CN1284160A - Heat pipe type cooling device, method of producing same and cooling plate for heat pipe type cooling device - Google Patents
Heat pipe type cooling device, method of producing same and cooling plate for heat pipe type cooling device Download PDFInfo
- Publication number
- CN1284160A CN1284160A CN98813366A CN98813366A CN1284160A CN 1284160 A CN1284160 A CN 1284160A CN 98813366 A CN98813366 A CN 98813366A CN 98813366 A CN98813366 A CN 98813366A CN 1284160 A CN1284160 A CN 1284160A
- Authority
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- China
- Prior art keywords
- heat pipe
- coldplate
- groove
- cooling device
- heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat pipe type cooling device capable of efficiently cooling a cooling plate according to heat reception comprises a cooling plate of which one side is a heat receiving surface and of which the other side is a heat dissipating surface and a heat pipe buried in the cooling plate. A plurality of heat dissipating fins are provided on the heat dissipating surface.
Description
Technical field
Present invention relate to that a heat pipe type cooling device is put and, more specifically, be suitable for the cooling power converter for one, as be installed on the electric vehicle as the phase inverter of traction motor or converter or as supplementary energy and provide, heat pipe type cooling device is put.
Technical background
The formation that the heat pipe type cooling device of prior art is put, in accompanying drawing 1, Japanese publication number is that 3-133165 (prior art 1) and Japanese publication number are 4-225790 (prior art 2).
Heat pipe type cooling device shown in the prior art 1 is put has a coldplate, and wherein one side is with the element that produces heat, and heat pipe is inserted into from the hole that here forms to the direction of another surperficial wall thickness with by the formed radiation blade in one side of wall thickness.
Heat pipe type cooling device shown in the prior art 2 is put the coldplate with one of them surface band groove, and heat pipe extends to groove thus.
Heat pipe type cooling device shown in the prior art 1 is put, and is embedded in the coldplate with wall thickness direction heat pipe, and the contact zone of coldplate and heat pipe is smaller or equal to the wall thickness of coldplate.The result is exactly, and the heat that coldplate receives can not be sent to heat pipe effectively because the radiation blade is to form along the wall thickness direction, thereby thereby the number of radiation blade seldom can't effectively be cooled off.
Heat pipe type cooling device shown in the prior art 2 is put, when cooling fluid contained in the heat pipe is solidified and function can't be taked any measure can't realize the time, so the coldplate effectively cooling of heat that it can't be received.
Summary of the invention
Present invention has a purpose to provide a heat pipe type cooling device to put, and it can receive coldplate and cool off effectively by its heat.
For reaching this purpose, present invention provides a heat pipe type cooling device to put, and it has comprised a coldplate, and it has a hot joining and is subjected to face, and another is as heat radiation surface, and heat pipe is embedded in the coldplate, and its heat radiation surface has multi-disc radiation blade.
Since the heat radiation surface at coldplate is formed with a plurality of radiation blades, dual heat radiation by heat pipe and heat radiation blade can reach good cooling effect, and when cooling fluid contained in the heat pipe solidify and function can't realize the time loss of cooling effectiveness can be limited in minimum degree because heat energy sheds from the radiation blade.
The accompanying drawing summary
Accompanying drawing 1 is the longitdinal cross-section diagram that a heat pipe type cooling device is put, and it is the preferred embodiment with regard to present invention.
Accompanying drawing 2 is that a cross-sectional diagram of amplifying is used for showing the cross section that the line II-II of deducting marks in the accompanying drawing one is become.
Accompanying drawing 3 is that the heat pipe before caulking shown in the accompanying drawing 2 amplifies accompanying drawing.
Accompanying drawing 4 is put accompanying drawing for heat pipe type cooling device, and it is another preferred embodiment with regard to present invention, and it is corresponding to the dextrad view in the accompanying drawing 1.
Accompanying drawing 5A, 5B, 5C and 5D are the different structure accompanying drawings in cross section shown in line V-V of deducting marks shown in the accompanying drawing 4.
Accompanying drawing 6 is a square frame accompanying drawing of power converter, and here, the electronic loop of U phase is shown, V mutually with W being omitted mutually.
Carry out the most preferred embodiment of this invention
The preferred embodiment that one heat pipe type cooling device is put with regard to present invention will be described to be contained under the electric vehicle floor, be used as power converter, as accompanying drawing 1 to shown in the accompanying drawing 3.
The electronic component of power converter must prevent dust, tide and water droplet.Electronic component kit 1 has an opening 2.Coldplate 3 is close to electronic component kit 1 so that cover opening part 2.With airtight conditions sealing, coldplate 3 is by the sealing gasket (not shown) of opening part with electronic component kit 1, and it is between coldplate 3 and electronic component kit, and the periphery by opening part is fixed in electronic component kit 1.
Coldplate is made by the material with high-termal conductivity, as copper and aluminium.Coldplate has a smooth inner surface and that is subjected to face as hot joining as heat radiation surface, is positioned at the outer surface in electronic component kit 1 outside.One big string is parallel, and upright radiation blade 4 forms in the heat radiation surface of coldplate, and they stand on heat radiation surface massively, and its length is corresponding to total height of coldplate 3.Groove 5 is formed at the heat radiation surface of coldplate 3, is positioned at (three radiation blades 4 are shown in accompanying drawing 2 and accompanying drawing 3) among large numbers of radiation blades 4.Groove 5 is parallel to radiation fin 4, and its length equals the total height of coldplate.Heat pipe 10 places groove 5, and the partial shape of groove 5 depends on the outer shape of heat pipe 10, purpose be to guarantee it with heat pipe between contact.
If the shape of heat pipe 10 has circular portion, then groove 5 must have the semicircle shape cross section to remove to cater to the semi-circular shape of heat pipe 10.
Little ridge 6a and 6b are shaped along the opposite side of the whole length of each groove 5.Little ridge 6a and 6b must form the outer semi-circumference that is exposed to that enough length is used for containing the heat pipe 10 that places groove 5, when they during by caulking.
Produce the electronic component 9 of heat, as door insulation bipolar transistor and diode, i.e. the element of some power converters, the hot joining of they and coldplate is linked by face, promptly has an apparent surface on surface of radiation blade 4.
The heat pipe 10 that embeds groove 5 has a circular cross-section, and crooked 95 degree form the shape that is similar to letter " L ".Heat pipe 10 has a hot joining section of being subjected to 11 and a heat radiation section 12.Contain certain cooling fluid in the heat pipe 10, its consumption is decided corresponding to the volume of the hot joining section of being subjected to 11.A plurality of radiation blades 13 are connected on the heat radiation section 12 by the pressure engagement.The quantity of radiation blade 13 is approximately 50.
In holding groove 5 during the hot joining section of being subjected to 11 of heat pipe 10, the hot joining section of being subjected to 11 is placed in the groove 5, and little ridge 6a that is shaped along the limit of groove 5 and 6b are pressed in as shown in Figure 3 the horsing iron 14 so that little ridge 6a and 6b bear plastic deformation and cover heating is accepted section 11 then.The little ridge 6a of result and 6b keep closely contacting with the hot joining section of being subjected to 11 and, the hot joining section of being subjected to 11 is being pressed groove 5.
Caulking is carved with a concave surface, and bent tip 15 is used for reinventing little ridge 6a and 6b so that its cover heating is accepted section 11.Horsing iron 14 is fixed to cutter mouthful or cutter mouthful with the lower part or by rolling as horsing iron 14 with roller, soon roller is pressed on little ridge 6a and the 6b and makes it and rolls along little ridge 6a and 6b, come to little ridge 6a and 6b caulking in the roller mode, little ridge 6a and 6b are handled by horsing iron 14 with the form of plastic deformation by above two kinds of methods.
As the above mentioned, coldplate 3 is provided with hot joining and is subjected to face, has the heat radiation surface and the electronic component kit 1 of giving birth to hot electronic component 9 and having heat pipe 10 and link on this face, and it comprises electronic component so that it covers opening part 2, as shown in Figure 1.When coldplate 3 and electronic component kit 1 were linked, the bearing of trend of radiation blade 4 was important.In this embodiment, thus coldplate 3 links with electronic component kit 1 and makes the radiation blade reach effective cooling along the free convection direction vertical stretching of atmosphere.
This embodiment uses single coldplate 3 and radiation blade 4, and the electronic component 9 and the heat pipe 10 that produce heat are installed on the coldplate 3.Yet, consider that simplification is assembled and loading and unloading coldplate 3 may be finished by a plurality of little coldplates 3 of assembling (as shown in Figure 4): that is exactly, each little coldplate 3U, 3V and 3W have the height identical with the sort of coldplate 3, wherein a surface is subjected to face as hot joining, with the electronic component 9 of giving birth to heat, another side provides the heat radiation surface of a plurality of radiation blades 4 and heat pipe 10 there.Heat pipe 10 is settled and is invested electronic component kit 1 mostly and made its energy cover outlet place 2 with row.
When electronic component kit 1 is in a row settled and invested to coldplate, in order to prevent dust, tide and water droplet pass through coldplate 3U, 3W or 3V, and the boundary face 7a of the adjoiner of 3W and 7b enter electronic component kit 1.Groove 8a and rank mouthful 8b are parallel to the groove 5 on radiation blade 4 and faying face 7a and the 7b respectively as shown in Figure 3, and the rank mouth 8b of coldplate 3V (3W) is entered electronic component kit 1 to prevent extraneous tide and atmosphere by the space between boundary face 7a and 7b by close installation to the groove 8a of coldplate 3U (3V) as shown in Figure 5.
As rank mouthful 8b during with groove 8a engagement, a kind of binder will put on a groove 8a and a rank mouthful 8b, or puts between the position of groove 8a with rank mouth 8b, is used for improving on the bubble-tight sealing ring of junction at interface, coldplate adjacent side.
In this embodiment, the rank mouth 8b of groove 8a and pairing with it is rectangular shown in accompanying drawing 5A.Yet shown in accompanying drawing 5B, coldplate combines by two cover rank mouth-groove interfaces, shown in accompanying drawing 5C the half lap scarf joint interface or by one have the semicircle shape cross section the rank mouth and the rank that groove is formed shown in the accompanying drawing 5D mouth-groove interface of correspondence.Say in essence, coldplate adjacent side interface 7a and 7b3U, 3V and 3W can not be the plane.
Another embodiment by present invention that heat pipe type cooling device is put provides little coldplate 3U, 3W, the electronic component 9 of 3V and living heat, such as four serial doors insulation bipolar transistor and diode, a phase wherein as shown in Figure 6, every each little coldplate 3U that invests mutually, 3V, 3W, as shown in Figure 4.The reason since little coldplate 3U, 3W, 3V energy coverlet in installation and maintenance work is stayed alone, this makes installation and maintenance work become convenient.Engagement by projection 8b and groove 8a is with little coldplate 3U, 3V, boundary face 7a and the 7b of 3W combine, binder may put on groove 8a and rank mouthful 8b, or put on position between groove 8a and rank mouthful 8b, be used for improving on the bubble-tight sealing ring of junction at interface, coldplate adjacent side.
When power converter operates, by the electronic component that is contained in electronic component kit 1 with invest heat that the electronic component 9 of coldplate 3 produced and absorbed by the surface by the hot joining towards electronic component kit 1 inside of coldplate 3.The heat that is absorbed is sent to the heat radiation surface of the coldplate 3 that is exposed in the ambient atmosphere, by radiation blade 4 and heat pipe 10 heat is dispersed in the atmosphere.
The heat that is sent to heat radiation surface under the normal running is by radiation blade 4, and the heat radiation surface of heat pipe 10 and coldplate 3 distributes.Most heat was to distribute by the radiation blade 13 that invests heat pipe 10 when electric vehicle travelled.Behind the electric vehicle stagnation of movement, the wind that is blown has disappeared, thereby most heat is distributed in the atmosphere by free convection along the heat radiation surface of upright radiation blade 4 and coldplate 3.
Sometimes dry-out may occur, cooling fluid evaporate in heat radiation section 12 and was solidified this moment, and then freezed and can't get back to the hot joining section of being subjected to 11, after this betides the interior running of cold area in winter one usually and stops.If cooling fluid freezes solidly on heat radiation section 12 and can't get back to the hot joining section of being subjected to 11, before coming into operation, do not have cooling fluid in the hot joining section of being subjected to 11 at all or a little is only arranged.Its result is exactly that the heat that is absorbed by coldplate 3 can't be sent to heat radiation section 12 and distribute its heat, but also may cause the electronic component of giving birth to heat to lose efficacy.
The phenomenon of being carried above considering, heat pipe 10 can be by providing the coldplate with the short heat pipe shorter than heat pipe 10, thereby the temperature that it can reduce cooling Power and improve heat pipe 10 is melted the cooling fluid of solidifying in the hot joining section of being subjected to 11, recovers the function that they lost by this.
When machinery comes into operation or after the running beginning, the electric vehicle speed of service is very slow, the wind that is obtained when travelling also seldom, outside atmosphere is by having caused the temperature difference on the inside and outside surface of coldplate 3 along radiation blade 4 free convections that invest coldplate 3, even heat pipe 10 can't operate as normal.As a result, the heat that electronic component produced that invests coldplate 3 inner surfaces is transferred into coldplate 3 outer surfaces and distributes by radiation blade 4, so that electronic component 9 is unlikely to overheated.Simultaneously, cooling fluid is evaporated in the heat radiation section 12 in the heat pipe 10, and heat pipe 10 can be carried out its normal function.
By current embodiment, coldplate is cooled off effectively, corresponding to amount of heat absorption.
Coldplate among this embodiment has radiation blade 4, groove 5, and little ridge 6a and 6b, boundary face 7a and 7b, they provide groove 8a and rank mouth 8b with overall structure stretch forming respectively, and heat pipe 10 does not need the special forming machine in its hole and can simply be made.
As little coldplate 3U, 3W, 3V is in a row settled, boundary face 7a, 7b longitudinal extension.Therefore, dust and water droplet and needless to say at boundary face 7a, the fixed position of 7b and falling down.Can prevent dust and water droplet like this by boundary face 7a, the slit between 7b enters electronic component kit 1.
By the way, in preceding the above embodiment, whole little ridge 6a and 6b are shaped with the length identical with radiation blade 4 along the edge of groove 5.After heat pipe 10 placed groove 5, they are caulking by plastic deformation.Little ridge 6a and 6b can local caulkings, have only one of them little ridge 6a and 6b by caulking or all little ridge 6a and 6b all by caulking discontinuously.
If little ridge 6a and 6b can not can be produced the slit by complete caulking between heat pipe 10 surfaces and groove 5.Slit between heat pipe 10 surfaces and the groove 5 will increase thermal contact resistance, reduces thermal conductivity and causes crevice corrosion.In order to prevent such trouble, the surface of the hot joining section of being subjected to of heat pipe 10 is coated with soft metal film 16, as soft solder, and films such as lead, the hot joining section of being subjected to 11 that equally also is coated with soft metal film 16 is placed in the groove 5, so little ridge 16 is by caulking.Can not form the slit like this, the increase of thermal contact resistance will be suppressed and crevice corrosion can be avoided.
The method that heat pipe 10 can be placed in by the hot joining section of being subjected to 11 with heat pipe 10 in the groove 5 places groove 5 and can not form the slit between the surface of groove 5 and the hot joining section of being subjected to.Its prerequisite is that the hot joining section of being subjected to 11 of heat pipe 10 is applied to the surface of groove 5 or metal level is placed groove 5 with the good filler of thermal conductivity or soft metal layer or the filler that thermal conductivity is good by plating, and the work of beginning filler.Behind the caulking residual slit must fill with the high-termal conductivity resin with the method for vacuum fill.
Very clear in the above description, the coldplate that this heat pipe type cooling device is put with regard to present invention can fully cool off corresponding to the heat that is absorbed.
Claims (11)
1. a heat pipe type cooling device is put and is comprised:
One coldplate, its one side is as hot receiving plane, and another side is as heat radiation surface; And
Be embedded in the heat pipe in the hot coldplate;
A plurality of radiation blades are wherein arranged on the heat radiation surface.
2. a heat pipe type cooling device is put and is comprised:
One coldplate, its one side is as hot receiving plane, and another side has a plurality of radiation blades as heat radiation surface on it; And
Invest the heat pipe of coldplate;
The groove that the oriented direction parallel with the radiation blade extended on the heat radiation surface wherein, heat pipe places groove, and the edge of groove mainly is bonded to heat pipe on the coldplate by plastic deformation.
3. heat pipe cooling device as claimed in claim 2 is characterized in that soon by the little ridge of caulking being parallel to the radiation blade and forming shape along the recess edge direction, and combines closely little ridge by caulking for groove and heat pipe.
4. heat pipe type cooling device as claimed in claim 3 is put, and it is characterized in that little ridge is shaped with certain altitude so that little ridge has contacting above the height of face with the heat pipe that places groove before caulking.
5. put as any described heat pipe type cooling device of claim 2 to 4, it is characterized in that the part that each heat pipe is arranged in groove has been coated with soft metal film.
6. heat pipe type cooling device as claimed in claim 2 is put, and it is characterized in that giving birth to hot electronic section is the hot receiving plane that invests coldplate.
7. put as any described heat pipe type cooling device of claim 2 to 6, it is characterized in that coldplate is by a plurality of little coldplates that have the longitudinal boundary face are formed, the boundary face of the little coldplate that is adjacent to each other is more closely connected, one half thickness of each boundary face of each little coldplate is cut, and adjacent so little coldplate is combined together by a half lap scarf joint interface.
8. heat pipe type cooling device as claimed in claim 7 is put, it is characterized in that coldplate invests an electronic component kit so that its covering be formed in the electronic component kit towards the hot receiving plane of electronic component kit inside and the opening that produces.
9. a heat pipe type cooling device is put and is comprised:
One coldplate, its one side are as hot receiving plane, and another side is as heat radiation surface and with a plurality of parallel radiation blades; And
Invest the heat pipe of coldplate;
It is characterized in that heat radiation surface has multiple tracks to be parallel to the groove of radiation blade, purpose is to make its admittance to be positioned in abutting connection with the interlobate heat pipe of radiation, will be by the little ridge of caulking along the edge of groove and be shaped.
10. heat pipe type cooling device as claimed in claim 9 is put, and it is characterized in that coldplate has radiation blade groove and little ridge with the stretch forming of monoblock form.
11. the step that the method that the manufacturing heat pipe type cooling device is put comprises:
The coldplate that make to be shaped, wherein one side has the heat pipe that a plurality of parallel radiation blades and parallel with it groove are used for admitting this place;
Between heat pipe that has been shaped and heat pipe embedded part, get involved a thermal conductivity material; And
The main marginal portion plastic deformation of groove is the heat pipe in being placed in groove, and heat pipe just has been fixed on the coldplate firmly like this.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP1998/000395 WO1999039145A1 (en) | 1998-01-30 | 1998-01-30 | Heat pipe type cooling device, method of producing the same and cooling plate for heat pipe type cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1284160A true CN1284160A (en) | 2001-02-14 |
| CN1175239C CN1175239C (en) | 2004-11-10 |
Family
ID=14207522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB988133660A Expired - Fee Related CN1175239C (en) | 1998-01-30 | 1998-01-30 | Heat pipe type cooling device, method of producing same and cooling plate for heat pipe type cooling device |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20010034443A (en) |
| CN (1) | CN1175239C (en) |
| WO (1) | WO1999039145A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1316224C (en) * | 2001-09-05 | 2007-05-16 | 昭和电工株式会社 | Heat sink, control device having the heat sink and machine tool provided with the device |
| CN100356557C (en) * | 2003-09-05 | 2007-12-19 | 良维科技股份有限公司 | Method for producing heating degassing heat conducting pipes |
| CN102218813A (en) * | 2010-04-14 | 2011-10-19 | 克罗内斯股份公司 | Component for cooling a radiation source |
| CN102233667A (en) * | 2010-04-23 | 2011-11-09 | 克罗内斯股份公司 | Heating module with surface cooling for pre-forms |
| CN109066007A (en) * | 2018-07-26 | 2018-12-21 | 东南大学 | A kind of extensive battery modules integral box cooling system based on heat pipe |
| TWI694233B (en) * | 2017-12-28 | 2020-05-21 | 日商古河電氣工業股份有限公司 | Cooling device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200803706A (en) * | 2006-06-29 | 2008-01-01 | Cooler Master Co Ltd | Heat conduction module and fabrication method thereof |
| CN103167780B (en) * | 2011-12-16 | 2016-06-08 | 台达电子企业管理（上海）有限公司 | Power model combined radiator assembly |
| EP3422403A1 (en) * | 2017-06-30 | 2019-01-02 | Siemens Aktiengesellschaft | Cooling device |
| WO2019012579A1 (en) * | 2017-07-10 | 2019-01-17 | 三菱電機株式会社 | Cooling device and method for manufacturing same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57104181U (en) * | 1980-12-17 | 1982-06-26 | ||
| JPS599495A (en) * | 1982-07-09 | 1984-01-18 | Matsushita Electric Ind Co Ltd | Heat pipe type radiator |
| JPH0536897U (en) * | 1991-10-11 | 1993-05-18 | 古河電気工業株式会社 | Heat pipe radiator |
| JPH07169889A (en) * | 1993-12-15 | 1995-07-04 | Hitachi Cable Ltd | Heat sink |
-
1998
- 1998-01-30 KR KR1020007008223A patent/KR20010034443A/en not_active Application Discontinuation
- 1998-01-30 WO PCT/JP1998/000395 patent/WO1999039145A1/en not_active Application Discontinuation
- 1998-01-30 CN CNB988133660A patent/CN1175239C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1316224C (en) * | 2001-09-05 | 2007-05-16 | 昭和电工株式会社 | Heat sink, control device having the heat sink and machine tool provided with the device |
| CN100356557C (en) * | 2003-09-05 | 2007-12-19 | 良维科技股份有限公司 | Method for producing heating degassing heat conducting pipes |
| CN102218813A (en) * | 2010-04-14 | 2011-10-19 | 克罗内斯股份公司 | Component for cooling a radiation source |
| CN102218813B (en) * | 2010-04-14 | 2013-10-09 | 克罗内斯股份公司 | Component for cooling a radiation source |
| US8983281B2 (en) | 2010-04-14 | 2015-03-17 | Krones Ag | Method and device for cooling of IR emitters for preforms |
| CN102233667A (en) * | 2010-04-23 | 2011-11-09 | 克罗内斯股份公司 | Heating module with surface cooling for pre-forms |
| TWI694233B (en) * | 2017-12-28 | 2020-05-21 | 日商古河電氣工業股份有限公司 | Cooling device |
| CN111670332A (en) * | 2017-12-28 | 2020-09-15 | 古河电气工业株式会社 | Cooling device |
| CN111670332B (en) * | 2017-12-28 | 2022-02-01 | 古河电气工业株式会社 | Cooling device |
| CN109066007A (en) * | 2018-07-26 | 2018-12-21 | 东南大学 | A kind of extensive battery modules integral box cooling system based on heat pipe |
| CN109066007B (en) * | 2018-07-26 | 2020-06-30 | 东南大学 | Large-scale battery module integration box cooling system based on heat pipe |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1175239C (en) | 2004-11-10 |
| KR20010034443A (en) | 2001-04-25 |
| WO1999039145A1 (en) | 1999-08-05 |
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