CN216736435U - Centering mechanism using rotatable contact - Google Patents
Centering mechanism using rotatable contact Download PDFInfo
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- CN216736435U CN216736435U CN202122773253.0U CN202122773253U CN216736435U CN 216736435 U CN216736435 U CN 216736435U CN 202122773253 U CN202122773253 U CN 202122773253U CN 216736435 U CN216736435 U CN 216736435U
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- centering
- adjusting
- wafer
- adjustment member
- movable contact
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- 230000007246 mechanism Effects 0.000 title claims abstract description 44
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- 238000001179 sorption measurement Methods 0.000 claims description 9
- 230000002457 bidirectional effect Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses an adopt rotatable contact centering mechanism, include: a first centering adjustment member and a second centering adjustment member slidably disposed along a predetermined direction; adjustment portions formed in the first centering adjustment member and the second centering adjustment member, respectively; the adjusting parts are provided with a plurality of groups, the adjusting parts on the first centering adjusting component and the second centering adjusting component respectively correspond to form an adjusting group, and the adjusting parts are rotatably provided with a plurality of groups of ceramic bearings along the inner side wall. The utility model discloses a ceramic bearing forms rotatable contact, and when being close to the skew part of wafer, thereby the wafer can produce a tangential force and make ceramic bearing take place to rotate, makes the wafer take place relative motion simultaneously and is close to the centre of a circle, has avoided the wafer centre of a circle position because the condition that receives small radial force and remove, has also protected the wafer not to be hurt.
Description
Technical Field
The utility model relates to a semiconductor equipment technical field specifically is to adopt rotatable contact centering mechanism.
Background
The patent publication No. CN112635380A, entitled "wafer centering device" discloses a wafer centering device, which includes: a first centering adjustment member and a second centering adjustment member arranged at intervals along a predetermined direction, adjustment portions formed in the first centering adjustment member and the second centering adjustment member, respectively, and adjustment groups formed by the adjustment portions included in the first centering adjustment member and the adjustment portions included in the second centering adjustment member, respectively, correspondingly; however, the above structure has the following drawbacks:
when the central point of the wafer is positioned, the adjusting component is required to touch the wafer to limit the displacement direction of the wafer, and if corresponding contact protection is not provided, the wafer is easily damaged when the adjusting component touches the wafer; although the common soft contact can be centered on the premise of not damaging the wafer, the position of the circle center of the common soft contact cannot be accurately guaranteed due to the elastic deformation of the plastic, and the centering effect of the common soft contact on the high-precision equipment required by the semiconductor industry is not good, so that a rotatable contact centering mechanism needs to be provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an adopt rotatable contact centering mechanism, form rotatable contact through ceramic bearing, avoided the condition that the wafer centre of a circle position removed owing to receive small radial force, also protected the wafer not hurt to solve the problem of proposing among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: adopt rotatable contact centering mechanism, include: a first centering adjustment member and a second centering adjustment member slidably disposed in a predetermined direction; adjustment portions formed in the first centering adjustment member and the second centering adjustment member, respectively;
the adjusting parts are provided with a plurality of groups, the adjusting parts on the first centering adjusting component and the second centering adjusting component respectively correspond to form an adjusting group, and the adjusting parts are rotatably provided with a plurality of groups of ceramic bearings along the inner side wall.
Preferably, the plurality of sets of the adjusting parts are formed in a stepped shape, and inner side walls of the adjusting parts are arc-shaped.
Preferably, mounting grooves are formed in the inner side wall of the adjusting portion at equal intervals, the ceramic bearings are correspondingly arranged in the mounting grooves, and one side of each ceramic bearing extends out of the mounting groove to form a contact.
Preferably, the centering mechanism using the movable contact further comprises a first driving mechanism, and the first centering adjusting member and the second centering adjusting member are arranged on the first driving mechanism.
Preferably, the first driving mechanism is a bidirectional telescopic cylinder, and the first centering adjustment member and the second centering adjustment member are respectively arranged on two groups of piston rods of the bidirectional telescopic cylinder.
Preferably, the two groups of piston rods of the bidirectional telescopic cylinder are fixedly provided with connecting rods, one end of each connecting rod is detachably provided with an assembly seat, and the first centering adjusting member and the second centering adjusting member are respectively arranged on the two groups of assembly seats.
Preferably, the centering mechanism using a movable contact further includes: the movable end of the second driving mechanism is connected with an adsorption component which is arranged between the first centering adjustment component and the second centering adjustment component.
Preferably, the second driving mechanism is arranged to be a one-way cylinder, an extension rod is fixedly mounted at one end of a piston rod of the one-way cylinder, a bearing plate is detachably mounted at one end of the extension rod, and the adsorption member is fixedly mounted on the bearing plate.
Preferably, the adsorption member is a vacuum chuck, and a positioning target line is arranged on the upper end surface of the vacuum chuck.
Preferably, the centering mechanism with the movable contact further comprises a base, and the first driving mechanism and the second driving mechanism are both fixedly mounted on the base.
Preferably, the connecting rod (9) is fixedly connected with the assembling seat (10) through a bolt.
Preferably, the extension rod (7) is fixedly connected with the bearing plate (11) through a bolt.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses an adjustment portion rotates the design that is provided with multiunit ceramic bearing along the inside wall, make first centering adjustment member and second centering adjustment member when to the wafer centre gripping, be close to the skew part of wafer time, thereby the wafer can produce a tangential force and make ceramic bearing take place to rotate, make the wafer take place relative motion simultaneously and be close to the centre of a circle, finally after whole action completion vacuum chuck will with the coincidence of wafer center, the rotatable contact of ceramic bearing through the adoption is hard centering, the condition of wafer centre of a circle position owing to receive small radial force and remove has been avoided, the wafer is protected not hurt yet.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of the assembly seat of the present invention.
In the figure: 1. a base station; 2. a bidirectional telescopic cylinder; 3. a first centering adjustment member; 4. a second centering adjustment member; 5. an adsorption member; 6. a one-way cylinder; 7. an extension rod; 8. a ceramic bearing; 9. a connecting rod; 10. assembling a seat; 11. a carrier plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the rotatable contact centering mechanism is adopted and comprises a base platform 1, wherein the upper surface of the base platform 1 can be formed into a plane and used as a mounting surface for mounting other parts in the embodiment;
a first driving mechanism is fixedly arranged on the base platform 1, a first centering adjusting member 3 and a second centering adjusting member 4 are arranged on the first driving mechanism, and the first centering adjusting member 3 and the second centering adjusting member 4 are arranged in a sliding mode along a preset direction;
the first centering adjusting member 3 and the second centering adjusting member 4 are respectively provided with an adjusting part; the adjusting parts are provided with a plurality of groups, and the adjusting parts on the first centering adjusting component 3 and the second centering adjusting component 4 respectively correspond to form an adjusting group;
when the centering device is used, the adjusting group formed by the two opposite adjusting parts moves relatively and is used for touching the outer side of the wafer so as to enable the outer side of the wafer to be stressed uniformly, and the wafer is stressed to be close to the central position of the adjusting group, so that centering is performed;
adjustment portion rotates along the inside wall and is provided with multiunit ceramic bearing 8, and the mounting groove has been seted up to the equidistance on the inside wall of specific adjustment portion, and ceramic bearing 8 corresponds and sets up in the mounting groove, and one side of ceramic bearing 8 stretches out the mounting groove and forms the contact.
The multiple groups of adjusting parts are formed into a step shape, so that the adjusting parts on the first pair of middle adjusting components 3 and the adjusting parts on the second pair of middle adjusting components 4 which are positioned at the same horizontal height correspondingly form adjusting groups;
in practical use, the inner side wall of the adjusting part is set to be arc-shaped to adapt to the outer side of the wafer because the wafer is circular;
in an embodiment of the present invention, the first driving mechanism is configured as a bidirectional telescopic cylinder 2, and the first centering adjustment member 3 and the second centering adjustment member 4 are respectively disposed on two sets of piston rods of the bidirectional telescopic cylinder 2; in actual use, an electric push rod or an electric sliding table can be adopted to drive the first centering adjusting member 3 and the second centering adjusting member 4 to slide;
specifically, two groups of piston rods of the bidirectional telescopic cylinder 2 are fixedly provided with connecting rods 9, one end of each connecting rod 9 is detachably provided with an assembly seat 10, and the first centering adjusting member 3 and the second centering adjusting member 4 are respectively arranged on the two groups of assembly seats 10;
the connecting rod 9 is connected with the assembling seat 10 by bolts, so that the disassembly and the replacement are convenient, and the daily maintenance is convenient;
a second driving mechanism is fixedly arranged on the base platform 1, the moving direction of the moving end of the second driving mechanism is vertical to the plane of the adjusting part, the moving end of the second driving mechanism is connected with an adsorption component 5, and the adsorption component 5 is arranged between the first centering adjusting component 3 and the second centering adjusting component 4;
in an embodiment of the present invention, the second driving mechanism is a one-way cylinder 6, an extension rod 7 is fixedly installed at one end of a piston rod of the one-way cylinder 6, a bearing plate 11 is detachably installed at one end of the extension rod 7, and the adsorption member 5 is fixedly installed on the bearing plate 11;
specifically, the extension rod 7 is connected with the bearing plate 11 through bolts, so that the bearing plate is convenient to detach and replace and is convenient to maintain in daily life;
the utility model discloses an in the embodiment, adsorb component 5 and set up to vacuum chuck, vacuum chuck's up end is provided with the location target line, and the location target line is convenient for survey the location.
When the vacuum chuck is used, as shown in an initial state in fig. 1, when a wafer is placed on the vacuum chuck, the bidirectional telescopic cylinder 2 drives the first centering adjustment member 3 and the second centering adjustment member 4 to move relatively, after the first centering adjustment member 3 and the second centering adjustment member 4 contact the wafer, because the stress directions of the ceramic bearing 8 point to the center of the chuck, when the wafer is not placed at the center, a tangential force is generated at the deviated part of the wafer to rotate the ceramic bearing 8, and simultaneously, the wafer moves relatively to be close to the center of the circle, finally, after the whole action is completed, the vacuum chuck is superposed with the center of the wafer, the rotatable contact of the ceramic bearing 8 is in rigid centering, so that the situation that the center position of the wafer moves due to small radial force is avoided, and the wafer is protected from being damaged.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (12)
1. Adopt rotatable contact centering mechanism, include: a first centering adjustment member (3) and a second centering adjustment member (4) slidably disposed along a predetermined direction; adjustment portions formed in the first centering adjustment member (3) and the second centering adjustment member (4), respectively;
the adjusting part is provided with a plurality of groups, the adjusting part on the first centering adjusting component (3) and the adjusting part on the second centering adjusting component (4) respectively correspond to form an adjusting group, and the adjusting part is characterized in that a plurality of groups of ceramic bearings (8) are rotatably arranged along the inner side wall.
2. The centering mechanism using the movable contact as claimed in claim 1, wherein a plurality of the adjusting portions are formed in a stepped shape, and inner side walls of the adjusting portions are provided in an arc shape.
3. The centering mechanism with the movable contact according to claim 2, wherein the inner sidewall of the adjusting portion is provided with mounting slots at equal intervals, the ceramic bearings (8) are correspondingly disposed in the mounting slots, and one side of the ceramic bearings (8) extends out of the mounting slots to form the contact.
4. A mechanism as claimed in claim 1, further comprising a first drive mechanism, the first (3) and second (4) centering members being arranged on the first drive mechanism.
5. A mechanism as claimed in claim 4, wherein the first drive mechanism is provided as a bi-directional telescopic cylinder (2), and the first (3) and second (4) centering adjustment members are provided on two sets of piston rods of the bi-directional telescopic cylinder (2), respectively.
6. A mechanism as claimed in claim 5, wherein the two sets of piston rods of the two-way telescopic cylinder (2) are fixedly provided with connecting rods (9), one end of each connecting rod (9) is detachably provided with a mounting seat (10), and the first centering adjusting member (3) and the second centering adjusting member (4) are respectively arranged on the two sets of mounting seats (10).
7. The movable contact centering mechanism as claimed in claim 6, further comprising: the movable end of the second driving mechanism is perpendicular to the plane where the adjusting part is located, the movable end of the second driving mechanism is connected with an adsorption component (5), and the adsorption component (5) is arranged between the first centering adjusting component (3) and the second centering adjusting component (4).
8. The centering mechanism with a movable contact according to claim 7, wherein the second driving mechanism is configured as a one-way cylinder (6), one end of a piston rod of the one-way cylinder (6) is fixedly provided with an extension rod (7), one end of the extension rod (7) is detachably provided with a bearing plate (11), and the absorbing member (5) is fixedly arranged on the bearing plate (11).
9. A mechanism for centering a movable contact as claimed in claim 8, wherein said suction member (5) is provided as a vacuum chuck having a positioning target line provided on an upper end surface thereof.
10. A mechanism as claimed in claim 9, further comprising a base (1), wherein the first and second actuating mechanisms are fixedly mounted on the base (1).
11. A centering mechanism using a movable contact according to claim 6, characterized in that the connection rod (9) is fixedly connected to the mounting seat (10) by means of a bolt.
12. A mechanism as claimed in claim 8, wherein the extension rod (7) is fixedly connected to the carrier plate (11) by means of bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122773253.0U CN216736435U (en) | 2021-11-12 | 2021-11-12 | Centering mechanism using rotatable contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122773253.0U CN216736435U (en) | 2021-11-12 | 2021-11-12 | Centering mechanism using rotatable contact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216736435U true CN216736435U (en) | 2022-06-14 |
Family
ID=81924476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122773253.0U Active CN216736435U (en) | 2021-11-12 | 2021-11-12 | Centering mechanism using rotatable contact |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216736435U (en) |
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2021
- 2021-11-12 CN CN202122773253.0U patent/CN216736435U/en active Active
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Address after: No. 26, Venture Capital Industrial Park, Suzhou Industrial Park, Jiangsu 215101 Patentee after: Xinda semiconductor equipment (Suzhou) Co.,Ltd. Country or region after: Zhong Guo Address before: 215000 unit c2-202, artificial intelligence Industrial Park, No. 88, Jinjihu Avenue, Suzhou Industrial Park, Suzhou area, China (Jiangsu) pilot Free Trade Zone, Suzhou, Jiangsu Patentee before: Xinda semiconductor equipment (Suzhou) Co.,Ltd. Country or region before: Zhong Guo |