CN219144151U

CN219144151U - Wafer level manipulator and transportation device with same

Info

Publication number: CN219144151U
Application number: CN202223519453.4U
Authority: CN
Inventors: 施心星
Original assignee: Suzhou Lumi Laser Technology Co ltd
Current assignee: Suzhou Lumi Laser Technology Co ltd
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-06-06
Anticipated expiration: 2032-12-28

Abstract

The utility model discloses a wafer-level manipulator and a conveying device with the same. The wafer level manipulator comprises a base, a holding assembly and a driving assembly; the holding assembly comprises at least two holding parts, holding adjusting parts connected with the at least two holding parts, and a first connecting piece for connecting the holding adjusting parts and the machine base, wherein the first connecting piece has a reciprocating movement stroke between at least two stations; the driving component is connected with the first connecting piece and is used for driving the first connecting piece to reciprocate between the two stations and driving the holding adjusting component and the at least two holding parts to move together; the at least two holding parts are positioned on the same virtual circle, and the holding adjusting component can move relative to the first connecting piece so as to adjust the distance between the at least two holding parts along the radial direction of the virtual circle. The wafer-level manipulator provided by the utility model is more flexible to use, wider in application range, free from frequent replacement of the manipulator, obviously capable of effectively improving production efficiency and lower in production cost.

Description

Wafer level manipulator and transportation device with same

Technical Field

The utility model relates to the technical field of wafer assembly machinery, in particular to a wafer-level manipulator and a conveying device with the same.

Background

The wafer is very fragile, so the wafer is got the blowing through sucking disc or suction nozzle in getting, blowing or transfer's in-process, usually. The wafer size is different, and the traditional wafer level manipulator can only pick up the wafer of fixed size, when the wafer size changes, then need to change the wafer manipulator of new model and carry out the pick up of wafer, equipment replacement cycle is long, and manufacturing cost improves.

Disclosure of Invention

Therefore, the technical problem to be solved by the utility model is that the traditional wafer level manipulator can only pick up wafers with fixed sizes and cannot adapt to the use requirements of wafers with different sizes, so that the production cycle is long and the production cost is high.

In order to solve the above technical problems, the present utility model provides a wafer level manipulator, including:

a base;

the holding assembly is movably arranged on the machine base and used for picking up and transferring the wafer module, and comprises at least two holding parts, holding adjusting parts connected with the at least two holding parts, and a first connecting piece for connecting the holding adjusting parts and the machine base, wherein the first connecting piece has a reciprocating movement stroke between at least two stations;

the driving assembly is connected with the first connecting piece and is used for driving the first connecting piece to reciprocate between the two stations and driving the holding adjusting part and the at least two holding parts to move together;

the at least two holding parts are positioned on the same virtual circle, and the holding adjusting component can move relative to the first connecting piece so as to adjust the distance between the at least two holding parts along the radial direction of the virtual circle.

Optionally, the holding adjusting part includes:

the first adjusting piece is connected with the first connecting piece;

the second adjusting piece is movably arranged on the first adjusting piece, and at least two holding parts are arranged on the second adjusting piece;

the second adjusting piece moves relative to the first adjusting piece so as to adjust the distance between at least two holding parts along the radial direction of the virtual circle.

Optionally, two second regulating members are arranged on the first regulating member at intervals in parallel, and the two second regulating members have movable strokes which are close to each other and far away from each other.

Optionally, the first regulating part includes the first regulating plate that extends along first direction and sets up, the second regulating part includes along the second regulating plate that extends along the second direction and sets up, locates clamping part on the second regulating plate and centre gripping regulating part, first direction with the second direction is mutually perpendicular, clamping part centre gripping in on the first regulating plate, and can follow the extending direction of first regulating plate slides, the centre gripping regulating part is used for with clamping part locking and unblock in on the first regulating plate.

Optionally, the clamping part comprises two clamping plate pieces protruding from the second adjusting plate, the two clamping plate pieces are respectively provided with clamping grooves oppositely arranged along the first direction, and the two clamping grooves are respectively clamped at two opposite sides of the first adjusting plate along the first direction;

the clamping adjusting part comprises a plurality of adjusting bolts, and the adjusting bolts are detachably arranged on the two clamping plate pieces so as to lock and unlock the clamping plate pieces on the first adjusting plate.

Optionally, the first adjusting member is provided with a plurality of mounting portions, each second adjusting member is provided with a matching portion, and each matching portion is respectively matched with the plurality of mounting portions, so that the two second adjusting members are close to each other or far away from each other.

Optionally, the first adjusting piece includes a first adjusting plate, the mounting portion includes a first mounting hole provided on the first adjusting plate, a plurality of first mounting holes are provided at intervals along an extending direction of the first adjusting plate, the second adjusting piece includes a second adjusting plate, the matching portion includes a second mounting hole provided on the second adjusting plate, and the extending direction of the first adjusting plate is perpendicular to the extending direction of the second adjusting plate;

the holding adjusting part further comprises a plurality of screw-connection pieces, and the screw-connection pieces are respectively penetrated in the corresponding first mounting holes and the second mounting holes to connect the first adjusting plate and the two second adjusting plates.

Optionally, each second adjusting piece is configured as a telescopic plate, and each holding portion is disposed at a telescopic front end of the corresponding telescopic plate.

Optionally, the holding part is arranged at the bottom of the holding adjusting part, and the wafer level manipulator further comprises a dustproof structure, wherein the dustproof structure is arranged above the holding adjusting part and at least covers the plane area where the holding adjusting part is arranged; and/or

The first connecting piece is provided with a first connecting section and a second connecting section which are oppositely arranged, the first connecting section is connected with the first adjusting piece, the second connecting section is connected with the driving assembly, and the first connecting section and the second connecting section are arranged in an included angle mode.

The utility model also provides a conveying device comprising the wafer level manipulator.

The technical scheme provided by the utility model has the following advantages:

the utility model provides a wafer level manipulator which comprises a machine base and a holding assembly, wherein the holding assembly is movably arranged on the machine base and is used for picking up and transferring a wafer module so as to take, discharge and transfer the wafer module; the holding assembly comprises a holding part, a holding adjusting part and a first connecting piece, wherein the holding part can be used for sucking the clamp acting on the wafer module, and the holding part can be driven to move through the movement of the first connecting piece, namely the wafer module is driven to move; the at least two holding parts are positioned on the same virtual circle, so that the wafer can be picked up by holding the wafer by the at least two holding parts, the holding adjusting part can move relative to the first connecting piece to adjust the distance between the at least two holding parts along the radial direction of the virtual circle, the size of the virtual circle where the two holding parts are positioned can be adjusted, the at least two holding parts can hold the wafer modules with different diameters, the wafer level manipulator can pick up the wafer modules with different diameters, the use is more flexible, the application range is wider, the manipulator is not required to be replaced frequently, the production efficiency can be obviously improved, and the production cost is lower.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a wafer level robot according to an embodiment of the present utility model;

FIG. 2 is a schematic view of the holding assembly of FIG. 1;

FIG. 3 is a schematic view of the wafer level robot of FIG. 1 from another perspective;

FIG. 4 is an exploded view of the holding assembly of FIG. 2;

FIG. 5 is a schematic view of the holding adjusting member shown in FIG. 1;

FIG. 6 is a schematic cross-sectional view of the holding adjusting member shown in FIG. 5;

fig. 7 is a schematic diagram of a wafer level robot according to the present utility model when sucking different wafers.

Reference numerals illustrate:

100-wafer level robot; 1-a stand; 2-a holding assembly; 21-a first connector; 211-a first connection section; 2111-long holes; 212-a second connection section; 213-limit notch; 22-a holding adjusting part; 221-a first adjustment member; 2211—a first adjusting plate; 2212-limiting plate; 222-a second adjustment member; 2221-second adjustment plate; 2222-grip; 2222 a-clamp member; 2223—grip adjustment; 2223 a-adjusting bolt; 23-a holding part; 231-vacuum chuck; 3-dustproof structure; 31-a first dust guard; 32-a second dust guard; 4-a drive assembly; 5-stopping blocks; 200-wafer module; 201-wafer; 202-clamp.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. The utility model will be described in detail hereinafter with reference to the drawings in conjunction with embodiments. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

In the present utility model, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the component itself in the vertical, upright or gravitational direction; also, for ease of understanding and description, "inner and outer" refers to inner and outer relative to the profile of each component itself, but the above-mentioned orientation terms are not intended to limit the present utility model.

The utility model provides a wafer level manipulator 100, which is suitable for transferring a wafer module 200, wherein the wafer module 200 comprises a wafer 201 and a clamp 202 surrounding the periphery of the wafer 201, the wafer 201 is in a circular sheet-shaped arrangement, the clamp 202 is in a concentric annular arrangement with the wafer 201 so as to clamp the periphery of the wafer 201, one sides of the wafer 201 and the clamp 202 are connected through a film, and when the wafer module is transferred through the wafer level manipulator 100, the wafer module is held on the clamp 202 through the wafer level manipulator 100, so that the wafer 201 is prevented from being directly acted on the wafer 201, and the wafer 201 is better protected.

Specifically, referring to fig. 1 and 2, the wafer level robot 100 includes a frame 1, a holding assembly 2, and a driving assembly 4, where the frame 1 may be configured as a mounting frame, a mounting plate, etc. to be suitable for connection and installation with other devices; the holding assembly 2 is movably arranged on the machine base 1 and is used for picking up and transferring the wafer module 200 so as to carry out material taking, material feeding, transferring and the like of the wafer module 200, the holding assembly 2 comprises at least two holding parts 23, a holding adjusting part 22 connected with the at least two holding parts 23 and a first connecting piece 21 connecting the holding adjusting part 22 and the machine base 1, the holding part 23 is used for sucking a clamp 202 acting on the wafer module 200, the first connecting piece 21 is provided with a reciprocating movement stroke at least between two stations, the driving assembly 4 is connected with the first connecting piece 21 and is used for driving the first connecting piece 21 to reciprocate between the two stations, and the first connecting piece 21 moves to drive the holding adjusting part 22 and the at least two holding parts 23 to move together so as to move the wafer module 200; wherein, at least two holding parts 23 are positioned on the same virtual circle, and the holding adjusting component 22 can move relative to the first connecting piece 21 to adjust the distance between the at least two holding parts 23 along the radial direction of the virtual circle.

As shown in fig. 2 and fig. 7, at least two holding parts 23 are on the same virtual circle, for example, the dashed circle in fig. 7 indicates the virtual circle where at least two holding parts 23 are located, so that the at least two holding parts 23 can hold the clamp 202 acting on the wafer module 200 to pick up the wafer module 200, after the wafer module 200 is sucked by the holding parts 23, the clamp 202 and the virtual circle where the holding parts 23 are located can be concentrically arranged, so that the clamp 202 is more stable after being sucked. Further, the size of the virtual circle where the two holding parts 23 are located can be adjusted through the holding adjusting part 22, namely, at least two holding parts 23 can be held and acted on the clamps 202 with different diameters, so that the wafer level manipulator 100 can pick up the clamps 202 with different diameters, the use is more flexible, the application range is wider, the manipulator does not need to be replaced frequently, the production efficiency can be obviously improved, and the production cost is lower.

It should be understood that, since the wafer 201 and the clamp 202 are all circular, when the wafer module 200 is sucked, it is preferable that, in order to keep the wafer module 200 more stable on the wafer level robot 100 after being picked up, each of the holding parts 23 should act on the clamp 202 of the wafer module 200 uniformly, and therefore, the plurality of holding parts 23 should act on the same annular surface of the clamp 202 of the wafer module 200, so that the wafer module 200 is not easy to fall after being sucked.

In order to make the plurality of holding parts 23 hold the jigs 202 of the wafer modules 200 with different diameters, the distance between at least two holding parts 23 along the radial direction of the virtual circle is adjusted by holding the adjusting part 22.

As shown in fig. 2 and fig. 4, the holding adjusting part 22 includes a first adjusting part 221 and a second adjusting part 222, where the first adjusting part 221 is connected with the first connecting part 21 to be fixedly arranged on the first connecting part 21, and the whole holding assembly 2 is driven to move between different stations by the movement of the first connecting part 21; the second adjusting member 222 is movably disposed on the first adjusting member 221, and the distance between the at least two holding portions 23 along the radial direction of the virtual circle is adjusted by moving the second adjusting member 222. For example, the second adjusting member 222 may be rotatably disposed on the first adjusting member 221, or the second adjusting member 222 may be slidably disposed on the first adjusting member 221, and the distance between at least two holding portions 23 on the second adjusting member 222 is changed by rotating the second adjusting member 222 at different angles with respect to the first adjusting member 221.

Further, two second adjusting members 222 are provided, and the two second adjusting members 222 are disposed on the first adjusting member 221 at parallel intervals, and the two second adjusting members 222 have movable strokes for approaching and separating from each other, so that the holding portions 23 on the two second adjusting members 222 can approach and separate from each other, and thus the clamps 202 with different diameters can be held.

In an embodiment, a plurality of mounting portions (not shown in the drawings) may be provided on the first adjusting member 221, and a mating portion is provided on each of the second adjusting members 222, and each mating portion mates with a plurality of mounting portions, respectively, so that the two second adjusting members 222 are close to or far from each other, thereby adjusting the distance between the plurality of holding portions 23.

Specifically, the first adjusting member 221 includes a first adjusting plate 2211, the mounting portion includes a first mounting hole provided on the first adjusting plate 2211, a plurality of first mounting holes are provided at intervals along an extending direction of the first adjusting plate 2211, the second adjusting member 222 includes a second adjusting plate 2221, the mating portion includes a second mounting hole provided on the second adjusting plate 2221, and the extending direction of the first adjusting plate 2211 is perpendicular to the extending direction of the second adjusting plate 2221; the holding adjusting part 22 further includes a plurality of screw connectors (such as screws, bolts, etc.), and the plurality of screw connectors are respectively inserted into the corresponding first mounting holes and second mounting holes to connect the first adjusting plate 2211 and the two second adjusting plates 2221. Preferably, the two second adjusting plates 2221 are symmetrically arranged on the first adjusting plate 2211, the center of symmetry between the two second adjusting plates 2221 is used for forming the center of a virtual circle where the plurality of holding parts 23 are located, and the plurality of first mounting holes are symmetrically arranged at two ends of the first adjusting plate 2211 so as to be respectively and correspondingly connected with the second mounting holes on the two second adjusting plates 2221, and the distance between the two second adjusting plates 2221 is symmetrically adjusted, so that the distance between the plurality of holding parts 23 is uniformly adjusted. At this time, two holding portions 23 may be disposed on each second adjusting plate 2221, where the two holding portions 23 are symmetrically disposed at two ends of each second adjusting plate 2221, and the four holding portions 23 are symmetrically disposed between each two of the two holding portions so as to be on the same virtual circle, thereby better sucking the fixture 202.

When the jig 202 acting on the wafer module 200 is sucked, the plane on which the plurality of holding portions 23 are located is parallel to the plane on which the wafer module 200 is located, for example, when the wafer module 200 is placed in a horizontal direction, the plurality of holding portions 23 are located on a horizontal plane, and the first adjusting plate 2211 and the second adjusting plate 2221 are disposed vertically on the horizontal plane, wherein the first adjusting plate 2211 extends in a first direction, the second adjusting plate 2221 extends in a second direction, the first direction may refer to any direction along the horizontal direction, such as a front-rear direction or a left-right direction, and when the first direction refers to the front-rear direction, the second direction is a left-right direction, and the first direction and the second direction are not specifically limited herein.

In another embodiment, as shown in fig. 4 to 6, the second adjusting member 222 may further include a clamping portion 2222 provided on the second adjusting plate 2221, and a clamping adjusting portion 2223, wherein the clamping portion 2222 is clamped on the first adjusting plate 2211 and can slide along the extending direction of the first adjusting plate 2211, and the clamping adjusting portion 2223 is used for locking and unlocking the clamping portion 2222 on the first adjusting plate 2211, so as to act on the first adjusting plate 2211 through the clamping portion 2222 in a clamping manner, and the clamping portion 2222 is clamped and fixed at different positions of the first adjusting plate 2211 through the clamping adjusting portion 2223, so that the distance between the two second adjusting plates 2221 can be adjusted, and the distance between the plurality of sucking portions 23 can be adjusted.

Specifically, the clamping portion 2222 includes two clamping plates 2222a protruding from the second adjusting plate 2221, where the two clamping plates 2222a are respectively provided with clamping grooves that are oppositely disposed along the first direction, and the two clamping grooves are respectively clamped on two opposite sides of the first adjusting plate 2211 along the first direction, so that the second adjusting plate 2221 can be more stably fixed on the first adjusting plate 2211; the clamping adjusting portion 2223 includes a plurality of adjusting bolts 2223a, and the plurality of adjusting bolts 2223a are detachably provided on the two clamping plates 2222a to lock and unlock the clamping plates 2222a to the first adjusting plate 2211. By tightening the adjusting bolt 2223a, the clamping plate 2222a can be locked with the first adjusting plate 2211 such that the second adjusting plate 2221 can be fixed to the first adjusting plate 2211; when it is desired to move the position of the first adjustment plate 2211, the adjustment bolt 2223a may be loosened so that the clamping plate 2222a may be moved relative to the first adjustment plate 2211. And the movable distance of the first adjusting plate 2211 is finer by adjusting the adjusting bolts 2223a, so that the size range of the wafer module 200 which can be held by the plurality of holding parts 23 is finer, and the applicability is better.

Also, as shown in fig. 2 and 4, two limiting plates 2212 are further protruded at both ends of the first adjusting plate 2211 in the first direction, and the two limiting plates 2212 may be used to limit the moving range of the second adjusting plate 2221, thereby preventing the second adjusting plate 2221 from falling off.

In still another embodiment, the second adjusting member 222 may be configured as a telescopic plate, where each of the holding portions 23 is disposed at a telescopic front end of the corresponding telescopic plate, and the holding portions 23 are driven to move by telescopic movement of the telescopic plate, so as to adjust the distance between the plurality of holding portions 23. For example, the expansion plate may include a fixing plate, a first expansion section, a second expansion section, and a third expansion section, where the fixing plate is fixed on the first adjusting plate 2211, the first expansion section is sleeved on the fixing plate, the second expansion section is sleeved on the first expansion section, the third expansion section is sleeved on the second expansion section, the holding portion 23 is disposed on the third expansion section, when the expansion plate is in a contracted state, the first expansion section, the second expansion section, and the third expansion section are all sleeved in the fixing plate, and when the expansion plate is in an expanded state, the first expansion section, the second expansion section, and the third expansion section may sequentially extend, so that the holding portion 23 may be located at different distances from the first adjusting plate 2211, thereby adjusting the distances between the plurality of holding portions 23. Of course, the arrangement mode of the expansion plate is not limited to the above one, and can be adaptively set according to the adjustment requirement, and will not be described in detail here.

In still another embodiment, a plurality of groups of holding groups (not shown in the drawings) may be disposed on each second adjusting member 222, where each group of holding groups includes two holding portions 23 disposed opposite to each other along the extending direction of the second adjusting plate 2221, and the plurality of groups of holding groups are sequentially disposed from inside to outside along the extending direction of the second adjusting member 222, and the holding portions 23 on the two second adjusting members 222 of the same group are on the same virtual circle, where from inside to outside refers to a direction from the center of the second adjusting plate 2221 toward both ends of the second adjusting plate 2221 along the second direction. For example, a set of holding parts 23 located in the middle of the second adjusting plate 2221 is set as a first holding group, two holding parts 23 located outside the first holding group are set as second holding groups, and so on, so that the first holding groups on the two second adjusting plates 2221 can be used to suck the clamps 202 of one diameter size, and the second holding groups on the two second adjusting plates can be used to suck the clamps 202 of another larger diameter, and thus, the multiple sets of holding groups can be used to suck the clamps 202 of multiple diameters. Wherein, control device can be provided, which is electrically connected with the plurality of groups of holding groups respectively, so that when the clamps 202 with different sizes are sucked, the control device can control the operation of each group of holding groups.

Wherein, the holding part 23 may be provided as a vacuum chuck 231, and the wafer level robot 100 may further include a suction device, such as a vacuum pump, in communication with the vacuum chuck 231, through which the jig 202 is sucked. Therefore, the control device can control the work of each holding part 23 by controlling the valve structure on the connecting pipe between the vacuum pump and the vacuum chuck 231, which is convenient and intelligent.

In addition, in the present embodiment, as shown in fig. 1, the wafer level robot 100 further includes a dust-proof structure 3, and the wafer 201 can be better shielded by the dust-proof structure 3, so as to avoid the wafer 201 from being damaged and polluted easily. Specifically, the holding portion 23 is disposed at the bottom of the holding adjusting member 22, the dust-proof structure 3 is disposed above the holding adjusting member 22 and at least covers the plane area where the holding adjusting member 22 is disposed, and preferably, the dust-proof structure 3 is disposed in a circular shape so as to be matched with the shape of the wafer module 200, thereby better shielding the wafer module 200 from all positions. The dustproof structure 3 comprises a first dustproof plate 31 and a second dustproof plate 32 which are connected, so that the installation is more convenient, the first dustproof plate 31 and the second dustproof plate 32 are connected with the first connecting piece 21, are fixedly arranged on the first connecting piece 21, and form shielding for the whole holding assembly 2, so that the wafer module 200 is less prone to being damaged in the transferring process.

The first connecting member 21 is mainly used for connecting the holding assembly 2 and the stand 1, and allows the holding assembly 2 to have more degrees of freedom, so that movement is more flexible. The first connector 21 may be provided as a single connection plate or as a combination of a plurality of connection plates, which are set in actual installation dimensions. It will be appreciated that the wafer module 200 is typically transferred from one station to another as the wafer module 200 is moved. For example, the wafer module 200 may be moved from the storage station to the loading station by the wafer level robot 100 to achieve automatic loading of the wafer module 200. Of course, depending on the use of the stations, more or different stations may be provided for transferring the wafer module 200.

The wafer module 200 is moved between two stations with more movement tracks. For example, the moving track of the first connecting member 21 may be arc-shaped, ring-shaped or linear. Accordingly, the driving unit 4 correspondingly connected to the first connecting member 21 is also more provided. Preferably, the first connecting piece 21 can have a movable stroke along the up-down direction and the horizontal direction of the base 1, and the driving assembly 4 can be set as a two-axis linear module or a three-axis linear module, so that the first connecting piece 21 can flexibly move in the horizontal direction and the up-down direction of the base 1, and the movement of the wafer module 200 is more convenient, so that the wafer-level manipulator 100 is more flexible in use, not only can meet the station layout requirements of different orientations, but also can meet the transfer requirements of the wafer modules 200 of different sizes, and the practicability is better.

Further, as shown in fig. 2 and 4, the first connecting member 21 has a first connecting section 211 and a second connecting section 212 disposed opposite to each other, and the first connecting section 211 is connected to the first regulating member 221.

Moreover, as shown in fig. 2, the first connecting section 211 and the second connecting section 212 are disposed at an included angle, a limiting notch 213 is disposed at a side of the second connecting section 212 facing the second adjusting member 222, and when the second adjusting member 222 moves along the first adjusting member 221 to the center of the nearest first adjusting member 221, the limiting notch 213 can abut against one end of the first adjusting member 221, so as to limit the movement stroke of the second adjusting member 222, so as to avoid the second adjusting member 222 being too close to the center of the first adjusting member 221, and interference is easy to occur in the process of moving the wafer module.

As shown in fig. 2, a plurality of long holes 2111 are provided on the first connection section 211, connection holes are provided on the first adjustment member 221 to be fitted with the plurality of long holes 2111, the first connection member 21 and the first adjustment member 221 are connected by the connection members penetrating into the long holes 2111 and the connection holes, and the first connection member 21 is fine-tuned on the first adjustment member 221 by the provision of the long holes 2111 so as to keep the portions of the first adjustment member 221 located on both sides of the first connection member 21 balanced. Furthermore, two stop blocks 5 are provided on the first adjusting member 221, and the two stop blocks 5 are respectively located at two sides of the first connecting section 211 to limit the fine tuning range of the first connecting section 211.

It should be understood that the first connecting member 21 may be made of a single plate, or may be formed by splicing a plurality of plates, and is specifically set according to the convenience of the actual manufacturing scheme, which is not limited herein.

The utility model also provides a conveying device, which comprises the wafer level manipulator 100, has the technical characteristics of the wafer level manipulator 100 and the technical effects brought by the technical characteristics, and can effectively improve the conveying convenience.

It will be apparent that the embodiments described above are merely some, but not all, embodiments of the utility model. Based on the embodiments of the present utility model, those skilled in the art may make other different changes or modifications without making any creative effort, which shall fall within the protection scope of the present utility model.

Claims

1. A wafer level manipulator, comprising:

a base;

2. The wafer level robot of claim 1, wherein the hold-down adjustment component comprises:

the first adjusting piece is connected with the first connecting piece;

3. The wafer level robot of claim 2, wherein two of said second adjustment members are disposed on said first adjustment member at parallel intervals, and wherein said two second adjustment members have movable strokes that are closer to each other and farther from each other.

4. The wafer level robot of claim 3, wherein the first adjustment member comprises a first adjustment plate extending in a first direction, the second adjustment member comprises a second adjustment plate extending in a second direction, a clamping portion disposed on the second adjustment plate, and a clamping adjustment portion, the first direction and the second direction being perpendicular, the clamping portion being clamped to the first adjustment plate and slidable along the extending direction of the first adjustment plate, the clamping adjustment portion being configured to lock and unlock the clamping portion to the first adjustment plate.

5. The wafer level manipulator according to claim 4, wherein the clamping portion comprises two clamping plate members protruding from the second adjusting plate, wherein two clamping grooves are respectively formed in the two clamping plate members and are opposite to each other along the first direction, and the two clamping grooves are respectively clamped at two opposite sides of the first adjusting plate along the first direction;

6. The wafer level robot of claim 3, wherein a plurality of mounting portions are provided on the first adjustment member, and wherein mating portions are provided on each of the second adjustment members, each of the mating portions being mated with a plurality of the mounting portions, respectively, such that two of the second adjustment members are closer to or farther from each other.

7. The wafer level robot of claim 6, wherein the first adjustment member comprises a first adjustment plate, the mounting portion comprises a first mounting hole provided in the first adjustment plate, the first mounting holes are spaced apart along an extension direction of the first adjustment plate, the second adjustment member comprises a second adjustment plate, the mating portion comprises a second mounting hole provided in the second adjustment plate, and the extension direction of the first adjustment plate is perpendicular to the extension direction of the second adjustment plate;

8. The wafer level robot of claim 3, wherein each of the second adjustment members is provided as a telescoping plate, and each of the holding portions is provided at a telescoping front end of a corresponding one of the telescoping plates.

9. The wafer level robot of any one of claims 2 to 7, wherein the holding portion is provided at a bottom of the holding adjustment member, the wafer level robot further comprising a dust-proof structure that is provided above the holding adjustment member and that covers at least a planar area where the holding adjustment member is located; and/or the number of the groups of groups,

10. A transportation device comprising a wafer level robot according to any one of claims 1 to 9.