CN117524971A

CN117524971A - Wafer clamping and carrying device

Info

Publication number: CN117524971A
Application number: CN202311845269.5A
Authority: CN
Inventors: 郭庆; 马林; 赵泽通
Original assignee: Maiwei Technology Zhuhai Co ltd
Current assignee: Maiwei Technology Zhuhai Co ltd
Priority date: 2023-12-29
Filing date: 2023-12-29
Publication date: 2024-02-06
Anticipated expiration: 2043-12-29
Also published as: CN117524971B

Abstract

The invention discloses a wafer clamping and carrying device, and belongs to the technical field of semiconductor equipment. The wafer clamping and carrying device comprises: a substrate; each clamping assembly comprises a connecting piece and a clamping piece which are connected, and the connecting piece is connected with the base plate in a sliding manner; the clamping piece is provided with a supporting surface and a limiting surface which are connected in an angle, the supporting surface is used for supporting the bottom surface of the wafer, and clamping spaces for accommodating the wafer are defined between the limiting surfaces of the clamping pieces; the rotary driving assembly comprises a rotary driving mechanism and a turntable; a plurality of links spaced about the first axis; one end of the connecting rod is hinged with the turntable, and the other end of the connecting rod is hinged with the adapter; the rotary driving assembly is used for driving the connecting rods to swing so as to drive the clamping assemblies to move towards or away from the first axis. The wafer clamping and conveying device can convey the wafer from the front surface of the wafer, and the clamping pieces shrink from outside to inside to position and clamp the wafer, so that the front surface of the wafer is not damaged.

Description

Wafer clamping and carrying device

Technical Field

The invention relates to the technical field of semiconductor equipment, in particular to a wafer clamping and conveying device.

Background

In semiconductor manufacturing, wafers need to be transferred between various processes/stations, such as during wafer packaging and testing.

In the related art, the wafer is generally transported by means of a robot arm such as lifting the back of the wafer, adsorbing the front of the wafer, etc., but in some processes, the robot arm is not suitable for directly lifting or adsorbing the wafer from the back of the wafer, and is also unsuitable for adsorbing the wafer on the front of the wafer. For example, in some processing procedures, a bare wafer needs to be placed on a spin-coating carrier, and then a layer of adhesive layer is coated on the front surface of the wafer, when the wafer needs to be lifted from the spin-coating carrier, the wafer cannot be lifted or adsorbed directly by the manipulator because the spin-coating carrier blocks the wafer, and the adhesive layer on the front surface of the wafer is damaged when the wafer is conveyed from the front surface by using the bernoulli chuck.

Disclosure of Invention

The aim of the embodiment of the invention is that: a wafer clamping and conveying device is provided, which can carry out the conveying operation on the wafer from the front side of the wafer.

In order to achieve the above purpose, the invention adopts the following technical scheme:

A wafer clamping and handling device, comprising:

a substrate;

a plurality of groups of clamping assemblies arranged at intervals around the first axis of the substrate; each group of clamping assemblies comprises a connecting adapter and a clamping piece, wherein the connecting adapter is connected with the base plate in a sliding manner; the clamping pieces are provided with supporting surfaces and limiting surfaces which are connected in an angle manner, the supporting surfaces are used for supporting the bottom surfaces of the wafers, and clamping spaces for accommodating the wafers are defined among the limiting surfaces of the clamping pieces;

the rotary driving assembly comprises a rotary driving mechanism arranged on the base plate and a turntable connected with the rotary driving mechanism;

a plurality of links spaced around the first axis; one end of the connecting rod is hinged with the turntable, and the other end of the connecting rod is hinged with the adapter;

the rotary driving assembly is used for driving the connecting rods to swing so as to drive the clamping assemblies to move towards or away from the first axis.

Optionally, the adaptor is provided with at least two groups of mounting parts along the radial direction of the substrate; the clamping assembly comprises a fixing piece which is detachably arranged on any one group of installation parts, and the clamping piece is connected with the fixing piece.

Optionally, each set of the mounting parts includes positioning grooves disposed on two sides of the adaptor; the mounting sets up the locating hole, the clamping assembly includes the reference column, the reference column wears to locate the locating hole just the tip of reference column inserts when locating the constant head tank, the reference column with the spacing cooperation of adaptor.

Optionally, an annular clamping groove is formed on the outer side of the clamping piece, and the clamping groove is used for accommodating a wafer; the supporting surface and the limiting surface are groove walls of the clamping groove, and the supporting surface is parallel to the substrate;

the groove wall of the clamping groove further comprises a groove top surface, and the groove top surface is connected with the limiting surface in an angle and is positioned on one side, deviating from the supporting surface, of the limiting surface.

Optionally, the fixing piece comprises a first fixing block and a second fixing block, the adapter piece is clamped between the first fixing block and the second fixing block, and the first fixing block is connected with the second fixing block through a fastener;

the clamping piece is a clamping roller; the clamping assembly comprises a spacer sleeve and a roller shaft; the roller shaft comprises a first shaft part and a second shaft part which are connected, and the first shaft part is connected with the first fixed block or the second fixed block; the spacing sleeve and the clamping roller are sleeved on the first shaft part; the spacer sleeve is positioned between the fixing piece and the clamping roller, the top surface of the clamping roller abuts against the spacer sleeve, the second shaft part protrudes relative to the first shaft part along the radial direction of the roller shaft, and the bottom surface of the clamping roller abuts against the second shaft part.

Optionally, the rotary driving mechanism is a rotary cylinder.

Optionally, the device comprises a limiting block, wherein the limiting block is installed on the adapter;

the adapter is provided with a retraction limiting position, and when the adapter is positioned at the retraction limiting position, the limiting block is abutted against at least one connecting rod.

Optionally, the device comprises an adjusting installation seat and an adjusting column, wherein the adjusting installation seat is installed on the side wall of the adapter, the adjusting column is in threaded connection with the adjusting installation seat, and the limiting block is connected with the adjusting column;

the adjusting column can move relative to the adjusting mounting seat so that the limiting block is close to or far away from the first axis.

Optionally, the device comprises an induction piece, a photoelectric switch and a controller, wherein the rotary driving mechanism is electrically connected with the controller, and the photoelectric switch is electrically connected with the controller;

the induction piece is arranged on the adapter, and the photoelectric switch is arranged on the substrate; the photoelectric switch comprises a light emitting element and a light receiving element, and when the adapter piece slides to the retraction limit position, the sensing piece blocks a light propagation channel between the light emitting element and the light receiving element.

Optionally, the device comprises a dust-proof plate and a plurality of connecting shafts, wherein the base plate is connected with the dust-proof plate; the base plate, the adapter and the connecting rod are all arranged above the dust-proof plate, and the clamping piece is arranged below the dust-proof plate; the dustproof plate is provided with a plurality of strip-shaped holes, the strip-shaped holes extend outwards from inside to outside, one end of the connecting shaft is connected with the adapter, the other end of the connecting shaft penetrates through the strip-shaped holes to be connected with the clamping piece, and when the adapter slides relative to the base plate, the connecting shaft moves along the strip-shaped holes;

the wafer clamping and carrying device comprises a wafer detector arranged above the dust-proof plate, wherein the dust-proof plate is provided with a clearance hole, and the wafer detector is used for sensing whether a wafer exists below the dust-proof plate through the clearance hole.

The beneficial effects of the invention are as follows: the wafer clamping and conveying device can convey the wafer from the front side of the wafer when being applied to wafer conveying, and the rotary motion of the rotary driving mechanism is converted into the linear motion of the clamping assemblies through the arrangement of the connecting rods, so that the clamping pieces can be retracted from outside to inside to position and clamp the wafer, and the front side of the wafer cannot be damaged or polluted.

Drawings

The invention is described in further detail below with reference to the drawings and examples.

FIG. 1 is a schematic front view of a wafer clamping and handling device according to an embodiment of the present invention;

FIG. 2 is a schematic back view of a wafer clamping and transporting apparatus according to an embodiment of the present invention (the dust-proof plate is omitted in the drawing);

FIG. 3 is a schematic diagram of an axial structure of a wafer clamping and transporting apparatus according to an embodiment of the present invention;

FIG. 4 is a schematic view of a wafer holding and transporting apparatus according to an embodiment of the present invention;

FIG. 5 is a second schematic view of a wafer being held by a holding member of the wafer holding and transporting apparatus according to the embodiment of the present invention;

FIG. 6 is a partial cross-sectional view of a clamping assembly according to an embodiment of the present invention;

FIG. 7 is a schematic diagram illustrating an assembly of a clamping assembly and an adapter according to an embodiment of the present invention;

FIG. 8 is a schematic view showing the sliding connection of the adaptor and the substrate according to the embodiment of the invention;

FIG. 9 is a second schematic view of the sliding connection of the adaptor and the substrate according to the embodiment of the invention;

FIG. 10 is a diagram showing the arrangement of the limiting member, the adjusting mounting base and the adjusting column according to the embodiment of the present invention;

FIG. 11 is a diagram showing an arrangement of the sensing piece and the photoelectric switch according to an embodiment of the present invention;

FIG. 12 is a schematic view of the clamping assembly selectively positionable in either mounting position of the adapter according to an embodiment of the present invention;

FIG. 13 is a schematic view of an embodiment of the present invention (two sets of clamping assemblies are shown on the same adapter for illustrating only two mounting positions of the clamping assemblies);

fig. 14 is a schematic view of a positioning column of a clamping assembly according to an embodiment of the invention.

In the figure: 10. a dust-proof plate; 11. a bar-shaped hole; 20. a substrate; 201. a first axis; 30. a clamping assembly; 31. an adapter; 311. a transfer block; 312. a transfer rod; 3121. a mounting part; 32. a clamping member; 321. a clamping groove; 3211. a support surface; 3212. a limiting surface; 3213. a groove top surface; 33. a fixing member; 331. a first fixed block; 332. a second fixed block; 34. positioning columns; 341. a pin body; 342. a pin head; 343. an elastic member; 35. a connecting shaft; 351. a spacer sleeve; 352. a roller shaft; 3521. a first shaft portion; 3522. a second shaft portion; 41. a rotary driving mechanism; 411. a cylinder joint; 42. a turntable; 43. a fixing seat; 50. a connecting rod; 61. a slide block; 62. a slide rail; 71. a limiting block; 72. adjusting the mounting seat; 73. an adjustment column; 81. an induction piece; 82. an optoelectronic switch; 91. a wafer detector; 92. a connecting plate; 100. and (3) a wafer.

Detailed Description

In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.

In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "affixed" and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In practical application, a manipulator is arranged on the back of the wafer, and the wafer is transported in a transportation mode that the manipulator is positioned on the back of the wafer and lifts/adsorbs the wafer from the back of the wafer; or the wafer is conveyed from the front side by adopting a Bernoulli sucker by arranging a sucker device on the back side of the wafer.

However, in some processes, it is not preferable to directly lift or suction the wafer from the back surface of the wafer by using a robot, or to suction the wafer from the front surface of the wafer. For example, in some processing steps involving bare wafer handling, a protective adhesive layer needs to be coated on the wafer surface in advance, and when the wafer is lifted from the spin chuck, the conventional handling method of lifting/adsorbing the wafer from the back of the wafer by a manipulator needs to lift/adsorb the middle position of the back of the wafer, and since the spin chuck is located at the back of the wafer to support the wafer, the wafer cannot be handled from the back of the wafer by the manipulator. In order to avoid damaging or polluting the front surface of the wafer, the handling device is not allowed to directly contact the front surface of the wafer, so that the front surface of the wafer cannot be adsorbed by the Bernoulli chuck in order to avoid damaging a protective adhesive layer on the surface of the wafer. Accordingly, there is a lack of a wafer handling device for handling wafers from the front side of the wafer without damaging or contaminating the front side of the wafer.

In view of this, the present invention provides a wafer clamping and transporting apparatus capable of transporting a wafer 100 from the front side of the wafer 100 without damaging or contaminating the front side of the wafer 100. The wafer clamping and conveying device also has a multi-dimension switching function, and can be compatible with wafers 100 with at least two dimensions.

Referring to fig. 1 to 14, the wafer clamping and transporting apparatus includes a substrate 20, a plurality of groups of clamping assemblies 30, a rotation driving assembly and a plurality of connecting rods 50.

When the wafer 100 is horizontally placed on the carrier (e.g. a spin chuck), the wafer 100 needs to be transported by using the wafer 100 clamping device (the front surface of the wafer 100 is the top surface of the wafer 100, the back surface of the wafer 100 is the bottom surface of the wafer 100), the wafer clamping and transporting device is disposed above the wafer 100, fig. 1 illustrates a top view of the wafer clamping and transporting device, fig. 2 illustrates a bottom view of the wafer clamping and transporting device (the dust-proof plate 10 is omitted in the drawing), and fig. 3 illustrates an isometric view of the wafer 100 clamping device.

The substrate 20 is used to provide each component mounting position, the substrate 20 having a first axis 201, the first axis 201 illustrated in fig. 1 to 3 being a virtual axis of the substrate 20. When the wafer 100 is transported, the substrate 20 is parallel to the wafer 100.

Each set of clamping assemblies 30 includes an adapter 31 and a clamp 32, with the sets of clamping assemblies 30 being spaced about the first axis 201, i.e., the plurality of adapters 31 being spaced about the first axis 201 and the plurality of clamps 32 being spaced about the first axis 201. The adaptor 31 is slidably mounted on the base plate 20 through a sliding assembly, wherein the sliding assembly is a linear sliding assembly, and the adaptor 31 can slide reciprocally along the radial direction of the base plate 20, so that the clamping member 32 can move reciprocally along the radial direction of the base plate 20.

The holder 32 has a support surface 3211 and a stopper surface 3212 connected at an angle, the support surface 3211 is for supporting an edge portion of the bottom surface of the wafer 100, and the stopper surface 3212 is for abutting against the outer periphery of the wafer 100. The limiting surfaces 3212 of the plurality of clamping members 32 define therebetween a clamping space for accommodating the wafer 100, and a broken line circle portion in fig. 2 illustrates the clamping space defined by the plurality of clamping members 32. The plurality of clamping members 32 are adapted to simultaneously move from outside to inside to reduce the clamping space, thereby achieving the clamping of the wafer 100 from outside to inside. In this embodiment, the clamping member 32 is laterally provided with a clamping groove 321, and the supporting surface 3211 and the limiting surface 3212 are two groove surfaces of the clamping groove 321.

The rotation driving assembly includes a rotation driving mechanism 41 and a turntable 42, the rotation driving mechanism 41 is mounted on the substrate 20, and a driving end of the rotation driving mechanism 41 is connected to the turntable 42. The plurality of links 50 are spaced around the first axis 201, and the plurality of links 50 are in one-to-one correspondence with the plurality of adapters 31. The first end of the link 50 is hinged to the turntable 42 and the second end is hinged to the adapter 31.

The rotation driving mechanism 41 is used for driving the turntable 42 to rotate around the first axis 201, so that the turntable 42 drives the plurality of connecting rods 50 to swing simultaneously, and the connecting rods 50 drive the adaptor 31 to slide towards or away from the first axis 201 relative to the substrate 20, so that the adaptor 31 drives the clamping pieces 32 to move towards or away from the first axis 201, and the plurality of clamping pieces 32 simultaneously retract inwards or simultaneously expand outwards.

Referring to fig. 1, the present application takes three groups of clamping assemblies 30 and three connecting rods 50 as an example, and each of the three connecting rods 50 is configured such that one end is mounted on the turntable 42 and the other end is mounted on the adaptor 31 corresponding to the connecting rod 50.

The wafer 100 clamping process of the wafer clamping and transporting apparatus will be described below.

When the rotary driving mechanism 41 drives the turntable 42 to rotate around the first direction, the turntable 42 simultaneously drives the plurality of connecting rods 50 to swing, each connecting rod 50 swings to drive the adaptor 31 connected with the turntable to slide inwards, and the clamping piece 32 serving as the wafer 100 clamping and carrying executing mechanism realizes inward contraction movement, so that the clamping space is reduced, and the clamping and supporting of the wafer 100 are realized. When the rotary driving mechanism 41 drives the turntable 42 to rotate around the second direction, the turntable 42 simultaneously drives the plurality of connecting rods 50 to swing, and each connecting rod 50 swings to drive the adapter 31 connected with the same to slide outwards, so as to drive the clamping piece 32 to move outwards in an expanding manner, and thus the clamping space is enlarged. In fig. 1, F1 indicates a first direction, and F2 indicates a second direction.

When it is desired to clamp the wafer 100, the plurality of clamps 32 are driven to rotate about the first direction by the turntable 42 while the wafer 100 is clamped and supported by the outside-in motion. When it is desired to unclamp the wafer 100, the plurality of grippers 32 are driven in rotation about the second direction by the turntable 42 while moving from inside to outside to unclamp the wafer 100.

The wafer clamping and conveying device has the following effects.

First, the present invention is applicable to a working condition in which the wafer 100 cannot be sucked from the front surface of the wafer 100 and the wafer 100 transporting device cannot be installed in the space on the back surface of the wafer 100. Taking the situation that the wafer 100 is placed on the spin chuck and the front surface of the wafer 100 is coated with the protective adhesive layer as an example, the wafer clamping and carrying device can be arranged above the wafer 100 (namely arranged on the front surface of the wafer 100), only the part of the clamping piece 32 is detected below the plane where the wafer 100 is located, the clamping pieces 32 are driven by the same driving mechanism to do linear motion simultaneously to shrink inwards, the limiting surfaces 3212 are pushed inwards simultaneously, centering, positioning and clamping of the wafer 100 are achieved from the side surface of the wafer 100, and the supporting surface 3211 with the upward side surface of the clamping piece 32 can support the bottom surface of the wafer 100 to prevent the wafer from falling. In this way, the bottom surface of the wafer 100 is supported by the supporting surfaces 3211 distributed around the first axis 201 at intervals, and the wafer 100 is clamped by the limiting surfaces 3212 distributed around the first axis 201 at intervals, so as to ensure stable clamping and conveying processes. In the process of clamping and carrying, the clamping pieces 32 move from outside to inside, so that the clamping pieces cannot interfere with the carrier at the bottom of the wafer 100, and the adhesive layer on the front surface of the wafer 100 cannot be damaged, so that the carrying requirement of the wafer 100 is met.

The centering of the wafer 100 means that the center of the wafer 100 coincides with the center of the clamping space defined by the plurality of clamping members 32, which is advantageous for clamping stability on one hand and centering the wafer 100 on the stage of the next process by the clamping and transporting device on the other hand.

Second, the rotary motion of the rotary driving mechanism 41 is changed into the linear motion of the clamping member 32 by the link assembly, and the structure is simple and the installation is flexible.

Third, the rotation force of the rotation driving mechanism 41 can be converted into a driving force for driving the adaptor 31 and the holder 32 to perform linear movement of contracting and expanding inward by the cooperation of the slide assembly and the link assembly.

Compared with the mode of directly driving the clamping piece to move spirally inwards through the connecting rod assembly, the clamping piece driving adapter piece 31 and the clamping piece 32 move linearly inwards, and the clamping piece driving adapter piece can realize large-range opening and closing by converting rotary motion into linear motion, thereby being beneficial to meeting the clamping requirements of wafers 100 with different diameters and also realizing size switching; the clamping and carrying device has compact structure; in addition, when the plurality of clamping pieces 32 clamp the wafer 100 inwards, the rotation of the wafer 100 is reduced or avoided, so that the clamping stability of the wafer 100 is ensured, the shaking and redistribution of the front adhesive material of the wafer 100 caused by the rotation of the wafer 100 is avoided, and the influence on the front adhesive layer when the wafer 100 is clamped is reduced; at the same time, the plurality of clamping members 32 move linearly inward to clamp the wafer 100, and the wafer 100 is subjected to a plurality of radially inward clamping forces, so that the clamping is more stable. The rotary driving mechanism 41 is a rotary cylinder. By using a cylinder as the rotation driving mechanism 41 instead of a motor as the rotation driving mechanism 41, the torque is larger, and the overall size and weight of the rotation driving mechanism 41 can be reduced while obtaining a larger torque. Referring to fig. 1 and 3, the rotary driving mechanism 41 includes a fixing base 43, the fixing base 43 is disposed above the substrate 20, a rotary cylinder is mounted on the fixing base 43, a turntable 42 is mounted above the rotary cylinder, and a cylinder joint 411 of the rotary cylinder for connecting to a gas source is illustrated in fig. 2.

In an embodiment, the spacing angles between any two adjacent adapters 31 are equal, that is, the plurality of adapters 31 are arranged at equal angular intervals, so that the resultant force of the inward clamping forces of the plurality of clamping members 32 acts on the center of the wafer 100, the clamping is more stable, and the automatic centering of the wafer 100 is facilitated during clamping. In this embodiment, the angle interval between any two adjacent adapters 31 and any two adjacent clamps 32 is 120 degrees, and the three groups of uniformly distributed clamps 32 shrink inwards from the outer ring of the wafer 100. In other embodiments, four sets of clamping assemblies 30 are provided, such that the angular separation between any two adjacent adapters 31 and any two adjacent clamps 32 is 90 degrees. Referring to fig. 2, L1, L2, L3 illustrate the centerlines of the adapters 31 in the three sets of clamp assemblies 30, respectively, with the three adapters 31, and the three clamps 32 being movable inwardly or outwardly along the paths of L1, L2, L3, respectively. It can be appreciated that the two groups of clamping assemblies are simultaneously retracted inwards, so that the centering and the stable clamping of the wafer cannot be realized. The embodiment adopts three groups of clamping assemblies to shrink inwards simultaneously, can realize the centering and positioning and clamping of the wafer, has the performances of stable clamping, simple structure and compact structure, and does not need a special guiding structure.

When the main body of the wafer clamping and transporting device is disposed above the wafer 100 to clamp the wafer 100 from the front surface of the wafer 100, the wafer clamping and transporting device further includes a dust-proof plate 10 to prevent dust or other impurities from falling on the adhesive layer on the front surface of the wafer 100. The base plate 20 is connected with the dust-proof plate 10, the base plate 20, the adapter 31 and the connecting rod 50 of the fixing seat 43 are all arranged above the dust-proof plate 10, and the clamping piece 32 is arranged below the dust-proof plate 10. The dust-proof plate 10 is provided with a plurality of bar-shaped holes 11, the bar-shaped holes 11 extend outwards from inside to outside in the radial direction, the wafer 100 clamping device comprises a connecting shaft 35, the clamping member 32 is connected with the substrate 20 through the connecting shaft 35, specifically, one end of the connecting shaft 35 is connected with the adapter member 31, the other end passes through the bar-shaped holes 11 to be connected with the clamping member 32, and when the adapter member 31 slides relative to the substrate 20, the connecting shaft 35 moves along the bar-shaped holes 11.

In this embodiment, the rotary driving mechanism 41 is a rotary cylinder, the fixed base 43 is connected with the substrate 20, the main body of the rotary cylinder is locked on the fixed base 43 and located below the fixed base 43, and the driving shaft of the rotary cylinder passes through the fixed base 43 to be connected with the turntable 42 above the fixed base 43. The dust guard 10 is provided with a clearance opening, and the main body part of the rotary cylinder is at least partially embedded into the clearance opening of the dust guard 10, so that the whole structure is more compact. It will be appreciated that the clearance opening of the dust-guard plate 10 may be a through hole, with the bottom of the main body portion of the rotary cylinder exposed from the dust-guard plate 10; of course, the clearance opening of the dust-proof plate 10 may be a non-penetrating groove.

The dust-proof plate 10 is used for shielding between the wafer 100 and the mechanical structures such as the substrate 20, the adapter 31, the rotation driving mechanism 41, the link 50, etc., and plays a role in preventing impurities from falling on the front surface of the wafer 100. The strip-shaped holes 11 on the dust-proof plate 10 not only provide clearance for the convenient clamping members 32 to be arranged below the dust-proof plate 10 to clamp the wafer 100 from the outer ring to the inner contraction, but also provide inner and outer telescopic guiding by matching the strip-shaped holes 11 with the connecting shafts 35.

In the related art, for wafers 100 having different diameters, different wafer clamping and transporting devices are required to be configured, so that the application range is limited and the cost is high. In order to expand the application scope, the wafer clamping and conveying device has a multi-size switching function, that is, the wafer clamping and conveying device can simultaneously meet the clamping and conveying requirements of wafers 100 with at least two diameter sizes, and can switch different wafer 100 clamping modes to adapt to wafers 100 with different sizes. Illustratively, the wafer clamping and handling device of the present application may be compatible with 12 inch, 8 inch wafers 100.

Referring to fig. 2, 7, 8, 12 and 13, the adapter 31 extends along the radial direction of the substrate 20. In order to be compatible with the multi-sized wafer 100, the adaptor 31 is provided with at least two sets of mounting portions 3121 along a radial direction of the substrate 20, the clamping assembly 30 includes a fixing member 33, the fixing member 33 is configured to be detachably mounted on any one set of mounting portions 3121, and the clamping member 32 is connected to the fixing member 33.

In this way, when the fixing member 33 is mounted on the inner mounting portion 3121 of each of the plurality of clamping units 30, the planar dimension of the clamping space defined between the limiting surfaces 3212 of the plurality of clamping members 32 is small, and the clamping space is suitable for clamping the wafer 100 having a small dimension; when the fixing members 33 are mounted on the outer mounting portions 3121 of the plurality of clamping units 30, the clamping space defined between the stopper surfaces 3212 of the plurality of clamping members 32 has a large planar dimension, and is suitable for clamping the wafer 100 having a large dimension. In this embodiment, each adapter 31 is provided with a first set of mounting portions 3121 and a second set of mounting portions 3121 along a radial direction of the substrate 20, the second set of mounting portions 3121 is far away from a central axis of the substrate 20 relative to the first set of mounting portions 3121, the plurality of fixing members 33 are used for clamping and conveying the wafer 100 with a diameter d1 when the plurality of fixing members 33 are mounted on the first set of mounting portions 3121, and the wafer clamping and conveying device is used for clamping and conveying the wafer 100 with a diameter d2 when the plurality of fixing members 33 are mounted on the second set of mounting portions 3121, and d2 is larger than d1. In fig. 1, 2, 4 and 7, the fixing members 33 are shown mounted on the second set of mounting portions 3121 located outside, and in fig. 5, two fixing blocks are shown provided on one adapter 31.

It can be appreciated that the present application configures the link assembly, the sliding assembly, and the adapter 31 extending in the radial direction, not only can convert the rotational motion of the rotation driving mechanism 41 into the linear telescopic motion of the clamping member 32, but also can provide different mounting portions 3121 based on the adapter 31 extending in the radial direction, so as to facilitate adjusting the mounting position of the clamping member 32, thereby performing position switching of the clamping member 32 when facing wafers 100 of different sizes, and has simple adjustment and flexible motion.

With continued reference to fig. 4 to 8 and fig. 12 to 14, a detachable connection method of the fixing member 33 and the adaptor 31 is provided. Each set of mounting portions 3121 includes positioning grooves disposed on opposite sides of the adaptor 31, in this embodiment, the positioning grooves are disposed on the left and right sides of each adaptor 31; correspondingly, positioning holes are formed in two side walls of the fixing piece 33, the clamping assembly 30 comprises two positioning columns 34, when the positioning columns 34 penetrate through the positioning holes and the end portions of the positioning columns 34 are inserted into the positioning grooves, limiting fit between the positioning columns 34 and the adapter piece 31 is achieved, and the fixing piece 33 cannot move radially along the adapter piece 31 so as to keep the fixing piece 33 and the clamping piece 32 at the current positions. One fixing piece 33 is respectively clamped into two positioning grooves of the adapter piece 31 through two positioning columns 34, and on the basis of meeting the clamping requirement of the wafer 100 with multiple sizes, the reliability of connection between the fixing piece 33 and the adapter piece 31 can be enhanced, and shaking of the clamping piece 32 is reduced or avoided so as to consider the stability of clamping the wafer 100 by the clamping pieces 32.

In one embodiment, the positioning posts 34 are resilient positioning pins, i.e., spring pins. Fig. 14 illustrates a schematic view of an elastic positioning pin, where the elastic positioning pin includes a pin main body 341, a pin head 342 and an elastic member 343, the pin head 342 is slidably assembled on the pin main body 341, the elastic member 343 is disposed between the pin head 342 and the pin main body 341, the pin main body 341 is installed in a positioning hole of the fixing member 33, the pin main body 341 can be fixed on the fixing member 33, and the locking and unlocking between the fixing member 33 and the adapting member 31 can be realized by the pin head 342 being clamped into or separated from a positioning groove on the adapting member 31. By adopting the spring pin as the positioning column 34, the pin main body 341 can be arranged in the fixing piece 33, and when the position of the fixing piece 33 on the adapter piece 31 needs to be adjusted, the positioning column 34 does not need to be frequently assembled and disassembled, so that the operation is more convenient and quick.

In other embodiments, one or more than three positioning grooves may be provided for each set of mounting portions 3121. In other embodiments, a common positioning pin without elastic expansion function may be used as the positioning post 34.

In one embodiment, the positioning groove is a V-shaped groove.

Referring to fig. 3 to 5, 8 and 12, the adapter 31 includes a connecting adapter block 311 and an adapter rod 312, the sliding assembly includes a sliding block 61 and a sliding rail 62, the sliding rail 62 is a linear rail, the sliding rail 62 is disposed on the substrate 20, the adapter block 311 is connected with the sliding block 61 through a screw lock or other means, and the sliding block 61 is slidably mounted on the sliding rail 62, so as to realize that the adapter 31 is slidably mounted on the substrate 20. The adapting rod 312 is integrally formed with the adapting block 311 or is connected by welding, fastening, clamping or the like, the adapting rod 312 extends from the adapting block 311 in a direction away from the first axis 201 of the substrate 20, the adapting rod 312 extends in a radial direction, the mounting portion 3121 is provided on the adapting rod 312, and the fixing member 33 is mounted on the adapting rod 312. The width and/or height of the adapter rod 312 is smaller than that of the adapter block 311, and the adapter block 311 with a larger volume can ensure the stability and reliability of the sliding connection between the adapter 31 and the substrate 20.

Referring to fig. 1 to 7, the fixing member 33 includes a first fixing block 331 and a second fixing block 332. The adaptor 31 is clamped between the first fixing block 331 and the second fixing block 332, and the first fixing block 331 and the second fixing block 332 are connected by fasteners or other structures. In this embodiment, the first fixing block 331 and the second fixing block 332 are respectively an upper fixing block and a lower fixing block, and are respectively clamped on the upper and lower sides of the adaptor 31. During assembly, the clamping piece 32 and the second fixing block 332 are assembled into a first assembly, then the first fixing block 331 and the second fixing block 332 are clamped on two sides of the adapter piece 31, the first fixing block 331 and the second fixing block 332 are locked, and the position of the fixing block on the adapter piece 31 is locked through the positioning piece, so that the clamping piece 32 is assembled on the adapter piece 31. In this embodiment, positioning holes are formed on the left and right sides of the first fixing block 331.

Referring to fig. 4 to 6, an annular clamping groove 321 is disposed on the outer side of the clamping member 32, and the clamping groove 321 is used for accommodating the wafer 100. The supporting surface 3211 and the limiting surface 3212 are both groove walls of the clamping groove 321. The groove wall of the clamping groove 321 further comprises a groove top surface 3213, wherein the groove top surface 3213 is connected with the limiting surface 3212 in an angle manner and is positioned on one side of the limiting surface 3212 away from the supporting surface 3211. In an embodiment, referring to fig. 4 and 6, the supporting surface 3211 is parallel to the substrate 20, the supporting surface 3211 is perpendicular to the first axis 201, and when the wafer 100 is clamped and carried, the supporting surface 3211 is located below the wafer 100, and the supporting surface 3211 is parallel to the wafer 100, so that the supporting surface 3211 can well and stably support the bottom surface of the wafer 100; although the first axis 201 is not illustrated in fig. 4, the direction of the first axis 201 coincides with the up-down direction in fig. 4.

In an embodiment, referring to fig. 4 and fig. 6, the limiting surface 3212 is perpendicular to the substrate 20, the limiting surface 3212 is parallel to the first axis 201, when the wafer 100 is clamped and carried, the limiting surface 3212 and the periphery of the wafer 100 can be well bonded and limited, and when the limiting surfaces 3212 of the plurality of clamping pieces 32 simultaneously abut against the periphery of the wafer 100, stable clamping of the wafer 100 is realized. In one embodiment, referring to fig. 4 and 6, the groove top surface 3213 prevents the wafer 100 from accidentally falling off the clamping roller from above the clamping roller when the wafer 100 is clamped and carried, resulting in falling and damage of the wafer 100; in addition, the height of the limiting surface 3212 is greater than the thickness of the wafer 100, the groove top surface 3213 is located above the wafer 100 and is at a certain distance from the front surface of the wafer 100, and the groove top surface 3213 is inclined relative to the limiting surface 3212 and the first axis 201 so as to avoid the groove top surface 3213 contacting the adhesive layer on the front surface of the wafer 100.

With continued reference to fig. 4-6, the clamping member 32 is a clamping roller. The clamp assembly 30 includes a fixture 33 and a connecting shaft 35, the connecting shaft 35 including a spacer 351 and a roller shaft 352. The roller shaft 352 includes a first shaft portion 3521 and a second shaft portion 3522 that are connected, the roller shaft 352 being perpendicular to the base plate 20, the second shaft portion 3522 protruding outwardly relative to the first shaft portion 3521 in a radial direction of the roller shaft 352. The first shaft portion 3521 is connected to the fixing member 33, and in this embodiment, the first shaft portion 3521 is connected to the second fixing block 332, and in other embodiments, the first shaft portion 3521 may be connected to the first fixing block 331. The spacer 351 and the clamping roller are both sleeved on the first shaft 3521, the spacer 351 is located between the fixing member 33 and the clamping roller, the top surface of the clamping roller is propped against the spacer 351, the bottom surface of the clamping roller is propped against the second shaft 3522, in other words, the upper part of the clamping roller is supported and limited by the spacer 351, the lower part of the clamping roller is supported and limited by the second shaft 3522, and the movement of the clamping roller along the direction parallel to the first axis 201 is limited, so that the wafer 100 shake caused by the vertical shake of the clamping roller relative to the substrate 20 in the carrying process is avoided, and the carrying stability of the wafer 100 is enhanced.

In order to make the structure more compact, the outward appearance is more pleasing to the eye, and the centre gripping gyro wheel sets up the gyro wheel hole, and the gyro wheel hole includes first hole portion and second hole portion, and first shaft portion 3521 wears to locate first hole portion, and second shaft portion 3522 wears to locate second hole portion, between second hole portion and the first hole portion, second shaft portion 3522 and first shaft portion 3521 to when second shaft portion 3522 supports the centre gripping gyro wheel, hide second shaft portion 3522.

When the clamping assembly 30 is assembled, the clamping roller is sleeved on the roller shaft 352, and then the spacing sleeve 351 is sleeved on the roller shaft 352; the roller shaft 352 is assembled to the second fixing block 332, the second fixing block 332 and the first fixing block 331 are respectively sleeved on two sides of the transfer rod 312, and the first fixing block 331 and the second fixing block 332 are locked by using screws, so that the preliminary installation of the clamping assembly 30 to the transfer piece 31 is completed. The position of the fixing piece 33 is adjusted, and the positioning column 34 on the fixing piece 33 is inserted into the corresponding positioning groove of the adapter rod 312 according to the size of the wafer 100 to be clamped, so that the radial locking of the clamping assembly 30 on the adapter piece 31 is realized, the installation of the clamping assembly 30 is completed, and the assembly of the clamping assembly 30 is convenient and quick. Of course, in other embodiments, the adapter 31 may be assembled by other step clamp assemblies 30.

In order to improve the safety and reliability of clamping and carrying the wafer 100, the wafer clamping and carrying device of the present application is provided with a hard limit component, a soft limit component and a sensor for sensing whether the wafer 100 is clamped or not.

The hard stop assembly is used to limit the excessive swing angle of the link 50 to limit the excessive shrink travel of the adaptor 31, thereby limiting the excessive shrink travel of the clamping member 32 to clamp the wafer 100. Referring to fig. 1, 9 and 10, in one embodiment, the hard stop assembly includes a stop block 71, the stop block 71 is mounted on the adapter 31, and the stop block 71 moves along with the inside and outside of the adapter 31. The adaptor 31 has a retraction limit position, when the adaptor 31 is at the retraction limit position, the clamping member 32 is also at the retraction limit position, at this time, the limiting block 71 abuts against at least one connecting rod 50, and the limiting block 71 limits the connecting rod 50 to swing in the first direction continuously, so as to limit the retraction stroke of the adaptor 31 and the clamping member 32, and avoid clamping the wafer 100. It can be appreciated that when the stopper 71 abuts against the link 50, the link 50 is only restricted from swinging in the first direction to restrict the adaptor 31 from further shrinking, but the link 50 is not restricted from swinging in the second direction, i.e. the adaptor 31 is not restricted from extending outwards.

In the present embodiment, the stopper 71 is provided only on the adapter 31 in the first group of the clamping assemblies 30, and the stopper 71 is configured to: when the links 50 in the second group of clamp assemblies 30 abut against the stopper 71, the swing of the links 50 of the second group of clamp assemblies 30 is restricted. Wherein the second set of clamping assemblies 30 is adjacent to the first set of clamping assemblies 30. Since the plurality of links 50 are all connected to the same turntable 42, when the swing of the links 50 of the second group of clamping assemblies 30 is restricted, the plurality of links 50 can be simultaneously restricted to the swing limit position, thereby restricting the plurality of adapters 31, the plurality of clamps 32 to the retracted limit position. For example, referring to fig. 1, a stopper 71 is disposed on the lower adaptor 31 in the drawing, and when the stopper 71 abuts against the upper right link 50, the links 50 are all at the limit position of swinging inwards, and at this time, the three adaptors 31 and the three clamps 32 are all at the retracted limit position.

Referring to fig. 9 and 10, the hard limiting assembly further includes an adjusting mounting seat 72 and an adjusting post 73, the adjusting mounting seat 72 is mounted on a side wall of the adapter 31, the adjusting post 73 is movably connected with the adjusting mounting seat 72, and the limiting block 71 is connected to an inner end of the adjusting post 73. The adjusting post 73 is adjustable relative to the adjusting mount 72 to adjust the position of the stopper 71, thereby adjusting the swing limit angle of the link 50 and adjusting the retraction limit positions of the adaptor 31 and the clamping member 32. Specifically, the adjusting post 73 is screwed to the adjusting mount 72, and the adjusting post 73 can move relative to the adjusting mount 72 to make the limiting block 71 approach or separate from the first axis 201. The stopper 71 and the adjustment post 73 may be detachably connected. In one embodiment, the adjustment post 73 is a set screw.

In order to set the retracted position of the limiting clamp 32 to prevent the wafer 100 from being damaged by clamping, the inventor considered to set three protruding limiting blocks 71 corresponding to the three adaptor 31 on the substrate 20, correspondingly set three protruding limiting parts corresponding to the adaptor 31, and realize the retracted limit position of the adaptor 31 by matching the limiting parts of the adaptor 31 with the limiting blocks 71 on the substrate 20, but on one hand, a plurality of limiting blocks 71, a large number of parts, a complex structure and troublesome installation are required, and if the retracted limit position of the adaptor 31 is required to be adjusted, the inventor also has trouble. The mode of the foregoing embodiment is adopted in the present application to set up the stopper 71, the adjustment mount 72 and the adjustment post 73, not only one stopper 71 is needed, but also the position adjustment of the stopper 71 is convenient and quick.

The soft stop assembly is used to limit the contraction stroke of the clamping member 32 to avoid clamping the wafer 100. The soft limit assembly comprises an induction piece 81 and a photoelectric switch 82, the wafer clamping and conveying device comprises a controller, the rotary driving mechanism 41 is electrically connected with the controller, and the photoelectric switch 82 is electrically connected with the controller. The sensing piece 81 is mounted on the adapter 31, and the photoelectric switch 82 is mounted on the substrate 20; the photoelectric switch 82 includes a light emitting element and a light receiving element, and when the adapter 31 is slid to the retracted limit position, the sensing piece 81 blocks a light propagation path between the light emitting element and the light receiving element.

When the adaptor 31 moves inward to the retracted limit position, the sensing piece 81 moves to a position for blocking the light transmission channel of the photoelectric switch 82, and at this time, the controller senses the change of the light signal, and controls the rotation driving mechanism 41 to stop rotating, so as to limit the retracted positions of the adaptor 31 and the clamping piece 32.

The wafer holding and transporting apparatus includes a wafer detector 91 and a connection plate 92. The wafer detector 91 and the connecting plate 92 are arranged above the dust-proof plate 10, the dust-proof plate 10 is provided with a clearance hole, the connecting plate 92 is connected with the dust-proof plate 10, the wafer detector 91 is arranged below the connecting plate 92, and the wafer detector 91 is used for sensing whether a wafer 100 exists below the dust-proof plate 10 through the clearance hole. In one embodiment, the wafer detector 91 is a reflective sensor, and the reflective sensor can detect whether the wafer 100 is below in a non-contact manner, and when the optical signal emitted by the reflective sensor is reflected by the wafer 100 back to the reflective sensor, the determining device clamps to the wafer 100. In other embodiments, the wafer detector 91 may be an ultrasonic sensor or the like.

The wafer clamping and conveying device has the following effects: first, the rotary motion of the rotary cylinder is converted into the linear motion of the clamping roller through the connecting rod 50 device, the structure is simple, and the installation is flexible. Second, the device uses a cylinder rather than a motor to control rotation, allowing for greater torque while reducing the overall size and weight of the drive device. Third, the three clamping rollers are driven by the same cylinder to retract inwards to clamp the wafer 100, so that the wafer 100 can be automatically centered and positioned. Fourth, mechanical hard limit, photoelectric soft limit and detection of the wafer 100 are installed at the same time, so that the device is safer and more reliable in operation and more compact in structure. Fifth, through the removal of centre gripping gyro wheel in the notch on dust guard 10, can correspond the size of different wafers 100 automatically during the centre gripping, compatible 12inch/8inch wafer 100 simultaneously can realize two size switches, adjusts simply, and the motion is nimble.

In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and the like are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and to simplify operation, rather than to indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for providing a special meaning.

In the description herein, reference to the term "one embodiment," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in the foregoing embodiments, and that the embodiments described in the foregoing embodiments may be combined appropriately to form other embodiments that will be understood by those skilled in the art.

The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.

Claims

1. The utility model provides a wafer centre gripping handling device which characterized in that includes:

a substrate (20);

a plurality of sets of clamping assemblies (30) spaced around a first axis (201) of the substrate (20); each group of clamping assemblies (30) comprises a connecting adapter piece (31) and a clamping piece (32), wherein the adapter pieces (31) are connected with the base plate (20) in a sliding manner; the clamping pieces (32) are provided with supporting surfaces (3211) and limiting surfaces (3212) which are connected in an angle mode, the supporting surfaces (3211) are used for supporting the bottom surface of the wafer (100), and clamping spaces for accommodating the wafer (100) are defined between the limiting surfaces (3212) of the plurality of clamping pieces (32);

a rotation driving assembly including a rotation driving mechanism (41) mounted on the substrate (20), and a turntable (42) connected to the rotation driving mechanism (41);

-a plurality of links (50) arranged at intervals around said first axis (201); one end of the connecting rod (50) is hinged with the rotary disc (42), and the other end of the connecting rod is hinged with the adapter piece (31);

wherein the rotary drive assembly is configured to drive the plurality of links (50) to pivot to drive the plurality of clamping assemblies (30) to move in a direction toward or away from the first axis (201).

2. Wafer clamping and transporting device according to claim 1, characterized in that the adapter (31) is provided with at least two sets of mounting parts (3121) along the radial direction of the substrate (20); the clamping assembly (30) comprises a fixing piece (33), the fixing piece (33) is detachably arranged on any group of the installation parts (3121), and the clamping piece (32) is connected with the fixing piece (33).

3. The wafer clamping and handling device according to claim 2, wherein each set of mounting portions (3121) includes positioning slots provided on both sides of the adapter (31); the fixing piece (33) is provided with a positioning hole, the clamping assembly (30) comprises a positioning column (34), the positioning column (34) penetrates through the positioning hole, and when the end part of the positioning column (34) is inserted into the positioning groove, the positioning column (34) is in limit fit with the adapter piece (31).

4. The wafer clamping and conveying device according to claim 1, wherein an annular clamping groove (321) is arranged on the outer side of the clamping piece (32), and the clamping groove (321) is used for accommodating a wafer (100); the supporting surface (3211) and the limiting surface (3212) are groove walls of the clamping groove (321), and the supporting surface (3211) is parallel to the substrate (20);

the groove wall of the clamping groove (321) further comprises a groove top surface (3213), and the groove top surface (3213) is connected with the limiting surface (3212) in an angle and is located at one side, deviating from the supporting surface (3211), of the limiting surface (3212).

5. The wafer clamping and handling device according to claim 2, wherein the fixing member (33) comprises a first fixing block (331) and a second fixing block (332), the adapter member (31) is clamped between the first fixing block (331) and the second fixing block (332), and the first fixing block (331) and the second fixing block (332) are connected by a fastener;

The clamping piece (32) is a clamping roller; the clamping assembly (30) includes a spacer sleeve (351) and a roller shaft (352); the roller shaft (352) comprises a first shaft part (3521) and a second shaft part (3522) which are connected, wherein the first shaft part (3521) is connected with the first fixed block (331) or the second fixed block (332); the spacing sleeve (351) and the clamping roller are sleeved on the first shaft part (3521); the spacing sleeve (351) is located between the fixing piece (33) and the clamping roller, the top surface of the clamping roller abuts against the spacing sleeve (351), the second shaft portion (3522) protrudes relative to the first shaft portion (3521) along the radial direction of the roller shaft (352), and the bottom surface of the clamping roller abuts against the second shaft portion (3522).

6. Wafer clamping and handling device according to any of claims 1-5, characterized in that the rotary drive mechanism (41) is a rotary cylinder.

7. The wafer clamping and handling device according to any one of claims 1 to 5, comprising a stopper (71), the stopper (71) being mounted to the adapter (31);

the adaptor (31) is provided with a retraction limiting position, and when the adaptor (31) is positioned at the retraction limiting position, the limiting block (71) is abutted against at least one connecting rod (50).

8. The wafer clamping and transporting device according to claim 7, comprising an adjustment mount (72) and an adjustment post (73), wherein the adjustment mount (72) is mounted on a side wall of the adapter (31), the adjustment post (73) is in threaded connection with the adjustment mount (72), and the stopper (71) is connected to the adjustment post (73);

the adjustment post (73) is movable relative to the adjustment mount (72) to move the stop (71) toward or away from the first axis (201).

9. The wafer clamping and handling device according to any one of claims 1 to 5, comprising an inductive blade (81), a photoelectric switch (82) and a controller, wherein the rotary drive mechanism (41) and the photoelectric switch (82) are electrically connected to the controller;

the induction piece (81) is mounted on the adapter (31), and the photoelectric switch (82) is mounted on the base plate (20); the photoelectric switch (82) comprises a light emitting element and a light receiving element, and when the adapter piece (31) slides to the retraction limit position, the sensing piece (81) blocks a light transmission channel between the light emitting element and the light receiving element.

10. Wafer clamping and transporting device according to any one of claims 1-5, characterized in that it comprises a dust-proof plate (10) and a plurality of connecting shafts (35), the base plate (20) being connected to the dust-proof plate (10); the base plate (20), the adapter (31) and the connecting rod (50) are all arranged above the dust-proof plate (10), and the clamping piece (32) is arranged below the dust-proof plate (10); the dustproof plate (10) is provided with a plurality of strip-shaped holes (11), the strip-shaped holes (11) extend outwards from inside to outside, one end of the connecting shaft (35) is connected with the adapter (31), the other end of the connecting shaft penetrates through the strip-shaped holes (11) to be connected with the clamping piece (32), and when the adapter (31) slides relative to the base plate (20), the connecting shaft (35) moves along the strip-shaped holes (11);

The wafer clamping and conveying device comprises a wafer detector (91) arranged above a dust-proof plate (10), wherein the dust-proof plate (10) is provided with a clearance hole, and the wafer detector (91) is used for sensing whether a wafer (100) exists below the dust-proof plate (10) through the clearance hole.