CN1175239C - Heat pipe type cooling device, method of producing same and cooling plate for heat pipe type cooling device - Google Patents
Heat pipe type cooling device, method of producing same and cooling plate for heat pipe type cooling device Download PDFInfo
- Publication number
- CN1175239C CN1175239C CNB988133660A CN98813366A CN1175239C CN 1175239 C CN1175239 C CN 1175239C CN B988133660 A CNB988133660 A CN B988133660A CN 98813366 A CN98813366 A CN 98813366A CN 1175239 C CN1175239 C CN 1175239C
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- coldplate
- cooling device
- groove
- type cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a heat pipe type cooling device capable of effectively cooling a cooling plate according to the heat received by the cooling plate, which comprises the cooling plate (3) and a heat pipe (10), wherein one surface of the cooling plate (3) is a heat receiving surface, and the other surface is a heat radiating surface; the heat pipe (10) is embedded in the cooling plate (3). The heat radiating surface is provided with a plurality of heat radiating fins.
Description
Technical field
The present invention relates to a heat pipe type cooling device and put, more specifically, be suitable for the cooling power transducer for one, as be installed on the motor vehicle as the inverter of traction motor or transducer or as supplementary energy and provide, heat pipe type cooling device is put.
Background technology
The formation that the heat pipe type cooling device of prior art is put, in accompanying drawing 1, Japanese publication number is that 3-133165 (prior art 1) and Japanese publication number are 4-225790 (prior art 2).
Heat pipe type cooling device shown in the prior art 1 is put has a coldplate, and wherein one side is with the element that produces heat, and heat pipe is inserted into from the hole that here forms to the direction of another surperficial wall thickness with by the formed radiation blade in one side of wall thickness.
Heat pipe type cooling device shown in the prior art 2 is put the coldplate with one of them surface band groove, and heat pipe extends to groove thus.
Heat pipe type cooling device shown in the prior art 1 is put, and is embedded in the coldplate with wall thickness direction heat pipe, and the contact zone of coldplate and heat pipe is smaller or equal to the wall thickness of coldplate.The result is exactly, and the heat that coldplate receives can not be sent to heat pipe effectively because the radiation blade is to form along the wall thickness direction, thereby thereby the number of radiation blade seldom can't effectively be cooled off.
Heat pipe type cooling device shown in the prior art 2 is put, when cooling fluid contained in the heat pipe is solidified and function can't be taked any measure can't realize the time, so the coldplate effectively cooling of heat that it can't be received.
Summary of the invention
The present invention has a purpose to provide a heat pipe type cooling device to put, and it can cool off coldplate according to the absorption heat effectively.
For reaching this purpose, the invention provides 1. 1 heat pipe type cooling devices and put and comprise: a coldplate, its one side are as hot receiving plane, and another side is as heat radiation surface and with a plurality of parallel radiation blades; And the heat pipe that invests coldplate; Wherein, be about to by the little ridge of caulking to be parallel to the radiation blade and to form shape, and combine closely little ridge by caulking for groove and heat pipe along the recess edge direction.
Since the heat radiation surface at coldplate is formed with a plurality of radiation blades, dual thermal radiation by heat pipe and thermal radiation blade can reach good cooling effect, and when cooling fluid contained in the heat pipe solidify and function can't realize the time loss of cooling effectiveness can be limited in minimum degree because heat energy sheds from the radiation blade.
Description of drawings
Fig. 1 is the longitdinal cross-section diagram that a heat pipe type cooling device is put, and it is preferred embodiment of the present invention.
Fig. 2 is the cross section along the amplification of Fig. 1 center line II-II.
Fig. 3 is the enlarged drawing of Fig. 2, is illustrated in the preceding heat pipe of caulking.
Fig. 4 puts accompanying drawing for heat pipe type cooling device, and it is another preferred embodiment of the present invention, and it is corresponding to the dextrad view among Fig. 1.
Fig. 5 A, 5B, 5C and 5D are the sectional drawings along Fig. 4 center line V-V different structure.
Fig. 6 is the block diagram of power converter, wherein, shows the circuit that is used for the U phase, is omitted with W circuit mutually mutually and be used for V.
Embodiment
A heat pipe type cooling device of the present invention is put preferred embodiment and will be described to be contained on the beneath power converter in motor vehicle floor, as shown in Figure 1 to Figure 3.
Must prevent dust, the electronic component of the power converter of moistureproof and anti-water droplet is contained in the electronic component kit 1, this electronic component kit 1 has an opening 2.Coldplate 3 is contained on the electronic component kit 1 to cover opening 2.For with electronic component kit 1 with gastight manner sealing, coldplate 3 is by the sealing gasket (not shown) between coldplate 3 and electronic component kit 1,, and be fixed on the electronic component kit 1 at the open circumferential place.
If heat pipe 10 be shaped as circle, then groove 5 must have the semicircle shape cross section to go to cater to the hemicycle shape of heat pipe 10.
Little ridge 6a and 6b are shaped along the opposite side of the whole length of each groove 5.Little ridge 6a and 6b must form enough length can contain the semi-circumference outside being exposed to of the heat pipe 10 that places groove 5 during by caulking when them.
Attached a plurality of radiation blade 4, groove 5 and little ridge 6a, the coldplate 3 following shapings of 6b for example, are efficiently made coldplate 3 with stretching die stretching aluminium.If yet coldplate 3 does not need manufacturing in enormous quantities, coldplate 3 must form the method manufacturing that it is connected on the flat board with screw thread by forming groove 5 with machine earlier on plain film again.
Produce the electronic component 9 of heat, as door insulation bipolar transistor and diode, i.e. the element of some power converters, the hot joining of they and coldplate is linked to each other by face, i.e. relative with the surface that is provided with radiation blade 4.
The heat pipe 10 that embeds groove 5 has a circular cross-section, and crooked 95 degree form the shape that is similar to letter " L ".Heat pipe 10 has a hot joining section of being subjected to 11 and a thermal radiation section 12.Contain certain cooling fluid in the heat pipe 10, its consumption is decided corresponding to the volume of the hot joining section of being subjected to 11.A plurality of radiation blades 13 are connected on the thermal radiation section 12 by the pressure engagement.The quantity of radiation blade 13 is approximately 50.
In holding groove 5 during the hot joining section of being subjected to 11 of heat pipe 10, the hot joining section of being subjected to 11 is placed in the groove 5, little ridge 6a that is shaped along the limit of groove 5 and 6b are pressed in as shown in Figure 3 the horsing iron 14 so that little ridge 6a and 6b bear plastic deformation and cover heating is accepted section 11 then, the little ridge 6a of result keeps closely contacting with the hot joining section of being subjected to 11 with 6b, and the hot joining section of being subjected to 11 is being pressed groove 5.
Caulking is carved with a recessed bent tip 15 and is used for making little ridge 6a and 6b distortion so that its cover heating is accepted section 11.Horsing iron 14 is fixed to cutter mouthful or cutter mouthful with the lower part or by rolling as horsing iron 14 with roller, soon roller is pressed on little ridge 6a and the 6b and makes it and rolls along little ridge 6a and 6b, come to little ridge 6a and 6b caulking in the roller mode, little ridge 6a and 6b are handled by horsing iron 14 with the form of plastic deformation by above two kinds of methods.
As mentioned above, coldplate 3 has hot joining and is subjected to face, the electronic component 9 of heating is housed on this face and has the heat radiation surface that keeps heat pipe 10, and coldplate 3 is installed on the electronic component kit 1 that comprises electronic component, so that cover opening 2, as shown in Figure 1.When coldplate 3 and electronic component kit 1 were linked, the bearing of trend of radiation blade 4 was important.In this embodiment, thus coldplate 3 links with electronic component kit 1 and makes radiation blade 4 reach effective cooling along the free convection direction vertical stretching of atmosphere.
This embodiment uses single coldplate 3 and radiation blade 4, and the electronic component 9 and the heat pipe 10 that produce heat all are installed on the coldplate 3.Yet, consider and simplify assembling and may handle coldplate 3 (as shown in Figure 4) by assembling a plurality of little coldplates 3; Just, each little coldplate 3U, 3V and 3W have the height identical with coldplate 3, wherein a surface is subjected to face as hot joining, the electronic component 9 of giving birth to heat is housed on it, another side provides the heat radiation surface of a plurality of radiation blades 4 and heat pipe 10, and these little coldplates are in a row placed and are installed to and cover opening 2 on the electronic component kit 1.
When coldplate is in a row settled and is invested on the electronic component kit 1, in order to prevent that dust, moisture and water droplet are by adjacent coldplate 3U, 3W and adjacent coldplate 3V, 3W boundary face 7a and 7b enter electronic component kit 1, as shown in Figure 3, on boundary face 7a and 7b, be formed with groove 8a and the rank mouthful 8b that is parallel to radiation blade 4 and groove 5.Shown in Fig. 5 A, the rank mouth 8b of coldplate 3V (3W) is entered electronic component kit 1 to prevent extraneous moisture and air by the space between boundary face 7a and 7b by close installation to the groove 8a of coldplate 3U (3V).
As rank mouthful 8b during with groove 8a engagement, a kind of binder can be put on a groove 8a and a rank mouthful 8b, perhaps placement is used for improving the bubble-tight sealing ring of the junction at interface, coldplate adjacent side between groove 8a and rank mouth 8b.
In this embodiment, the rank mouth 8b of groove 8a and pairing with it is rectangular shown in Fig. 5 A.Yet shown in Fig. 5 B, coldplate combines by two cover rank mouth-groove interfaces, shown in Fig. 5 C the half lap scarf joint interface or by one have the semi-circular section the rank mouth and the rank that groove is formed shown in Fig. 5 D mouth-groove interface of correspondence.Say in essence, coldplate 3U, the adjacent edge interface 7a of 3V and 3W and 7b are the plane scarcely.
Heat pipe type cooling device according to the present invention is put another embodiment little coldplate 3U is provided, 3W, and 3V gives birth to hot electronic component 9, such as four serial doors insulation bipolar transistor and diode, a phase wherein as shown in Figure 6, every each little coldplate 3U that invests mutually, 3V, 3W, as shown in Figure 4.The reason since little coldplate 3U, 3W, 3V energy coverlet in installation and maintenance work is stayed alone, this makes installation and maintenance work become convenient.Engagement by rank mouthful 8b and groove 8a is with little coldplate 3U, 3V, boundary face 7a and the 7b of 3W combine, binder may put on groove 8a and rank mouthful 8b, or the position between groove 8a and rank mouthful 8b is provided with the bubble-tight sealing ring that is used for improving junction, interface, coldplate adjacent side.
When power converter moves, by the electronic component in the electronic component kit 1 with invest heat that the electronic component 9 of coldplate 3 produced and absorbed by the surface by the hot joining towards electronic component kit 1 inside of coldplate 3.The heat that is absorbed is sent to the heat radiation surface of the coldplate 3 that is exposed in the ambient atmosphere, by radiation blade 4 and heat pipe 10 heat is dispersed in the atmosphere.
The heat that is sent to heat radiation surface under the normal running is that the heat radiation surface by radiation blade 4, heat pipe 10 and coldplate 3 distributes.When motor vehicle travelled, most heat was to distribute by the radiation blade 13 that invests heat pipe 10.Behind the motor vehicle stagnation of movement, the wind that is blown has disappeared, thereby most heat is distributed in the atmosphere by free convection along the heat radiation surface of upright radiation blade 4 and coldplate 3.
Sometimes dry-out may occur, this moment, evaporation and the cooling fluid of solidifying in thermal radiation section 12 were frozen and can't get back to the hot joining section of being subjected to 11, and motor vehicle this phenomenon can occur behind the stagnation of movement in winter one cold area.If cooling fluid freezes solidly on thermal radiation section 12 and can't get back to the hot joining section of being subjected to 11, before coming into operation, do not have cooling fluid in the hot joining section of being subjected to 11 at all or a little is only arranged.Its result is exactly that the heat that is absorbed by coldplate 3 can't be sent to thermal radiation section 12 and distribute its heat, but also may cause the electronic component 9 of giving birth to heat to lose efficacy.
The phenomenon of being carried above considering, the function of heat pipe 10 is recoverable, thereby promptly with reduction cooling capacity and the temperature that improves heat pipe 10 cooling fluid of solidifying in the hot joining section of being subjected to 11 is melted by providing with the coldplate of the short heat pipe shorter than heat pipe 10.
When bringing into operation or operation just during the beginning, the very slow and wind that obtained when travelling of speed of service this moment also seldom, even heat pipe 10 can't operate as normal, outside atmosphere is by also causing the temperature difference on the inside and outside surface of coldplate 3 along radiation blade 4 free convections that invest coldplate 3.As a result, invest heat that the electronic component 9 of coldplate 3 inner surfaces produced and be transferred into coldplate 3 outer surfaces and distribute, so that electronic component 9 is unlikely to overheated by radiation blade 4.Simultaneously, cooling fluid is melted in the thermal radiation section 12 in the heat pipe 10, and heat pipe 10 can be carried out its normal function.
Press present embodiment, coldplate is cooled off effectively according to the heat that is absorbed.
Coldplate among this embodiment has radiation blade 4, groove 5, and little ridge 6a and 6b, boundary face 7a and 7b, they provide groove 8a and rank mouth 8b with overall structure stretch forming respectively, and heat pipe 10 does not need other special forming machine just can make easily.
As little coldplate 3U, 3W, 3V is in a row settled, boundary face 7a, 7b longitudinal extension.Therefore, dust and water droplet can't treat at boundary face 7a, and the fixed position of 7b but fall down can prevent dust and water droplet like this by boundary face 7a, and the slit between 7b enters electronic component kit 1.
In addition, in the aforementioned embodiment, whole little ridge 6a and 6b are shaped with the length identical with radiation blade 4 along the edge of groove 5.After heat pipe 10 placed groove 5, they are caulking by plastic deformation.Little ridge 6a and 6b can local caulkings, but have only one of them little ridge 6a and 6b by caulking or all little ridge 6a and 6b all by caulking discontinuously.
If little ridge 6a and 6b can not can be produced the slit by complete caulking between heat pipe 10 surfaces and groove 5.Slit between heat pipe 10 surfaces and the groove 5 will increase thermal contact resistance, reduces thermal conductivity and causes crevice corrosion.In order to prevent such trouble, the surface of the hot joining section of being subjected to of heat pipe 10 is coated with soft metal film 16, as soft solder, and films such as lead, the hot joining section of being subjected to 11 that equally also is coated with soft metal film 16 is placed in the groove 5, however little ridge 16 is by caulking.Can not form the slit like this, the increase of thermal contact resistance will be suppressed and crevice corrosion can be avoided.
The method that heat pipe 10 can be placed in by the hot joining section of being subjected to 11 with heat pipe 10 in the groove 5 places groove 5 and can not form the slit between the surface of groove 5 and the hot joining section of being subjected to.Its prerequisite is that the hot joining section of being subjected to 11 of heat pipe 10 is applied to the surface of groove 5 or metal level is placed groove 5 with the good filler of thermal conductivity or soft metal layer or the filler that thermal conductivity is good by plating, and then carries caulking work.Behind the caulking residual slit must fill with the high-termal conductivity resin with the method for vacuum fill.
Very clear in the above description, the coldplate put of this heat pipe type cooling device can fully cool off according to the heat that is absorbed for the present invention.
Claims (8)
1. a heat pipe type cooling device is put and is comprised:
One coldplate, its one side are as hot receiving plane, and another side is as heat radiation surface and with a plurality of parallel radiation blades; And
Invest the heat pipe of coldplate;
It is characterized in that, be about to by the little ridge of caulking to be parallel to the radiation blade and to form shape, and combine closely little ridge by caulking for groove and heat pipe along the recess edge direction.
2. heat pipe type cooling device as claimed in claim 1 is put, and it is characterized in that, little ridge is shaped with certain altitude so that little ridge has contacting above the height of face with the heat pipe that places groove before caulking.
3. heat pipe type cooling device as claimed in claim 2 is put, and it is characterized in that, the part that each heat pipe is arranged in groove has been coated with soft metal film.
4. heat pipe type cooling device as claimed in claim 3 is put, and it is characterized in that, the electronic section of giving birth to heat is the hot receiving plane that invests coldplate.
5. the described heat pipe type cooling device of arbitrary as described above claim is put, it is characterized in that, coldplate is by a plurality of little coldplates that have the longitudinal boundary face are formed, the boundary face of the little coldplate that is adjacent to each other is more closely connected, one half thickness of each boundary face of each little coldplate is cut, and adjacent so little coldplate is combined together by a half lap scarf joint interface.
6. heat pipe type cooling device as claimed in claim 5 is put, it is characterized in that, coldplate invest an electronic component kit so that its covering be formed in the electronic component kit towards the hot receiving plane of electronic component kit inside and the opening that produces.
7. heat pipe type cooling device as claimed in claim 6 is put, and it is characterized in that, the coldplate with radiation blade groove and little ridge is with the stretch forming of monoblock form.
8. make the step that method that heat pipe type cooling device puts comprises:
The coldplate that make to be shaped, wherein one side has the heat pipe that a plurality of parallel radiation blades and parallel with it groove are used for admitting this place;
Between heat pipe that has been shaped and heat pipe embedded part, get involved a thermal conductivity material; And
The main marginal portion plastic deformation of groove is the heat pipe in being placed in groove, and heat pipe just has been fixed on the coldplate firmly like this.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP1998/000395 WO1999039145A1 (en) | 1998-01-30 | 1998-01-30 | Heat pipe type cooling device, method of producing the same and cooling plate for heat pipe type cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1284160A CN1284160A (en) | 2001-02-14 |
| CN1175239C true CN1175239C (en) | 2004-11-10 |
Family
ID=14207522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB988133660A Expired - Fee Related CN1175239C (en) | 1998-01-30 | 1998-01-30 | Heat pipe type cooling device, method of producing same and cooling plate for heat pipe type cooling device |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20010034443A (en) |
| CN (1) | CN1175239C (en) |
| WO (1) | WO1999039145A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1424532A4 (en) * | 2001-09-05 | 2011-12-14 | Showa Denko Kk | Heat sink, control device with the heat sink and machine tool with the device |
| CN100356557C (en) * | 2003-09-05 | 2007-12-19 | 良维科技股份有限公司 | Method for producing heating degassing heat conducting pipes |
| TW200803706A (en) * | 2006-06-29 | 2008-01-01 | Cooler Master Co Ltd | Heat conduction module and fabrication method thereof |
| DE102010015018A1 (en) | 2010-04-14 | 2011-10-20 | Krones Ag | lamp cooling |
| DE102010018214A1 (en) * | 2010-04-23 | 2011-10-27 | Krones Ag | Heating module with surface cooling for preforms |
| CN103167780B (en) * | 2011-12-16 | 2016-06-08 | 台达电子企业管理（上海）有限公司 | Power model combined radiator assembly |
| EP3422403A1 (en) * | 2017-06-30 | 2019-01-02 | Siemens Aktiengesellschaft | Cooling device |
| JP6837552B2 (en) * | 2017-07-10 | 2021-03-03 | 三菱電機株式会社 | Manufacturing method of cooling device |
| JP7222920B2 (en) * | 2017-12-28 | 2023-02-15 | 古河電気工業株式会社 | Cooling system |
| CN109066007B (en) * | 2018-07-26 | 2020-06-30 | 东南大学 | Large-scale battery module integration box cooling system based on heat pipe |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57104181U (en) * | 1980-12-17 | 1982-06-26 | ||
| JPS599495A (en) * | 1982-07-09 | 1984-01-18 | Matsushita Electric Ind Co Ltd | Heat pipe type radiator |
| JPH0536897U (en) * | 1991-10-11 | 1993-05-18 | 古河電気工業株式会社 | Heat pipe radiator |
| JPH07169889A (en) * | 1993-12-15 | 1995-07-04 | Hitachi Cable Ltd | Heat sink |
-
1998
- 1998-01-30 CN CNB988133660A patent/CN1175239C/en not_active Expired - Fee Related
- 1998-01-30 KR KR1020007008223A patent/KR20010034443A/en not_active Application Discontinuation
- 1998-01-30 WO PCT/JP1998/000395 patent/WO1999039145A1/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| WO1999039145A1 (en) | 1999-08-05 |
| KR20010034443A (en) | 2001-04-25 |
| CN1284160A (en) | 2001-02-14 |
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