CN117549624A - 一种用于单双玻TOPcon组件聚烯烃封装膜及其制备方法 - Google Patents
一种用于单双玻TOPcon组件聚烯烃封装膜及其制备方法 Download PDFInfo
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Abstract
本发明涉及一种用于单双玻TOPcon组件聚烯烃封装膜,所述聚烯烃封装膜包括依次层叠的POE层、粘结层和EVA层;所述粘结层原料组成包括结构式I所示的超支化聚酰亚胺聚合物,其主链以三嗪结构为位点与聚酰亚胺链段连接,而支链则在三嗪结构上分别连接有PEG链段和聚硅氧烷链段;所述POE层、粘结层和EVA层中的至少一个膜层原料还包括功能助剂。本发明用于单双玻TOPcon组件聚烯烃封装膜,兼具POE和EVA材料优点,同时其兼具耐湿热老化和抗PID等性能,使其可满足单双玻TOPcon组件在长期恶劣条件下的封装性能要求。
Description
技术领域
本发明涉及光伏的技术领域,尤其涉及一种用于单双玻TOPcon组件聚烯烃封装膜及其制备方法。
背景技术
TOPcon太阳能电池作为一种新型太阳能电池,已经成为近年来光伏领域的新热点。光伏组件可分为单玻组件和双玻组件。双玻组件采用全新的封装方式相对于传统的单玻组件在性能方面表现出一系列的优势,是未来光伏组件的发展方向。双玻组件的结构可以承载各种电池技术,新型的双面电池技术对封装材料有特殊的需求。目前来说光伏组件的封装一般采用EVA或POE薄膜,其中POE各方面综合性能优于EVA,但成本较高。现在一般把EVA和POE做成共挤胶膜以此降低成本;然而,强行把非极性POE和极性EVA共挤在一起,老化后层与层之间的粘结力会降低,容易产生分层,导致光伏组件可靠性降低;同时,老化后易发生降解释放酸性物质,导致腐蚀TOPcon组件元器件而无法通过PID测试。
发明内容
鉴于以上现有技术的不足之处,本发明一方面提供了一种用于单双玻TOPcon组件聚烯烃封装膜,以解决现有TOPcon组件封装膜无法兼具耐湿热老化和抗PID等性能的问题,使其同时可满足单双玻TOPcon组件在长期恶劣条件下的封装性能要求。
为达到以上目的,本发明采用的技术方案为:
一种用于单双玻TOPcon组件聚烯烃封装膜,所述聚烯烃封装膜包括依次层叠的POE层、粘结层和EVA层;所述粘结层原料组成包括结构式I所示的超支化聚酰亚胺聚合物,
式中,所述R1为聚酰亚胺链段,R2为PEG链段,R3为聚硅氧烷链段,所述a和b独立地为自然数10~30;所述POE层、粘结层和EVA层中的至少一个膜层原料还包括功能助剂。本发明聚烯烃封装膜通过结构式I所示的超支化聚酰亚胺聚合物作为粘结层原料,将POE层和EVA层复合成一体,相对于现行把非极性POE和极性EVA共挤在一起制备得到的封装膜,本发明聚烯烃封装膜耐老化性能优越,长期使用后层与层之间的粘结力不会明显降低,不容易发生分层现象,导致光伏组件可靠性降低。本发明粘结层原料组成包括结构式I所示的超支化聚酰亚胺聚合物,其主链以三嗪结构为位点与聚酰亚胺链段连接,而支链则在三嗪结构上分别连接有PEG链段和聚硅氧烷链段。本发明粘结层原料通过聚酰亚胺链段、PEG链段和聚硅氧烷链段的协同作用,使其与POE层和EVA层具有优异的粘性性能;并且由于引入了三嗪结构,进一步有效提高了本发明聚烯烃封装膜的耐湿热老化性能。
作为优选,所述超支化聚酰亚胺聚合物的合成路径:先由2,4,6-三氯-1,3,5-三嗪和端胺基聚酰亚胺在冰浴条件下进行聚合反应,得到聚合物主链;然后加入极性基团封端的PEG-NH2和三烷氧基硅烷基苯胺升温进行加热反应,再经水解反应后最终得到所述超支化聚酰亚胺聚合物。
作为优选,所述2,4,6-三氯-1,3,5-三嗪和端胺基聚酰亚胺的摩尔比为1:1;所述极性基团封端的PEG-NH2和三烷氧基硅烷基苯胺的摩尔比为1:1。
作为优选,所述端胺基聚酰亚胺由4,4-六氟异丙基邻苯二甲酸酐和4,4’-二氨基二苯醚单体反应得到。
作为优选,所述极性基团封端的NH2-PEG为NH2-PEG-NH2(双端氨基聚乙二醇)、NH2-PEG-OH(氨基PEG羟基)、NH2-PEG-CH2CH2COOH(氨基PEG丙酸)、NH2-PEG-Mal(氨基PEG马来酰亚胺)中的至少一种。本发明极性基团封端的NH2-PEG,PEG(中文名称,聚乙二醇)一端连接的氨基可与三嗪结构上的氯原子进行取代反应,使得超支化聚酰亚胺聚合物接枝有极性基团封端的PEG。进一步,通过极性基团封端的NH2-PEG的引入,使粘结层与极性EVA层具有良好的相容性,进一步保证了光伏组件长期稳定的封装效果。本发明极性基团封端的NH2-PEG的引入,有利于抑制或吸收EVA层老化降解酸性物质的释放,从而保证TOPcon组件顺利通过PID测试,保证了光伏组件长期稳定的大功率输出。
作为优选,所述三烷氧基硅烷基苯胺为4-(三乙氧基硅烷基)苯胺、3-[3-(三甲氧基硅烷基)丙氧基]苯胺、4-(三甲氧基硅烷基)-苯胺中的至少一种。本发明的三烷氧基硅烷基苯胺,其带有的胺基官能团可与三嗪结构上的氯原子进行取代反应,使得超支化聚酰亚胺聚合物接枝有三烷氧基硅烷基,该三烷氧基硅烷基可进一步水解得到聚硅氧烷链段。
作为优选,所述POE层原料组成包括聚烯烃树脂和改性聚烯烃树脂。所述聚烯烃树脂包括乙烯-丙烯共聚物、乙烯-1-丁烯共聚物、乙烯-1-辛烯共聚物、乙烯-异丁烯共聚物、乙烯-1-己烯共聚物、乙烯-1-庚烯共聚物、乙烯-1-壬烯共聚物或乙烯-1-癸烯共聚物中的至少一种。
作为优选,所述改性聚烯烃树脂由POE、交联剂、助交联剂和硅烷偶联剂改性反应得到。本发明聚烯烃树脂通过硅烷偶联剂进行改性,使得POE层与粘结层中的超支化聚酰亚胺聚合物具有优异的相容性能,进一步保证了光伏组件长期稳定的封装效果。
作为优选,所述功能助剂为抗氧剂、紫外线吸收剂和紫外线稳定剂中的至少一种。
本申请的另外一方面是提供一种如上述的用于单双玻TOPcon组件聚烯烃封装膜的制备方法,所述制备方法包括以下步骤:将POE层、粘结层和EVA层中的至少一种母粒与功能助剂进行混合,再采用双螺杆挤出机分别将POE层、粘结层和EVA层原料熔融挤出制备得到POE层母粒、粘结层母粒和EVA层母粒;然后依次将POE层母粒、粘结层母粒和EVA层母粒进行流延,即可制备得到所述用于单双玻TOPcon组件聚烯烃封装膜。
与现有技术相比,本发明的有益效果为:
本发明的聚烯烃封装膜,兼具POE和EVA材料作为TOPcon光伏组件封装薄膜的优点。采用以结构式I所示的超支化聚酰亚胺聚合物作为粘结层原料,将POE层和EVA层复合成一体,封装膜不易分层,有利提高了TOPcon组件聚烯烃封装膜的耐湿热老化性能,同时提高了其抗PID性能,并可保证光伏组件长期稳定的大功率输出。
本发明的聚烯烃封装膜可用于单双玻TOPcon组件,具有高可靠,长寿命的使用性能,可满足单双玻TOPcon组件在长期恶劣条件下的封装性能要求。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。
实施例1
本实施例的用于单双玻TOPcon组件聚烯烃封装膜,所述聚烯烃封装膜包括依次层叠的POE层、粘结层和EVA层;所述粘结层原料组成包括结构式I所示的超支化聚酰亚胺聚合物,
式中,所述R1为聚酰亚胺链段,R2为PEG链段,R3为聚硅氧烷链段,所述a和b独立地均为自然数15;所述EVA层原料组成包括质量比100:1的EVA树脂和功能助剂。所述POE层原料组成包括质量比的70:30:1的聚烯烃树脂(乙烯-1-丁烯共聚物)、改性聚烯烃树脂和功能助剂。所述功能助剂由质量比为5:2:2的抗氧剂(亚磷酸三(2,4-二叔丁苯基)酯)、紫外线吸收剂(2-羟基-4-正辛氧基二苯甲酮)和紫外线稳定剂(癸二酸双-2,2,6,6-四甲基哌啶醇酯)组成;所述功能助剂在POE层和EVA层的添加量为0.5wt%。所述改性聚烯烃树脂由质量比为100:1:0.5:0.5的POE(乙烯-1-丁烯共聚物)、交联剂(过氧化苯甲酸叔丁酯)、助交联剂(氰尿酸三烯丙酯)和硅烷偶联剂(乙烯基三甲氧基硅烷)升温至120℃进行改性反应得到。
所述超支化聚酰亚胺聚合物的合成路径:先将2,4,6-三氯-1,3,5-三嗪(8mmol)、端胺基聚酰亚胺(8mmol)和N,N-二异丙基乙胺(15mmol)加入到100mL的THF溶剂中,在10℃条件下进行反应12h,得到聚合物主链;然后在真空反应釜中,加入NH2-PEG-OH(氨基PEG羟基)(4mmol)和4-(三乙氧基硅烷基)苯胺(4mmol)升温至80℃进行加热反应8h,再经水解反应后最终得到所述超支化聚酰亚胺聚合物。
所述端胺基聚酰亚胺的制备:将4,4-六氟异丙基邻苯二甲酸酐(4mmol)和4,4’-二氨基二苯醚(6mmol)单体在装有甲苯溶剂的反应釜,升温至170℃进行反应8h,得到目标产物,即端胺基聚酰亚胺。
本实施例用于单双玻TOPcon组件聚烯烃封装膜的制备方法,其包括以下步骤:先将包括聚烯烃树脂、改性聚烯烃树脂和功能助剂的POE层原料进行混合,再采用双螺杆挤出机将POE层原料经90℃熔融挤出制备得到POE层母粒;其次,将包括EVA树脂和功能助剂的EVA层原料进行混合,同样采用双螺杆挤出机将EVA层原料经90℃熔融挤出制备得到EVA层母粒;最后依次将POE层母粒、粘结层母粒和EVA层母粒进行流延,即可制备得到所述用于单双玻TOPcon组件聚烯烃封装膜;得到POE层、粘结层和EVA层厚度分别为0.5mm、0.2mm和0.5mm。
实施例2
本实施例的用于单双玻TOPcon组件聚烯烃封装膜,所述聚烯烃封装膜包括依次层叠的POE层、粘结层和EVA层;所述粘结层原料组成包括结构式I所示的超支化聚酰亚胺聚合物,
式中,所述R1为聚酰亚胺链段,R2为PEG链段,R3为聚硅氧烷链段,所述a和b独立地为自然数15;所述EVA层原料组成包括质量比100:1的EVA树脂和功能助剂。所述POE层原料组成包括质量比的70:30:1的聚烯烃树脂(乙烯-异丁烯共聚物)、改性聚烯烃树脂和功能助剂。所述功能助剂同实施例1。所述改性聚烯烃树脂与实施例1不同之处在于POE为乙烯-异丁烯共聚物。
所述超支化聚酰亚胺聚合物的合成路径:先将2,4,6-三氯-1,3,5-三嗪(8mmol)、端胺基聚酰亚胺(8mmol)和N,N-二异丙基乙胺(15mmol)加入到100mL的THF溶剂中,在10℃条件下进行反应12h,得到聚合物主链;然后在真空反应釜中,加入NH2-PEG-NH2(双端氨基聚乙二醇)(4mmol)和3-[3-(三甲氧基硅烷基)丙氧基]苯胺(4mmol)升温至80℃进行加热反应8h,再经水解反应后最终得到所述超支化聚酰亚胺聚合物。
所述端胺基聚酰亚胺的制备同实施例1。本实施例用于单双玻TOPcon组件聚烯烃封装膜的制备方法同实施例1。
实施例3
本实施例的用于单双玻TOPcon组件聚烯烃封装膜,所述聚烯烃封装膜包括依次层叠的POE层、粘结层和EVA层;所述粘结层原料组成包括结构式I所示的超支化聚酰亚胺聚合物,
式中,所述R1为聚酰亚胺链段,R2为PEG链段,R3为聚硅氧烷链段,所述a和b独立地为自然数15;所述EVA层原料组成包括质量比100:1的EVA树脂和功能助剂。所述POE层原料组成包括质量比的70:30:1的聚烯烃树脂(乙烯-1-己烯共聚物)、改性聚烯烃树脂和功能助剂。所述功能助剂同实施例1。所述改性聚烯烃树脂与实施例1不同之处在于POE为乙烯-1-己烯共聚物。
所述超支化聚酰亚胺聚合物的合成路径:先将2,4,6-三氯-1,3,5-三嗪(8mmol)、端胺基聚酰亚胺(8mmol)和N,N-二异丙基乙胺(15mmol)加入到100mL的THF溶剂中,在10℃条件下进行反应12h,得到聚合物主链;然后在真空反应釜中,加入NH2-PEG-Mal(氨基PEG马来酰亚胺)(4mmol)和4-(三甲氧基硅烷基)-苯胺(4mmol)升温至80℃进行加热反应8h,再经水解反应后最终得到所述超支化聚酰亚胺聚合物。
所述端胺基聚酰亚胺的制备同实施例1。本实施例用于单双玻TOPcon组件聚烯烃封装膜的制备方法同实施例1。
将实施例1~3制备得到的聚烯烃封装膜进行性能测试,其性能结果如表1所示:
其中,透光率、剥离强度和耐湿热老化性能按照GB/T29848进行测试;抗PID性能的测试条件为85℃、85RH%,并通过施加-1000V电压进行测试,1000h后测试其PID功率衰减率。
表1
由此可见,本发明专利相比目前使用的技术具有相当大的优势。以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是本发明的原理,在不脱离本发明精神和范围的前提下本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明的范围内。
Claims (10)
1.一种用于单双玻TOPcon组件聚烯烃封装膜,其特征在于,所述聚烯烃封装膜包括依次层叠的POE层、粘结层和EVA层;所述粘结层原料组成包括结构式I所示的超支化聚酰亚胺聚合物,
式中,所述R1为聚酰亚胺链段,R2为PEG链段,R3为聚硅氧烷链段,所述a和b独立地为自然数10~30;
所述POE层、粘结层和EVA层中的至少一个膜层原料还包括功能助剂。
2.如权利要求1所述的用于单双玻TOPcon组件聚烯烃封装膜,其特征在于,所述超支化聚酰亚胺聚合物的合成路径:先由2,4,6-三氯-1,3,5-三嗪和端胺基聚酰亚胺在冰浴条件下进行聚合反应,得到聚合物主链;然后加入极性基团封端的PEG-NH2和三烷氧基硅烷基苯胺升温进行加热反应,再经水解反应后最终得到所述超支化聚酰亚胺聚合物。
3.如权利要求2所述的用于单双玻TOPcon组件聚烯烃封装膜,其特征在于,所述2,4,6-三氯-1,3,5-三嗪和端胺基聚酰亚胺的摩尔比为1:1;所述极性基团封端的PEG-NH2和三烷氧基硅烷基苯胺的摩尔比为1:1。
4.如权利要求2所述的用于单双玻TOPcon组件聚烯烃封装膜,其特征在于,所述端胺基聚酰亚胺由4,4-六氟异丙基邻苯二甲酸酐和4,4’-二氨基二苯醚单体反应得到。
5.如权利要求2所述的用于单双玻TOPcon组件聚烯烃封装膜,其特征在于,所述极性基团封端的NH2-PEG为NH2-PEG-NH2(双端氨基聚乙二醇)、NH2-PEG-OH(氨基PEG羟基)、NH2-PEG-CH2CH2COOH(氨基PEG丙酸)、NH2-PEG-Mal(氨基PEG马来酰亚胺)中的至少一种。
6.如权利要求2所述的用于单双玻TOPcon组件聚烯烃封装膜,其特征在于,所述三烷氧基硅烷基苯胺为4-(三乙氧基硅烷基)苯胺、3-[3-(三甲氧基硅烷基)丙氧基]苯胺、4-(三甲氧基硅烷基)-苯胺中的至少一种。
7.如权利要求1所述的用于单双玻TOPcon组件聚烯烃封装膜,其特征在于,所述POE层原料组成包括聚烯烃树脂和改性聚烯烃树脂。
8.如权利要求7所述的用于单双玻TOPcon组件聚烯烃封装膜,其特征在于,所述改性聚烯烃树脂由POE、交联剂、助交联剂和硅烷偶联剂改性反应得到。
9.如权利要求1所述的用于单双玻TOPcon组件聚烯烃封装膜,其特征在于,所述功能助剂为抗氧剂、紫外线吸收剂和紫外线稳定剂中的至少一种。
10.一种如权利要求1-9任一项所述的用于单双玻TOPcon组件聚烯烃封装膜的制备方法,其特征在于,所述制备方法包括以下步骤:将POE层、粘结层和EVA层中的至少一种母粒与功能助剂进行混合,再采用双螺杆挤出机分别将POE层、粘结层和EVA层原料熔融挤出制备得到POE层母粒、粘结层母粒和EVA层母粒;然后依次将POE层母粒、粘结层母粒和EVA层母粒进行流延,即可制备得到所述用于单双玻TOPcon组件聚烯烃封装膜。
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