CN115020317B - Wafer lifting and rotating mechanism, semiconductor equipment processing unit and semiconductor equipment - Google Patents

Wafer lifting and rotating mechanism, semiconductor equipment processing unit and semiconductor equipment Download PDF

Info

Publication number
CN115020317B
CN115020317B CN202210930678.4A CN202210930678A CN115020317B CN 115020317 B CN115020317 B CN 115020317B CN 202210930678 A CN202210930678 A CN 202210930678A CN 115020317 B CN115020317 B CN 115020317B
Authority
CN
China
Prior art keywords
ring
driving
lifting
disc
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210930678.4A
Other languages
Chinese (zh)
Other versions
CN115020317A (en
Inventor
顾雪平
杨仕品
时新宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Zhicheng Semiconductor Technology Co ltd
Original Assignee
Zhicheng Semiconductor Equipment Technology Kunshan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhicheng Semiconductor Equipment Technology Kunshan Co Ltd filed Critical Zhicheng Semiconductor Equipment Technology Kunshan Co Ltd
Priority to CN202210930678.4A priority Critical patent/CN115020317B/en
Publication of CN115020317A publication Critical patent/CN115020317A/en
Application granted granted Critical
Publication of CN115020317B publication Critical patent/CN115020317B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a wafer lifting and rotating mechanism, a semiconductor equipment processing unit and semiconductor equipment, wherein the wafer lifting and rotating mechanism comprises: the device comprises a hollow pipe body, a carrying disc axially sleeved at the tail end of the hollow pipe body, a driving ring body coaxially arranged with the carrying disc, an outer ring body coaxially arranged on the radial outer side of the carrying disc in a ring manner and connected with the carrying disc through a plurality of spokes, a plurality of clamping components annularly embedded in the outer ring body, a lifting driving unit axially sleeved on the outer side of the hollow pipe body and formed on the inner side of the carrying disc, and a transmission mechanism driving the driving ring body to axially rotate, wherein the lifting driving unit drives the transmission mechanism to axially lift; a rotating body is transversely arranged between the carrying disc and the driving ring body, and the driving ring body radially and outwards extends to form a shifting rod assembly for driving the clamping assembly to rotate. Through the application, the clamping component stably clamps the wafer, the driving lever component is driven to synchronously rotate, and the driving lever component synchronously drives the clamping component to rotate around the axis of the clamping component, so that the clamping component synchronously clamps or releases the wafer.

Description

Wafer lifting and rotating mechanism, semiconductor equipment processing unit and semiconductor equipment
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer lifting and rotating mechanism, a semiconductor equipment processing unit and semiconductor equipment.
Background
The wafer lifting and rotating mechanism is commonly used for clamping, lifting, rotating and other movements of a wafer in semiconductor equipment, but the wafer lifting and rotating mechanism can only rotate and does not lift, and the wafer lifting and rotating mechanism is mainly applied to realizing relative lifting of the wafer lifting and rotating mechanism through a splash guard on the premise that the splash guard arranged outside the wafer lifting and rotating mechanism has a lifting function. Taking a single wafer cleaning machine as an example, when a wafer is subjected to a cleaning process, there are many ways for a lifting and rotating mechanism in a conventional single wafer cleaning machine to clamp the wafer, such as sucking the wafer by negative pressure, clamping the edge of the wafer by a magnetic clamping block, and clamping the edge of the wafer by driving the clamping block to rotate by a shifting fork (referred to as a "shift lever" in this application). The mode of driving the clamping blocks to rotate through the shifting forks so as to clamp the edges of the wafers is mainly characterized in that a plurality of clamping block assemblies capable of rotating are uniformly arranged at the edges of the wafers, and the shifting forks are driven by the driving units to swing so that the shifting forks drive the clamping block assemblies to rotate, so that the clamping block assemblies clamp and release the wafers.
However, the clamping assembly included in the wafer lifting and rotating mechanism in the prior art has the defect that it is difficult to stably clamp the wafer in the process of clamping the wafer.
In view of the above, there is a need for an improved wafer lifting and rotating mechanism in the prior art to solve the above problems.
Disclosure of Invention
The invention aims to disclose a wafer lifting and rotating mechanism, a semiconductor equipment processing unit and semiconductor equipment, which are used for solving the defects of the wafer lifting and rotating mechanism in the prior art, in particular to realize that a clamping component stably clamps a wafer, and the deflector rod component is driven to synchronously rotate so as to synchronously drive the clamping component to rotate around the axis of the clamping component, so that the clamping component synchronously clamps or releases the wafer.
In order to achieve one of the above objects, the present invention provides a wafer lifting and rotating mechanism, comprising:
the device comprises a hollow pipe body, a carrying disc axially sleeved at the tail end of the hollow pipe body, a driving ring body coaxially arranged with the carrying disc, an outer ring body coaxially and annularly arranged on the radial outer side of the carrying disc and connected with the carrying disc through a plurality of spokes, a plurality of clamping components annularly embedded in the outer ring body, a lifting driving unit axially sleeved on the outer side of the hollow pipe body and formed on the inner side of the carrying disc, and a transmission mechanism driving the driving ring body to axially rotate, wherein the lifting driving unit drives the transmission mechanism to axially move up and down;
and a rotating body is transversely arranged between the carrying disc and the driving ring body, and the driving ring body radially extends outwards to form a driving lever assembly for driving the clamping assembly to rotate.
As a further improvement of the present invention, the transmission mechanism includes:
a plurality of vertical guide parts penetrating through the carrying disc, a lifting ring body configured at the tail end of the vertical guide parts and axially sleeved on the hollow pipe body, a plurality of guide blocks with guide holes arranged along the ring shape of the lifting ring body, and a guide shaft configured on the driving ring body and at least partially extending into the guide holes;
the lifting ring body drives the guide shaft to axially rotate along the guide hole in the process of axial lifting movement, so that the lifting ring body can axially rotate relative to the carrying disc in a passive mode, and the deflector rod assembly drives the clamping assembly to synchronously rotate.
As a further improvement of the present invention, the driving ring body forms a plurality of protrusions protruding toward the lifting ring body, and the guide shaft laterally penetrates the protrusions and forms a first roller rolling in the guide hole.
As a further improvement of the invention, the lifting ring body comprises:
the inner lifting ring and the outer lifting ring are configured at the tail end of the vertical guide piece and are arranged in concentric circles, and the inner lifting ring and the outer lifting ring are both provided with a plurality of guide blocks along the ring shape.
As a further improvement of the invention, the lifting ring body is configured as an inner lifting ring or an outer lifting ring connected only to the end of the vertical guide, the inner lifting ring or the outer lifting ring being arranged with a plurality of guide blocks along a ring.
As a further improvement of the present invention, the drive ring body is configured as an inner drive ring disposed coaxially with only the carrier disk;
the inner driving ring extends outwards in the radial direction to form a plurality of shifting lever assemblies which drive the clamping assemblies to rotate synchronously;
the carrying disc is convexly provided with an inner ring wall, and a first bearing is transversely arranged between the inner ring wall and the inner driving ring.
As a further improvement of the present invention, the drive ring body is configured as an outer drive ring disposed coaxially with only the carrier disk;
the outer driving ring extends outwards in the radial direction to form a plurality of shifting lever assemblies which drive the clamping assemblies to rotate synchronously;
the carrying disc is convexly provided with an outer ring wall, and a second bearing is transversely arranged between the outer ring wall and the outer driving ring.
As a further development of the invention, the drive ring comprises:
an inner driving ring and an outer driving ring which are arranged coaxially with the carrying disc;
the driving lever assembly comprises: the inner driving ring extends outwards in the radial direction to form a plurality of first deflector rods which are arranged at intervals, and the outer driving ring extends outwards in the radial direction to form a plurality of second deflector rods which are arranged at intervals;
the carrier disc is convexly provided with an inner annular wall and an outer annular wall which are arranged in a concentric circle;
the rotating body includes: the first bearing is transversely arranged between the inner ring wall and the inner driving ring, and the second bearing is transversely arranged between the outer ring wall and the outer driving ring.
As a further improvement of the present invention, the elevation drive unit includes:
the lifting guide mechanism comprises a sleeve, a chassis, a rotating disc, a driving disc and a lifting guide mechanism, wherein the sleeve is axially sleeved on the hollow pipe body, the chassis is coaxially nested outside the sleeve and is connected with the tail end of the sleeve, the rotating disc is coaxially sleeved on the sleeve and is formed outside the chassis, the driving disc is formed between the rotating disc and the driving disc, and the lifting guide mechanism is formed between the rotating disc and the driving disc;
and a third bearing is transversely arranged between the sleeve and the rotating disc, and at least one group of driving parts for driving the rotating disc to axially rotate are horizontally arranged on the chassis.
As a further improvement of the present invention, the elevation guide mechanism comprises:
the guide shell is provided with an outlet end, the rotating disc is annularly provided with a plurality of guide shells, a guide shaft penetrates through a coaming formed by axially extending the edge of the driving disc, an inclined block is formed on the inner side of the guide shell, and the guide shell and the inclined block are encircled to form an inclined raceway;
the guide shaft forms a second roller that rolls at least partially within the angled raceway.
As a further improvement of the invention, the oblique block forms a first oblique plane with an angle relative to the horizontal plane where the rotating disk is arranged, and a second oblique plane which is continuous from the first oblique plane and has a different angle from the first oblique plane;
the width of an opening formed between the outlet end and the second inclined surface is larger than the diameter of the second roller.
As a further improvement of the present invention, the outer ring body is configured with a mounting portion for the clamping component to be embedded;
the mounting portion includes:
and the adjusting holes divide the area where the mounting part is located into an upper arc plate and a lower arc plate.
As a further improvement of the present invention, the wafer lifting and rotating mechanism further comprises:
the bearing shell is coaxially arranged on the radial outer side of the outer ring body in a ring mode and is connected with the sealing cover;
and a plurality of processing holes are formed in the circumferential direction of the sealing cover.
As a further improvement of the invention, the radial outer sides of the first deflector rod and the second deflector rod are both provided with deflector blocks with deflector grooves.
As a further improvement of the invention, the clamping assembly comprises:
dispose in the installation lid of last arc board, coaxial disposition in the installation lid and inlay in the sealed cowling in the processing hole runs through in proper order the sealed cowling with the rotating part of installation lid, dispose in the rotating part top and be in the drive of rotating part is executed down and is rotated with the holder at centre gripping wafer edge, the coaxial cover of rotating part is established at least partly and is transversely supported and hold the first bearing of last arc board, the coaxial cover of rotating part is established at least partly and transversely supports and hold the second bearing of arc board down to and the cover is located the rotating part and at least part is formed in the transmission portion in the adjusting hole, the sealed cowling outside is inlayed and is established at least a set of third sealing washer that transversely supports and hold the processing hole inner wall.
As a further improvement of the present invention, the transmission portion includes:
the transmission block and a transmission shaft penetrating through the tail end of the transmission block are provided with a third roller at least partially formed in the toggle groove.
As a further improvement of the present invention, the hollow pipe body includes:
the tail end of the sealing cover axially abuts against the connecting pipe of the carrying disc, the sealing cover axially sequentially penetrates through the sealing cover and the carrying disc and abuts against the lantern ring of the connecting pipe, the sealing cover is transversely arranged between the lantern ring and the connecting pipe and axially abuts against the lantern ring and the first sealing ring of the connecting pipe, the lantern ring radially extends outwards to form an extension ring portion transversely abutting against the sealing cover, the second sealing ring is transversely arranged between the extension ring portion and the sealing cover, the sealing ring is coaxially assembled between the extension ring portion and the carrying disc and supports the second sealing ring, and the second sealing ring transversely abuts against the extension ring portion and the sealing cover.
As a further improvement of the present invention, the elevation driving unit further includes: a limiting component;
the spacing subassembly includes: the device comprises a sleeve vertically arranged on the chassis, a limiting rod longitudinally and sequentially penetrating through the sleeve and a first abdicating hole formed in the rotating disk and connected with the driving disk, and an elastic part sleeved on the limiting rod and connected with the driving disk and the sleeve.
Based on the same inventive concept, to achieve another object, the present invention also discloses a semiconductor device processing unit, comprising:
the wafer lifting and rotating mechanism comprises an outer shell, a support cover axially arranged in the outer shell, and a wafer lifting and rotating mechanism which is axially assembled on the inner side of the outer shell and abuts against the support cover.
As a further improvement of the present invention, the semiconductor device processing unit further comprises a buffer member;
the buffer assembly includes: an annular base, a flexible connecting cover which is circumferentially formed and surrounds the outer side wall of the outer shell and is propped against the outer shell,
wherein, flexible connection cover includes: fixed connection is in last solid fixed ring, the fold ring and the lower fixed ring who connects the fold ring and separate with shell body circumference outside the shell body.
Based on the same inventive concept, the present invention also discloses a semiconductor apparatus comprising:
at least one semiconductor equipment handling unit as disclosed in any one of the preceding inventions.
Compared with the prior art, the invention has the beneficial effects that:
the driving ring body can realize axial rotation on the carrying disc through the rotating body, the driving mechanism is driven to do axial lifting motion through the lifting driving unit, the driving ring body is driven to do axial rotating motion on the carrying disc through the driving mechanism, the driving lever assembly can follow the driving ring body to do synchronous motion, the driving lever assembly can drive the clamping assembly to rotate around the axis of the clamping assembly synchronously, the clamping assembly synchronously clamps the wafer, and the technical effect that the clamping assembly synchronously and stably clamps the wafer is achieved.
Drawings
FIG. 1 is a cross-sectional view of a semiconductor equipment processing unit including a wafer elevating and rotating mechanism according to the present invention;
FIG. 2 is an enlarged partial view of the collar and carrier plate connection shown in FIG. 1;
FIG. 3 is a cross-sectional view of the wafer lifting and rotating mechanism;
FIG. 4 is a perspective view of the drive section connected to the chassis;
fig. 5 is a perspective view of the rotary disk shown in fig. 3 coupled with a guide housing;
FIG. 6 is a perspective view of the rotary plate coupled to the guide housing;
FIG. 7 is a cross-sectional view of the guide housing coupled to the second roller;
FIG. 8 is a perspective view of the vertical guide shown in FIG. 3 coupled to a carrier plate;
FIG. 9 is a perspective view of the guide block in connection with the outer lift ring;
FIG. 10 is a perspective view of the clamping assembly in connection with the closure;
FIG. 11 is a perspective view of the connection of the lift sensor and the stress sensor;
FIG. 12 is an enlarged fragmentary view of the seal assembly shown in FIG. 1 in connection with an outer housing;
FIG. 13 is an enlarged partial view of the connection of the damper assembly shown in FIG. 1 to an outer housing;
FIG. 14 is a perspective view of the engagement ring connected to the outer housing;
FIG. 15 is a perspective view of the swivel ring in connection with the arcuate gas groove;
FIG. 16 is an overall view of a semiconductor equipment processing unit including a wafer lifting and rotating mechanism;
fig. 17 is a schematic view of a semiconductor device processing unit mounted on a first substrate.
Detailed Description
The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that functional, methodological, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.
In particular, in the following embodiments, the term "axial" refers to the direction of the axis a in fig. 3. The term "axial abutment" refers to the abutment defined in a direction parallel to the axis a, and the term "lateral abutment" refers to the abutment defined in any horizontal plane perpendicular to the axis a. The term "vertical direction" refers to a direction parallel to the axial direction a and perpendicular to the horizontal plane.
The wafer lifting and rotating mechanism disclosed in this embodiment can be applied to a single wafer cleaning machine, a spin coater and other semiconductor devices for holding the edge of the wafer 300 (or other circular electronic devices such as GaN, siC, etc.) in a horizontal posture, so that after the wafer 300 is held by the plurality of holding components 70 in the wafer lifting and rotating mechanism when the wafer 300 is transferred to any one of the semiconductor devices, the subsequent semiconductor processes such as a cleaning process, a glue coating process, etc. are performed, and after the semiconductor process is completed, the wafer 300 is held by a transfer device (such as a wafer picking robot) and the holding of the wafer edge is released by the holding components 70, the wafer 300 is taken out.
The present embodiment discloses a wafer lifting and rotating mechanism 200, which is used in a semiconductor device processing unit 1000 disclosed in the following embodiments, and realizes that the clamping assembly 70 synchronously and stably clamps the wafer 300, and drives the lever assembly 33 to synchronously rotate, so that the lever assembly 33 synchronously drives the clamping assembly 70 to axially rotate around the axis b, and the clamping assembly 70 synchronously clamps the wafer 300. The wafer lifting and rotating mechanism, the semiconductor device processing unit and the semiconductor device disclosed in the present application are specifically implemented as follows.
Please refer to fig. 1 to 11 for an embodiment of a wafer lifting and rotating mechanism.
Referring to fig. 1 to 3, in the present embodiment, the wafer lifting and rotating mechanism 200 includes: the device comprises a hollow pipe body 10, a carrying disc 20 axially sleeved at the tail end of the hollow pipe body 10, a driving ring body 30 coaxially arranged with the carrying disc 20, an outer ring body 40 coaxially arranged on the radial outer side of the carrying disc 20 and connected with the carrying disc 20 through a plurality of spokes 41, a plurality of clamping components 70 annularly embedded in the outer ring body 40, a lifting driving unit 90 axially sleeved on the outer side of the hollow pipe body 10 and formed on the inner side of the carrying disc 20, and a transmission mechanism 80 driving the driving ring body 30 to axially rotate along an axis a, wherein the lifting driving unit 90 drives the transmission mechanism 80 to axially lift; the rotating body 60 is transversely arranged between the carrying disc 20 and the driving ring body 30, and the driving ring body 30 extends outwards in the radial direction to form a shifting lever assembly 33 for driving the clamping assembly 70 to rotate.
The drive ring 30 is rotatably mounted on the carrier plate 20 about the central axis a in fig. 3 by means of a rotary body 60. The initial state of the clamp assembly 70 is a state rotated clockwise about the axis b. The transmission mechanism 80 is driven by the lifting drive unit 90 to move upwards along the vertical direction (i.e., along the direction indicated by the arrow V1 in fig. 3), so as to drive the driving ring body 30 to rotate clockwise (i.e., along the direction indicated by the arrow W2 in fig. 3) on the tray 20 around the central axis a in fig. 3 through the transmission mechanism 80, so that the shift lever assembly 33 rotates synchronously with the driving ring body 30, so that the shift lever assembly 33 drives the plurality of clamping assemblies 70 to rotate counterclockwise around the axis b on the outer ring body 40 synchronously, and thus the clamping assemblies 70 are released from clamping the edge of the wafer 300, or the clamping assemblies 70 are switched to the open state, so as to load the wafer 300; the driving ring 30 can be driven by the transmission mechanism 80 to rotate on the carrying tray 20 around the axis a in a counterclockwise direction (i.e., the direction indicated by the arrow W1 in fig. 3) to drive the driving ring 30 to reset on the carrying tray 20, and at the same time, the driving ring 30 will drive the shift lever assembly 33 to drive the clamping assembly 70 to rotate on the outer ring 40 around the axis b in a clockwise direction, so that the plurality of clamping assemblies 70 synchronously clamp the wafer 300, and the technical effect of synchronously and stably clamping the wafer 300 by the clamping assembly 70 is achieved.
It should be noted that, the outer ring body 40 is connected to the carrier disc 20 through a plurality of spokes 41, and the spokes 41 may be connected to the edge of the carrier disc 20 or the upper surface of the carrier disc 20 as long as the outer ring body 40 can be supported and the rotation of the shift lever assembly 33 is not affected. The present embodiment preferably has a plurality of spokes 41 attached to the edge of the carrier plate 20 and forming an integral structure with the carrier plate 20.
As shown in fig. 3, 8 and 9, the transmission mechanism 80 includes: a plurality of vertical guiding members 81 penetrating the carrier 20, a lifting ring 82 disposed at an end of the vertical guiding members 81 and axially sleeved on the hollow tube 10, a plurality of guiding blocks 83 having guiding holes 831 annularly disposed on the lifting ring 82, and a guiding shaft 84 disposed on the driving ring 30 and at least partially extending into the guiding holes 831. It should be noted that the vertical guide 81 may be: a linear bearing 811 passing through the carrying tray 20, a movable rod 812 longitudinally passing through the linear bearing 811, a first spring (not shown) sleeved outside the movable rod 812 and respectively connecting the linear bearing 811 and the lifting ring body 82, wherein the end of the movable rod 812 is fixedly connected with the lifting ring body 82; the movable rod 812 can move up and down in the vertical direction in the linear bearing 811, and the lifting ring 82 can be driven to move downward in the vertical direction (i.e., in the direction indicated by the arrow V2 in fig. 8) by the elasticity of the first spring (not shown), so as to drive the lifting ring 82 to reset (i.e., be held by the lifting driving unit 90 at the position before moving upward). The vertical guide 81 may be an automatic telescopic rod as long as it can perform a vertical guide effect on the lifting ring 82 and drive the lifting ring 82 to move downward along the vertical direction when the lifting ring 82 performs lifting movement. This embodiment is preferably a vertical guide 81 comprising a linear bearing 811, a movable rod 812 and a first spring (not shown).
Specifically, the lifting ring 82 drives the guide shaft 84 to axially rotate along the guide hole 831 during the axial lifting movement, so as to be passively rotated relative to the carrier 20 by the driving ring 30, and to drive the clamping assembly 70 to synchronously rotate by the shift lever assembly 33. When the lifting driving unit 90 abuts against the lifting ring body 82 to drive the lifting ring body 82 to move upwards along the vertical direction, the lifting ring body 82 drives the movable rod 812 to slide in the linear bearing 811, and extrude the first spring (not shown) to compress the first spring, meanwhile, the lifting ring body 82 drives the guide block 83 to move synchronously, since the guide hole 831 is arranged obliquely, the guide block 83 can guide the guide shaft 84 to rotate clockwise around the axis a by a certain angle through the guide hole 831 when moving upwards along the vertical direction, so as to drive the driving ring body 30 to rotate synchronously on the carrying disc 20 through the guide shaft 84, and further drive the clamping assembly 70 to be switched into an open state through the deflector rod assembly 33.
When the lifting driving unit 90 releases the abutting state of the lifting ring 82, the compressed first spring (not shown) releases the elastic potential energy to drive the lifting ring 82 to move downward along the vertical direction, so that the lifting ring 82 is reset, the lifting ring 82 synchronously drives the guide block 83 and the movable rod 812 to move downward along the vertical direction, so as to guide the guide shaft 84 to rotate counterclockwise around the axis a by a certain angle through the guide hole 831, and further, the guide shaft 84 drives the driving ring 30 to synchronously rotate, so that the driving lever assembly 33 drives the clamping assembly 70 to switch to the clamping state. In the process of the lifting ring 82 doing lifting motion along the vertical direction, the movable rod 812 is synchronously driven to lift and slide in the linear bearing 811, so as to play a lifting guiding role for the lifting ring 82 through the movable rod 812, prevent the lifting ring 82 from rotating axially, and avoid influencing the stability of the clamping assembly 70 for clamping the wafer 300.
As shown in fig. 3, 8 and 9, the driving ring 30 forms a plurality of protrusions 34 protruding toward the lifting ring 82, and the guide shaft 84 transversely penetrates the protrusions 34 and forms a first roller 841 rolling in the guide hole 831. The protrusion 34 is used to attach the guide shaft 84. When the guiding block 83 moves up and down along the vertical direction, the outer wall (not labeled) of the first roller 841 contacts and rubs with the inner wall (not labeled) of the guiding hole 831, so that the first roller 841 rolls around the axis of the first roller 841 in the guiding hole 831, and the guiding hole 831 is inclined, so that the guiding hole 831 can guide the guiding shaft 84 to axially rotate, and the guiding shaft 84 drives the driving ring 30 to synchronously rotate, so that the driving ring 30 drives the shift lever assembly 33 to drive the clamping assembly 70 to rotate, and the clamping assembly 70 clamps or releases the wafer 300.
As shown in fig. 3, 8 and 9, the lifting ring body 82 is configured to be connected to only the inner lifting ring 821 or the outer lifting ring 822 at the end of the vertical guide 81, and the inner lifting ring 821 or the outer lifting ring 822 is provided with a plurality of guide blocks 83 arranged along a ring shape. It should be noted that the lifting ring 82 may be configured as a single inner lifting ring 821, a single outer lifting ring 822, or an inner lifting ring 821 and an outer lifting ring 822, as long as the driving ring 30 can be driven by the guide block 83 to rotate axially, and preferably, the inner lifting ring 821 and the outer lifting ring 822 are configured at the same time.
The lifting ring 82 comprises: an inner lifting ring 821 and an outer lifting ring 822 which are configured at the end of the vertical guiding member 81 and are arranged in a concentric circle, and a plurality of guiding blocks 83 are arranged along the ring shape on both the inner lifting ring 821 and the outer lifting ring 822. When the lifting ring 82 is configured as an inner lifting ring 821 and an outer lifting ring 822 arranged in concentric circles, correspondingly, the carrier tray 20 is configured with a plurality of vertical guides 81 to suspend and mount the inner lifting ring 821 and the outer lifting ring 822 through the vertical guides 81, and to make the bottoms of the inner lifting ring 821 and the outer lifting ring 822 on the same horizontal plane, so that the lifting driving unit 90 simultaneously contacts the inner lifting ring 821 and the outer lifting ring 822, thereby synchronously driving the inner lifting ring 821 and the outer lifting ring 822 to move upwards in the vertical direction.
It should be noted that the driving ring body 30 can be configured as a single inner driving ring 31, a single outer driving ring 32, an inner driving ring 31 and an outer driving ring 32, as long as the driving lever assembly 33 can be driven to rotate synchronously, and the inner driving ring 31 and the outer driving ring 32 are preferably configured at the same time.
As shown in fig. 1 to 3 and 8, the driving ring body 30 includes: an inner drive ring 31 and an outer drive ring 32 disposed coaxially with the carrier disk 20; the shift lever assembly 33 includes: the inner driving ring 31 extends radially outwards to form a plurality of first driving levers 331 arranged at intervals, and the outer driving ring 32 extends radially outwards to form a plurality of second driving levers 332 arranged at intervals; the carrying disc 20 is convexly provided with an inner annular wall 201 and an outer annular wall 202 which are arranged in a concentric circle; the rotating body 60 includes: a first bearing 61 disposed transversely between the inner annular wall 201 and the inner drive ring 31, and a second bearing 62 disposed transversely between the outer annular wall 202 and the outer drive ring 32. The inner driving ring 31 can axially rotate on the inner annular wall 201 through the first bearing 61, the outer driving ring 32 can axially rotate on the outer annular wall 202 through the second bearing 62, and the inner driving ring 31 and the outer driving ring 32 are both provided with the guide shafts 84, so that the inner driving ring 31 and the outer driving ring 32 are synchronously driven by the guide shafts 84 to axially rotate relative to the carrier tray 20, so as to respectively drive the first driving levers 331 and the second driving levers 332 to synchronously rotate, and thus the plurality of clamping assemblies 70 are driven by the first driving levers 331 and the second driving levers 332 to synchronously rotate around the axis b on the outer annular body 40, so that the clamping assemblies 70 synchronously and stably clamp or release the wafer 300.
Further, as shown in fig. 3 and 8, the drive ring body 30 is configured as an inner drive ring 31 disposed coaxially with the carrier disc 20 only; the inner driving ring 31 extends outwards in the radial direction to form a plurality of shifting rod assemblies 33 which drive the clamping assemblies 70 to rotate synchronously; the carrying disc 20 is convexly provided with an inner ring wall 201, and a first bearing 61 is transversely arranged between the inner ring wall 201 and the inner driving ring 31. When the driving ring body 30 is configured as the inner driving ring 31 disposed coaxially with the carrier disc 20, the inner driving ring 31 can axially rotate on the inner ring wall 201 through the first bearing 61, the inner driving ring 31 is disposed with the guiding shaft 84, and the lever assembly 33 is connected to the inner driving ring 31, so that when the guiding shaft 84 drives the inner driving ring 31 to axially rotate relative to the carrier disc 20, the lever assembly 33 will synchronously rotate along with the inner driving ring 31, so that the lever assembly 33 drives the plurality of clamping assemblies 70 to synchronously rotate on the outer ring body 40 around the axis b.
The drive ring body 30 is configured as an outer drive ring 32 disposed coaxially with the carrier disc 20 only; the outer driving ring 32 extends outwards in the radial direction to form a plurality of shift lever assemblies 33 which drive the clamping assemblies 70 to rotate synchronously; the carrier disc 20 is provided with an outer annular wall 202 in a protruding manner, and a second bearing 62 is transversely arranged between the outer annular wall 202 and the outer driving ring 32. When the driving ring 30 is configured as an outer driving ring 32 coaxially disposed with the carrier disc 20, the outer driving ring 32 can axially rotate on the outer ring wall 202 through the second bearing 62, the outer driving ring 32 is disposed with a guiding shaft 84, and the lever assembly 33 is connected to the outer driving ring 32, so that when the guiding shaft 84 drives the outer driving ring 32 to axially rotate relative to the carrier disc 20, the lever assembly 33 will synchronously rotate along with the outer driving ring 32, so that the lever assembly 33 drives the plurality of clamping assemblies 70 to synchronously rotate on the outer ring 40 around the axis b.
As shown in fig. 1, 3, 4 and 11, the elevation driving unit 90 includes: a sleeve 91 axially sleeved on the hollow pipe 10, a chassis 92 coaxially nested outside the sleeve 91 and connected to the end of the sleeve 91, a rotating disc 94 coaxially sleeved on the sleeve 91 and formed outside the chassis 92, a driving disc 95, and a lifting guide mechanism 93 formed between the rotating disc 94 and the driving disc 95; a third bearing 97 is transversely arranged between the sleeve 91 and the rotary disc 94, and at least one group of driving parts 922 for driving the rotary disc 94 to axially rotate is horizontally arranged on the chassis 92.
Specifically, the driving section 922 includes: a supporting block 9221 arranged on the chassis 92, a telescopic driving mechanism 9222 rotationally connected with the supporting block 9221, and a driving block 9224 assembled on the rotating disc 94, wherein the telescopic driving mechanism 9222 drives a telescopic rod (not labeled) to do linear telescopic motion, and the tail end of the telescopic rod is provided with a fourth bearing 9223 rotationally connected with the driving block 9224. It should be noted that the telescopic driving mechanism 9222 may be an air cylinder or an electric telescopic rod as long as the telescopic function can be realized to drive the rotating disc 94 to axially rotate. The present embodiment is preferably a cylinder. The rotary disc 94 is axially rotatable on the sleeve 91 by means of a third bearing 97. When the telescopic rod (not labeled) of the telescopic driving mechanism 9222 retracts, the telescopic driving mechanism 9222 rotates on the supporting block 9221, and the telescopic rod (not labeled) and the fourth bearing 9223 rotate, so that the telescopic rod (not labeled) can drive the driving block 9224 to drive the rotating disc 94 to rotate clockwise (i.e., in the direction indicated by the arrow W2 in fig. 4) around the axis a on the sleeve 91, and the driving disc 95 is driven to move upwards in the vertical direction by matching with the lifting guide mechanism 93; when the telescopic rod (not labeled) of the telescopic driving mechanism 9222 extends, the rotating disc 94 is driven to rotate on the sleeve 91 around the axis a counterclockwise (i.e., in the direction indicated by the arrow W1 in fig. 4), so that the rotating disc 94 can cooperate with the lifting guide mechanism 93 to drive the driving disc 95 to move downward in the vertical direction.
As shown in fig. 1 and 3 to 7, the elevation guide mechanism 93 includes: a guide shell 931 having an outlet end 9311, a plurality of guide shells 931 arranged in a ring shape on the rotary disk 94, a guide shaft 932 penetrating a surrounding plate 951 formed by axially extending the edge of the drive disk 95, a slant block 933 formed inside the guide shell 931, and the guide shell 931 and the slant block 933 surround to form a slant raceway 934; the guide shaft 932 forms a second roller 9321 that rolls at least partially within the angled raceway 934. The second roller 9321 has an outer rolling surface 9322. When the rotating disc 94 drives the guide housing 931 and the tilt block 933 to rotate clockwise (i.e., in the direction of arrow W2 in fig. 6) about the axis a, the tilt block 933 is inclined, so that the tilt block 933 can drive the second roller 9321 to roll around the axis of the guide shaft 932 when contacting the outer rolling surface 9322 of the second roller 9321, and guide the second roller 9321 to move upward in the vertical direction (i.e., in the direction of arrow V1 in fig. 6) in the inclined rolling path 934.
Specifically, as shown in fig. 6 and 7, the ramp block 933 forms a first ramp 9331 having an angle with respect to a horizontal plane on which the rotating disk 94 is located, and a second ramp 9332 continuous from the first ramp 9331 and having an angle different from that of the first ramp 9331; an opening 9333 formed between the outlet end 9311 and the second slope 9332 has a width greater than the diameter of the second roller 9321.
As shown in fig. 1 and 3 to 10, when the telescopic rod (not labeled) driven by the telescopic driving mechanism 9222 and performing telescopic motion along the horizontal plane retracts, the telescopic driving mechanism 9222 rotates on the supporting block 9221, and the telescopic rod (not labeled) and the fourth bearing 9223 rotate, so that the telescopic rod (not labeled) can drive the driving block 9224 to rotate the rotating disc 94 on the sleeve 91 around the axis a clockwise (i.e. in the direction indicated by the arrow W2 in fig. 4), and further the rotating disc 94 synchronously drives the guide shell 931 and the inclined block 933 to rotate around the axis a clockwise (i.e. in the direction indicated by the arrow W2 in fig. 6), so as to drive the first inclined plane 9331 to contact with the outer rolling surface 9322 of the second roller 9321, because the first inclined plane 9331 has a certain inclination angle, the first inclined plane 1 can perform a guide lifting function on the second roller 9321 during the rotation along the direction indicated by the arrow W2 in fig. 4, the second roller 9321 is driven to move upward in a passive manner in a vertical direction relative to the rotating disc 94, so that the second roller 9321 and the guide shaft 932 synchronously drive the driving disc 95 to move upward in the vertical direction, and at the same time, since the width of the opening 9333 (as indicated by the double-headed arrow c in fig. 7) is greater than the diameter Φ 1 of the second roller 9321, the second roller 9321 passes through the opening 9333 to contact with the second inclined plane 9332, and the second roller 9321 is guided to move upward by the second inclined plane 9332, so as to form the state of the second roller 9321' in fig. 7, at this time, the driving disc 95 follows the second roller 9321 to move upward to the highest position, and the driving disc 95 contacts with the lifting ring 82 during the upward movement in the vertical direction, so as to support the lifting ring 82 to move upward in the vertical direction, the lifting ring 82 drives the guide block 83 to move upward in a vertical direction synchronously, and the guide holes 831 are arranged in an inclined manner, so that when the guide block 83 moves upward in the vertical direction, the guide holes 831 can guide the guide shafts 84 to rotate clockwise around the axis a by a certain angle, so that the guide shafts 84 drive the driving ring 30 to rotate synchronously on the tray 20, further the driving ring 30 drives the first driving lever 331 and the second driving lever 332 to rotate clockwise around the axis a synchronously, so that the clamping assembly 70 is driven to rotate counterclockwise around the axis b on the outer ring 40 by the first driving lever 331 and the second driving lever 332, further the clamping member 74 included in the clamping assembly 70 rotates counterclockwise, so that the clamping state of the plurality of clamping assemblies 70 on the edge of the wafer 300 is synchronously released, or the clamping assembly 70 is switched to an open state, so that the wafer 300 is loaded and then rotates clockwise synchronously, and the edge of the wafer 300 is clamped by the clamping member 74 included in the plurality of clamping assemblies 70.
On the contrary, when the telescopic rod driven by the telescopic driving mechanism 9222 and performing telescopic motion in the horizontal plane is extended, the rotating disc 94 is driven to rotate on the sleeve 91 around the axis a counterclockwise (i.e., in the direction indicated by the arrow W1 in fig. 4), so that the rotating disc 94 synchronously drives the guide shell 931 and the inclined block 933 to rotate around the axis a counterclockwise (i.e., in the direction indicated by the arrow W1 in fig. 7), so that the state of the second roller 9321' in fig. 7 is sequentially moved downward in the vertical direction under the guidance of the second inclined plane 9332 and the first inclined plane 9331, and the state of the second roller 9321 in fig. 7 is formed, and in the process, the driving disc 95 is driven to move downward in the vertical direction relative to the rotating disc 94. Meanwhile, the driving disc 95 releases the holding state of the lifting ring 82, the compressed first spring (not shown) releases the elastic potential energy to drive the lifting ring 82 to move downward along the vertical direction, the lifting ring 82 synchronously drives the guide block 83 and the movable rod 812 to move downward along the vertical direction, so as to guide the guide shaft 84 to rotate counterclockwise around the axis a by a certain angle through the guide hole 831, and enable the guide shaft 84 to drive the driving ring 30 to rotate synchronously, so that the driving ring 30 synchronously drives the first driving lever 331 and the second driving lever 332 to rotate counterclockwise around the axis a, so as to drive the clamping assembly 70 to rotate clockwise around the axis b on the outer ring 40 through the first driving lever 331 and the second driving lever 332, so as to enable the clamping member 74 included in the clamping assembly 70 to rotate clockwise, so as to realize that the plurality of clamping assemblies 70 synchronously clamp the wafer 300, and realize the technical effect that the clamping assemblies 70 synchronously and stably clamp the wafer 300.
As shown in fig. 3 and 10, the outer ring body 40 is configured with a mounting portion 42 for the clamping component 70 to be embedded therein; the mounting portion 42 includes: and a plurality of adjusting holes 421, wherein the adjusting holes 421 divide the region where the mounting portion 42 is located into an upper arc plate 422 and a lower arc plate 423. It should be noted that the number of the mounting portions 42 may be greater than the number of the clamping assemblies 70, or equal to the number of the clamping assemblies 70, as long as the clamping assemblies 70 can be mounted in an embedded manner and the clamping assemblies 70 can axially rotate around the axis b. The present embodiment preferably has a number of mounting portions 42 equal to the number of clamping assemblies 70.
As shown in fig. 1 and 10, the wafer lifting and rotating mechanism 200 further includes: a cap 100 coaxially disposed with the hollow tube 10 and formed outside the outer ring body 40, and a bearing case 101 coaxially disposed outside the outer ring body 40 in a radial direction and connected to the cap 100; the cover 100 is circumferentially provided with a plurality of machining holes 102. The number of the processing holes 102 is the same as the number of the clamping assemblies 70, the clamping assemblies 70 penetrate the processing holes 102 and are embedded in the mounting portion 42, and the sealing cover 100 and the bearing shell 101 are hermetically arranged to prevent liquid from flowing into the bearing shell 101 and prevent components such as the clamping assemblies 70 and the outer ring body 40 from being corroded.
As shown in fig. 3 and 10, the clamping assembly 70 includes: the wafer processing apparatus includes an installation cover 71 disposed on the upper arc plate 422, a sealing cover 72 coaxially disposed on the installation cover 71 and embedded in the processing hole 102, a rotation part 73 sequentially penetrating through the sealing cover 72 and the installation cover 71, a clamping member 74 disposed on the top of the rotation part 73 and driven by the rotation part 73 to rotate so as to clamp the edge of the wafer 300, a first support bearing 75 coaxially sleeved on the rotation part 73 and at least partially supporting the upper arc plate 422, a second support bearing 76 coaxially sleeved on the rotation part 73 and at least partially supporting the lower arc plate 423, and a transmission part 77 coaxially sleeved on the rotation part 73 and at least partially formed in the adjustment hole 421, wherein at least one set of third sealing rings 78 transversely supporting the inner wall of the processing hole 102 is embedded outside the sealing cover 72. The mounting cover 71 is fixed to the upper arc plate 422 by bolts (not shown), and the sealing cap 72 is fitted into the machining hole 102. The axes of the first and second back bearings 75 and 76 fall into the axis b as shown in fig. 10, and at the same time, the axis b is perpendicular to the horizontal plane, so that the rotation portion 73 can rotate around the axis b in the mounting portion 42 through the first and second back bearings 75 and 76, and the rotation portion 73 can drive the clamping member 74 to clamp the wafer 300 in a horizontal posture, thereby improving the stability of clamping the wafer 300. The transmission portion 77 is used to rotate the rotation portion 73 about the axis b.
Specifically, the radial outer sides of the first driving lever 331 and the second driving lever 332 are respectively provided with a driving block 333 having a driving groove 334. The transmission section 77 includes: a driving block 771, and a driving shaft 772 extending through the end of the driving block 771, wherein the driving shaft 772 is configured with a third roller 773 at least partially formed in the toggle groove 334. Since the third roller 773 is located in the toggle groove 334, as shown in fig. 3 and 10, when the first toggle lever 331 and the second toggle lever 332 synchronously drive the toggle block 333 to rotate clockwise around the axis a, the toggle block 333 can contact the third roller 773 and drive the third roller 773 to rotate on the transmission shaft 772, so as to drive the transmission shaft 772 and the transmission block 771 to rotate counterclockwise around the axis b through the third roller 773, and further the transmission block 771 synchronously drives the rotating part 73 to rotate in the adjusting hole 421, so that the rotating part 73 can drive the clamping member 74 to rotate clockwise around the axis b to release the wafer 300. On the contrary, when the first toggle lever 331 and the second toggle lever 332 synchronously drive the toggle block 333 to rotate counterclockwise around the axis a, the toggle block 333 can drive the third roller 773 to rotate the transmission shaft 772 and the transmission block 771 clockwise around the axis b, so that the transmission block 771 synchronously drives the rotation portion 73 to rotate in the adjustment hole 421, and the rotation portion 73 can drive the clamping member 74 to rotate clockwise around the axis b to clamp the wafer 300.
As shown in fig. 1 to 3, the hollow tubular body 10 includes: the tail end of the connecting tube 11 axially abuts against the carrier disc 20, the sleeve ring 12 axially penetrates through the sealing cover 100 and the carrier disc 20 in sequence and abuts against the connecting tube 11, the sleeve ring 12 is transversely arranged between the sleeve ring 12 and the connecting tube 11 and axially abuts against the first sealing ring 13 of the sleeve ring 12 and the connecting tube 11, the sleeve ring 12 radially extends outwards to form an extension ring part 121 transversely abutting against the sealing cover 100, the second sealing ring 14 is transversely arranged between the extension ring part 121 and the sealing cover 100, the sealing ring 15 is coaxially assembled between the extension ring part 121 and the carrier disc 20 and supports the second sealing ring 14, and the second sealing ring 14 transversely abuts against the extension ring part 121 and the sealing cover 100. The joint tube 11 includes: an inner tube 111 axially supported by the ring 12, and an outer tube 112 sleeved outside the inner tube 111 and axially supported by the carrying plate 20. Illustratively, the inner tube 111 is selected from PTFE (Poly tetra fluoroethylene), which has good chemical resistance, and may be other chemical resistance materials.
After the wafer 300 is clamped by the clamping assembly 70, the hollow tube 10 can integrally drive the carrier plate 20, the cover cap 100, and the like to rotate around the central axis a in fig. 3, and drive the wafer 300 to rotate, so that the liquid uniformly cleans the surface of the wafer 300 and finally spin-dries the liquid, and the inner tube 111 can convey the liquid (for example, IPA) or the gas (nitrogen) or the gas-liquid mixture (a mixture of IPA and nitrogen) in the direction indicated by the arrow y in fig. 2 to perform back spray cleaning on the back surface of the wafer 300. The first sealing ring 13 can improve the sealing performance between the collar 12 and the inner pipe 111, and the second sealing ring 14 can improve the sealing performance between the extension ring part 121 and the cover 100, so as to prevent liquid from penetrating into components such as the carrier plate 20 and causing corrosion.
As shown in fig. 1 and 3, the elevation driving unit 90 further includes: a stop assembly 96; the stop assembly 96 includes: the driving device comprises a sleeve 961 vertically arranged on the chassis 92, a limiting rod 962 longitudinally and sequentially penetrating through the sleeve 961 and a first abdicating hole 941 formed in the rotating disc 94 and connected with the driving disc 95, and an elastic piece 963 sleeved on the limiting rod 962 and connected with the driving disc 95 and the sleeve 961. It should be noted that the number of the limiting assemblies 96 is preferably three or more, so as to provide a stable supporting effect to the driving disc 95 by the limiting assemblies 96. Illustratively, the sleeve 961 is selected from linear bearings for sliding the stop lever 962 vertically up and down within the sleeve 961. When drive disk 95 is in an unraised state, resilient member 963 is in a compressed state. When driving-disc 95 moves upward in the vertical direction, elastic member 963 releases elastic potential energy to assist driving-disc 95 to move upward by its elastic force and to assist second roller 9321 to rise to the highest position of second slope 9332. After the driving disk 95 is raised to the highest state, the elastic member 963 can play an auxiliary supporting role for the driving disk 95. Meanwhile, the limiting rod 962 can limit the axial rotation of the driving disc 95, so that the stability of the driving disc 95 in lifting motion along the vertical direction is improved.
As shown in fig. 11, the chassis 92 is provided with a lift sensor 923 penetrating through the first concession hole 941, two sets of stress sensors 9241 horizontally arranged on the chassis 92, and a stress sensing block 9242 vertically arranged on the turntable 94.
When the retractable rod driven by the retractable driving mechanism 9222 and performing retractable movement along the horizontal plane retracts, the retractable rod and the fourth bearing 9223 rotate, so that the retractable rod (not labeled) can drive the driving block 9224 to rotate the rotating disc 94 on the sleeve 91 around the axis a clockwise (i.e., in the direction indicated by the arrow W2 in fig. 11), so that the rotating disc 94 will synchronously drive the stress sensing block 9242 to rotate along the direction indicated by the arrow W2, and the stress sensing block 9242 is in contact with the stress sensor 9241a, thereby detecting whether the retractable rod is driven by the retractable driving mechanism 9222 to retract.
When the telescopic rod driven by the telescopic driving mechanism 9222 and performing telescopic motion along the horizontal plane extends, the telescopic rod and the fourth bearing 9223 rotate, so that the telescopic rod (not labeled) can drive the driving block 9224 to rotate the rotating disc 94 on the sleeve 91 around the axis a counterclockwise (i.e., in the direction indicated by the arrow W1 in fig. 11), so that the rotating disc 94 will synchronously drive the stress sensing block 9242 to rotate along the direction indicated by the arrow W1, and the stress sensing block 9242 is in contact with the stress sensor 9241b, thereby detecting whether the telescopic rod is driven by the telescopic driving mechanism 9222 to extend. It is possible to detect whether the driving disc 95 vertically moves by the elevation sensor 923.
Based on the technical solution of the wafer lifting and rotating mechanism disclosed in the foregoing embodiments, the present embodiment further discloses a semiconductor device processing unit 1000.
Referring to fig. 1, 12, and 14 to 15, in the present embodiment, the semiconductor device processing unit 1000 includes: the wafer lifting and rotating mechanism 200 includes an outer housing 400, a supporting cover 401 axially disposed inside the outer housing 400, and the wafer lifting and rotating mechanism 200 axially assembled inside the outer housing 400 and abutting against the supporting cover 401. A hollow shaft motor 402 formed inside the support cover 401 and axially abutting against the support cover 401. The wafer lifting and rotating mechanism 200 is supported by the supporting cover 401, the hollow tube 10 penetrates through the supporting cover 401 and is connected with the hollow shaft motor 402, so that the hollow shaft motor 402 can drive the hollow tube 10 to axially rotate, the outer shell 400 is sleeved with an outer ring plate 403 formed on the inner side of the bearing shell 101, liquid can be prevented from contacting the outer shell 400 through the outer ring plate 403, corrosion to the outer shell 400 is avoided, and the sealing assembly 410 arranged on the outer side of the wafer lifting and rotating mechanism 200 is embedded in the outer shell 400 in a ring mode.
Specifically, as shown in fig. 14 and 15, the sealing assembly 410 includes: a connecting ring 411 disposed on the top of the supporting cover 401 and laterally abutting against the outer housing 400, at least one set of fourth sealing rings 412 laterally abutting between the connecting ring 411 and the outer housing 400, and a movable ring 413 formed inside the connecting ring 411 and arranged concentrically with the connecting ring 411, wherein a plurality of second springs 414 axially abutting against the movable ring 413 are annularly embedded in the connecting ring 411, at least one set of fifth sealing rings 415 laterally abutting between the movable ring 413 and the connecting ring 411, a rotating ring 416 laterally abutting between the carrier plate 20 and the carrier shell 101, at least one set of sixth sealing rings 417 laterally abutting between the rotating ring 416 and the carrier plate 20, and a small gap (not shown) exists between the movable ring 413 and the rotating ring 416. The sixth seal 417 can improve the sealing performance between the rotary ring 416 and the carrier plate 20 and the stability of the arrangement of the rotary ring 416 between the carrier plate 20 and the carrier case 101, and the fourth seal 412 and the fifth seal 415 can improve the sealing performance between the joint ring 411 and the outer case 400 and the movable ring 413. In the embodiment, the plurality of second springs 414 are annularly spaced, so that the second springs 414 can be used for abutting against the movable ring 413 only in the stage of clamping or releasing the wafer 300 when the semiconductor device processing unit 1000 does not drive the wafer 300 to rotate, so as to prevent contaminants from entering the interior of the semiconductor device processing unit 1000 from the gap between the rotating ring 416 and the movable ring 413, thereby ensuring the reliability and stability of the operation of the wafer lifting and rotating mechanism 200. Meanwhile, during the rotation process that the edge of the wafer 300 needs to be clamped by the plurality of clamping assemblies 70, an air floating structure is formed by the arc-shaped air groove 4161 at the bottom of the rotating ring 416 to separate the annular contact surface 4163 formed between the rotating ring 416 and the movable ring 413.
Further, a plurality of groups of arc-shaped air grooves 4161 and a plurality of air guide grooves 4162 formed outside the arc-shaped air grooves 4161 and communicating with the arc-shaped air grooves 4161 are formed at the bottom of the rotating ring 416. It should be noted that the arc-shaped air groove 4161 may be configured as a circular air groove (not shown) formed at the bottom of the rotation ring 416 and communicating circumferentially. The air guide groove 4162 can guide air into the arc-shaped air groove 4161 during the axial rotation of the rotating ring 416, and when the rotating ring 416 is in a high-speed rotation state, an air floating structure is formed by the arc-shaped air groove 4161 at the bottom of the rotating ring 416 so that a small gap exists between the rotating ring 416 and the movable ring 413 to prevent the rotating ring 416 from being worn due to contact and friction with the movable ring 413 during the axial rotation, and the arc-shaped air groove 4161 forms an annular air barrier (not shown) with the movable ring 413 so as to prevent contaminants such as dust from entering components such as the carrier disk 20 and the like to cause contamination through the air barrier.
As shown in fig. 1, 13 and 16, the semiconductor device processing unit 1000 further includes a buffer assembly 420. The buffer assembly 420 includes: an annular base 4201 circumferentially forming a flexible connection cover 4203 enclosed on an outer side wall of the outer case 400 and abutting against the outer case 400, wherein the flexible connection cover 4203 includes: an upper fixing ring 4223 fixedly connected to the outside of the outer case 400, a corrugated ring 4213, and a lower fixing ring 4233 connected to the corrugated ring 4213 and circumferentially separated from the outer case 400. The lower fixing ring 4233 is connected with an annular base 4201, the annular base 4201 is circumferentially provided with a plurality of assembling holes 4211, a flow guide sleeve 4202 is annularly arranged on the outer side of the flexible connection cover 4203, and the lower fixing ring is arranged on the annular base 4201 and connected with a support 4204 of the flow guide sleeve 4202. The support 4204 supports the pod 4202. The crumple rings 4213 are circumferentially separated from the outer housing 400 and form a gap, and at least the crumple rings 4213 in the semiconductor device processing unit 1000 are selected from flexible weather-resistant materials, so that the upper fixing ring 4223 and the lower fixing ring 4233 are flexibly connected through the crumple rings 4213 and fine adjustment in any direction is realized.
Finally, referring to fig. 17, based on the technical solution disclosed in the foregoing embodiment, the present invention further discloses a semiconductor device 2000, where the semiconductor device 2000 includes: at least one semiconductor device processing unit 1000 as disclosed in the previous embodiments. The semiconductor apparatus 2000 may be used to perform a cleaning process, a spin coating process, and other semiconductor processes on the wafer 300.
Illustratively, the semiconductor device 2000 further includes: the plurality of plate bodies 2001 surround to form a shielding cavity 2006, a first substrate 2002 and a second substrate 2004 are disposed in the shielding cavity 2006, so that the semiconductor device processing unit 1000 can be inserted and mounted through a first mounting hole 2012 preset on the first substrate 2002, and the second substrate 2004 is configured to support a second mounting hole 2014 of the semiconductor device processing unit 1000. A space for the semiconductor device processing unit 1000 to move exists between the semiconductor device processing unit 1000 and the first mounting hole 2012, and the inclination angle of the second substrate 2004 is adjustable in the shielding chamber 2006.
Specifically, the seventh sealing ring 2005 is disposed laterally between the first substrate 2002 and the annular base 4201. To improve the sealing property between the first substrate 2002 and the annular base 4201, bolts (not shown) penetrating the fitting holes 4211 are disposed between the first substrate 2002 and the annular base 4201 to fix the annular base 4201 to the first substrate 2002 by the bolts (not shown). The flow guide sleeve 4202 can protect the flexible connection sleeve 4203, and particularly the corrugated ring 4213, from corrosive acidic or alkaline liquids used in semiconductor manufacturing processes entering the flexible connection sleeve 4203 and causing undesirable situations such as corrosion of components such as the outer housing 400.
In fact, it is difficult to ensure absolute parallelism between the first substrate 2002 and the second substrate 2004 in the shielding chamber 2006 due to the limitation of processing and assembling accuracy, and when the first substrate 2002 and/or the second substrate 2004 are not strictly parallel to the horizontal plane, the semiconductor device processing unit 1000 may be inclined, and the wafer 300 held by the semiconductor device processing unit 1000 may not be ensured to be in an absolute horizontal posture. The radial inner side of the second substrate 2004 is formed with a support ring 2044 for supporting the semiconductor device processing unit 1000, and a plurality of jackscrews (not shown) vertically penetrating through the support ring 2044 are uniformly arranged along the circumferential direction of the support ring 2044 at intervals so as to integrally adjust the posture of the semiconductor device processing unit 1000 relative to the horizontal plane by rotating the jackscrews, so as to ensure that the semiconductor device processing unit 1000 is absolutely perpendicular to the horizontal plane, so that the semiconductor device processing unit 1000 is adjusted from a possible inclined state to a state absolutely perpendicular to the horizontal plane, so that the semiconductor device processing unit 1000 can clamp the wafer 300 in a horizontal posture for processing, thereby ensuring the stability of the wafer 300 during high-speed rotation.
Meanwhile, in the posture conversion process in which the tilted state is adjusted to be absolutely perpendicular to the second substrate 2004, the outer housing 400 moves in the ring base 4201 and the lower fixing ring 4233, and simultaneously drives the upper fixing ring 4223 to move, so that the upper fixing ring 4223 presses the corrugated ring 4213, the corrugated ring 4213 is pressed and one side along the axis a (i.e., the vertical direction) is compressed, and the other side is extended relatively, thereby preventing the lower fixing ring 4233 and the ring base 4201 from being driven to move in the vertical direction, so as to counteract an adverse effect that the semiconductor device processing unit 1000 cannot be kept strictly perpendicular to the horizontal plane during horizontal adjustment due to a possible non-parallel phenomenon between the first substrate 2002 and the second substrate 2004, which is understood as an adverse effect that a semiconductor process such as a liquid cannot uniformly coat the upper surface or the lower surface of the wafer 300 during clamping and rotating of the wafer 300 when the semiconductor device processing unit 1000 is tilted, and a vibration and a shaking phenomenon due to a high-speed rotation of the wafer 300.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (21)

1. A wafer lifting and rotating mechanism is characterized by comprising:
the device comprises a hollow pipe body, a carrying disc axially sleeved at the tail end of the hollow pipe body, a driving ring body coaxially arranged with the carrying disc, an outer ring body coaxially and annularly arranged on the radial outer side of the carrying disc and connected with the carrying disc through a plurality of spokes, a plurality of clamping components annularly embedded in the outer ring body, a lifting driving unit axially sleeved on the outer side of the hollow pipe body and formed on the inner side of the carrying disc, and a transmission mechanism driving the driving ring body to axially rotate, wherein the lifting driving unit drives the transmission mechanism to axially move up and down;
and a rotating body is transversely arranged between the carrying disc and the driving ring body, and the driving ring body radially extends outwards to form a driving lever assembly for driving the clamping assembly to rotate.
2. The wafer lifting and rotating mechanism according to claim 1, wherein the transmission mechanism comprises:
a plurality of vertical guide members penetrating through the carrying disc, a lifting ring body configured at the tail end of the vertical guide members and axially sleeved on the hollow pipe body, a plurality of guide blocks with guide holes arranged along the ring shape of the lifting ring body, and a guide shaft configured on the driving ring body and at least partially extending into the guide holes;
the lifting ring body drives the guide shaft to axially rotate along the guide hole in the axial lifting motion process so as to axially rotate relative to the carrying disc in a passive mode through the driving ring body and drive the clamping assembly to synchronously rotate through the deflector rod assembly.
3. The wafer lifting and rotating mechanism according to claim 2, wherein the driving ring body forms a plurality of protrusions protruding toward the lifting ring body, and the guide shaft transversely penetrates through the protrusions and forms a first roller rolling in the guide hole.
4. The wafer lifting and rotating mechanism according to claim 2, wherein the lifting ring body comprises:
the inner lifting ring and the outer lifting ring are configured at the tail end of the vertical guide piece and are arranged in concentric circles, and the inner lifting ring and the outer lifting ring are both provided with a plurality of guide blocks along the ring shape.
5. The wafer lifting and rotation mechanism of claim 4, wherein the lift ring body is configured as an inner lift ring or an outer lift ring connected only to the ends of the vertical guides, the inner lift ring or the outer lift ring having a plurality of guide blocks arranged in a ring shape.
6. The wafer lifting and rotating mechanism according to claim 1, wherein the drive ring body is configured as an inner drive ring disposed coaxially with the carrier disk only;
the inner driving ring extends outwards in the radial direction to form a plurality of shifting lever assemblies which drive the clamping assemblies to rotate synchronously;
an inner ring wall is convexly arranged on the carrying disc, and a first bearing is transversely arranged between the inner ring wall and the inner driving ring.
7. The wafer lifting and rotating mechanism according to claim 1, wherein the drive ring body is configured as an outer drive ring disposed coaxially with the carrier disk only;
the outer driving ring extends outwards in the radial direction to form a plurality of shifting lever assemblies which drive the clamping assemblies to rotate synchronously;
the load disc is convexly provided with an outer ring wall, and a second bearing is transversely arranged between the outer ring wall and the outer driving ring.
8. The wafer lifting and rotating mechanism of claim 1, wherein the drive ring body comprises:
an inner driving ring and an outer driving ring which are coaxially arranged with the carrying disc;
the driving lever subassembly includes: the inner driving ring radially extends outwards to form a plurality of first deflector rods which are arranged at intervals, and the outer driving ring radially extends outwards to form a plurality of second deflector rods which are arranged at intervals;
the carrying disc is convexly provided with an inner annular wall and an outer annular wall which are arranged in a concentric circle;
the rotating body includes: the first bearing is transversely arranged between the inner ring wall and the inner driving ring, and the second bearing is transversely arranged between the outer ring wall and the outer driving ring.
9. The wafer lifting and rotating mechanism according to claim 1, wherein the lifting and driving unit comprises:
the lifting guide mechanism comprises a sleeve, a chassis, a rotating disc, a driving disc and a lifting guide mechanism, wherein the sleeve is axially sleeved on the hollow pipe body, the chassis is coaxially nested outside the sleeve and is connected with the tail end of the sleeve, the rotating disc is coaxially sleeved on the sleeve and is formed outside the chassis, the driving disc is formed between the rotating disc and the driving disc, and the lifting guide mechanism is formed between the rotating disc and the driving disc;
and a third bearing is transversely arranged between the sleeve and the rotating disc, and at least one group of driving parts for driving the rotating disc to axially rotate are horizontally arranged on the chassis.
10. The wafer lifting and rotating mechanism according to claim 9, wherein the lifting and guiding mechanism comprises:
the guide shell is provided with an outlet end, the rotating disc is annularly provided with a plurality of guide shells, a guide shaft penetrates through a coaming formed by axially extending the edge of the driving disc, an inclined block is formed on the inner side of the guide shell, and the guide shell and the inclined block are encircled to form an inclined raceway;
the guide shaft forms a second roller that rolls at least partially within the angled raceway.
11. The wafer lifting and rotating mechanism according to claim 10, wherein the ramp block forms a first ramp having an angle with respect to a horizontal plane on which the rotating disk is placed, and a second ramp continuous from the first ramp and having an angle different from the first ramp;
the width of an opening formed between the outlet end and the second inclined surface is larger than the diameter of the second roller.
12. The wafer lifting and drop rotating mechanism of claim 8, wherein the outer ring body is configured with a mounting portion for the clamping assembly to be embedded therein;
the mounting portion includes:
and the adjusting holes divide the area where the mounting part is located into an upper arc plate and a lower arc plate.
13. The wafer elevating and rotating mechanism according to claim 12, further comprising:
the bearing shell is coaxially arranged on the radial outer side of the outer ring body in a ring mode and is connected with the sealing cover;
the sealing cover is circumferentially provided with a plurality of processing holes.
14. The wafer lifting and rotating mechanism of claim 13, wherein the radial outer sides of the first and second shift levers are provided with a shift block having a shift slot.
15. The wafer lifting and rotating mechanism of claim 14, wherein the clamping assembly comprises:
dispose in the installation lid of last arc board, coaxial disposition in the installation lid and inlay in the sealed cowling in the processing hole runs through in proper order the sealed cowling with the rotating part of installation lid, dispose in the rotating part top and be in the drive of rotating part is executed down and is rotated with the holder at centre gripping wafer edge, the coaxial cover of rotating part is established at least partly and is transversely supported and hold the first bearing of last arc board, the coaxial cover of rotating part is established at least partly and transversely supports and hold the second bearing of arc board down to and the cover is located the rotating part and at least part is formed in the transmission portion in the adjusting hole, the sealed cowling outside is inlayed and is established at least a set of third sealing washer that transversely supports and hold the processing hole inner wall.
16. The wafer lifting and rotating mechanism according to claim 15, wherein the transmission portion comprises:
the transmission block and a transmission shaft penetrating through the tail end of the transmission block are provided with a third roller at least partially formed in the toggle groove.
17. The wafer lifting and rotating mechanism of claim 13, wherein the hollow tube comprises:
the tail end of the sealing cover axially abuts against the connecting pipe of the carrying disc, the sealing cover axially sequentially penetrates through the sealing cover and the carrying disc and abuts against the lantern ring of the connecting pipe, the sealing cover is transversely arranged between the lantern ring and the connecting pipe and axially abuts against the lantern ring and the first sealing ring of the connecting pipe, the lantern ring radially extends outwards to form an extension ring portion transversely abutting against the sealing cover, the second sealing ring is transversely arranged between the extension ring portion and the sealing cover, the sealing ring is coaxially assembled between the extension ring portion and the carrying disc and supports the second sealing ring, and the second sealing ring transversely abuts against the extension ring portion and the sealing cover.
18. The wafer lifting and rotating mechanism according to claim 9, wherein the lifting and driving unit further comprises: a limiting component;
the spacing subassembly includes: the limiting rod is vertically and sequentially penetrates through the sleeve and a first abdicating hole formed in the rotating disc and is connected with the driving disc, and the elastic piece is sleeved on the limiting rod and is connected with the driving disc and the sleeve.
19. A semiconductor device processing unit, comprising:
the wafer lifting and rotating mechanism comprises an outer shell, a support cover axially arranged in the outer shell, and the wafer lifting and rotating mechanism as claimed in any one of claims 1 to 18 axially assembled in the inner side of the outer shell and abutted against the support cover.
20. The semiconductor device processing unit of claim 19, further comprising a buffer component;
the buffer assembly includes: an annular base, a flexible connecting cover which is formed in the circumferential direction and surrounds the outer side wall of the outer shell and is abutted against the outer shell,
wherein, flexible connection cover includes: fixed connection is in last solid fixed ring, the fold ring and the lower fixed ring who connects the fold ring and separate with shell body circumference outside the shell body.
21. A semiconductor device, comprising:
at least one semiconductor device processing unit as claimed in claim 19 or 20.
CN202210930678.4A 2022-08-04 2022-08-04 Wafer lifting and rotating mechanism, semiconductor equipment processing unit and semiconductor equipment Active CN115020317B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210930678.4A CN115020317B (en) 2022-08-04 2022-08-04 Wafer lifting and rotating mechanism, semiconductor equipment processing unit and semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210930678.4A CN115020317B (en) 2022-08-04 2022-08-04 Wafer lifting and rotating mechanism, semiconductor equipment processing unit and semiconductor equipment

Publications (2)

Publication Number Publication Date
CN115020317A CN115020317A (en) 2022-09-06
CN115020317B true CN115020317B (en) 2022-10-11

Family

ID=83065459

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210930678.4A Active CN115020317B (en) 2022-08-04 2022-08-04 Wafer lifting and rotating mechanism, semiconductor equipment processing unit and semiconductor equipment

Country Status (1)

Country Link
CN (1) CN115020317B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117080143B (en) * 2023-10-12 2023-12-22 福建安芯半导体科技有限公司 Semiconductor positioning device
CN118156188B (en) * 2024-05-10 2024-07-09 苏州智程半导体科技股份有限公司 Semiconductor cleaning system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203721699U (en) * 2014-02-20 2014-07-16 北京七星华创电子股份有限公司 Disk-like object holding device and disk-like object rotating platform <
CN204303791U (en) * 2015-01-08 2015-04-29 北京七星华创电子股份有限公司 The clamping device of semiconductor wafer
CN114653660B (en) * 2022-05-20 2022-09-16 智程半导体设备科技(昆山)有限公司 Magnetic clamping block and semiconductor substrate cleaning device

Also Published As

Publication number Publication date
CN115020317A (en) 2022-09-06

Similar Documents

Publication Publication Date Title
CN115020317B (en) Wafer lifting and rotating mechanism, semiconductor equipment processing unit and semiconductor equipment
US10121692B2 (en) Substrate holding apparatus
US9962744B2 (en) Substrate holding and rotating device, substrate processing device equipped with same, and substrate processing method
US10847407B2 (en) Substrate holding apparatus
JP4858635B2 (en) Aligner device
US20050031497A1 (en) Holding device for disk-shaped objects
KR102382691B1 (en) Apparatus for liquid treatment of wafer shaped articles
WO2001093316A2 (en) Apparatus and method for spinning a work piece
CN108666251B (en) Silicon wafer adsorption device, silicon wafer conveying device, silicon wafer transmission system and silicon wafer transmission method
US20230223293A1 (en) Wafer locking mechanism, wafer positioning device and wafer conveying apparatus
US8020570B2 (en) Substrate processing apparatus and substrate processing method
US10449577B2 (en) Substrate processing apparatus
CN114999995B (en) Wafer tilting mechanism
TWI679719B (en) Cleaning device and cleaning method
JP2005123583A5 (en)
CN117558668B (en) Double fork type mechanical arm for conveying wafers and conveying device
US7849865B2 (en) System for processing a workpiece
KR20220027007A (en) Wafer processing apparatus
JP2013208705A (en) Robotic system
KR101667151B1 (en) Vaccum suction device
CN114434137B (en) Assembling device for sealing ring in heat exchanger of motor vehicle
CN211565606U (en) Fixing device and detection equipment
CN115020315A (en) Chuck device of cleaning equipment and cleaning equipment
CN116246998B (en) Wafer clamping mechanism and wafer post-processing device
CN114394428B (en) Rotatable flexible suction head and material taking device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd.

Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd.

CP03 Change of name, title or address

Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd.

Country or region after: China

Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd.

Country or region before: China