sealing material is not needed to be used for sealing, so that the molding period can be shortened, the liquid glue is used for sealing, the material cost can be effectively reduced, and the problem of wire punching of the EMC plastic sealing material during plastic sealing can be solved.
In the liquid glue encapsulated IC packaging structure, the lead 4 is copper wire, gold wire or silver wire, which are all within the protection scope of the invention.
In the liquid glue sealed IC packaging structure, no matter whether the front or the back is filled with the liquid glue, the liquid glue sealed IC packaging structure is within the protection scope of the invention as long as the liquid glue sealed IC packaging structure is similar to the structure of the patent.
The packaging forms of the liquid glue sealed IC packaging structure of the invention, including but not limited to SOP, DIP, SOT, QFN, DFN packaging forms, are within the protection scope of the invention as long as the same structural mode as the IC packaging structure of the patent is adopted.
In one embodiment of the present invention, the outer surface of the liquid glue 6 is the upper top surface of the IC package structure encapsulated by the liquid glue, and this structure corresponds to the front glue filling process, and particularly, refer to fig. 3, 5 and 6. Then when carrying out radium carving, just carry out on the liquid gluey surface, avoided the fuzzy problem of printing that radium carving led to on traditional EMC plastic envelope.
In another embodiment of the present invention, the outer surface of the liquid glue 6 is the lower bottom surface of the IC package structure encapsulated by the liquid glue, and this structure corresponds to the back side glue filling process, and refer to fig. 3 and fig. 4 specifically. In this case, the top surface structure of the IC package structure encapsulated by the liquid glue is indistinguishable from the conventional EMC molding compound package structure. But the whole structure can reduce the requirement on storage conditions, shorten the plastic package period and reduce the material cost while maintaining the tightness.
As shown in fig. 7, the process for manufacturing the IC package structure encapsulated by the liquid glue according to any one of the above embodiments includes the following steps:
s1, forming a needed base island 1 and a needed pin 2 by a stamping frame 7;
s2, fixing the pins 2 and the base island 1 by using plastic packaging glue 5 through an injection molding process;
s3, partially separating the frame 7, the pins 2 and the base island 1 through die stamping;
s4, coating heat-conducting glue on the base island 1, and fixing the wafer 3 on the base island 1;
s5, connecting the wafer 3 with each pin 2 through a bonding process by using a lead 4;
s6, dripping liquid glue 6 into a plastic package glue 5 port injection-molded around the base island 1 through a glue dispenser, and sealing the base island 1 and the wafer 3 after the liquid glue 5 is solidified.
The surface of the wafer 3 and the surface of the base island 1 are sealed by using the liquid glue, so that the molding period can be shortened, and the material cost can be effectively reduced by sealing by using the liquid glue.
Of course, the manufacturing process provided by the invention is not only suitable for front side glue filling of the IC packaging structure, but also suitable for back side glue filling of the IC packaging structure.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures made by the description of the invention and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the scope of the invention.
Claims (8)
1. An IC package structure encapsulated by liquid glue, which is characterized in that:
including frame (7), integrated into one piece base island (1) on frame (7), pin (2), wafer (3), wire (4), plastic envelope glue (5) injection molding fixed connection base island (1) and pin (2), wafer (3) bond on base island (1) face through the heat conduction glue, wire (4) bond connection wafer (3) and pin (2), plastic envelope glue (5) intraoral embedment solidification of base island (1) injection molding all around has liquid glue (6) on sealed wafer (3) and base island (1) surface.
2. The liquid glue encapsulated IC package structure of claim 1, wherein: the lead (4) is a copper wire.
3. The liquid glue encapsulated IC package structure of claim 1, wherein: the lead (4) is a gold wire.
4. The liquid glue encapsulated IC package structure of claim 1, wherein: the lead (4) is a silver wire.
5. The liquid glue encapsulated IC package structure of claim 1, wherein: each liquid glue encapsulated IC packaging structure comprises at least one base island (1).
6. The liquid glue encapsulated IC package structure of claim 5, wherein: the outer surface of the liquid glue (6) is the upper top surface of the IC packaging structure encapsulated by the liquid glue.
7. The liquid glue encapsulated IC package structure of claim 5, wherein: the outer surface of the liquid glue (6) is the lower bottom surface of the IC packaging structure encapsulated by the liquid glue.
8. The process for manufacturing the liquid glue-encapsulated IC package structure as claimed in claim 6 or 7, wherein: the method comprises the following steps:
s1, forming a needed base island (1) and a needed pin (2) by a stamping frame (7);
s2, fixing the pins (2) and the base island (1) by using plastic packaging glue (5) through an injection molding process;
s3, partially separating the frame (7), the pins (2) and the base island (1) through die stamping;
s4, coating heat-conducting glue on the base island (1), and fixing the wafer (3) on the base island (1);
s5, connecting the wafer (3) with each pin (2) through a wire (4) in a bonding process;
s6, dripping liquid glue (6) into a plastic packaging glue (5) port of injection molding around the base island (1) through a glue dispenser, and sealing the base island (1) and the wafer (3) after the liquid glue (5) is solidified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311771400.8A CN117577593A (en) | 2023-12-21 | 2023-12-21 | IC packaging structure and process for encapsulating with liquid glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311771400.8A CN117577593A (en) | 2023-12-21 | 2023-12-21 | IC packaging structure and process for encapsulating with liquid glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117577593A true CN117577593A (en) | 2024-02-20 |
Family
ID=89888223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311771400.8A Pending CN117577593A (en) | 2023-12-21 | 2023-12-21 | IC packaging structure and process for encapsulating with liquid glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117577593A (en) |
-
2023
- 2023-12-21 CN CN202311771400.8A patent/CN117577593A/en active Pending
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