CN117551992A - 一种化学镀金溶液及其镀金工艺 - Google Patents
一种化学镀金溶液及其镀金工艺 Download PDFInfo
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- CN117551992A CN117551992A CN202311541943.0A CN202311541943A CN117551992A CN 117551992 A CN117551992 A CN 117551992A CN 202311541943 A CN202311541943 A CN 202311541943A CN 117551992 A CN117551992 A CN 117551992A
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- 239000010931 gold Substances 0.000 title claims abstract description 89
- 238000007747 plating Methods 0.000 title claims abstract description 88
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 87
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 8
- 239000008139 complexing agent Substances 0.000 claims abstract description 8
- 230000000873 masking effect Effects 0.000 claims abstract description 5
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract 6
- WJFYXDJAFDTXDE-UHFFFAOYSA-K gold(3+);2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Au+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WJFYXDJAFDTXDE-UHFFFAOYSA-K 0.000 claims abstract 2
- 150000002500 ions Chemical class 0.000 claims abstract 2
- MUBZPKHOEPUJKR-UHFFFAOYSA-N oxalic acid group Chemical group C(C(=O)O)(=O)O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 21
- 238000005406 washing Methods 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 230000008021 deposition Effects 0.000 claims description 11
- 230000003213 activating effect Effects 0.000 claims description 9
- 238000005488 sandblasting Methods 0.000 claims description 8
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical group [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims description 8
- 238000000227 grinding Methods 0.000 claims description 7
- 235000006408 oxalic acid Nutrition 0.000 claims description 7
- 238000005554 pickling Methods 0.000 claims description 7
- 238000001556 precipitation Methods 0.000 claims description 7
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Natural products NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 6
- 230000004913 activation Effects 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 239000004471 Glycine Substances 0.000 claims description 4
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 claims description 4
- ISAKRJDGNUQOIC-UHFFFAOYSA-N Uracil Chemical compound O=C1C=CNC(=O)N1 ISAKRJDGNUQOIC-UHFFFAOYSA-N 0.000 claims description 4
- 235000010265 sodium sulphite Nutrition 0.000 claims description 4
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 3
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical group [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 238000005238 degreasing Methods 0.000 claims description 3
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 3
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 2
- 125000003630 glycyl group Chemical group [H]N([H])C([H])([H])C(*)=O 0.000 claims description 2
- 229960003512 nicotinic acid Drugs 0.000 claims description 2
- 235000001968 nicotinic acid Nutrition 0.000 claims description 2
- 239000011664 nicotinic acid Substances 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 229940035893 uracil Drugs 0.000 claims description 2
- 239000002671 adjuvant Substances 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 13
- 238000005260 corrosion Methods 0.000 abstract description 13
- 238000004381 surface treatment Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 41
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical group S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 26
- 238000000151 deposition Methods 0.000 description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- 239000007921 spray Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005237 degreasing agent Methods 0.000 description 4
- 239000013527 degreasing agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012190 activator Substances 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 229910003298 Ni-Ni Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1806—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by mechanical pretreatment, e.g. grinding, sanding
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
本发明公开了一种化学镀金溶液及其镀金工艺,属于表面处理技术领域。公开的化学镀金溶液,按质量浓度计包括以下组分:柠檬酸金(以Au离子的含量计)为0.5g/L、柠檬酸5‑20.0g/L、还原剂5‑40.0g/L、掩蔽剂2‑15.0g/L、络合剂1‑15.0g/L、辅助剂0.1‑1.0g/L和加速剂0.1‑5.0g/L,镀金溶液pH为5.0‑6.0,控制镀金溶液正常工作时温度在78‑85℃。通过本发明限定的一种半置换半还原的化学镀金溶液,既保证了化学镀金溶液的稳定性,不易分解;还减少了其对镍层的腐蚀。
Description
技术领域
本发明涉及表面处理技术领域,更具体的说是涉及一种化学镀金溶液及其镀金工艺。
背景技术
目前,在线路板制造过程中,为了提高铜表面的抗腐蚀能力,一般的表面处理会在铜表面形成一层表面防护层,电镀镍金,OSP,化学镀锡或化学镀镍金。
其中,采用无氰溶液进行电镀镍金,在电镀的时候容易出现空洞、夹缝等缺陷,导致镀层表面不平整,达不到均镀的效果,且镀液的稳定性以及电流效率也不是很理想;
而化学镀镍金不需要电流,且操作简单,镀层化学性质稳定,镀层均匀,抗腐蚀能力强,焊接性能优异,所以被广泛使用。
线路板的铜表面,一般经过除油、微蚀、钯活化等前处理制程后,先进行化学镀镍,然后化学镀金。反应原理如下:
阳极反应 Ni→Ni2++2e- (E0=-0.25V)
阴极反应 Au(CN)2-+e-→Au+2CN- (E0=0.6V)
全反应 Ni+2Au(CN)2 -→Ni2++2Au+4CN-
该置换型化学镀金溶液配比简单,使用周期长,溶液稳定不会发生分解,维护方便。但由于置换型化学镀金溶液对电镀的镍层有不同程度的腐蚀作用,所以镍层会受到损害,降低了防护效果,所得产品在进行盐雾测试时判定不合格。
传统化学镀金溶液都是置换型化学镀金,对镍层有强烈的腐蚀作用,
因此,提供一种既有置换镀金溶液的优势,又可以减少对镍层腐蚀的方法,是本领域技术人员亟需解决的问题。
发明内容
有鉴于此,本发明提供了一种化学镀金溶液及其镀金工艺,克服了传统化学镀金过程中会对镍层的腐蚀,提高了产品的可靠性。
为了实现上述目的,本发明采用如下技术方案:
一种化学镀金溶液,每升镀金溶液中按质量计包括以下组分:
将上述组分按照配比均匀混合后,采用pH调节剂调节溶液pH至5.0-6.0;
其中,所述镀金溶液正常工作时温度为78-85℃。
上述技术方案达到的有益效果为:通过本发明限定的上述一种半置换半还原的化学镀金溶液,可以减少了对镍层的攻击,提高了产品的可靠性。
优选的,所述pH调节剂为硫酸或烧碱。
优选的,在所述镀金溶液中所述还原剂、络合剂、辅助剂和加速剂的质量浓度之比为20:10:0.1:0.1。
优选的,所述还原剂为草酸。
上述技术方案达到的有益效果为:本发明用草酸作为原料,既可作为还原剂,也可作为络合剂。草酸的质量浓度限定为5-20g/L;若草酸的质量浓度低于5g/L时,会使得沉金速度变慢;若高于20g/L时没有实际意义,并产生浪费。
优选的,所述络合剂为亚硫酸钠。
上述技术方案达到的有益效果为:本发明使用草酸和亚硫酸钠作为镀金溶液中的络合剂,避免使用有毒的氰化物,极大的降低了生产工艺过程中的不安全因素。其中,亚硫酸钠的浓度范围:1-15.0g/L,若低于1.0g/L,溶液不稳定,有金粉析出;若高于15.0g/L时没有实际意义,并产生浪费。
优选的,所述辅助剂为含有环状结构的化合物。
上述技术方案达到的有益效果为:含有环状结构的化合物作为镀液的辅助成分,减少对镍层的攻击;其质量浓度低于0.1g/L时,镍层有腐蚀状况,高于1.0g/L时会降低沉金的速率。
优选的,所述化合物为烟酸、尿嘧啶和苯并咪唑中的一种或是多种。
优选的,所述加速剂为甘氨酸。
上述技术方案达到的有益效果为:若甘氨酸的质量浓度低于0.1g/L时,沉金速率慢,高于5.0g/L时没有实际意义,并产生浪费。
优选的,所述掩蔽剂为EDTA二钠。
上述技术方案达到的有益效果为:EDTA二钠作为铜离子的掩蔽剂;其质量浓度低于2.0g/L时,镍层的腐蚀严重;高于15.0g/L没有实际意义,并产生浪费。
为实现上述目的,本发明还提供了另一技术方案:
一种镀金工艺,包括以下步骤:
(1)预处理:将印制电路板依次进行磨板、喷砂、除油,酸洗;
(2)活化:将步骤(1)预处理后的印制电路板浸渍再活化剂中进行活化;
(3)化学沉镍:将步骤(2)活化后的印制电路板进行沉镍、水洗;
(4)化学沉金:将步骤(3)沉镍后的印制电路板浸渍在上述化学镀金溶液中进行沉金。
优选的,步骤(1)所述预处理具体包括以下步骤
11)磨板喷砂:将印制电路板磨板,喷砂;
12)除油:用酸性除油剂或碱性除油剂对步骤11)处理后的印制电路板清洗,之后水洗;
13)酸洗:将步骤12)处理后的印制电路板浸渍在过硫酸钠和硫酸的混合液中进行微蚀,后水洗;再浸渍在硫酸溶液中进行酸,后水洗;
优选的,步骤(2)所述活化具体包括以下步骤:
21)预浸酸:将步骤(1)中预处理后的印制电路板浸渍在硫酸中;
22)活化:将步骤(21)中预浸酸的印制电路板浸渍在含钯的活化剂溶液中进行活化,之后水洗;
23)后浸酸:将步骤(22)中活化后的印制电路板浸渍在硫酸中,之后水洗。
上述技术方案达到的有益效果为:线路板铜表面,形成了一层含钯的催化层,以便在镍缸缸中发生自催化化学反应,沉积上镍。
进一步,所述步骤22)中所述含钯的活化剂为斯美特公司生产的S-32活化剂。
优选的,步骤(4)所述沉金时间10-20min,沉金温度78-85℃。
经由上述的技术方案可知,与现有技术相比,本发明公开提供了一种化学镀金溶液及其镀金工艺,具有以下有益效果:
1.本发明化学镀金溶液可以长期使用,稳定性好。
2.本发明限定的半还原半置换化学镀金溶液在化学镀金过程中降低了对镍层的攻击,进而增强了镀层抗盐雾能力;沉积速率可以达到0.05μm/10min。
3.本发明用草酸作为还原剂,用含有环状结构的化合物镀液的辅助成分,减少对镍层的攻击,增强了抗盐雾测试能力,提高了镀层的可靠性。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据提供的附图获得其他的附图。
图1附图为本发明实施例1镀层剥金后SEM图。
图2附图为本发明对比例1镀层剥金后SEM图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明公开了一种化学镀金溶液,按质量浓度计包括以下组分:
镀金溶液正常工作时PH值:5.0-6.0;温度为78-85℃。
一种高稳定性的半置换半还原型化学镀金工艺,具体包括以下步骤:
(1)磨板喷砂:将印制电路板磨板,喷砂;
(2)除油:碱性除油剂S-01T(斯美特公司生产)对印制电路板清洗,之后水洗;
(3)微蚀:将步骤(2)中处理后的印制电路板浸渍在过硫酸钠80-120g/L和2-4%硫酸的混合液中,之后水洗;
(4)酸洗:将步骤(3)中处理后的印制电路板浸渍在5%(V/V)硫酸溶液中,之后水洗;
(5)预浸酸:将步骤(4)中处理后的印制电路板浸渍在硫酸1-2%(V/V)中;
(6)活化:将步骤(5)中预浸酸后的印制电路板浸渍在S-32活化剂(斯美特公司生产)溶液中活化,之后水洗;
(7)后浸酸:将步骤(6)中处理后的印制电路板浸渍在2-3%(V/V)硫酸中,之后水洗;
(8)化学沉镍:将步骤(7)中处理后的印制电路板浸渍在化学镍SEN-33体系中(斯美特公司生产),沉镍,之后水洗;
(9)化学沉金:将步骤(8)中处理后的印制电路板浸渍在上述镀金溶液中,沉金时间15min,温度78-85℃。
实施例1
化学沉金配方组分如下:
一种高稳定性的半置换半还原型化学镀金工艺,具体包括以下步骤:
(1)磨板喷砂:将FPC线路板磨板,喷砂;
(2)除油:碱性除油剂S-01T(斯美特公司生产)对印制电路板清洗,之后水洗;
(3)微蚀:将步骤(2)中处理后的印制电路板浸渍在过硫酸钠80-120g/L和2-4%硫酸的混合液中,之后水洗;
(4)酸洗:将步骤(3)中处理后的印制电路板浸渍在5%(V/V)硫酸溶液中,之后水洗;
(5)预浸酸:将步骤(4)中处理后的印制电路板浸渍在1-2%(V/V)硫酸中;
(6)活化:将步骤(5)中预浸酸后的印制电路板浸渍在S-32活化剂(斯美特公司生产)溶液中活化,之后水洗;
(7)后浸酸:将步骤(6)中处理后的印制电路板浸渍在2-3%(V/V)硫酸中,之后水洗;
(8)化学沉镍:将步骤(7)中处理后的印制电路板浸渍在化学镍SEN-33体系中(斯美特公司生产),沉镍,之后水洗;
(9)化学沉金:将步骤(8)中处理后的印制电路板浸渍在上述镀金溶液中,沉金时间15min,温度78-85℃。
测试结果:沉积速率0.05μm/10min,盐雾测试合格,剥金无腐蚀。
备注:本发明具体实施方式中涉及到的性盐雾测试标准为:5%NaCl溶液,PH值6.5-7.2,35±2℃。
对比例1除化学沉金配方组分不同外,其他条件同实施例1。其化学沉金配方组分如下:
测试结果:沉积速率慢0.03μm/10min,剥金有腐蚀,具体详见图2,镍面有明显的腐蚀。
对比例2除化学沉金配方组分不同外,其他条件同实施例1。其化学沉金配方组分如下:
测试结果:有金颗粒从溶液中析出,镀液不稳定。
对比例3除化学沉金配方组分不同外,其他条件同实施例1。其化学沉金配方组分如下:
测试结果:沉积速率0.05μm/10min,剥金有轻微腐蚀,盐雾试验不合格。
对比例4除化学沉金配方组分不同外,其他条件同实施例1。其化学沉金配方组分如下:
测试结果:沉积速率0.04μm/10min,速率偏慢,盐雾测试合格。剥金无腐蚀。
本说明书中各个实施例采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似部分互相参见即可。对于实施例公开的装置而言,由于其与实施例公开的方法相对应,所以描述的比较简单,相关之处参见方法部分说明即可。
对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下,在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。
Claims (10)
1.一种化学镀金溶液,其特征在于,每升溶液中按质量计包括以下组分:
柠檬酸金,以Au离子的含量计为0.5g
柠檬酸5-20.0g
还原剂5-40.0g
掩蔽剂2-15.0g
络合剂1-15.0g
辅助剂0.1-1.0g
加速剂0.1-5.0g
将上述组分按照配比混合均匀后,调节溶液pH至5.0-6.0。
2.根据权利要求1所述的一种化学镀金溶液,其特征在于,在所述化学镀金溶液正常工作时,所述还原剂、络合剂、辅助剂和加速剂的质量浓度之比为20:10:0.1:0.1。
3.根据权利要求1所述的一种化学镀金溶液,其特征在于,所述还原剂为草酸。
4.根据权利要求1所述的一种化学镀金溶液,其特征在于,所述络合剂为亚硫酸钠。
5.根据权利要求1所述的一种化学镀金溶液,其特征在于,所述辅助剂为含环状结构的化合物。
6.根据权利要求5所述的一种化学镀金溶液,其特征在于,所述含环状结构的化合物为烟酸、尿嘧啶和苯并咪唑中的一种或多种。
7.根据权利要求1所述的一种化学镀金溶液,其特征在于,所述加速剂为甘氨酸。
8.根据权利要求1所述的一种化学镀金溶液,其特征在于,所述掩蔽剂为EDTA二钠。
9.一种镀金工艺,其特征在于,包括以下步骤:
(1)预处理:将印制电路板依次进行磨板、喷砂、除油、酸洗;
(2)活化:将预处理后的印制电路板浸渍在活化剂中进行活化;
(3)化学沉镍:将活化后的印制电路板在化学镍体系进行沉镍、水洗;
(4)化学沉金:将化学沉镍后的印制电路板浸渍在上述权利要求1-8任一项所述化学镀金溶液中进行沉金。
10.根据权利要求9所述的一种镀金工艺,其特征在于,步骤(4)所述沉金时间10-20min,沉金温度78-85℃。
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